DE69201923D1 - Gerät und Verfahren zum Einbrennen. - Google Patents

Gerät und Verfahren zum Einbrennen.

Info

Publication number
DE69201923D1
DE69201923D1 DE69201923T DE69201923T DE69201923D1 DE 69201923 D1 DE69201923 D1 DE 69201923D1 DE 69201923 T DE69201923 T DE 69201923T DE 69201923 T DE69201923 T DE 69201923T DE 69201923 D1 DE69201923 D1 DE 69201923D1
Authority
DE
Germany
Prior art keywords
burning apparatus
burning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69201923T
Other languages
English (en)
Other versions
DE69201923T2 (de
Inventor
Tatsuya Hashinaga
Masanori Nishiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3179774A external-priority patent/JPH0529417A/ja
Priority claimed from JP3189019A external-priority patent/JPH0536778A/ja
Priority claimed from JP3192307A external-priority patent/JPH0536790A/ja
Priority claimed from JP3192312A external-priority patent/JPH0536793A/ja
Priority claimed from JP3192310A external-priority patent/JPH0536791A/ja
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE69201923D1 publication Critical patent/DE69201923D1/de
Publication of DE69201923T2 publication Critical patent/DE69201923T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2849—Environmental or reliability testing, e.g. burn-in or validation tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
DE69201923T 1991-07-19 1992-07-17 Gerät und Verfahren zum Einbrennen. Expired - Fee Related DE69201923T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP3179774A JPH0529417A (ja) 1991-07-19 1991-07-19 バーンイン方法および装置
JP3189019A JPH0536778A (ja) 1991-07-29 1991-07-29 バーンイン方法および装置
JP3192307A JPH0536790A (ja) 1991-07-31 1991-07-31 バーンイン方法および装置
JP3192312A JPH0536793A (ja) 1991-07-31 1991-07-31 バーンイン方法および装置
JP3192310A JPH0536791A (ja) 1991-07-31 1991-07-31 バーンイン方法および装置

Publications (2)

Publication Number Publication Date
DE69201923D1 true DE69201923D1 (de) 1995-05-11
DE69201923T2 DE69201923T2 (de) 1995-10-05

Family

ID=27528758

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69201923T Expired - Fee Related DE69201923T2 (de) 1991-07-19 1992-07-17 Gerät und Verfahren zum Einbrennen.

Country Status (7)

Country Link
US (2) US5327075A (de)
EP (1) EP0523735B1 (de)
KR (1) KR960003989B1 (de)
AU (1) AU657976B2 (de)
CA (1) CA2073886A1 (de)
DE (1) DE69201923T2 (de)
MY (1) MY131275A (de)

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US6998862B2 (en) * 2003-04-28 2006-02-14 Micron Technology, Inc. Test socket for semiconductor components having serviceable nest
US20050012516A1 (en) * 2003-07-18 2005-01-20 Sung-Pei Hou Burn-in socket adapt to assembly sensor thereon
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US7265561B2 (en) * 2003-09-30 2007-09-04 International Business Machines Corporation Device burn in utilizing voltage control
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Also Published As

Publication number Publication date
US5414370A (en) 1995-05-09
DE69201923T2 (de) 1995-10-05
AU2033592A (en) 1993-02-11
KR960003989B1 (ko) 1996-03-25
CA2073886A1 (en) 1993-01-20
US5327075A (en) 1994-07-05
KR930003443A (ko) 1993-02-24
AU657976B2 (en) 1995-03-30
EP0523735A1 (de) 1993-01-20
EP0523735B1 (de) 1995-04-05
MY131275A (en) 2007-07-31

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