DE69228855T2 - Kondensator und Herstellungsverfahren - Google Patents
Kondensator und HerstellungsverfahrenInfo
- Publication number
- DE69228855T2 DE69228855T2 DE69228855T DE69228855T DE69228855T2 DE 69228855 T2 DE69228855 T2 DE 69228855T2 DE 69228855 T DE69228855 T DE 69228855T DE 69228855 T DE69228855 T DE 69228855T DE 69228855 T2 DE69228855 T2 DE 69228855T2
- Authority
- DE
- Germany
- Prior art keywords
- capacitor
- manufacturing process
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/86—Electrodes with an enlarged surface, e.g. formed by texturisation having horizontal extensions
- H01L28/88—Electrodes with an enlarged surface, e.g. formed by texturisation having horizontal extensions made by patterning layers, e.g. by etching conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
- H01L28/92—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions made by patterning layers, e.g. by etching conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/92—Capacitors with potential-jump barrier or surface barrier
- H01L29/94—Metal-insulator-semiconductors, e.g. MOS
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
- H10B12/318—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910020618A KR950003240B1 (ko) | 1991-11-19 | 1991-11-19 | 반도체 장치 및 그의 제조방법 |
KR1019920000158A KR950013382B1 (ko) | 1992-01-08 | 1992-01-08 | 커패시터 및 그 제조방법 |
KR1019920000156A KR960012255B1 (ko) | 1992-01-08 | 1992-01-08 | 커패시터 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69228855D1 DE69228855D1 (de) | 1999-05-12 |
DE69228855T2 true DE69228855T2 (de) | 1999-09-16 |
Family
ID=27348787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69228855T Expired - Fee Related DE69228855T2 (de) | 1991-11-19 | 1992-11-17 | Kondensator und Herstellungsverfahren |
Country Status (5)
Country | Link |
---|---|
US (1) | US5350707A (de) |
EP (2) | EP0543616B1 (de) |
JP (1) | JPH0831574B2 (de) |
DE (1) | DE69228855T2 (de) |
TW (2) | TW396373B (de) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5350707A (en) * | 1991-11-19 | 1994-09-27 | Samsung Electronics Co., Ltd. | Method for making a capacitor having an electrode surface with a plurality of trenches formed therein |
JP2658824B2 (ja) * | 1993-08-31 | 1997-09-30 | 日本電気株式会社 | 半導体装置の製造方法 |
US5656531A (en) * | 1993-12-10 | 1997-08-12 | Micron Technology, Inc. | Method to form hemi-spherical grain (HSG) silicon from amorphous silicon |
US5696014A (en) * | 1994-03-11 | 1997-12-09 | Micron Semiconductor, Inc. | Method for increasing capacitance of an HSG rugged capacitor using a phosphine rich oxidation and subsequent wet etch |
US5972771A (en) | 1994-03-11 | 1999-10-26 | Micron Technology, Inc. | Enhancing semiconductor structure surface area using HSG and etching |
US5427974A (en) * | 1994-03-18 | 1995-06-27 | United Microelectronics Corporation | Method for forming a capacitor in a DRAM cell using a rough overlayer of tungsten |
US5492848A (en) * | 1994-03-18 | 1996-02-20 | United Microelectronics Corp. | Stacked capacitor process using silicon nodules |
US5482885A (en) * | 1994-03-18 | 1996-01-09 | United Microelectronics Corp. | Method for forming most capacitor using poly spacer technique |
US5482882A (en) * | 1994-03-18 | 1996-01-09 | United Microelectronics Corporation | Method for forming most capacitor using polysilicon islands |
US5466627A (en) * | 1994-03-18 | 1995-11-14 | United Microelectronics Corporation | Stacked capacitor process using BPSG precipitates |
US5512768A (en) * | 1994-03-18 | 1996-04-30 | United Microelectronics Corporation | Capacitor for use in DRAM cell using surface oxidized silicon nodules |
TW236710B (de) * | 1994-04-08 | 1994-12-21 | ||
US5763286A (en) * | 1994-09-14 | 1998-06-09 | Micron Semiconductor, Inc. | Process for manufacturing a DRAM capacitor having an annularly-grooved, cup-shaped storage-node plate which stores charge on inner and outer surfaces |
US5444013A (en) * | 1994-11-02 | 1995-08-22 | Micron Technology, Inc. | Method of forming a capacitor |
US6121081A (en) * | 1994-11-15 | 2000-09-19 | Micron Technology, Inc. | Method to form hemi-spherical grain (HSG) silicon |
US5726085A (en) * | 1995-03-09 | 1998-03-10 | Texas Instruments Inc | Method of fabricating a dynamic random access memory (DRAM) cell capacitor using hemispherical grain (HSG) polysilicon and selective polysilicon etchback |
US5981992A (en) * | 1995-06-07 | 1999-11-09 | International Business Machines Corporation | Mechanical supports for very thin stacked capacitor plates |
US6027970A (en) * | 1996-05-17 | 2000-02-22 | Micron Technology, Inc. | Method of increasing capacitance of memory cells incorporating hemispherical grained silicon |
US5849624A (en) * | 1996-07-30 | 1998-12-15 | Mircon Technology, Inc. | Method of fabricating a bottom electrode with rounded corners for an integrated memory cell capacitor |
US5679596A (en) * | 1996-10-18 | 1997-10-21 | Vanguard International Semiconductor Corporation | Spot deposited polysilicon for the fabrication of high capacitance, DRAM devices |
US5731235A (en) * | 1996-10-30 | 1998-03-24 | Micron Technology, Inc. | Methods of forming a silicon nitrite film, a capacitor dielectric layer and a capacitor |
US5723373A (en) * | 1996-11-18 | 1998-03-03 | Powerchip Semiconductor Corp. | Method of making porous-Si capacitors for high density drams cell |
US5937314A (en) | 1997-02-28 | 1999-08-10 | Micron Technology, Inc. | Diffusion-enhanced crystallization of amorphous materials to improve surface roughness |
TW375778B (en) * | 1997-04-29 | 1999-12-01 | Promos Technologies Inc | Process for forming rugged polysilicon |
US5920763A (en) * | 1997-08-21 | 1999-07-06 | Micron Technology, Inc. | Method and apparatus for improving the structural integrity of stacked capacitors |
US6025248A (en) * | 1997-10-07 | 2000-02-15 | Samsung Electronics Co., Ltd. | Methods of forming capacitor electrodes including a capacitor electrode etch |
US6159788A (en) * | 1997-11-21 | 2000-12-12 | United Microelectronics Corp. | Method to increase DRAM cell capacitance |
US6265263B1 (en) * | 1998-02-19 | 2001-07-24 | Texas Instruments - Acer Incorporated | Method for forming a DRAM capacitor with porous storage node and rugged sidewalls |
US6156597A (en) * | 1998-06-09 | 2000-12-05 | Promos Technologies, Inc. | Additional buffer layer for eliminating ozone/tetraethylorthosilicate sensitivity on an arbitrary trench structure |
US6833329B1 (en) | 2000-06-22 | 2004-12-21 | Micron Technology, Inc. | Methods of forming oxide regions over semiconductor substrates |
US6686298B1 (en) | 2000-06-22 | 2004-02-03 | Micron Technology, Inc. | Methods of forming structures over semiconductor substrates, and methods of forming transistors associated with semiconductor substrates |
US6660657B1 (en) * | 2000-08-07 | 2003-12-09 | Micron Technology, Inc. | Methods of incorporating nitrogen into silicon-oxide-containing layers |
DE10038378A1 (de) * | 2000-08-07 | 2002-02-28 | Infineon Technologies Ag | Verfahren zur Herstellung von Kondensatorelektroden |
US6689668B1 (en) | 2000-08-31 | 2004-02-10 | Samsung Austin Semiconductor, L.P. | Methods to improve density and uniformity of hemispherical grain silicon layers |
US6403455B1 (en) | 2000-08-31 | 2002-06-11 | Samsung Austin Semiconductor, L.P. | Methods of fabricating a memory device |
US6555430B1 (en) | 2000-11-28 | 2003-04-29 | International Business Machines Corporation | Process flow for capacitance enhancement in a DRAM trench |
DE10105686A1 (de) * | 2001-02-08 | 2002-09-05 | Infineon Technologies Ag | Verfahren zum Herstellen einer Kondensatoranordnung für eine Halbleiterspeichereinrichtung |
US6878585B2 (en) | 2001-08-29 | 2005-04-12 | Micron Technology, Inc. | Methods of forming capacitors |
US6723599B2 (en) | 2001-12-03 | 2004-04-20 | Micron Technology, Inc. | Methods of forming capacitors and methods of forming capacitor dielectric layers |
US6613642B2 (en) * | 2001-12-13 | 2003-09-02 | International Business Machines Corporation | Method for surface roughness enhancement in semiconductor capacitor manufacturing |
TWI297414B (en) * | 2002-08-30 | 2008-06-01 | Toppoly Optoelectronics Corp | Storage capacitor structure for use in planar display and process for producing same |
TWI242889B (en) * | 2004-10-20 | 2005-11-01 | Advanced Semiconductor Eng | Integrated capacitor on packaging substrate |
TW201222778A (en) * | 2010-11-18 | 2012-06-01 | Ind Tech Res Inst | Trench capacitor structures and method of manufacturing the same |
US8236645B1 (en) * | 2011-02-07 | 2012-08-07 | GlobalFoundries, Inc. | Integrated circuits having place-efficient capacitors and methods for fabricating the same |
TWI585795B (zh) * | 2015-05-29 | 2017-06-01 | 力晶科技股份有限公司 | 電容器結構及其製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03101261A (ja) * | 1989-09-14 | 1991-04-26 | Sony Corp | 容量素子の形成方法 |
US5366917A (en) * | 1990-03-20 | 1994-11-22 | Nec Corporation | Method for fabricating polycrystalline silicon having micro roughness on the surface |
KR930008580B1 (ko) * | 1990-06-22 | 1993-09-09 | 현대전자산업 주식회사 | 표면적이 극대화된 실리콘층 및 그 제조방법 |
JP2692402B2 (ja) * | 1991-02-26 | 1997-12-17 | 日本電気株式会社 | 半導体素子の製造方法 |
US5256587A (en) * | 1991-03-20 | 1993-10-26 | Goldstar Electron Co., Ltd. | Methods of patterning and manufacturing semiconductor devices |
US5223448A (en) * | 1991-07-18 | 1993-06-29 | Industrial Technology Research Institute | Method for producing a layered capacitor structure for a dynamic random access memory device |
KR940007391B1 (ko) * | 1991-08-23 | 1994-08-16 | 삼성전자 주식회사 | 고집적 반도체 메모리장치의 제조방법 |
JPH0555505A (ja) * | 1991-08-29 | 1993-03-05 | Nec Corp | 半導体メモリセルとその形成方法 |
US5350707A (en) * | 1991-11-19 | 1994-09-27 | Samsung Electronics Co., Ltd. | Method for making a capacitor having an electrode surface with a plurality of trenches formed therein |
US5204280A (en) * | 1992-04-09 | 1993-04-20 | International Business Machines Corporation | Process for fabricating multiple pillars inside a dram trench for increased capacitor surface |
-
1992
- 1992-11-13 US US07/974,735 patent/US5350707A/en not_active Expired - Lifetime
- 1992-11-17 TW TW081109171A patent/TW396373B/zh active
- 1992-11-17 DE DE69228855T patent/DE69228855T2/de not_active Expired - Fee Related
- 1992-11-17 EP EP92310476A patent/EP0543616B1/de not_active Expired - Lifetime
- 1992-11-17 EP EP98201423A patent/EP0867927A3/de not_active Withdrawn
- 1992-11-17 TW TW086100027A patent/TW353792B/zh active
- 1992-11-18 JP JP4308940A patent/JPH0831574B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0831574B2 (ja) | 1996-03-27 |
US5350707A (en) | 1994-09-27 |
EP0867927A3 (de) | 1999-03-10 |
EP0543616A3 (en) | 1993-08-18 |
EP0867927A2 (de) | 1998-09-30 |
EP0543616A2 (de) | 1993-05-26 |
TW353792B (en) | 1999-03-01 |
EP0543616B1 (de) | 1999-04-07 |
DE69228855D1 (de) | 1999-05-12 |
TW396373B (en) | 2000-07-01 |
JPH05226605A (ja) | 1993-09-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |