DE69208480T2 - Nukleationsvergrösserung für die chemische dampfabscheidung von diamanten - Google Patents

Nukleationsvergrösserung für die chemische dampfabscheidung von diamanten

Info

Publication number
DE69208480T2
DE69208480T2 DE69208480T DE69208480T DE69208480T2 DE 69208480 T2 DE69208480 T2 DE 69208480T2 DE 69208480 T DE69208480 T DE 69208480T DE 69208480 T DE69208480 T DE 69208480T DE 69208480 T2 DE69208480 T2 DE 69208480T2
Authority
DE
Germany
Prior art keywords
diamonds
nucleation
magnification
vapor deposition
chemical vapor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69208480T
Other languages
English (en)
Other versions
DE69208480D1 (de
Inventor
Brian R Stoner
Jeffrey T Glass
William M Hooke
Bradley Earl Williams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of North Carolina at Chapel Hill
North Carolina State University
University of California
Original Assignee
University of North Carolina at Chapel Hill
North Carolina State University
University of California
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of North Carolina at Chapel Hill, North Carolina State University, University of California filed Critical University of North Carolina at Chapel Hill
Application granted granted Critical
Publication of DE69208480D1 publication Critical patent/DE69208480D1/de
Publication of DE69208480T2 publication Critical patent/DE69208480T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26Deposition of carbon only
    • C23C16/27Diamond only
    • C23C16/274Diamond only using microwave discharges
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02Pretreatment of the material to be coated
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4581Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/10Heating of the reaction chamber or the substrate
    • C30B25/105Heating of the reaction chamber or the substrate by irradiation or electric discharge
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/04Diamond
DE69208480T 1991-12-20 1992-12-18 Nukleationsvergrösserung für die chemische dampfabscheidung von diamanten Expired - Fee Related DE69208480T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US81142591A 1991-12-20 1991-12-20
US07/937,481 US5397428A (en) 1991-12-20 1992-08-28 Nucleation enhancement for chemical vapor deposition of diamond
PCT/US1992/011091 WO1993013242A1 (en) 1991-12-20 1992-12-18 Nucleation enhancement for chemical vapor deposition of diamond

Publications (2)

Publication Number Publication Date
DE69208480D1 DE69208480D1 (de) 1996-03-28
DE69208480T2 true DE69208480T2 (de) 1996-11-14

Family

ID=27123471

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69208480T Expired - Fee Related DE69208480T2 (de) 1991-12-20 1992-12-18 Nukleationsvergrösserung für die chemische dampfabscheidung von diamanten

Country Status (8)

Country Link
US (5) US5397428A (de)
EP (1) EP0617741B1 (de)
JP (1) JP2648394B2 (de)
KR (1) KR0170441B1 (de)
AU (1) AU665054B2 (de)
CA (1) CA2125873A1 (de)
DE (1) DE69208480T2 (de)
WO (1) WO1993013242A1 (de)

Families Citing this family (182)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5902640A (en) * 1991-11-25 1999-05-11 The University Of Chicago Method of improving field emission characteristics of diamond thin films
DE4233085C2 (de) * 1992-10-01 1996-10-10 Fraunhofer Ges Forschung Verfahren zur Herstellung heteroepitaktischer Diamantschichten
GB9309346D0 (en) * 1993-05-06 1993-06-16 Kobe Steel Europ Ltd Preparation of nucleated silicon surfaces
US6835523B1 (en) 1993-05-09 2004-12-28 Semiconductor Energy Laboratory Co., Ltd. Apparatus for fabricating coating and method of fabricating the coating
JP3755904B2 (ja) * 1993-05-14 2006-03-15 株式会社神戸製鋼所 ダイヤモンド整流素子
JPH0786311A (ja) * 1993-05-14 1995-03-31 Kobe Steel Ltd 高配向性ダイヤモンド薄膜電界効果トランジスタ
JP3176493B2 (ja) * 1993-09-17 2001-06-18 株式会社神戸製鋼所 高配向性ダイヤモンド薄膜の形成方法
GB9405029D0 (en) * 1994-03-15 1994-04-27 Franks Joseph Dr Improved catheters and other tubular inserts
US5670777A (en) * 1994-04-14 1997-09-23 Semiconductor Energy Laboratory Co., Ltd. Photosensitive device and two frequency driving method thereof
DE4427715C1 (de) * 1994-08-05 1996-02-08 Daimler Benz Ag Komposit-Struktur mit auf einer Diamantschicht und/oder einer diamantähnlichen Schicht angeordneter Halbleiterschicht sowie ein Verfahren zu deren Herstellung
US5576589A (en) * 1994-10-13 1996-11-19 Kobe Steel Usa, Inc. Diamond surface acoustic wave devices
US5637950A (en) * 1994-10-31 1997-06-10 Lucent Technologies Inc. Field emission devices employing enhanced diamond field emitters
US5852341A (en) * 1994-11-14 1998-12-22 Crystallume Diamond film with sharp field emission turn-on
US5592053A (en) * 1994-12-06 1997-01-07 Kobe Steel Usa, Inc. Diamond target electron beam device
DE19514079A1 (de) * 1995-04-13 1996-10-17 Siemens Ag Verfahren zum Passivieren einer Siliciumcarbid-Oberfläche gegenüber Sauerstoff
DE19514542C2 (de) * 1995-04-20 1997-07-31 Daimler Benz Ag Komposit-Struktur und Verfahren zu deren Herstellung
US6054719A (en) * 1995-04-20 2000-04-25 Damilerchrysler Ag Composite structure of an electronic component
US5803967A (en) * 1995-05-31 1998-09-08 Kobe Steel Usa Inc. Method of forming diamond devices having textured and highly oriented diamond layers therein
GB9514558D0 (en) 1995-07-17 1995-09-13 Gersan Ets Marking diamond
JP3728467B2 (ja) * 1995-08-04 2005-12-21 株式会社神戸製鋼所 単結晶ダイヤモンド膜の形成方法
US6060839A (en) * 1995-08-09 2000-05-09 Thermotrex Corporation Thin diamond electron beam amplifier
US5652436A (en) * 1995-08-14 1997-07-29 Kobe Steel Usa Inc. Smooth diamond based mesa structures
US5961718A (en) * 1995-10-16 1999-10-05 National Science Council Process for selectively depositing diamond films
US5726524A (en) * 1996-05-31 1998-03-10 Minnesota Mining And Manufacturing Company Field emission device having nanostructured emitters
KR100262259B1 (ko) * 1996-06-12 2000-07-15 모리시타 요이찌 다이아몬드막 및 그 제조방법
US5952060A (en) * 1996-06-14 1999-09-14 Applied Materials, Inc. Use of carbon-based films in extending the lifetime of substrate processing system components
US5812362A (en) * 1996-06-14 1998-09-22 Applied Materials, Inc. Method and apparatus for the use of diamond films as dielectric coatings on electrostatic chucks
US6342277B1 (en) * 1996-08-16 2002-01-29 Licensee For Microelectronics: Asm America, Inc. Sequential chemical vapor deposition
US6287900B1 (en) * 1996-08-13 2001-09-11 Semiconductor Energy Laboratory Co., Ltd Semiconductor device with catalyst addition and removal
CN1116451C (zh) * 1996-08-15 2003-07-30 时至准钟表股份有限公司 导衬的内周面上形成的硬质碳膜的剥离方法
US5872415A (en) * 1996-08-16 1999-02-16 Kobe Steel Usa Inc. Microelectronic structures including semiconductor islands
US5907768A (en) * 1996-08-16 1999-05-25 Kobe Steel Usa Inc. Methods for fabricating microelectronic structures including semiconductor islands
JPH10101481A (ja) * 1996-08-27 1998-04-21 Samsung Electron Co Ltd ダイアモンド薄膜のヘテロエピタクシサイクリックテクスチャー成長法
JP3461274B2 (ja) 1996-10-16 2003-10-27 株式会社東芝 半導体装置
US5696385A (en) * 1996-12-13 1997-12-09 Motorola Field emission device having reduced row-to-column leakage
US6037240A (en) * 1997-01-23 2000-03-14 Daimlerchrysler Ag Growth substrate having growth nuclei made of diamonds and/or diamond-like carbon arranged on its growth surface as well as process for a uniform nucleation on the growth substrate
US5801401A (en) * 1997-01-29 1998-09-01 Micron Technology, Inc. Flash memory with microcrystalline silicon carbide film floating gate
US5852306A (en) * 1997-01-29 1998-12-22 Micron Technology, Inc. Flash memory with nanocrystalline silicon film floating gate
US6356014B2 (en) * 1997-03-27 2002-03-12 Candescent Technologies Corporation Electron emitters coated with carbon containing layer
DE19718517C2 (de) * 1997-05-02 2000-08-10 Daimler Chrysler Ag Verfahren zum Aufbringen von Diamant auf einem mikroelektronischen Bauteil
GB2325439A (en) 1997-05-23 1998-11-25 Gersan Ets Marking diamond gemstone by plasma or ion beam etching through a laser ablated resist
US6161499A (en) * 1997-07-07 2000-12-19 Cvd Diamond Corporation Apparatus and method for nucleation and deposition of diamond using hot-filament DC plasma
US6746893B1 (en) 1997-07-29 2004-06-08 Micron Technology, Inc. Transistor with variable electron affinity gate and methods of fabrication and use
US7154153B1 (en) 1997-07-29 2006-12-26 Micron Technology, Inc. Memory device
US6031263A (en) * 1997-07-29 2000-02-29 Micron Technology, Inc. DEAPROM and transistor with gallium nitride or gallium aluminum nitride gate
US6794255B1 (en) 1997-07-29 2004-09-21 Micron Technology, Inc. Carburized silicon gate insulators for integrated circuits
US7196929B1 (en) 1997-07-29 2007-03-27 Micron Technology Inc Method for operating a memory device having an amorphous silicon carbide gate insulator
US6936849B1 (en) 1997-07-29 2005-08-30 Micron Technology, Inc. Silicon carbide gate transistor
US5886368A (en) 1997-07-29 1999-03-23 Micron Technology, Inc. Transistor with silicon oxycarbide gate and methods of fabrication and use
US6965123B1 (en) 1997-07-29 2005-11-15 Micron Technology, Inc. Transistor with variable electron affinity gate and methods of fabrication and use
US5926740A (en) * 1997-10-27 1999-07-20 Micron Technology, Inc. Graded anti-reflective coating for IC lithography
KR100279051B1 (ko) * 1997-09-23 2001-02-01 박호군 다이아몬드 전계방출 소자의 제조방법
US6013191A (en) * 1997-10-27 2000-01-11 Advanced Refractory Technologies, Inc. Method of polishing CVD diamond films by oxygen plasma
US6143655A (en) 1998-02-25 2000-11-07 Micron Technology, Inc. Methods and structures for silver interconnections in integrated circuits
US6121126A (en) 1998-02-25 2000-09-19 Micron Technologies, Inc. Methods and structures for metal interconnections in integrated circuits
US6492694B2 (en) 1998-02-27 2002-12-10 Micron Technology, Inc. Highly conductive composite polysilicon gate for CMOS integrated circuits
JP3189780B2 (ja) * 1998-03-24 2001-07-16 日本電気株式会社 半導体装置の製造装置及びその製造方法
SE9801881D0 (sv) 1998-05-28 1998-05-28 Asea Brown Boveri A switching device
US6479939B1 (en) * 1998-10-16 2002-11-12 Si Diamond Technology, Inc. Emitter material having a plurlarity of grains with interfaces in between
FR2786794B1 (fr) * 1998-12-02 2001-03-02 Commissariat Energie Atomique Couche monoatomique et monocristalline de grande taille, en carbone de type diamant, et procede de fabrication de cette couche
US6107643A (en) * 1999-03-24 2000-08-22 Abb Ab Photoconductive switch with doping adapted to the intensity distribution of an illumination source thereof
US6064145A (en) * 1999-06-04 2000-05-16 Winbond Electronics Corporation Fabrication of field emitting tips
US6447851B1 (en) * 1999-07-14 2002-09-10 The University Of Chicago Field emission from bias-grown diamond thin films in a microwave plasma
US6395090B1 (en) 1999-08-16 2002-05-28 Ford Global Technologies, Inc. Masking for engine blocks for thermally sprayed coatings
TW483945B (en) * 1999-11-10 2002-04-21 Nat Science Council Field emission device film deposition manufacture process
US6605352B1 (en) * 2000-01-06 2003-08-12 Saint-Gobain Ceramics & Plastics, Inc. Corrosion and erosion resistant thin film diamond coating and applications therefor
US6392257B1 (en) * 2000-02-10 2002-05-21 Motorola Inc. Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same
US6693033B2 (en) * 2000-02-10 2004-02-17 Motorola, Inc. Method of removing an amorphous oxide from a monocrystalline surface
US6410101B1 (en) 2000-02-16 2002-06-25 Motorola, Inc. Method for scrubbing and passivating a surface of a field emission display
GB0006318D0 (en) * 2000-03-15 2000-05-03 De Beers Ind Diamond Radiation detector
AU2001264866A1 (en) * 2000-05-23 2001-12-03 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. A process and apparatus for plasma activated deposition in vacuum
US6620723B1 (en) 2000-06-27 2003-09-16 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US6551929B1 (en) 2000-06-28 2003-04-22 Applied Materials, Inc. Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US7101795B1 (en) * 2000-06-28 2006-09-05 Applied Materials, Inc. Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
US7732327B2 (en) 2000-06-28 2010-06-08 Applied Materials, Inc. Vapor deposition of tungsten materials
US7964505B2 (en) 2005-01-19 2011-06-21 Applied Materials, Inc. Atomic layer deposition of tungsten materials
WO2002009187A2 (en) * 2000-07-24 2002-01-31 Motorola, Inc. Heterojunction tunneling diodes and process for fabricating same
DE10043512A1 (de) * 2000-09-01 2002-03-28 Daimler Chrysler Ag Wärmeleitschicht aus Diamant bei mikroelektronischen Bauteilen sowie Verfahren zur Herstellung einer Wärmeleitschicht aus Diamant bei mikroelektronischen Bauteilen
US6638838B1 (en) 2000-10-02 2003-10-28 Motorola, Inc. Semiconductor structure including a partially annealed layer and method of forming the same
US7132309B2 (en) 2003-04-22 2006-11-07 Chien-Min Sung Semiconductor-on-diamond devices and methods of forming
US6814130B2 (en) * 2000-10-13 2004-11-09 Chien-Min Sung Methods of making diamond tools using reverse casting of chemical vapor deposition
US7011134B2 (en) * 2000-10-13 2006-03-14 Chien-Min Sung Casting method for producing surface acoustic wave devices
DE10061278B4 (de) * 2000-12-08 2004-09-16 GFD-Gesellschaft für Diamantprodukte mbH Instrument für chirurgische Zwecke
US6558380B2 (en) 2000-12-08 2003-05-06 Gfd Gesellschaft Fur Diamantprodukte Mbh Instrument for surgical purposes and method of cleaning same
US6765178B2 (en) * 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US6825447B2 (en) 2000-12-29 2004-11-30 Applied Materials, Inc. Apparatus and method for uniform substrate heating and contaminate collection
US20020096683A1 (en) * 2001-01-19 2002-07-25 Motorola, Inc. Structure and method for fabricating GaN devices utilizing the formation of a compliant substrate
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6673646B2 (en) 2001-02-28 2004-01-06 Motorola, Inc. Growth of compound semiconductor structures on patterned oxide films and process for fabricating same
US6660126B2 (en) 2001-03-02 2003-12-09 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6734020B2 (en) 2001-03-07 2004-05-11 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
FR2823770B1 (fr) * 2001-04-19 2004-05-21 Commissariat Energie Atomique Procede de traitement de la surface d'un materiau semiconducteur, utilisant notamment l'hydrogene, et surface obtenue par ce procede
US6736984B2 (en) 2001-05-17 2004-05-18 Honeywell International Inc. Non-mechanical fabrication of carbon-containing work pieces
US6849545B2 (en) 2001-06-20 2005-02-01 Applied Materials, Inc. System and method to form a composite film stack utilizing sequential deposition techniques
US6709989B2 (en) 2001-06-21 2004-03-23 Motorola, Inc. Method for fabricating a semiconductor structure including a metal oxide interface with silicon
US7211144B2 (en) 2001-07-13 2007-05-01 Applied Materials, Inc. Pulsed nucleation deposition of tungsten layers
US20030010992A1 (en) * 2001-07-16 2003-01-16 Motorola, Inc. Semiconductor structure and method for implementing cross-point switch functionality
US6646293B2 (en) 2001-07-18 2003-11-11 Motorola, Inc. Structure for fabricating high electron mobility transistors utilizing the formation of complaint substrates
US6693298B2 (en) 2001-07-20 2004-02-17 Motorola, Inc. Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same
US6855992B2 (en) * 2001-07-24 2005-02-15 Motorola Inc. Structure and method for fabricating configurable transistor devices utilizing the formation of a compliant substrate for materials used to form the same
US6667196B2 (en) 2001-07-25 2003-12-23 Motorola, Inc. Method for real-time monitoring and controlling perovskite oxide film growth and semiconductor structure formed using the method
US7085616B2 (en) 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US6639249B2 (en) 2001-08-06 2003-10-28 Motorola, Inc. Structure and method for fabrication for a solid-state lighting device
US6589856B2 (en) 2001-08-06 2003-07-08 Motorola, Inc. Method and apparatus for controlling anti-phase domains in semiconductor structures and devices
US6673667B2 (en) 2001-08-15 2004-01-06 Motorola, Inc. Method for manufacturing a substantially integral monolithic apparatus including a plurality of semiconductor materials
US20030036217A1 (en) * 2001-08-16 2003-02-20 Motorola, Inc. Microcavity semiconductor laser coupled to a waveguide
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US20030071327A1 (en) * 2001-10-17 2003-04-17 Motorola, Inc. Method and apparatus utilizing monocrystalline insulator
US7780785B2 (en) 2001-10-26 2010-08-24 Applied Materials, Inc. Gas delivery apparatus for atomic layer deposition
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US6620670B2 (en) 2002-01-18 2003-09-16 Applied Materials, Inc. Process conditions and precursors for atomic layer deposition (ALD) of AL2O3
DE50307871D1 (de) * 2002-01-25 2007-09-20 Schwerionenforsch Gmbh Detektor zur erfassung von teilchenstrahlen und verfahren zur herstellung desselben
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6998014B2 (en) 2002-01-26 2006-02-14 Applied Materials, Inc. Apparatus and method for plasma assisted deposition
US6827978B2 (en) 2002-02-11 2004-12-07 Applied Materials, Inc. Deposition of tungsten films
US6833161B2 (en) 2002-02-26 2004-12-21 Applied Materials, Inc. Cyclical deposition of tungsten nitride for metal oxide gate electrode
US7439191B2 (en) 2002-04-05 2008-10-21 Applied Materials, Inc. Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
US6720027B2 (en) 2002-04-08 2004-04-13 Applied Materials, Inc. Cyclical deposition of a variable content titanium silicon nitride layer
US6846516B2 (en) 2002-04-08 2005-01-25 Applied Materials, Inc. Multiple precursor cyclical deposition system
US6869838B2 (en) 2002-04-09 2005-03-22 Applied Materials, Inc. Deposition of passivation layers for active matrix liquid crystal display (AMLCD) applications
US6875271B2 (en) 2002-04-09 2005-04-05 Applied Materials, Inc. Simultaneous cyclical deposition in different processing regions
US7279432B2 (en) 2002-04-16 2007-10-09 Applied Materials, Inc. System and method for forming an integrated barrier layer
US6916717B2 (en) * 2002-05-03 2005-07-12 Motorola, Inc. Method for growing a monocrystalline oxide layer and for fabricating a semiconductor device on a monocrystalline substrate
US20040012037A1 (en) * 2002-07-18 2004-01-22 Motorola, Inc. Hetero-integration of semiconductor materials on silicon
US7060130B2 (en) * 2002-08-27 2006-06-13 Board Of Trustees Of Michigan State University Heteroepitaxial diamond and diamond nuclei precursors
US6821563B2 (en) 2002-10-02 2004-11-23 Applied Materials, Inc. Gas distribution system for cyclical layer deposition
US6903385B2 (en) * 2002-10-09 2005-06-07 Sensor Electronic Technology, Inc. Semiconductor structure having a textured nitride-based layer
US20040069991A1 (en) * 2002-10-10 2004-04-15 Motorola, Inc. Perovskite cuprate electronic device structure and process
US20040070312A1 (en) * 2002-10-10 2004-04-15 Motorola, Inc. Integrated circuit and process for fabricating the same
JP4207554B2 (ja) * 2002-12-12 2009-01-14 住友電気工業株式会社 光射出面上に回折光学膜を有する発光素子とその製造方法
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
US6965128B2 (en) * 2003-02-03 2005-11-15 Freescale Semiconductor, Inc. Structure and method for fabricating semiconductor microresonator devices
US7020374B2 (en) * 2003-02-03 2006-03-28 Freescale Semiconductor, Inc. Optical waveguide structure and method for fabricating the same
US20040164315A1 (en) * 2003-02-25 2004-08-26 Motorola, Inc. Structure and device including a tunneling piezoelectric switch and method of forming same
US7211508B2 (en) 2003-06-18 2007-05-01 Applied Materials, Inc. Atomic layer deposition of tantalum based barrier materials
US20050025886A1 (en) * 2003-07-14 2005-02-03 Carnegie Institution Of Washington Annealing single crystal chemical vapor depositon diamonds
GB0317854D0 (en) * 2003-07-30 2003-09-03 Element Six Ltd Method of manufacturing diamond substrates
EP1660703B1 (de) * 2003-07-30 2011-09-21 Element Six Limited Verfahren zur herstellung von diamantsubstraten
JP4113509B2 (ja) * 2004-03-09 2008-07-09 スピードファム株式会社 被研磨物保持用キャリア
TWI411710B (zh) * 2004-09-10 2013-10-11 Carnegie Inst Of Washington 超韌化學蒸氣沉積(cvd)之單一結晶鑽石及其三維生長方法
US7394103B2 (en) * 2004-09-13 2008-07-01 Uchicago Argonne, Llc All diamond self-aligned thin film transistor
US20060147631A1 (en) * 2005-01-04 2006-07-06 Lev Leonid C Method for making diamond coated substrates, articles made therefrom, and method of drilling
US20080166952A1 (en) * 2005-02-25 2008-07-10 Shin-Etsu Handotai Co., Ltd Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same
JP5163920B2 (ja) * 2005-03-28 2013-03-13 住友電気工業株式会社 ダイヤモンド単結晶基板の製造方法及びダイヤモンド単結晶基板
JP5053553B2 (ja) * 2006-03-08 2012-10-17 信越化学工業株式会社 単結晶ダイヤモンド成長用基材の製造方法
US8404313B1 (en) * 2006-03-22 2013-03-26 University Of South Florida Synthesis of nanocrystalline diamond fibers
US20070269646A1 (en) * 2006-05-18 2007-11-22 Haverty Michael G Bond termination of pores in a porous diamond dielectric material
JP4904960B2 (ja) * 2006-07-18 2012-03-28 信越半導体株式会社 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法
US8157914B1 (en) 2007-02-07 2012-04-17 Chien-Min Sung Substrate surface modifications for compositional gradation of crystalline materials and associated products
US7799600B2 (en) * 2007-05-31 2010-09-21 Chien-Min Sung Doped diamond LED devices and associated methods
US7846767B1 (en) 2007-09-06 2010-12-07 Chien-Min Sung Semiconductor-on-diamond devices and associated methods
JP4605233B2 (ja) * 2008-02-27 2011-01-05 信越半導体株式会社 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法
US8101526B2 (en) * 2008-03-12 2012-01-24 City University Of Hong Kong Method of making diamond nanopillars
WO2009114130A2 (en) * 2008-03-13 2009-09-17 Michigan State University Process and apparatus for diamond synthesis
US10040161B2 (en) * 2008-10-21 2018-08-07 Gemex Systems, Inc. Gemstone positioning fixture
US8153985B2 (en) 2009-01-30 2012-04-10 Honeywell International Inc. Neutron detector cell efficiency
US20100213175A1 (en) * 2009-02-22 2010-08-26 General Electric Company Diamond etching method and articles produced thereby
US20100276701A1 (en) * 2009-04-29 2010-11-04 Hebert Francois Low thermal resistance and robust chip-scale-package (csp), structure and method
US20110024767A1 (en) * 2009-07-30 2011-02-03 Chien Min Sung Semiconductor Substrates, Devices and Associated Methods
US8859337B2 (en) * 2009-12-15 2014-10-14 Soitec Thermal matching in semiconductor devices using heat distribution structures
KR101415552B1 (ko) * 2009-12-21 2014-07-07 주식회사 미코 접지구조물, 이를 구비하는 히터 및 화학기상 증착장치
US20110186940A1 (en) * 2010-02-03 2011-08-04 Honeywell International Inc. Neutron sensor with thin interconnect stack
US8310021B2 (en) 2010-07-13 2012-11-13 Honeywell International Inc. Neutron detector with wafer-to-wafer bonding
US8546246B2 (en) * 2011-01-13 2013-10-01 International Business Machines Corporation Radiation hardened transistors based on graphene and carbon nanotubes
US8852998B1 (en) * 2011-08-30 2014-10-07 Sandia Corporation Method to fabricate micro and nano diamond devices
CN104903490B (zh) * 2012-08-30 2017-11-07 二A科技有限公司 生产金刚石和执行实时原位分析的装置和方法
RU2557360C2 (ru) * 2012-12-20 2015-07-20 Общество с ограниченной ответственностью "Си Эн Эл Девайсез" Формирование маски для травления алмазных пленок
CN105144849B (zh) * 2013-03-15 2019-06-18 普拉斯玛比利提有限责任公司 环形等离子体处理装置
US9698454B1 (en) * 2013-07-09 2017-07-04 Calabazas Creek Research, Inc. High power RF window deposition apparatus, method, and device
US20150104648A1 (en) * 2013-10-15 2015-04-16 Nano And Advanced Materials Institute Limited Method and Apparatus of Growing Metal-free and Low Stress Thick Film of Diamond-like Carbon
US10066443B2 (en) * 2014-12-22 2018-09-04 Haliburton Energy Services, Inc. Chemically strengthened bond between thermally stable polycrystalline hard materials and braze material
US10727072B2 (en) * 2015-05-15 2020-07-28 President And Fellows Of Harvard College System and method for wafer-scale fabrication of free standing mechanical and photonic structures by ion beam etching
US9941111B2 (en) * 2015-05-29 2018-04-10 Infineon Technologies Ag Method for processing a semiconductor layer, method for processing a silicon substrate, and method for processing a silicon layer
US10584412B2 (en) 2016-03-08 2020-03-10 Ii-Vi Delaware, Inc. Substrate comprising a layer of silicon and a layer of diamond having an optically finished (or a dense) silicon-diamond interface
WO2017159682A1 (ja) * 2016-03-18 2017-09-21 三菱電機株式会社 半導体装置および半導体装置を生産する方法
US10541118B2 (en) * 2016-03-21 2020-01-21 Board Of Trustees Of Michigan State University Methods and apparatus for microwave plasma assisted chemical vapor deposition reactors
US20200286732A1 (en) * 2019-03-04 2020-09-10 Samsung Electronics Co., Ltd. Method of pre-treating substrate and method of directly forming graphene using the same
US20200411314A1 (en) * 2019-06-28 2020-12-31 HAMILTON & EADES GENETIC RESEARCH and DEVELOPMENT, LLC Diamond Seed Technology
CN113755813A (zh) * 2021-09-10 2021-12-07 安徽光智科技有限公司 一种衬底的预处理方法和金刚石膜的制备方法

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3961103A (en) * 1972-07-12 1976-06-01 Space Sciences, Inc. Film deposition
JPS5325632B2 (de) * 1973-03-22 1978-07-27
US4168213A (en) * 1976-04-29 1979-09-18 U.S. Philips Corporation Field emission device and method of forming same
DE3167761D1 (en) * 1980-01-16 1985-01-31 Nat Res Dev Method and apparatus for depositing coatings in a glow discharge
US4339304A (en) * 1980-12-30 1982-07-13 Grigoriev Anatoly P Method of treating diamond
US4691662A (en) * 1983-02-28 1987-09-08 Michigan State University Dual plasma microwave apparatus and method for treating a surface
US4698256A (en) * 1984-04-02 1987-10-06 American Cyanamid Company Articles coated with adherent diamondlike carbon films
JPS60221395A (ja) * 1984-04-19 1985-11-06 Yoshio Imai ダイヤモンド薄膜の製造方法
US4607591A (en) * 1985-08-06 1986-08-26 Spectrum Cvd, Inc. CVD heater control circuit
JPS6335495A (ja) * 1986-07-25 1988-02-16 Toshiba Tungaloy Co Ltd 高効率ダイヤモンド気相合成装置
JPS63210099A (ja) * 1987-02-26 1988-08-31 Nissin Electric Co Ltd ダイヤモンド膜の作製方法
US4863529A (en) * 1987-03-12 1989-09-05 Sumitomo Electric Industries, Ltd. Thin film single crystal diamond substrate
US4830702A (en) * 1987-07-02 1989-05-16 General Electric Company Hollow cathode plasma assisted apparatus and method of diamond synthesis
US4756794A (en) * 1987-08-31 1988-07-12 The United States Of America As Represented By The Secretary Of The Navy Atomic layer etching
JP2820206B2 (ja) * 1987-10-26 1998-11-05 東ソー株式会社 ジペプチドエステルの精製方法
US4971832A (en) * 1988-03-02 1990-11-20 Canon Kabushiki Kaisha HR-CVD process for the formation of a functional deposited film on a substrate with application of a voltage in the range of -5 to -100 V
JPH01246116A (ja) * 1988-03-29 1989-10-02 Natl Inst For Res In Inorg Mater 針状,繊維状,多孔質状ダイヤモンドまたはそれらの集合体の製造法
US4925701A (en) * 1988-05-27 1990-05-15 Xerox Corporation Processes for the preparation of polycrystalline diamond films
JPH0288497A (ja) * 1988-06-09 1990-03-28 Toshiba Corp 単結晶ダイヤモンド粒子の製造方法
JPH0258221A (ja) * 1988-08-23 1990-02-27 Semiconductor Energy Lab Co Ltd 炭素または炭素を主成分とするマスクを用いたエッチング方法
US4939763A (en) * 1988-10-03 1990-07-03 Crystallume Method for preparing diamond X-ray transmissive elements
US5030583A (en) * 1988-12-02 1991-07-09 Advanced Technolgy Materials, Inc. Method of making single crystal semiconductor substrate articles and semiconductor device
US5006914A (en) * 1988-12-02 1991-04-09 Advanced Technology Materials, Inc. Single crystal semiconductor substrate articles and semiconductor devices comprising same
JPH0620464B2 (ja) * 1989-04-03 1994-03-23 信越化学工業株式会社 医療用切開、圧入器具およびその製造方法
US5036373A (en) * 1989-06-01 1991-07-30 Semiconductor Energy Laboratory Co., Ltd. Electric device with grains and an insulating layer
DE3927136A1 (de) * 1989-08-17 1991-02-21 Philips Patentverwaltung Verfahren zur herstellung polykristalliner diamantschichten
GB2240114B (en) * 1990-01-18 1993-03-24 Stc Plc Film nucleation process
JP2763172B2 (ja) * 1990-03-19 1998-06-11 株式会社神戸製鋼所 ダイヤモンド薄膜のエッチング方法
US5126287A (en) * 1990-06-07 1992-06-30 Mcnc Self-aligned electron emitter fabrication method and devices formed thereby
US5203731A (en) * 1990-07-18 1993-04-20 International Business Machines Corporation Process and structure of an integrated vacuum microelectronic device
DE69101756T2 (de) * 1990-08-07 1994-08-04 Sumitomo Electric Industries Verfahren zur Diamantenherstellung.
US5221411A (en) * 1991-04-08 1993-06-22 North Carolina State University Method for synthesis and processing of continuous monocrystalline diamond thin films
EP0512129B1 (de) * 1991-05-03 1995-08-23 Siemens Aktiengesellschaft Drucksensor
US5169676A (en) * 1991-05-16 1992-12-08 The United States Of America As Represented By The Secretary Of The Navy Control of crystallite size in diamond film chemical vapor deposition
US5283501A (en) * 1991-07-18 1994-02-01 Motorola, Inc. Electron device employing a low/negative electron affinity electron source
US5141460A (en) * 1991-08-20 1992-08-25 Jaskie James E Method of making a field emission electron source employing a diamond coating
US5258685A (en) * 1991-08-20 1993-11-02 Motorola, Inc. Field emission electron source employing a diamond coating
US5138237A (en) * 1991-08-20 1992-08-11 Motorola, Inc. Field emission electron device employing a modulatable diamond semiconductor emitter
US5129850A (en) * 1991-08-20 1992-07-14 Motorola, Inc. Method of making a molded field emission electron emitter employing a diamond coating
JP3255960B2 (ja) * 1991-09-30 2002-02-12 株式会社神戸製鋼所 冷陰極エミッタ素子
US5199918A (en) * 1991-11-07 1993-04-06 Microelectronics And Computer Technology Corporation Method of forming field emitter device with diamond emission tips
US5290610A (en) * 1992-02-13 1994-03-01 Motorola, Inc. Forming a diamond material layer on an electron emitter using hydrocarbon reactant gases ionized by emitted electrons
US5449970A (en) * 1992-03-16 1995-09-12 Microelectronics And Computer Technology Corporation Diode structure flat panel display
US5236545A (en) * 1992-10-05 1993-08-17 The Board Of Governors Of Wayne State University Method for heteroepitaxial diamond film development
US5285089A (en) * 1992-12-02 1994-02-08 Kobe Steel U.S.A., Inc. Diamond and silicon carbide heterojunction bipolar transistor
US5410166A (en) * 1993-04-28 1995-04-25 The United States Of America As Represented By The Secretary Of The Air Force P-N junction negative electron affinity cathode

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EP0617741B1 (de) 1996-02-21
US5397428A (en) 1995-03-14
WO1993013242A1 (en) 1993-07-08
US5420443A (en) 1995-05-30
AU665054B2 (en) 1995-12-14
JPH07506799A (ja) 1995-07-27
EP0617741A1 (de) 1994-10-05
US5458733A (en) 1995-10-17
CA2125873A1 (en) 1993-07-08
JP2648394B2 (ja) 1997-08-27
US5562769A (en) 1996-10-08
DE69208480D1 (de) 1996-03-28
KR0170441B1 (ko) 1999-02-18
US5580380A (en) 1996-12-03

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