DE69125793T2 - Halbleiteranordnung und Verpackungssystem für Halbleiteranordnung - Google Patents

Halbleiteranordnung und Verpackungssystem für Halbleiteranordnung

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Publication number
DE69125793T2
DE69125793T2 DE69125793T DE69125793T DE69125793T2 DE 69125793 T2 DE69125793 T2 DE 69125793T2 DE 69125793 T DE69125793 T DE 69125793T DE 69125793 T DE69125793 T DE 69125793T DE 69125793 T2 DE69125793 T2 DE 69125793T2
Authority
DE
Germany
Prior art keywords
semiconductor device
packaging system
packaging
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69125793T
Other languages
English (en)
Other versions
DE69125793D1 (de
Inventor
Takashi Tsukamoto
Sachiyuki Abe
Tetsuo Yabushita
Yoshimitsu Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of DE69125793D1 publication Critical patent/DE69125793D1/de
Application granted granted Critical
Publication of DE69125793T2 publication Critical patent/DE69125793T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • G06F15/76—Architectures of general purpose stored program computers
    • G06F15/78—Architectures of general purpose stored program computers comprising a single central processing unit
    • G06F15/7828—Architectures of general purpose stored program computers comprising a single central processing unit without memory
    • G06F15/7835—Architectures of general purpose stored program computers comprising a single central processing unit without memory on more than one IC chip
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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DE69125793T 1990-10-22 1991-10-22 Halbleiteranordnung und Verpackungssystem für Halbleiteranordnung Expired - Fee Related DE69125793T2 (de)

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Families Citing this family (109)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6355976B1 (en) * 1992-05-14 2002-03-12 Reveo, Inc Three-dimensional packaging technology for multi-layered integrated circuits
US5786629A (en) * 1992-05-14 1998-07-28 Reveo, Inc. 3-D packaging using massive fillo-leaf technology
US5634821A (en) * 1992-12-01 1997-06-03 Crane, Jr.; Stanford W. High-density electrical interconnect system
TW238431B (de) 1992-12-01 1995-01-11 Stanford W Crane Jr
JP3293334B2 (ja) * 1993-08-25 2002-06-17 セイコーエプソン株式会社 半導体装置及びその製造方法
WO1995010852A1 (en) * 1993-10-12 1995-04-20 Atmel Corporation Bonding of leads directly over chip active areas
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
AU2093795A (en) 1994-03-11 1995-09-25 Panda Project, The Modular architecture for high bandwidth computers
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US5541449A (en) * 1994-03-11 1996-07-30 The Panda Project Semiconductor chip carrier affording a high-density external interface
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US5543586A (en) * 1994-03-11 1996-08-06 The Panda Project Apparatus having inner layers supporting surface-mount components
US5705047A (en) * 1994-04-29 1998-01-06 National Science Council Method for manufacturing porous blue light emitting diode
US5576931A (en) * 1994-05-03 1996-11-19 The Panda Project Computer with two fans and two air circulation areas
US5654204A (en) * 1994-07-20 1997-08-05 Anderson; James C. Die sorter
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5870290A (en) * 1994-11-30 1999-02-09 Intel Corporation Interface adapter board having arrays of interstitial connectors and an intermediate switching circuit
US5613033A (en) * 1995-01-18 1997-03-18 Dell Usa, Lp Laminated module for stacking integrated circuits
US5701233A (en) * 1995-01-23 1997-12-23 Irvine Sensors Corporation Stackable modules and multimodular assemblies
US5642262A (en) * 1995-02-23 1997-06-24 Altera Corporation High-density programmable logic device in a multi-chip module package with improved interconnect scheme
JP2944449B2 (ja) * 1995-02-24 1999-09-06 日本電気株式会社 半導体パッケージとその製造方法
US5783870A (en) * 1995-03-16 1998-07-21 National Semiconductor Corporation Method for connecting packages of a stacked ball grid array structure
US5649179A (en) * 1995-05-19 1997-07-15 Motorola, Inc. Dynamic instruction allocation for a SIMD processor
US5739584A (en) * 1995-06-07 1998-04-14 Lsi Logic Corporation Multiple pin die package
US5633530A (en) * 1995-10-24 1997-05-27 United Microelectronics Corporation Multichip module having a multi-level configuration
US5821619A (en) * 1995-12-07 1998-10-13 Dallas Semiconductor Corp. Replaceable power module
US5798564A (en) * 1995-12-21 1998-08-25 Texas Instruments Incorporated Multiple chip module apparatus having dual sided substrate
US6169329B1 (en) * 1996-04-02 2001-01-02 Micron Technology, Inc. Semiconductor devices having interconnections using standardized bonding locations and methods of designing
US5748452A (en) * 1996-07-23 1998-05-05 International Business Machines Corporation Multi-electronic device package
US5973924A (en) * 1996-09-09 1999-10-26 Intel Corporation Symmetric multi-processor-package design
US6133637A (en) * 1997-01-24 2000-10-17 Rohm Co., Ltd. Semiconductor device having a plurality of semiconductor chips
US6515370B2 (en) 1997-03-10 2003-02-04 Seiko Epson Corporation Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board
JP3349058B2 (ja) * 1997-03-21 2002-11-20 ローム株式会社 複数のｉｃチップを備えた半導体装置の構造
US5915167A (en) * 1997-04-04 1999-06-22 Elm Technology Corporation Three dimensional structure memory
US6195268B1 (en) * 1997-06-09 2001-02-27 Floyd K. Eide Stacking layers containing enclosed IC chips
US6413797B2 (en) 1997-10-09 2002-07-02 Rohm Co., Ltd. Semiconductor device and method for making the same
US6016256A (en) 1997-11-14 2000-01-18 The Panda Project Multi-chip module having interconnect dies
JP2000208698A (ja) 1999-01-18 2000-07-28 Toshiba Corp 半導体装置
US6078102A (en) * 1998-03-03 2000-06-20 Silicon Bandwidth, Inc. Semiconductor die package for mounting in horizontal and upright configurations
US6297548B1 (en) * 1998-06-30 2001-10-02 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6093029A (en) * 1998-09-08 2000-07-25 S3 Incorporated Vertically stackable integrated circuit
US7026718B1 (en) 1998-09-25 2006-04-11 Stmicroelectronics, Inc. Stacked multi-component integrated circuit microprocessor
US6141869A (en) 1998-10-26 2000-11-07 Silicon Bandwidth, Inc. Apparatus for and method of manufacturing a semiconductor die carrier
JP3538045B2 (ja) * 1998-12-09 2004-06-14 三菱電機株式会社 Ｒｆ回路モジュール
US6305987B1 (en) 1999-02-12 2001-10-23 Silicon Bandwidth, Inc. Integrated connector and semiconductor die package
US6624508B2 (en) * 2000-01-03 2003-09-23 Sophia Wireless, Inc. High frequency, low cost package for semiconductor devices
US6631555B1 (en) * 2000-02-08 2003-10-14 Cardiac Pacemakers, Inc. Method of thin film deposition as an active conductor
DE10030994A1 (de) * 2000-06-30 2002-01-17 Infineon Technologies Ag Halbleiter-Chip
US7273769B1 (en) * 2000-08-16 2007-09-25 Micron Technology, Inc. Method and apparatus for removing encapsulating material from a packaged microelectronic device
US6614121B1 (en) * 2000-08-21 2003-09-02 Advanced Micro Devices, Inc. Vertical cache configuration
US7337522B2 (en) * 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
US6885106B1 (en) 2001-01-11 2005-04-26 Tessera, Inc. Stacked microelectronic assemblies and methods of making same
WO2002095879A1 (en) * 2001-05-18 2002-11-28 Sophia Wireless, Inc. A high frequency, low cost package for semiconductor devices
US20030002267A1 (en) * 2001-06-15 2003-01-02 Mantz Frank E. I/O interface structure
US20020190367A1 (en) * 2001-06-15 2002-12-19 Mantz Frank E. Slice interconnect structure
US6787916B2 (en) * 2001-09-13 2004-09-07 Tru-Si Technologies, Inc. Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity
US6573461B2 (en) 2001-09-20 2003-06-03 Dpac Technologies Corp Retaining ring interconnect used for 3-D stacking
US6573460B2 (en) * 2001-09-20 2003-06-03 Dpac Technologies Corp Post in ring interconnect using for 3-D stacking
US6977440B2 (en) 2001-10-09 2005-12-20 Tessera, Inc. Stacked packages
US6897565B2 (en) 2001-10-09 2005-05-24 Tessera, Inc. Stacked packages
US7335995B2 (en) 2001-10-09 2008-02-26 Tessera, Inc. Microelectronic assembly having array including passive elements and interconnects
KR20030066004A (ko) * 2002-02-04 2003-08-09 삼성전기주식회사 기판상의 플래쉬롬 조립구조
KR20030083306A (ko) * 2002-04-20 2003-10-30 삼성전자주식회사 메모리 카드
KR100461721B1 (ko) * 2002-05-27 2004-12-14 삼성전기주식회사 리드 방열 세라믹 패키지
US6906407B2 (en) * 2002-07-09 2005-06-14 Lucent Technologies Inc. Field programmable gate array assembly
US6710246B1 (en) * 2002-08-02 2004-03-23 National Semiconductor Corporation Apparatus and method of manufacturing a stackable package for a semiconductor device
US6965160B2 (en) * 2002-08-15 2005-11-15 Micron Technology, Inc. Semiconductor dice packages employing at least one redistribution layer
WO2004017399A1 (en) * 2002-08-16 2004-02-26 Tessera, Inc. Microelectronic packages with self-aligning features
US7246431B2 (en) * 2002-09-06 2007-07-24 Tessera, Inc. Methods of making microelectronic packages including folded substrates
US7294928B2 (en) * 2002-09-06 2007-11-13 Tessera, Inc. Components, methods and assemblies for stacked packages
US7071547B2 (en) 2002-09-11 2006-07-04 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
JP2006502587A (ja) * 2002-10-11 2006-01-19 テッセラ，インコーポレイテッド マルチチップパッケージ用のコンポーネント、方法およびアセンブリ
US6723585B1 (en) 2002-10-31 2004-04-20 National Semiconductor Corporation Leadless package
US6856010B2 (en) * 2002-12-05 2005-02-15 Staktek Group L.P. Thin scale outline package
US6781243B1 (en) * 2003-01-22 2004-08-24 National Semiconductor Corporation Leadless leadframe package substitute and stack package
JP4131935B2 (ja) 2003-02-18 2008-08-13 株式会社東芝 インターフェイスモジュールとインターフェイスモジュール付ｌｓｉパッケージ及びその実装方法
US20040207990A1 (en) * 2003-04-21 2004-10-21 Rose Andrew C. Stair-step signal routing
US7061121B2 (en) 2003-11-12 2006-06-13 Tessera, Inc. Stacked microelectronic assemblies with central contacts
DE10353139B4 (de) * 2003-11-14 2008-12-04 Fachhochschule Stralsund Stapelbares modulares Gehäusesystem und ein Verfahren zu dessen Herstellung
US20050127490A1 (en) * 2003-12-16 2005-06-16 Black Bryan P. Multi-die processor
US6974333B2 (en) * 2004-03-30 2005-12-13 General Electric Company High-density connection between multiple circuit boards
US7368695B2 (en) * 2004-05-03 2008-05-06 Tessera, Inc. Image sensor package and fabrication method
US7419852B2 (en) * 2004-08-27 2008-09-02 Micron Technology, Inc. Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies
JP4548264B2 (ja) * 2005-08-01 2010-09-22 株式会社デンソー 車両用交流発電機
US20070070608A1 (en) * 2005-09-29 2007-03-29 Skyworks Solutions, Inc. Packaged electronic devices and process of manufacturing same
US7545029B2 (en) 2006-08-18 2009-06-09 Tessera, Inc. Stack microelectronic assemblies
US7901989B2 (en) 2006-10-10 2011-03-08 Tessera, Inc. Reconstituted wafer level stacking
US8513789B2 (en) 2006-10-10 2013-08-20 Tessera, Inc. Edge connect wafer level stacking with leads extending along edges
CN101809739B (zh) 2007-07-27 2014-08-20 泰塞拉公司 具有后应用的衬垫延长部分的重构晶片堆封装
GB0716055D0 (en) * 2007-08-17 2007-09-26 Regan Timothy J Vertical distribution of planar signals in stacked integrated circuits
KR100895812B1 (ko) * 2007-10-31 2009-05-08 주식회사 하이닉스반도체 적층 반도체 패키지
SG142321A1 (en) * 2008-04-24 2009-11-26 Micron Technology Inc Pre-encapsulated cavity interposer
CN102067310B (zh) * 2008-06-16 2013-08-21 泰塞拉公司 带有边缘触头的晶片级芯片规模封装的堆叠及其制造方法
US20100140750A1 (en) * 2008-12-10 2010-06-10 Qualcomm Incorporated Parallel Plane Memory and Processor Coupling in a 3-D Micro-Architectural System
US8310835B2 (en) 2009-07-14 2012-11-13 Apple Inc. Systems and methods for providing vias through a modular component
US9483266B2 (en) * 2013-03-15 2016-11-01 Intel Corporation Fusible instructions and logic to provide OR-test and AND-test functionality using multiple test sources
US9886277B2 (en) 2013-03-15 2018-02-06 Intel Corporation Methods and apparatus for fusing instructions to provide OR-test and AND-test functionality on multiple test sources
US10468363B2 (en) 2015-08-10 2019-11-05 X-Celeprint Limited Chiplets with connection posts
US10580735B2 (en) 2016-10-07 2020-03-03 Xcelsis Corporation Stacked IC structure with system level wiring on multiple sides of the IC die
US10580757B2 (en) 2016-10-07 2020-03-03 Xcelsis Corporation Face-to-face mounted IC dies with orthogonal top interconnect layers
KR102647767B1 (ko) 2016-10-07 2024-03-13 엑셀시스 코포레이션 직접-접합된 네이티브 상호접속부 및 능동 베이스 다이
US10672745B2 (en) 2016-10-07 2020-06-02 Xcelsis Corporation 3D processor
US10672744B2 (en) 2016-10-07 2020-06-02 Xcelsis Corporation 3D compute circuit with high density Z-axis interconnects
US10600691B2 (en) 2016-10-07 2020-03-24 Xcelsis Corporation 3D chip sharing power interconnect layer
US10672743B2 (en) 2016-10-07 2020-06-02 Xcelsis Corporation 3D Compute circuit with high density z-axis interconnects
US10672663B2 (en) 2016-10-07 2020-06-02 Xcelsis Corporation 3D chip sharing power circuit
US10719762B2 (en) 2017-08-03 2020-07-21 Xcelsis Corporation Three dimensional chip structure implementing machine trained network
CN110739258A (zh) * 2018-07-20 2020-01-31 东泰高科装备科技有限公司 一种晶片取片分离装置及方法
US11599299B2 (en) 2019-11-19 2023-03-07 Invensas Llc 3D memory circuit

