DE69230474D1 - Herstellung von hochpräzisen elektronischen komponenten mit hochreinen flüssigkeiten - Google Patents

Herstellung von hochpräzisen elektronischen komponenten mit hochreinen flüssigkeiten

Info

Publication number
DE69230474D1
DE69230474D1 DE69230474T DE69230474T DE69230474D1 DE 69230474 D1 DE69230474 D1 DE 69230474D1 DE 69230474 T DE69230474 T DE 69230474T DE 69230474 T DE69230474 T DE 69230474T DE 69230474 D1 DE69230474 D1 DE 69230474D1
Authority
DE
Germany
Prior art keywords
manufacture
electronic components
precision electronic
purity liquids
liquids
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69230474T
Other languages
English (en)
Other versions
DE69230474T2 (de
Inventor
R Clark
Stephen Baird
Joe Hoffman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Liquide America Corp
Original Assignee
Air Liquide America Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide America Corp filed Critical Air Liquide America Corp
Publication of DE69230474D1 publication Critical patent/DE69230474D1/de
Application granted granted Critical
Publication of DE69230474T2 publication Critical patent/DE69230474T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
DE69230474T 1991-03-19 1992-03-17 Herstellung von hochpräzisen elektronischen komponenten mit hochreinen flüssigkeiten Expired - Fee Related DE69230474T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/672,665 US5242468A (en) 1991-03-19 1991-03-19 Manufacture of high precision electronic components with ultra-high purity liquids
PCT/US1992/002167 WO1992016306A2 (en) 1991-03-19 1992-03-17 Manufacture of high precision electronic components with ultra-high purity liquids

Publications (2)

Publication Number Publication Date
DE69230474D1 true DE69230474D1 (de) 2000-01-27
DE69230474T2 DE69230474T2 (de) 2000-07-27

Family

ID=24699507

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69230474T Expired - Fee Related DE69230474T2 (de) 1991-03-19 1992-03-17 Herstellung von hochpräzisen elektronischen komponenten mit hochreinen flüssigkeiten

Country Status (8)

Country Link
US (3) US5242468A (de)
EP (1) EP0693974B1 (de)
JP (2) JP3001634B2 (de)
KR (1) KR0182281B1 (de)
DE (1) DE69230474T2 (de)
MY (1) MY107019A (de)
TW (1) TW199233B (de)
WO (1) WO1992016306A2 (de)

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JP3920429B2 (ja) 1997-12-02 2007-05-30 株式会社ルネサステクノロジ 位相シフトフォトマスクの洗浄方法および洗浄装置
US6085762A (en) * 1998-03-30 2000-07-11 The Regents Of The University Of California Apparatus and method for providing pulsed fluids
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JP4548555B2 (ja) * 2000-03-09 2010-09-22 三菱瓦斯化学株式会社 高純度アンモニア水の製造方法
US6372022B1 (en) * 2000-08-10 2002-04-16 Air Liquide America Corporation Ionic purifier
JP3878452B2 (ja) * 2001-10-31 2007-02-07 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
US7067015B2 (en) * 2002-10-31 2006-06-27 Texas Instruments Incorporated Modified clean chemistry and megasonic nozzle for removing backside CMP slurries
US6969466B1 (en) * 2002-12-24 2005-11-29 Puritan Products, Inc. Purification of ammonia
US7229601B2 (en) * 2004-02-06 2007-06-12 Seh-America, Inc. Ammonia reclamation system
US7293609B2 (en) * 2004-10-20 2007-11-13 Halliburton Energy Services, Inc. Treatment fluids comprising vitrified shale and methods of using such fluids in subterranean formations
KR100706822B1 (ko) * 2005-10-17 2007-04-12 삼성전자주식회사 절연 물질 제거용 조성물, 이를 이용한 절연막의 제거 방법및 기판의 재생 방법
US8790533B2 (en) 2010-04-23 2014-07-29 Postech Academy-Industry Foundation Method of etching semiconductor nanocrystals
US10343907B2 (en) * 2014-03-28 2019-07-09 Asm Ip Holding B.V. Method and system for delivering hydrogen peroxide to a semiconductor processing chamber
DE102015106556A1 (de) 2015-04-28 2016-11-17 MP Technology GmbH Verfahren zur Reinigung von Materialoberflächen
US20160296902A1 (en) 2016-06-17 2016-10-13 Air Liquide Electronics U.S. Lp Deterministic feedback blender
WO2019181475A1 (ja) * 2018-03-22 2019-09-26 富士フイルム株式会社 ろ過装置、精製装置、薬液の製造方法
KR102405561B1 (ko) * 2018-03-22 2022-06-08 후지필름 가부시키가이샤 여과 장치, 정제 장치, 및 약액의 제조 방법
WO2019181435A1 (ja) * 2018-03-22 2019-09-26 富士フイルム株式会社 ろ過装置、精製装置、薬液の製造方法
EP4065313A4 (de) 2019-11-27 2023-08-02 Diversified Fluid Solutions, LLC Bedarfsabhängiges inline-mischen und zuführen von chemikalien

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Also Published As

Publication number Publication date
JP3001634B2 (ja) 2000-01-24
JP2000124093A (ja) 2000-04-28
WO1992016306A2 (en) 1992-10-01
TW199233B (de) 1993-02-01
KR0182281B1 (ko) 1999-04-15
JPH06504164A (ja) 1994-05-12
JP3351770B2 (ja) 2002-12-03
DE69230474T2 (de) 2000-07-27
EP0693974B1 (de) 1999-12-22
US5242468A (en) 1993-09-07
EP0693974A1 (de) 1996-01-31
USRE37972E1 (en) 2003-02-04
MY107019A (en) 1995-08-30
EP0693974A4 (de) 1994-04-22
USRE36290E (en) 1999-09-07
WO1992016306A3 (en) 1992-12-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee