DE69126152T2 - Lichtemittierende Halbleitervorrichtung mit Gallium-Nitrid-Verbindung - Google Patents
Lichtemittierende Halbleitervorrichtung mit Gallium-Nitrid-VerbindungInfo
- Publication number
- DE69126152T2 DE69126152T2 DE69126152T DE69126152T DE69126152T2 DE 69126152 T2 DE69126152 T2 DE 69126152T2 DE 69126152 T DE69126152 T DE 69126152T DE 69126152 T DE69126152 T DE 69126152T DE 69126152 T2 DE69126152 T2 DE 69126152T2
- Authority
- DE
- Germany
- Prior art keywords
- light emitting
- emitting device
- semiconductor light
- compound semiconductor
- gallium nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/025—Physical imperfections, e.g. particular concentration or distribution of impurities
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5021290A JP2681094B2 (ja) | 1990-02-28 | 1990-02-28 | 窒化ガリウム系化合物半導体発光素子 |
JP5020990A JP2623466B2 (ja) | 1990-02-28 | 1990-02-28 | 窒化ガリウム系化合物半導体発光素子 |
JP5021190A JP3193981B2 (ja) | 1990-02-28 | 1990-02-28 | 窒化ガリウム系化合物半導体発光素子 |
JP5021090A JP3193980B2 (ja) | 1990-02-28 | 1990-02-28 | 窒化ガリウム系化合物半導体発光素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69126152D1 DE69126152D1 (de) | 1997-06-26 |
DE69126152T2 true DE69126152T2 (de) | 1997-11-13 |
Family
ID=27462459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69126152T Expired - Lifetime DE69126152T2 (de) | 1990-02-28 | 1991-02-27 | Lichtemittierende Halbleitervorrichtung mit Gallium-Nitrid-Verbindung |
Country Status (4)
Country | Link |
---|---|
US (4) | US5733796A (de) |
EP (1) | EP0444630B1 (de) |
CA (1) | CA2037198C (de) |
DE (1) | DE69126152T2 (de) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0444630B1 (de) * | 1990-02-28 | 1997-05-21 | Toyoda Gosei Co., Ltd. | Lichtemittierende Halbleitervorrichtung mit Gallium-Nitrid-Verbindung |
US6362017B1 (en) * | 1990-02-28 | 2002-03-26 | Toyoda Gosei Co., Ltd. | Light-emitting semiconductor device using gallium nitride group compound |
US7235819B2 (en) * | 1991-03-18 | 2007-06-26 | The Trustees Of Boston University | Semiconductor device having group III nitride buffer layer and growth layers |
DE4313798A1 (de) * | 1992-04-28 | 1993-11-04 | Toyoda Gosei Kk | Lichtemittierendes halbleiterbauelement aus einer verbindung der gallium-nitrid-gruppe |
DE69333250T2 (de) * | 1992-07-23 | 2004-09-16 | Toyoda Gosei Co., Ltd. | Lichtemittierende Vorrichtung aus einer Verbindung der Galliumnitridgruppe |
CN1132253C (zh) * | 1995-08-31 | 2003-12-24 | 株式会社东芝 | 氮化镓基半导体发光元件及其制造方法 |
US5930656A (en) * | 1996-10-21 | 1999-07-27 | Kabushiki Kaisha Toshiba | Method of fabricating a compound semiconductor device |
JPH10294531A (ja) * | 1997-02-21 | 1998-11-04 | Toshiba Corp | 窒化物化合物半導体発光素子 |
AU747260B2 (en) | 1997-07-25 | 2002-05-09 | Nichia Chemical Industries, Ltd. | Nitride semiconductor device |
JP3955367B2 (ja) * | 1997-09-30 | 2007-08-08 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 光半導体素子およびその製造方法 |
JP2000201050A (ja) * | 1998-11-02 | 2000-07-18 | Ngk Insulators Ltd | 表面弾性波装置用基板およびその製造方法 |
US20010042866A1 (en) | 1999-02-05 | 2001-11-22 | Carrie Carter Coman | Inxalygazn optical emitters fabricated via substrate removal |
JP3770014B2 (ja) | 1999-02-09 | 2006-04-26 | 日亜化学工業株式会社 | 窒化物半導体素子 |
EP1168539B1 (de) | 1999-03-04 | 2009-12-16 | Nichia Corporation | Nitridhalbleiterlaserelement |
US6596079B1 (en) | 2000-03-13 | 2003-07-22 | Advanced Technology Materials, Inc. | III-V nitride substrate boule and method of making and using the same |
US6391748B1 (en) | 2000-10-03 | 2002-05-21 | Texas Tech University | Method of epitaxial growth of high quality nitride layers on silicon substrates |
JP3866540B2 (ja) * | 2001-07-06 | 2007-01-10 | 株式会社東芝 | 窒化物半導体素子およびその製造方法 |
JP3758537B2 (ja) * | 2001-07-23 | 2006-03-22 | 豊田合成株式会社 | Iii族窒化物系化合物半導体の製造方法 |
US6881983B2 (en) * | 2002-02-25 | 2005-04-19 | Kopin Corporation | Efficient light emitting diodes and lasers |
US6911079B2 (en) * | 2002-04-19 | 2005-06-28 | Kopin Corporation | Method for reducing the resistivity of p-type II-VI and III-V semiconductors |
US7002180B2 (en) * | 2002-06-28 | 2006-02-21 | Kopin Corporation | Bonding pad for gallium nitride-based light-emitting device |
WO2003107442A2 (en) | 2002-06-17 | 2003-12-24 | Kopin Corporation | Electrode for p-type gallium nitride-based semiconductors |
US6734091B2 (en) | 2002-06-28 | 2004-05-11 | Kopin Corporation | Electrode for p-type gallium nitride-based semiconductors |
US6955985B2 (en) | 2002-06-28 | 2005-10-18 | Kopin Corporation | Domain epitaxy for thin film growth |
US7122841B2 (en) | 2003-06-04 | 2006-10-17 | Kopin Corporation | Bonding pad for gallium nitride-based light-emitting devices |
JP4342853B2 (ja) * | 2003-07-01 | 2009-10-14 | 独立行政法人科学技術振興機構 | 基板上への窒化物薄膜の成長方法及び窒化物薄膜装置 |
US20050040212A1 (en) * | 2003-08-23 | 2005-02-24 | Kuang-Neng Yang | Method for manufacturing nitride light-emitting device |
US20050179046A1 (en) * | 2004-02-13 | 2005-08-18 | Kopin Corporation | P-type electrodes in gallium nitride-based light-emitting devices |
US20050179042A1 (en) * | 2004-02-13 | 2005-08-18 | Kopin Corporation | Monolithic integration and enhanced light extraction in gallium nitride-based light-emitting devices |
KR100486614B1 (ko) * | 2004-03-05 | 2005-05-03 | 에피밸리 주식회사 | 낮은 접촉저항을 가지는 ⅲ-질화물반도체 발광소자 |
KR100486177B1 (ko) * | 2004-03-25 | 2005-05-06 | 에피밸리 주식회사 | Ⅲ-질화물 반도체 발광소자 |
WO2006057485A1 (en) * | 2004-11-29 | 2006-06-01 | Epivalley Co., Ltd. | Iii-nitride semiconductor light emitting device |
US8168000B2 (en) * | 2005-06-15 | 2012-05-01 | International Rectifier Corporation | III-nitride semiconductor device fabrication |
KR100565894B1 (ko) * | 2005-07-06 | 2006-03-31 | (주)룩셀런트 | 3족 질화물 반도체 발광소자의 활성층을 제어하는 방법 |
KR101008285B1 (ko) * | 2005-10-28 | 2011-01-13 | 주식회사 에피밸리 | 3족 질화물 반도체 발광소자 |
KR101008588B1 (ko) * | 2005-11-16 | 2011-01-17 | 주식회사 에피밸리 | 3족 질화물 반도체 발광소자 |
WO2007119919A1 (en) * | 2006-04-18 | 2007-10-25 | Epivalley Co., Ltd. | Iii-nitride semiconductor light emitting device and method for manufacturing the same |
US20080315240A1 (en) * | 2006-08-31 | 2008-12-25 | Epivalley Co., Ltd. | III-Nitride Semiconductor light Emitting Device |
JP2008127252A (ja) * | 2006-11-22 | 2008-06-05 | Hitachi Cable Ltd | 窒化物半導体インゴット及びこれから得られる窒化物半導体基板並びに窒化物半導体インゴットの製造方法 |
KR20090034163A (ko) * | 2007-10-02 | 2009-04-07 | 주식회사 에피밸리 | 3족 질화물 반도체 발광소자 |
KR20090034169A (ko) * | 2007-10-02 | 2009-04-07 | 주식회사 에피밸리 | 3족 질화물 반도체 발광소자 |
KR100947676B1 (ko) * | 2007-12-17 | 2010-03-16 | 주식회사 에피밸리 | 3족 질화물 반도체 발광소자 |
KR100972852B1 (ko) * | 2007-12-31 | 2010-07-28 | 주식회사 에피밸리 | 3족 질화물 반도체 발광소자 및 그 제조방법 |
KR20090073935A (ko) * | 2007-12-31 | 2009-07-03 | 주식회사 에피밸리 | 3족 질화물 반도체 발광소자 |
TWI362769B (en) * | 2008-05-09 | 2012-04-21 | Univ Nat Chiao Tung | Light emitting device and fabrication method therefor |
KR100941616B1 (ko) * | 2008-05-15 | 2010-02-11 | 주식회사 에피밸리 | 반도체 발광소자 |
KR100988041B1 (ko) * | 2008-05-15 | 2010-10-18 | 주식회사 에피밸리 | 반도체 발광소자 |
KR100997908B1 (ko) * | 2008-09-10 | 2010-12-02 | 박은현 | 3족 질화물 반도체 발광소자 |
KR100981275B1 (ko) * | 2008-09-25 | 2010-09-10 | 주식회사 에피밸리 | 3족 질화물 반도체 발광소자 |
KR101009651B1 (ko) * | 2008-10-15 | 2011-01-19 | 박은현 | 3족 질화물 반도체 발광소자 |
US20100102338A1 (en) * | 2008-10-24 | 2010-04-29 | Epivalley Co., Ltd. | III-Nitride Semiconductor Light Emitting Device |
US20100102352A1 (en) * | 2008-10-24 | 2010-04-29 | Epivalley Co., Ltd. | III-Nitride Semiconductor Light Emitting Device |
US8101965B2 (en) * | 2008-12-02 | 2012-01-24 | Epivalley Co., Ltd. | III-nitride semiconductor light emitting device having a multilayered pad |
KR100960280B1 (ko) * | 2008-12-02 | 2010-06-04 | 주식회사 에피밸리 | 3족 질화물 반도체 발광소자 |
US20100140656A1 (en) * | 2008-12-04 | 2010-06-10 | Epivalley Co., Ltd. | Semiconductor Light-Emitting Device |
KR101000276B1 (ko) * | 2008-12-04 | 2010-12-10 | 주식회사 에피밸리 | 반도체 발광소자 |
KR101134063B1 (ko) * | 2009-09-30 | 2012-04-13 | 주식회사 세미콘라이트 | 3족 질화물 반도체 발광소자 |
WO2011083551A1 (ja) | 2010-01-06 | 2011-07-14 | パナソニック株式会社 | 窒化物系半導体発光素子およびその製造方法 |
JP2012104528A (ja) * | 2010-11-08 | 2012-05-31 | Sharp Corp | 窒化物半導体発光素子 |
Family Cites Families (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4929771A (de) | 1972-07-17 | 1974-03-16 | ||
JPS5042785A (de) * | 1973-08-20 | 1975-04-18 | ||
DE2738329A1 (de) * | 1976-09-06 | 1978-03-09 | Philips Nv | Elektrolumineszierende galliumnitridhalbleiteranordnung und verfahren zu deren herstellung |
SU773795A1 (ru) * | 1977-04-01 | 1980-10-23 | Предприятие П/Я А-1172 | Светоизлучающий прибор |
JPS5931232B2 (ja) * | 1977-11-17 | 1984-07-31 | 松下電器産業株式会社 | GaN発光素子 |
JPS5471589A (en) * | 1977-11-17 | 1979-06-08 | Matsushita Electric Ind Co Ltd | Production of gan light emitting element |
JPS6026079B2 (ja) | 1979-10-17 | 1985-06-21 | 松下電器産業株式会社 | 窒化ガリウムの成長方法 |
JPS6016758B2 (ja) | 1979-10-19 | 1985-04-27 | 松下電器産業株式会社 | 窒化ガリウム発光素子およびその製造方法 |
US4396929A (en) * | 1979-10-19 | 1983-08-02 | Matsushita Electric Industrial Company, Ltd. | Gallium nitride light-emitting element and method of manufacturing the same |
JPS6055996B2 (ja) | 1979-12-05 | 1985-12-07 | 松下電器産業株式会社 | 電場発光半導体装置 |
JPS5718377A (en) * | 1980-07-08 | 1982-01-30 | Matsushita Electric Ind Co Ltd | Light emitting element |
JPS601826B2 (ja) * | 1980-09-03 | 1985-01-17 | 日本国有鉄道 | リニアモ−タの停止位置検出装置 |
JPS5787184A (en) * | 1980-11-19 | 1982-05-31 | Sanyo Electric Co Ltd | Gan blue light emitting element |
JPS57153479A (en) * | 1981-03-17 | 1982-09-22 | Matsushita Electric Ind Co Ltd | Nitride gallium light emitting element |
JPS5812381A (ja) * | 1981-07-16 | 1983-01-24 | Sanyo Electric Co Ltd | GaN青色発光素子 |
JPS5846686A (ja) * | 1981-09-14 | 1983-03-18 | Sanyo Electric Co Ltd | 青色発光素子 |
FR2514566A1 (fr) * | 1982-02-02 | 1983-04-15 | Bagratishvili Givi | Dispositif emetteur de lumiere semi-conducteur a base de nitrure de gallium et procede de fabrication dudit dispositif |
JPS58200527A (ja) | 1982-05-18 | 1983-11-22 | Oki Electric Ind Co Ltd | 化合物半導体薄膜の製造方法 |
JPS59228776A (ja) * | 1983-06-10 | 1984-12-22 | Nippon Telegr & Teleph Corp <Ntt> | 半導体ヘテロ接合素子 |
JPS6095919A (ja) * | 1983-10-31 | 1985-05-29 | Toshiba Corp | 半導体素子およびその製造方法 |
JPS60173829A (ja) | 1984-02-14 | 1985-09-07 | Nippon Telegr & Teleph Corp <Ntt> | 化合物半導体薄膜の成長方法 |
JPS60175468A (ja) | 1984-02-21 | 1985-09-09 | Matsushita Electric Ind Co Ltd | 窒化ガリウム半導体装置の製造方法 |
JPS617671A (ja) * | 1984-06-21 | 1986-01-14 | Matsushita Electric Ind Co Ltd | 窒化ガリウム半導体装置 |
US4614961A (en) * | 1984-10-09 | 1986-09-30 | Honeywell Inc. | Tunable cut-off UV detector based on the aluminum gallium nitride material system |
JPS62119196A (ja) * | 1985-11-18 | 1987-05-30 | Univ Nagoya | 化合物半導体の成長方法 |
US4911102A (en) * | 1987-01-31 | 1990-03-27 | Toyoda Gosei Co., Ltd. | Process of vapor growth of gallium nitride and its apparatus |
US5218216A (en) * | 1987-01-31 | 1993-06-08 | Toyoda Gosei Co., Ltd. | Gallium nitride group semiconductor and light emitting diode comprising it and the process of producing the same |
EP0277597B1 (de) * | 1987-01-31 | 1994-07-13 | Toyoda Gosei Co., Ltd. | Gallium-Nitrid Halbleiter-Lumisneszenzdiode sowie Verfahren zu deren Herstellung |
JPH079999B2 (ja) * | 1987-01-31 | 1995-02-01 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体発光素子 |
JPS63188938A (ja) | 1987-01-31 | 1988-08-04 | Toyoda Gosei Co Ltd | 窒化ガリウム系化合物半導体の気相成長方法 |
US4844989A (en) * | 1987-03-19 | 1989-07-04 | The University Of Chicago (Arch Development Corp.) | Superconducting structure with layers of niobium nitride and aluminum nitride |
US4945548A (en) | 1988-04-28 | 1990-07-31 | Digital Equipment Corporation | Method and apparatus for detecting impending overflow and/or underrun of elasticity buffer |
US4946548A (en) * | 1988-04-29 | 1990-08-07 | Toyoda Gosei Co., Ltd. | Dry etching method for semiconductor |
JP2829311B2 (ja) | 1988-08-01 | 1998-11-25 | 豊田合成株式会社 | 発光素子の製造方法 |
JP2829319B2 (ja) * | 1988-09-16 | 1998-11-25 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体発光素子 |
JP3140751B2 (ja) * | 1988-09-16 | 2001-03-05 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体発光素子 |
JPH0281484A (ja) * | 1988-09-16 | 1990-03-22 | Toyoda Gosei Co Ltd | 窒化ガリウム系化合物半導体発光素子 |
DE68919408T2 (de) * | 1989-01-13 | 1995-04-20 | Toshiba Kawasaki Kk | Verbindungshalbleiter, denselben anwendendes Halbleiter-Bauelement und Herstellungsverfahren des Halbleiter-Bauelementes. |
JP2809690B2 (ja) * | 1989-01-13 | 1998-10-15 | 株式会社東芝 | 化合物半導体材料とこれを用いた半導体素子およびその製造方法 |
JP2704181B2 (ja) * | 1989-02-13 | 1998-01-26 | 日本電信電話株式会社 | 化合物半導体単結晶薄膜の成長方法 |
JPH06101587B2 (ja) * | 1989-03-01 | 1994-12-12 | 日本電信電話株式会社 | 半導体発光素子 |
JP3026087B2 (ja) * | 1989-03-01 | 2000-03-27 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体の気相成長方法 |
JP2809692B2 (ja) * | 1989-04-28 | 1998-10-15 | 株式会社東芝 | 半導体発光素子およびその製造方法 |
JP2809691B2 (ja) * | 1989-04-28 | 1998-10-15 | 株式会社東芝 | 半導体レーザ |
JPH034549A (ja) * | 1989-06-01 | 1991-01-10 | Sumitomo Metal Ind Ltd | 試料保持装置 |
DE69023956T2 (de) * | 1989-06-16 | 1996-04-25 | Toshiba Kawasaki Kk | Verfahren zur Herstellung eines III-V-Verbindungshalbleiterbauelementes. |
JP2768742B2 (ja) | 1989-06-30 | 1998-06-25 | 株式会社東芝 | バイポーラトランジスタ |
JP3034549B2 (ja) | 1990-02-28 | 2000-04-17 | ティーディーケイ株式会社 | 電子写真用磁性トナー、電子写真用磁性トナーの製造方法および画像形成方法 |
JP2623466B2 (ja) | 1990-02-28 | 1997-06-25 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体発光素子 |
EP0444630B1 (de) * | 1990-02-28 | 1997-05-21 | Toyoda Gosei Co., Ltd. | Lichtemittierende Halbleitervorrichtung mit Gallium-Nitrid-Verbindung |
US5278433A (en) | 1990-02-28 | 1994-01-11 | Toyoda Gosei Co., Ltd. | Light-emitting semiconductor device using gallium nitride group compound with double layer structures for the n-layer and/or the i-layer |
JP3078821B2 (ja) * | 1990-05-30 | 2000-08-21 | 豊田合成株式会社 | 半導体のドライエッチング方法 |
JP3160914B2 (ja) * | 1990-12-26 | 2001-04-25 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体レーザダイオード |
JP3633636B2 (ja) * | 1993-02-05 | 2005-03-30 | 住友電気工業株式会社 | 窒化アルミニウム焼結体 |
-
1991
- 1991-02-27 EP EP91102921A patent/EP0444630B1/de not_active Expired - Lifetime
- 1991-02-27 DE DE69126152T patent/DE69126152T2/de not_active Expired - Lifetime
- 1991-02-27 CA CA002037198A patent/CA2037198C/en not_active Expired - Lifetime
-
1995
- 1995-11-09 US US08/556,232 patent/US5733796A/en not_active Expired - Lifetime
-
1997
- 1997-10-23 US US08/956,950 patent/US6249012B1/en not_active Expired - Fee Related
-
1999
- 1999-10-14 US US09/417,778 patent/US6593599B1/en not_active Expired - Fee Related
-
2000
- 2000-10-02 US US09/677,788 patent/US6607595B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2037198C (en) | 1996-04-23 |
DE69126152D1 (de) | 1997-06-26 |
US6607595B1 (en) | 2003-08-19 |
EP0444630B1 (de) | 1997-05-21 |
US6249012B1 (en) | 2001-06-19 |
US5733796A (en) | 1998-03-31 |
EP0444630A1 (de) | 1991-09-04 |
US6593599B1 (en) | 2003-07-15 |
CA2037198A1 (en) | 1991-08-29 |
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