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT964669B (it) * 1972-07-14 1974-01-31 Olivetti & Co Spa Calcolatrice elettronica da tavolo con logica a circuiti mos
FR2244207B1 (de) * 1973-09-17 1977-01-07
US3984813A (en) * 1974-10-07 1976-10-05 Fairchild Camera And Instrument Corporation Microprocessor system
GB2053566B (en) * 1979-07-02 1984-05-02 Mostek Corp Integrated circuit package
JPS56167340A (en) * 1980-05-27 1981-12-23 Toshiba Corp Junction of semicondctor pellet with substrate
JPS5988852A (ja) * 1982-11-12 1984-05-22 Toshiba Corp 集積回路用パツケ−ジ装置
JPS60225438A (ja) * 1984-04-23 1985-11-09 Seiko Epson Corp Ｉｃ実装構造
JPS6154656A (ja) * 1984-08-24 1986-03-18 Fujitsu Ltd 半導体装置
JPS61287133A (ja) * 1985-06-13 1986-12-17 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS62285434A (ja) * 1986-06-03 1987-12-11 Texas Instr Japan Ltd 半導体装置
JPS634633A (ja) * 1986-06-25 1988-01-09 Hitachi Ltd バンプレスフイルムキヤリア
US4763188A (en) * 1986-08-08 1988-08-09 Thomas Johnson Packaging system for multiple semiconductor devices
EP0262530B1 (de) * 1986-09-23 1993-06-23 Siemens Aktiengesellschaft Halbleiterbauelemente mit Leistungs-MOSFET und Steuerschaltung
JPH01214035A (ja) * 1988-02-22 1989-08-28 Canon Inc 電気回路装置
JPS6438725A (en) * 1987-08-04 1989-02-09 Seiko Epson Corp Projection type display device
JP2548602B2 (ja) * 1988-04-12 1996-10-30 株式会社日立製作所 半導体実装モジュール
US4862322A (en) * 1988-05-02 1989-08-29 Bickford Harry R Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
JPH0262069A (ja) * 1988-08-26 1990-03-01 Nec Corp 半導体装置
JPH0682707B2 (ja) * 1988-10-21 1994-10-19 日本電気株式会社 半導体装置
JPH02142151A (ja) * 1988-11-22 1990-05-31 Nec Corp 集積回路装置
US4994902A (en) * 1988-11-30 1991-02-19 Hitachi, Ltd. Semiconductor devices and electronic system incorporating them
JPH02187880A (ja) * 1989-01-13 1990-07-24 Seiko Epson Corp ワンチップマイクロコンピュータ
US4953060A (en) * 1989-05-05 1990-08-28 Ncr Corporation Stackable integrated circuit chip package with improved heat removal
US5012323A (en) * 1989-11-20 1991-04-30 Micron Technology, Inc. Double-die semiconductor package having a back-bonded die and a face-bonded die interconnected on a single leadframe

Also Published As

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JP2876773B2 (ja) 1999-03-31
DE69125793D1 (de) 1997-05-28
JPH04158565A (ja) 1992-06-01
US5376825A (en) 1994-12-27

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