DE69210650D1 - Vorrichtung und Verfahren zum Elektroplattieren - Google Patents

Vorrichtung und Verfahren zum Elektroplattieren

Info

Publication number
DE69210650D1
DE69210650D1 DE69210650T DE69210650T DE69210650D1 DE 69210650 D1 DE69210650 D1 DE 69210650D1 DE 69210650 T DE69210650 T DE 69210650T DE 69210650 T DE69210650 T DE 69210650T DE 69210650 D1 DE69210650 D1 DE 69210650D1
Authority
DE
Germany
Prior art keywords
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69210650T
Other languages
English (en)
Other versions
DE69210650T2 (de
Inventor
Mats A Hallberg
Carl G Langenskioeld
Stefan Olin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cinram Ltd
Original Assignee
Cinram Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cinram Ltd filed Critical Cinram Ltd
Application granted granted Critical
Publication of DE69210650D1 publication Critical patent/DE69210650D1/de
Publication of DE69210650T2 publication Critical patent/DE69210650T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/619—Amorphous layers
DE69210650T 1991-02-20 1992-02-12 Vorrichtung und Verfahren zum Elektroplattieren Expired - Fee Related DE69210650T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9100507A SE467976B (sv) 1991-02-20 1991-02-20 Anordning foer elektroplaetering, vid framstaellning av matriser foer tillverkning av t ex cd-skivor samt foerfarande foer tillverkning av matriser medelst anordningen

Publications (2)

Publication Number Publication Date
DE69210650D1 true DE69210650D1 (de) 1996-06-20
DE69210650T2 DE69210650T2 (de) 1996-09-19

Family

ID=20381949

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69210650T Expired - Fee Related DE69210650T2 (de) 1991-02-20 1992-02-12 Vorrichtung und Verfahren zum Elektroplattieren

Country Status (4)

Country Link
US (2) US5244563A (de)
EP (1) EP0500513B1 (de)
DE (1) DE69210650T2 (de)
SE (1) SE467976B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE467976B (sv) * 1991-02-20 1992-10-12 Dcm Innovation Ab Anordning foer elektroplaetering, vid framstaellning av matriser foer tillverkning av t ex cd-skivor samt foerfarande foer tillverkning av matriser medelst anordningen
US5807469A (en) * 1995-09-27 1998-09-15 Intel Corporation Flexible continuous cathode contact circuit for electrolytic plating of C4, tab microbumps, and ultra large scale interconnects
DE19602182C2 (de) * 1996-01-23 1998-08-13 Technotrans Gmbh Verfahren und Vorrichtung zur thermischen Prozessteuerung bei der elektrolytischen Beschichtung von Werkzeugen für die Herstellung von CD-Datenträgern
US6174425B1 (en) * 1997-05-14 2001-01-16 Motorola, Inc. Process for depositing a layer of material over a substrate
US6001235A (en) * 1997-06-23 1999-12-14 International Business Machines Corporation Rotary plater with radially distributed plating solution
US6187164B1 (en) 1997-09-30 2001-02-13 Symyx Technologies, Inc. Method for creating and testing a combinatorial array employing individually addressable electrodes
US6818110B1 (en) * 1997-09-30 2004-11-16 Symyx Technologies, Inc. Combinatorial electrochemical deposition and testing system
US6080288A (en) * 1998-05-29 2000-06-27 Schwartz; Vladimir System for forming nickel stampers utilized in optical disc production
US6228232B1 (en) 1998-07-09 2001-05-08 Semitool, Inc. Reactor vessel having improved cup anode and conductor assembly
US6231743B1 (en) 2000-01-03 2001-05-15 Motorola, Inc. Method for forming a semiconductor device
SE0001368L (sv) * 2000-04-13 2001-10-14 Obducat Ab Apparat och förfarande för elektrokemisk bearbetning av substrat
SE0001367L (sv) * 2000-04-13 2001-10-14 Obducat Ab Apparat och förfarande för elektrokemisk bearbetning av substrat
US6610189B2 (en) * 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
AU2002343330A1 (en) * 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7118658B2 (en) * 2002-05-21 2006-10-10 Semitool, Inc. Electroplating reactor
US20040055873A1 (en) * 2002-09-24 2004-03-25 Digital Matrix Corporation Apparatus and method for improved electroforming
US20070125652A1 (en) * 2005-12-02 2007-06-07 Buckley Paul W Electroform, methods of making electroforms, and products made from electroforms
US20100320081A1 (en) 2009-06-17 2010-12-23 Mayer Steven T Apparatus for wetting pretreatment for enhanced damascene metal filling
US9455139B2 (en) 2009-06-17 2016-09-27 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US9677188B2 (en) 2009-06-17 2017-06-13 Novellus Systems, Inc. Electrofill vacuum plating cell
ES2606321T3 (es) * 2010-07-15 2017-03-23 Luxembourg Institute Of Science And Technology (List) Llenado de una cámara de impresión y mandril correspondiente
KR102113883B1 (ko) * 2012-03-13 2020-05-22 노벨러스 시스템즈, 인코포레이티드 관통 레지스트 금속 도금을 위한 웨팅 전처리의 방법들 및 장치
US9613833B2 (en) 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US9435049B2 (en) 2013-11-20 2016-09-06 Lam Research Corporation Alkaline pretreatment for electroplating
US9617648B2 (en) 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1771680A (en) * 1927-03-29 1930-07-29 Ishisaka Sansaku Apparatus for electroplating
DE2011305A1 (de) * 1970-03-10 1971-10-14 Deutsche Grammophon Gmbh Verfahren zur Vorbehandlung von mit Nickeloberflächen versehenen Galvanos, insbesondere Schallplattengalvanos
JPS5524141Y2 (de) * 1976-10-16 1980-06-09
DE3067925D1 (en) * 1979-06-01 1984-06-28 Emi Ltd High-speed plating arrangement and stamper plate formed using such an arrangement
JPS57126998A (en) * 1981-01-28 1982-08-06 Mishima Kosan Co Ltd Plating apparatus
EP0076569B1 (de) * 1981-10-01 1986-08-27 EMI Limited Elektroplattierungsvorrichtung
US4534831A (en) * 1982-09-27 1985-08-13 Inoue-Japax Research Incorporated Method of and apparatus for forming a 3D article
NL8300916A (nl) * 1983-03-14 1984-10-01 Philips Nv Werkwijze voor het galvanisch neerslaan van een homogeen dikke metaallaag, aldus verkregen metaallaag en toepassing van de aldus verkregen metaallaag, inrichting voor het uitvoeren van de werkwijze en verkregen matrijs.
US4750981A (en) * 1986-09-30 1988-06-14 The Boeing Company Apparatus for electroplating limited surfaces on a workpiece
DE3736240A1 (de) * 1987-10-27 1989-05-11 Flachglas Ag Vorrichtung zur galvanischen verstaerkung einer leiterspur auf einer glasscheibe
US4964958A (en) * 1988-10-14 1990-10-23 Philips & Du Pont Optical Company Method of producing a metal matrix
SE467976B (sv) * 1991-02-20 1992-10-12 Dcm Innovation Ab Anordning foer elektroplaetering, vid framstaellning av matriser foer tillverkning av t ex cd-skivor samt foerfarande foer tillverkning av matriser medelst anordningen

Also Published As

Publication number Publication date
US5244563A (en) 1993-09-14
EP0500513A1 (de) 1992-08-26
SE9100507L (sv) 1992-08-21
SE467976B (sv) 1992-10-12
EP0500513B1 (de) 1996-05-15
DE69210650T2 (de) 1996-09-19
US5427674A (en) 1995-06-27
SE9100507D0 (sv) 1991-02-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee