DE69217795D1 - Lichtempfängermodul - Google Patents

Lichtempfängermodul

Info

Publication number
DE69217795D1
DE69217795D1 DE69217795T DE69217795T DE69217795D1 DE 69217795 D1 DE69217795 D1 DE 69217795D1 DE 69217795 T DE69217795 T DE 69217795T DE 69217795 T DE69217795 T DE 69217795T DE 69217795 D1 DE69217795 D1 DE 69217795D1
Authority
DE
Germany
Prior art keywords
receiver module
light receiver
light
module
receiver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69217795T
Other languages
English (en)
Other versions
DE69217795T2 (de
Inventor
Goro Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP25538291A external-priority patent/JP3264284B2/ja
Priority claimed from JP3256525A external-priority patent/JP3003324B2/ja
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of DE69217795D1 publication Critical patent/DE69217795D1/de
Application granted granted Critical
Publication of DE69217795T2 publication Critical patent/DE69217795T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G02B6/364—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves inverted grooves, e.g. dovetails
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/928—Front and rear surface processing
DE69217795T 1991-10-02 1992-10-02 Lichtempfängermodul Expired - Fee Related DE69217795T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25538291A JP3264284B2 (ja) 1991-10-02 1991-10-02 光受信モジュール
JP3256525A JP3003324B2 (ja) 1991-10-03 1991-10-03 光受信モジュール

Publications (2)

Publication Number Publication Date
DE69217795D1 true DE69217795D1 (de) 1997-04-10
DE69217795T2 DE69217795T2 (de) 1997-10-09

Family

ID=26542181

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69217795T Expired - Fee Related DE69217795T2 (de) 1991-10-02 1992-10-02 Lichtempfängermodul

Country Status (3)

Country Link
US (2) US5357103A (de)
EP (1) EP0535690B1 (de)
DE (1) DE69217795T2 (de)

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DE4325955C2 (de) * 1993-07-27 1997-09-11 Siemens Ag Verfahren zum Herstellen eines Halbleitersubstrats mit integriertem Wellenleiter und daran angekoppelter optischer Faser
JP3490745B2 (ja) * 1993-10-01 2004-01-26 日本碍子株式会社 複合光導波路型光デバイス
DE69330563T2 (de) * 1993-11-08 2002-06-27 Corning Inc Kopplung von planaren optischen Wellenleitern und optischen Fasern mit geringer Rückreflexion
EP0654866A3 (de) * 1993-11-23 1997-08-20 Motorola Inc Träger zur Verbindung eines Halbleiterwürfels und Herstellungsverfahren.
CA2139086C (en) * 1993-12-27 2000-06-13 Kiyoto Matsumoto Light-receiving structure for waveguide type optical devices
US5479540A (en) * 1994-06-30 1995-12-26 The Whitaker Corporation Passively aligned bi-directional optoelectronic transceiver module assembly
US5911022A (en) * 1994-09-29 1999-06-08 Siemens Aktiengesellschaft Optical coupling arrangement
DE4445997C2 (de) * 1994-12-22 1997-07-10 Bosch Gmbh Robert Anordnung zur Ankopplung einer Lichtleitfaser an ein optisches Bauelement
US5617036A (en) * 1995-02-24 1997-04-01 The Whitaker Corporation Laser/pin assembly with integrated burn-in assembly
US5694048A (en) * 1995-02-24 1997-12-02 The Whitaker Corporation Monitor-detector assembly on silicon wafer board
US5621573A (en) * 1995-05-18 1997-04-15 The Whitaker Corporation Microoptic bidirectional module
DE19529978A1 (de) * 1995-08-16 1997-02-20 Bosch Gmbh Robert Anordnung zur Ankopplung eines Lichtwellenleiters an ein oberflächenemittierendes Sendeelement und Anordnung zur Ankopplung eines Lichtwellenleiters an ein Empfangselement
US5692084A (en) * 1996-06-11 1997-11-25 The Whitaker Corporation Package for an optoelectronic device
US5764836A (en) * 1996-06-11 1998-06-09 The Whitaker Corporation Pigtailed package for an optoelectronic device
DE19647685C1 (de) * 1996-11-07 1998-03-12 Siemens Ag Koppelanordnung
JPH10253857A (ja) * 1997-03-13 1998-09-25 Hitachi Ltd 光通信モジュール
US6136611A (en) * 1997-07-31 2000-10-24 Research International, Inc. Assay methods and apparatus
US6151430A (en) * 1998-07-08 2000-11-21 Gore Enterprise Holdings, Inc. Photonic device having an integal guide and method of manufacturing
US6205274B1 (en) 1998-07-20 2001-03-20 Honeywell Inc. Fiber optic header for an edge emitting laser
US6081638A (en) * 1998-07-20 2000-06-27 Honeywell Inc. Fiber optic header with integrated power monitor
DE19836535C1 (de) * 1998-08-06 1999-11-11 Siemens Ag Elektrooptische Koppelbaugruppe
JP2000081524A (ja) * 1998-09-07 2000-03-21 Sony Corp 光送受信システム
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JP3152907B2 (ja) * 1998-12-10 2001-04-03 沖電気工業株式会社 半導体受光素子及びその製造方法
US6587605B2 (en) * 1999-01-06 2003-07-01 Intel Corporation Method and apparatus for providing optical interconnection
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US6792178B1 (en) 2000-01-12 2004-09-14 Finisar Corporation Fiber optic header with integrated power monitor
US6890065B1 (en) 2000-07-25 2005-05-10 Lexmark International, Inc. Heater chip for an inkjet printhead
US6655853B1 (en) 2000-08-25 2003-12-02 Hrl Laboratories, Llc Optical bond-wire interconnections and a method for fabrication thereof
JP3429282B2 (ja) 2001-02-02 2003-07-22 リサーチ・インターナショナル・インコーポレーテッド 自動化されたシステム、及びサンプルの分析方法
DE10131374A1 (de) * 2001-06-28 2003-01-09 Mergeoptics Gmbh Anordnung zur Positionierung einer optischen Faser
US6717126B1 (en) * 2001-07-16 2004-04-06 Amkor Technology, Inc. Method of fabricating and using an image sensor package with reflector
US6686580B1 (en) 2001-07-16 2004-02-03 Amkor Technology, Inc. Image sensor package with reflector
GB0127689D0 (en) * 2001-11-19 2002-01-09 Denselight Semiconductors Pte Wafer scale L-I-V probing
JP2003167175A (ja) * 2001-12-04 2003-06-13 Matsushita Electric Ind Co Ltd 光実装基板及び光デバイス
JP2003207694A (ja) * 2002-01-15 2003-07-25 Nec Corp 光モジュール
GB2387479A (en) * 2002-04-08 2003-10-15 Denselight Semiconductors Pte Sacrificial side tilting mirror for on-wafer optical testing
US7197224B2 (en) * 2003-07-24 2007-03-27 Reflex Photonics Inc. Optical ferrule
US7289207B2 (en) 2003-10-28 2007-10-30 Los Alamos National Security, Llc Integrated optical biosensor system (IOBS)
US7496245B2 (en) 2004-08-20 2009-02-24 Research International, Inc. Misalignment compensating optical sensor and method
US7651869B2 (en) 2006-03-14 2010-01-26 Research International, Inc. Optical assay apparatus and methods
JP2009540597A (ja) * 2006-06-15 2009-11-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ｌｅｄ照明器具における正確な色制御、アウトカップリング、及びバックグラウンドリジェクションに関する角度選択的光センサ構造
WO2008005894A2 (en) * 2006-06-30 2008-01-10 Applied Materials, Inc. Wafer-level alignment of optical elements
KR100871252B1 (ko) * 2007-01-19 2008-11-28 삼성전자주식회사 광섬유를 이용한 광/전기 배선을 갖는 연성 인쇄회로기판
US7794158B2 (en) * 2007-10-04 2010-09-14 Hitachi Cable Ltd. Fabrication method of optical interconnection component and optical interconnection component itself
US8031993B2 (en) 2009-07-28 2011-10-04 Tyco Electronics Corporation Optical fiber interconnect device
US8611716B2 (en) * 2009-09-30 2013-12-17 Corning Incorporated Channeled substrates for integrated optical devices employing optical fibers
JP5299551B2 (ja) * 2011-12-28 2013-09-25 日立電線株式会社 光基板、光基板の製造方法、及び光モジュール構造
US8757897B2 (en) 2012-01-10 2014-06-24 Invensas Corporation Optical interposer
US9323010B2 (en) 2012-01-10 2016-04-26 Invensas Corporation Structures formed using monocrystalline silicon and/or other materials for optical and other applications
TW201344130A (zh) * 2012-04-18 2013-11-01 Hon Hai Prec Ind Co Ltd 太陽能集光裝置
US11693197B2 (en) 2021-06-25 2023-07-04 Google Llc Fixture and method for attaching fibers to V-grooves of photonic integrated circuit

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US4130343A (en) * 1977-02-22 1978-12-19 Bell Telephone Laboratories, Incorporated Coupling arrangements between a light-emitting diode and an optical fiber waveguide and between an optical fiber waveguide and a semiconductor optical detector
US4210923A (en) * 1979-01-02 1980-07-01 Bell Telephone Laboratories, Incorporated Edge illuminated photodetector with optical fiber alignment
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US4294510A (en) * 1979-12-10 1981-10-13 International Business Machines Corporation Semiconductor fiber optical detection
JPS57198420A (en) * 1981-06-01 1982-12-06 Fujitsu Ltd Coupling structure between photoelectric conversion element and fiber
JPS60172004A (ja) * 1984-02-17 1985-09-05 Fujitsu Ltd 光受光器
US4772787A (en) * 1985-01-07 1988-09-20 Siemens Aktiengesellschaft Monolithically integrated opto-electronic semiconductor component
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JPS62230065A (ja) * 1986-03-31 1987-10-08 Mitsubishi Electric Corp 半導体受光器
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US5017263A (en) * 1988-12-23 1991-05-21 At&T Bell Laboratories Optoelectronic device package method
US5071213A (en) * 1990-10-31 1991-12-10 The Boeing Company Optical coupler and method of making optical coupler

Also Published As

Publication number Publication date
EP0535690B1 (de) 1997-03-05
EP0535690A1 (de) 1993-04-07
US5466558A (en) 1995-11-14
US5357103A (en) 1994-10-18
DE69217795T2 (de) 1997-10-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee