DE69223964D1 - Leiterrahmen fuer integrierte oder aehnliche schaltungen - Google Patents

Leiterrahmen fuer integrierte oder aehnliche schaltungen

Info

Publication number
DE69223964D1
DE69223964D1 DE69223964T DE69223964T DE69223964D1 DE 69223964 D1 DE69223964 D1 DE 69223964D1 DE 69223964 T DE69223964 T DE 69223964T DE 69223964 T DE69223964 T DE 69223964T DE 69223964 D1 DE69223964 D1 DE 69223964D1
Authority
DE
Germany
Prior art keywords
integrated
ladder frame
similar circuits
circuits
similar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69223964T
Other languages
English (en)
Other versions
DE69223964T2 (de
Inventor
Jack Seidler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interplex NAS Inc
Original Assignee
North American Specialties Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by North American Specialties Corp filed Critical North American Specialties Corp
Publication of DE69223964D1 publication Critical patent/DE69223964D1/de
Application granted granted Critical
Publication of DE69223964T2 publication Critical patent/DE69223964T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
DE69223964T 1991-06-19 1992-06-19 Leiterrahmen fuer integrierte oder aehnliche schaltungen Expired - Fee Related DE69223964T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/717,681 US5176255A (en) 1991-06-19 1991-06-19 Lead frame for integrated circuits or the like and method of manufacture
PCT/US1992/005237 WO1992022923A1 (en) 1991-06-19 1992-06-19 Lead frame for integrated circuits or the like

Publications (2)

Publication Number Publication Date
DE69223964D1 true DE69223964D1 (de) 1998-02-12
DE69223964T2 DE69223964T2 (de) 1998-06-18

Family

ID=24883037

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69223964T Expired - Fee Related DE69223964T2 (de) 1991-06-19 1992-06-19 Leiterrahmen fuer integrierte oder aehnliche schaltungen

Country Status (4)

Country Link
US (2) US5176255A (de)
EP (1) EP0591414B1 (de)
DE (1) DE69223964T2 (de)
WO (1) WO1992022923A1 (de)

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US5499160A (en) * 1990-08-01 1996-03-12 Staktek Corporation High density integrated circuit module with snap-on rail assemblies
US5239806A (en) * 1990-11-02 1993-08-31 Ak Technology, Inc. Thermoplastic semiconductor package and method of producing it
US5274911A (en) * 1991-10-21 1994-01-04 American Shizuki Corporation Electronic components with leads partly solder coated
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
US5309322A (en) * 1992-10-13 1994-05-03 Motorola, Inc. Leadframe strip for semiconductor packages and method
US6205654B1 (en) * 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US5503895A (en) * 1993-09-20 1996-04-02 Bi-Link Metal Specialties Supply feedstock for workpiece finishing machine
TW270213B (de) * 1993-12-08 1996-02-11 Matsushita Electric Ind Co Ltd
JP3166460B2 (ja) * 1993-12-24 2001-05-14 松下電器産業株式会社 コネクタの実装方法
US5621244A (en) * 1994-05-16 1997-04-15 Lin; Shih-Jen Fin assembly for an integrated circuit
US5644839A (en) * 1994-06-10 1997-07-08 Xetel Corporation Surface mountable substrate edge terminal
WO1997002578A2 (en) * 1995-06-30 1997-01-23 Philips Electronics N.V. Surface-mountable electrical component
DE19533299A1 (de) * 1995-09-08 1997-03-13 Siemens Ag Mehrpolige, variable SMD-Anschlußanordnung und Verfahren zu ihrer Montage auf einem Schaltungssubstrat
US5944536A (en) * 1996-10-31 1999-08-31 Thomas & Betts Corporation Cover for an edge mounted printed circuit board connector
US6089911A (en) * 1997-12-05 2000-07-18 The Whitaker Corporation Apparatus and method for mounting a plurality of surface mount contacts
US6121674A (en) * 1998-02-23 2000-09-19 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
US6091317A (en) * 1998-07-06 2000-07-18 Ford Motor Company Temperature sensor assembly
US6977214B2 (en) * 1998-12-11 2005-12-20 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US6462408B1 (en) * 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
US6647603B2 (en) * 2001-11-05 2003-11-18 Ceramate Technical Co., Ltd. Process for manufacturing electronic device packages
US7484291B1 (en) * 2002-06-26 2009-02-03 Western Digital Technologies, Inc. Method of manufacturing a disk drive with a lead frame engaged within a host electronic unit socket
TWM250321U (en) * 2004-01-14 2004-11-11 Optimum Care Int Tech Inc Lead frame unit structure of chip with hidden position
US6979238B1 (en) * 2004-06-28 2005-12-27 Samtec, Inc. Connector having improved contacts with fusible members
US7645639B2 (en) * 2004-08-26 2010-01-12 Infineon Technologies Ag Packaging of integrated circuits to lead frames
JP2007208231A (ja) * 2006-01-06 2007-08-16 Nisshinbo Ind Inc 太陽電池セルへのタブリードのハンダ付け方法
TWM338528U (en) * 2007-12-21 2008-08-11 Universal Scient Ind Co Ltd Solder furnace with pressing plate apparatus
US8851356B1 (en) * 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US8007286B1 (en) 2008-03-18 2011-08-30 Metrospec Technology, Llc Circuit boards interconnected by overlapping plated through holes portions
US8143631B2 (en) 2008-03-06 2012-03-27 Metrospec Technology Llc Layered structure for use with high power light emitting diode systems
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
US10334735B2 (en) 2008-02-14 2019-06-25 Metrospec Technology, L.L.C. LED lighting systems and methods
DE112009000200B4 (de) * 2008-02-15 2013-05-16 Multitest Elektronische Systeme Gmbh Betätigungsvorrichtungen für eine Vorrichtung und ein Verfahren zum Ausrichten und Halten einer Mehrzahl singulierter Halbleiterbauelemente in Aufnahmetaschen eines Klemmträgers
US8410720B2 (en) * 2008-04-07 2013-04-02 Metrospec Technology, LLC. Solid state lighting circuit and controls
US20100173507A1 (en) * 2009-01-07 2010-07-08 Samtec, Inc. Electrical connector having multiple ground planes
MY152834A (en) * 2009-08-18 2014-11-28 Multitest Elektronische Syst An elastic unit for clamping an electronic component and extending below an electronic component receiving volume of an align fixture
MY152429A (en) * 2009-08-18 2014-09-30 Multitest Elektronische Syst Carrier for aligning electronic components with slidably arranged plates
MY154258A (en) * 2009-08-18 2015-05-29 Multitest Elektronische Syst Elastic unit exerting two angled force components on an abutting section of an align fixture
US7837522B1 (en) 2009-11-12 2010-11-23 Samtec, Inc. Electrical contacts with solder members and methods of attaching solder members to electrical contacts
CN104048779B (zh) * 2014-05-30 2016-07-06 合肥京东方光电科技有限公司 一种测温样本制作治具和制作设备
US10849200B2 (en) 2018-09-28 2020-11-24 Metrospec Technology, L.L.C. Solid state lighting circuit with current bias and method of controlling thereof

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Publication number Priority date Publication date Assignee Title
US2830698A (en) * 1955-04-25 1958-04-15 Erie Resistor Corp Condenser
US3702954A (en) * 1967-07-21 1972-11-14 Siemens Ag Semiconductor component and method of its production
US3902148A (en) * 1970-11-27 1975-08-26 Signetics Corp Semiconductor lead structure and assembly and method for fabricating same
GB1339660A (en) * 1971-11-20 1973-12-05 Ferranti Ltd Supports for semiconductor devices
US4054238A (en) * 1976-03-23 1977-10-18 Western Electric Company, Inc. Method, apparatus and lead frame for assembling leads with terminals on a substrate
JPS6016111B2 (ja) * 1978-02-03 1985-04-23 株式会社東芝 光結合素子用リ−ドフレ−ム
US4728589A (en) * 1980-03-11 1988-03-01 University Patents, Inc. Reversible electrochemical doping of conjugated polymers and secondary batteries based thereon
US4809054A (en) * 1986-07-25 1989-02-28 Kurt Waldner Semiconductor lead frame
JPS63228657A (ja) * 1987-03-18 1988-09-22 Hitachi Ltd 混成集積回路装置およびリ−ドフレ−ム
US4782589A (en) * 1987-04-06 1988-11-08 Dennis Richard K Process of connecting lead frame to a semi-conductor device and a device to effect same

Also Published As

Publication number Publication date
US5176255A (en) 1993-01-05
US5307929A (en) 1994-05-03
WO1992022923A1 (en) 1992-12-23
EP0591414B1 (de) 1998-01-07
EP0591414A1 (de) 1994-04-13
DE69223964T2 (de) 1998-06-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee