DE69118031T2 - Verfahren zum Herstellen einer Halbleiteranordnung mit einer Ausrichtungsmarke - Google Patents
Verfahren zum Herstellen einer Halbleiteranordnung mit einer AusrichtungsmarkeInfo
- Publication number
- DE69118031T2 DE69118031T2 DE69118031T DE69118031T DE69118031T2 DE 69118031 T2 DE69118031 T2 DE 69118031T2 DE 69118031 T DE69118031 T DE 69118031T DE 69118031 T DE69118031 T DE 69118031T DE 69118031 T2 DE69118031 T2 DE 69118031T2
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- manufacturing
- alignment mark
- apertures
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/102—Mask alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/975—Substrate or mask aligning feature
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2169949A JPH0461219A (ja) | 1990-06-29 | 1990-06-29 | 半導体装置、その製造方法およびアライメント法 |
JP2169948A JP2863277B2 (ja) | 1990-06-29 | 1990-06-29 | 半導体装置、その製造方法およびアライメント法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69118031D1 DE69118031D1 (de) | 1996-04-25 |
DE69118031T2 true DE69118031T2 (de) | 1996-09-05 |
Family
ID=26493124
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69118031T Expired - Fee Related DE69118031T2 (de) | 1990-06-29 | 1991-06-28 | Verfahren zum Herstellen einer Halbleiteranordnung mit einer Ausrichtungsmarke |
Country Status (7)
Country | Link |
---|---|
US (2) | US5482893A (de) |
EP (1) | EP0465152B1 (de) |
KR (1) | KR940010490B1 (de) |
CN (1) | CN1024730C (de) |
AT (1) | ATE135848T1 (de) |
DE (1) | DE69118031T2 (de) |
MY (1) | MY109605A (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0608628A3 (de) * | 1992-12-25 | 1995-01-18 | Kawasaki Steel Co | Verfahren zur Herstellung einer Halbleitervorrichtung mit Mehrlagen-Verbindungsstruktur. |
JPH0831575B2 (ja) * | 1993-02-12 | 1996-03-27 | 日本電気株式会社 | 半導体記憶装置 |
JP3219909B2 (ja) * | 1993-07-09 | 2001-10-15 | 株式会社東芝 | 半導体装置の製造方法 |
KR0135840B1 (ko) * | 1994-07-26 | 1998-04-29 | 김광호 | 개구부 매몰(filling)장치와 이를 이용한 반도체소자 제조방법 |
JP3528350B2 (ja) * | 1995-08-25 | 2004-05-17 | ソニー株式会社 | 半導体装置の製造方法 |
US5904563A (en) * | 1996-05-20 | 1999-05-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for metal alignment mark generation |
US6020263A (en) * | 1996-10-31 | 2000-02-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of recovering alignment marks after chemical mechanical polishing of tungsten |
US5898227A (en) * | 1997-02-18 | 1999-04-27 | International Business Machines Corporation | Alignment targets having enhanced contrast |
US5783490A (en) * | 1997-04-21 | 1998-07-21 | Vanguard International Semiconductor Corporation | Photolithography alignment mark and manufacturing method |
US5972793A (en) * | 1997-06-09 | 1999-10-26 | Vanguard International Semiconductor Corporation | Photolithography alignment mark manufacturing process in tungsten CMP metallization |
US5863825A (en) * | 1997-09-29 | 1999-01-26 | Lsi Logic Corporation | Alignment mark contrast enhancement |
US6184104B1 (en) | 1998-09-10 | 2001-02-06 | Chartered Semiconductor Manufacturing Ltd. | Alignment mark strategy for oxide CMP |
DE19903196A1 (de) * | 1999-01-27 | 2000-08-10 | Siemens Ag | Verfahren zur Verbesserung der Erkennbarkeit von Alignmentmarken |
KR100293378B1 (ko) * | 1999-08-31 | 2001-06-15 | 윤종용 | 반도체 장치의 제조방법 |
DE10000759C1 (de) * | 2000-01-11 | 2001-05-23 | Infineon Technologies Ag | Verfahren zur Erzeugung von Justiermarken |
US6780775B2 (en) * | 2001-01-24 | 2004-08-24 | Infineon Technologies Ag | Design of lithography alignment and overlay measurement marks on CMP finished damascene surface |
JP4468609B2 (ja) * | 2001-05-21 | 2010-05-26 | 株式会社ルネサステクノロジ | 半導体装置 |
US6979526B2 (en) * | 2002-06-03 | 2005-12-27 | Infineon Technologies Ag | Lithography alignment and overlay measurement marks formed by resist mask blocking for MRAMs |
US6858441B2 (en) * | 2002-09-04 | 2005-02-22 | Infineon Technologies Ag | MRAM MTJ stack to conductive line alignment method |
US7508034B2 (en) * | 2002-09-25 | 2009-03-24 | Sharp Kabushiki Kaisha | Single-crystal silicon substrate, SOI substrate, semiconductor device, display device, and manufacturing method of semiconductor device |
US7675174B2 (en) | 2003-05-13 | 2010-03-09 | Stmicroelectronics, Inc. | Method and structure of a thick metal layer using multiple deposition chambers |
EP1642330A4 (de) * | 2003-06-24 | 2011-09-28 | Ibm | Planares magnetisches tunnel-sperrschicht-substrat mit ausgesparten ausrichtungsmarkierungen |
TWI288428B (en) * | 2004-01-21 | 2007-10-11 | Seiko Epson Corp | Alignment method, method for manufacturing a semiconductor device, substrate for a semiconductor device, electronic equipment |
US7223612B2 (en) * | 2004-07-26 | 2007-05-29 | Infineon Technologies Ag | Alignment of MTJ stack to conductive lines in the absence of topography |
US7442624B2 (en) * | 2004-08-02 | 2008-10-28 | Infineon Technologies Ag | Deep alignment marks on edge chips for subsequent alignment of opaque layers |
CN101116185B (zh) * | 2005-03-01 | 2010-04-21 | 富士通微电子株式会社 | 半导体装置的制造方法 |
JP4610447B2 (ja) * | 2005-08-31 | 2011-01-12 | Okiセミコンダクタ株式会社 | 半導体装置とその製造方法及び検査方法 |
JP2008166351A (ja) * | 2006-12-27 | 2008-07-17 | Nec Electronics Corp | 半導体装置 |
JP2011238652A (ja) * | 2010-05-06 | 2011-11-24 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
CN102569257B (zh) * | 2010-12-08 | 2016-01-20 | 无锡华润上华科技有限公司 | 线宽测试结构 |
WO2018117654A1 (ko) | 2016-12-20 | 2018-06-28 | 에스케이이노베이션 주식회사 | 파우치형 이차 전지 및 이의 제조 방법 |
US10515903B2 (en) * | 2018-05-18 | 2019-12-24 | International Business Machines Corporation | Selective CVD alignment-mark topography assist for non-volatile memory |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5952867A (ja) * | 1982-09-20 | 1984-03-27 | Ricoh Co Ltd | 絶縁層に識別記号を刻設した半導体装置及びその製造方法 |
JPS60229334A (ja) * | 1984-04-26 | 1985-11-14 | Fujitsu Ltd | 半導体装置の製造方法 |
US4641420A (en) * | 1984-08-30 | 1987-02-10 | At&T Bell Laboratories | Metalization process for headless contact using deposited smoothing material |
EP0199030A3 (de) * | 1985-04-11 | 1987-08-26 | Siemens Aktiengesellschaft | Verfahren zum Herstellen einer Mehrlagenverdrahtung von integrierten Halbleiterschaltungen mit mindestens einer aus einer Aluminiumlegierung bestehenden Leitbahnebene mit Kontaktlochauffüllung |
US4630357A (en) * | 1985-08-02 | 1986-12-23 | Ncr Corporation | Method for forming improved contacts between interconnect layers of an integrated circuit |
US4632724A (en) * | 1985-08-19 | 1986-12-30 | International Business Machines Corporation | Visibility enhancement of first order alignment marks |
DE3735449A1 (de) * | 1987-10-20 | 1989-05-03 | Convac Gmbh | Fertigungssystem fuer halbleitersubstrate |
JP2788275B2 (ja) * | 1988-06-06 | 1998-08-20 | キヤノン株式会社 | 半導体装置の製造方法 |
JPH0230113A (ja) * | 1988-07-20 | 1990-01-31 | Sony Corp | 半導体集積回路装置 |
JPH0250414A (ja) * | 1988-08-12 | 1990-02-20 | Oki Electric Ind Co Ltd | 半導体素子の製造方法 |
PT95232B (pt) * | 1989-09-09 | 1998-06-30 | Canon Kk | Processo de producao de uma pelicula de aluminio depositada |
-
1991
- 1991-06-28 AT AT91305871T patent/ATE135848T1/de not_active IP Right Cessation
- 1991-06-28 EP EP91305871A patent/EP0465152B1/de not_active Expired - Lifetime
- 1991-06-28 MY MYPI91001181A patent/MY109605A/en unknown
- 1991-06-28 DE DE69118031T patent/DE69118031T2/de not_active Expired - Fee Related
- 1991-06-29 CN CN91105290A patent/CN1024730C/zh not_active Expired - Fee Related
- 1991-06-29 KR KR1019910011038A patent/KR940010490B1/ko not_active IP Right Cessation
-
1994
- 1994-01-19 US US08/183,254 patent/US5482893A/en not_active Expired - Fee Related
-
1995
- 1995-09-29 US US08/536,791 patent/US5663099A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0465152A2 (de) | 1992-01-08 |
ATE135848T1 (de) | 1996-04-15 |
KR940010490B1 (ko) | 1994-10-24 |
US5482893A (en) | 1996-01-09 |
CN1061872A (zh) | 1992-06-10 |
KR920001622A (ko) | 1992-01-30 |
CN1024730C (zh) | 1994-05-25 |
MY109605A (en) | 1997-03-31 |
EP0465152B1 (de) | 1996-03-20 |
US5663099A (en) | 1997-09-02 |
EP0465152A3 (en) | 1992-04-15 |
DE69118031D1 (de) | 1996-04-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |