DE69232872D1 - Trägerschicht für Aufzeichnungskopf, Aufzeichnungskopf und Herstellungsverfahren dafür - Google Patents
Trägerschicht für Aufzeichnungskopf, Aufzeichnungskopf und Herstellungsverfahren dafürInfo
- Publication number
- DE69232872D1 DE69232872D1 DE69232872T DE69232872T DE69232872D1 DE 69232872 D1 DE69232872 D1 DE 69232872D1 DE 69232872 T DE69232872 T DE 69232872T DE 69232872 T DE69232872 T DE 69232872T DE 69232872 D1 DE69232872 D1 DE 69232872D1
- Authority
- DE
- Germany
- Prior art keywords
- recording head
- manufacturing
- carrier layer
- method therefor
- recording
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1604—Production of bubble jet print heads of the edge shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/13—Heads having an integrated circuit
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11524091A JP3046640B2 (ja) | 1991-04-20 | 1991-04-20 | 記録ヘッド用基体の製造方法および記録ヘッドの製造方法 |
JP11523991A JP3241060B2 (ja) | 1991-04-20 | 1991-04-20 | インクジェット記録ヘッド用基体、インクジェット記録ヘッドおよびインクジェット記録装置 |
JP11522391A JP3173811B2 (ja) | 1991-04-20 | 1991-04-20 | インクジェット記録ヘッド用基体およびインクジェット記録ヘッドの製造方法 |
JP11522891A JP2839964B2 (ja) | 1991-04-20 | 1991-04-20 | 記録ヘッド用基体および記録ヘッドの製造方法 |
JP11524191A JP3046641B2 (ja) | 1991-04-20 | 1991-04-20 | インクジェット記録ヘッド用基体の製造方法およびインクジェット記録ヘッドの製造方法 |
JP11522291A JPH0596731A (ja) | 1991-04-20 | 1991-04-20 | 記録ヘツド用基体および記録ヘツドの製造方法 |
JP11523891A JP2846501B2 (ja) | 1991-04-20 | 1991-04-20 | 記録ヘッド用基体および記録ヘッドの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69232872D1 true DE69232872D1 (de) | 2003-01-23 |
DE69232872T2 DE69232872T2 (de) | 2003-09-18 |
Family
ID=27565823
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69230196T Expired - Fee Related DE69230196T2 (de) | 1991-04-20 | 1992-04-16 | Trägerschicht für Aufzeichnungskopf, Aufzeichnungskopf und Herstellungsverfahren dafür |
DE69232872T Expired - Fee Related DE69232872T2 (de) | 1991-04-20 | 1992-04-16 | Trägerschicht für Aufzeichnungskopf, Aufzeichnungskopf und Herstellungsverfahren dafür |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69230196T Expired - Fee Related DE69230196T2 (de) | 1991-04-20 | 1992-04-16 | Trägerschicht für Aufzeichnungskopf, Aufzeichnungskopf und Herstellungsverfahren dafür |
Country Status (3)
Country | Link |
---|---|
US (1) | US5376231A (de) |
EP (2) | EP0925933B1 (de) |
DE (2) | DE69230196T2 (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6164759A (en) * | 1990-09-21 | 2000-12-26 | Seiko Epson Corporation | Method for producing an electrostatic actuator and an inkjet head using it |
US6168263B1 (en) | 1990-09-21 | 2001-01-02 | Seiko Epson Corporation | Ink jet recording apparatus |
US6113218A (en) * | 1990-09-21 | 2000-09-05 | Seiko Epson Corporation | Ink-jet recording apparatus and method for producing the head thereof |
JPH06188108A (ja) * | 1992-12-21 | 1994-07-08 | Canon Inc | 薄膜抵抗器の製造方法、成膜装置用防着板及び成膜装置 |
JPH07178911A (ja) * | 1993-12-22 | 1995-07-18 | Canon Inc | 記録ヘッド用基体及び記録ヘッド |
JPH07201864A (ja) * | 1993-12-28 | 1995-08-04 | Fujitsu Ltd | 突起電極形成方法 |
JP2844051B2 (ja) | 1994-10-31 | 1999-01-06 | セイコーインスツルメンツ株式会社 | サーマルヘッド |
JP3376128B2 (ja) * | 1994-10-31 | 2003-02-10 | 能美防災株式会社 | 火災感知器用作動試験装置 |
JP3361916B2 (ja) * | 1995-06-28 | 2003-01-07 | シャープ株式会社 | 微小構造の形成方法 |
US6382775B1 (en) * | 1995-06-28 | 2002-05-07 | Canon Kabushiki Kaisha | Liquid ejecting printing head, production method thereof and production method for base body employed for liquid ejecting printing head |
US5774148A (en) * | 1995-10-19 | 1998-06-30 | Lexmark International, Inc. | Printhead with field oxide as thermal barrier in chip |
US6406641B1 (en) * | 1997-06-17 | 2002-06-18 | Luxtron Corporation | Liquid etch endpoint detection and process metrology |
US6264309B1 (en) * | 1997-12-18 | 2001-07-24 | Lexmark International, Inc. | Filter formed as part of a heater chip for removing contaminants from a fluid and a method for forming same |
US6267251B1 (en) * | 1997-12-18 | 2001-07-31 | Lexmark International, Inc. | Filter assembly for a print cartridge container for removing contaminants from a fluid |
CN1107592C (zh) * | 2000-01-12 | 2003-05-07 | 威硕科技股份有限公司 | 喷墨头的芯片制造方法 |
JP2002062665A (ja) * | 2000-08-16 | 2002-02-28 | Koninkl Philips Electronics Nv | 金属膜の製造方法、該金属膜を有する薄膜デバイス、及び該薄膜デバイスを備えた液晶表示装置 |
US20020158945A1 (en) * | 2001-04-30 | 2002-10-31 | Miller Richard Todd | Heating element of a printhead having resistive layer over conductive layer |
JP3697196B2 (ja) | 2001-10-22 | 2005-09-21 | キヤノン株式会社 | 記録ヘッド用基体、記録ヘッド及び記録装置 |
US6933588B1 (en) * | 2002-04-29 | 2005-08-23 | National Semiconductor Corporation | High performance SCR-like BJT ESD protection structure |
JP4125069B2 (ja) * | 2002-08-13 | 2008-07-23 | キヤノン株式会社 | インクジェット記録ヘッド用基板、インクジェット記録ヘッドおよび該インクジェット記録ヘッドを用いたインクジェット記録装置 |
US7152958B2 (en) * | 2002-11-23 | 2006-12-26 | Silverbrook Research Pty Ltd | Thermal ink jet with chemical vapor deposited nozzle plate |
US7086718B2 (en) | 2002-11-23 | 2006-08-08 | Silverbrook Research Pty Ltd | Thermal ink jet printhead with high nozzle areal density |
US6719406B1 (en) * | 2002-11-23 | 2004-04-13 | Silverbrook Research Pty Ltd | Ink jet printhead with conformally coated heater |
US6838351B2 (en) * | 2003-03-31 | 2005-01-04 | Canon Kabushiki Kaisha | Manufacturing method of circuit board, circuit board, and liquid discharging apparatus |
US7244370B2 (en) * | 2003-08-05 | 2007-07-17 | Canon Kabushiki Kaisha | Method for producing circuit substrate |
US7862156B2 (en) * | 2007-07-26 | 2011-01-04 | Hewlett-Packard Development Company, L.P. | Heating element |
US7837886B2 (en) * | 2007-07-26 | 2010-11-23 | Hewlett-Packard Development Company, L.P. | Heating element |
US9237992B2 (en) | 2009-10-27 | 2016-01-19 | The Procter & Gamble Company | Two-step mascara product |
US9216145B2 (en) | 2009-10-27 | 2015-12-22 | The Procter & Gamble Company | Semi-permanent cosmetic concealer |
US10034829B2 (en) | 2010-10-27 | 2018-07-31 | Noxell Corporation | Semi-permanent mascara compositions |
US9004791B2 (en) | 2010-04-30 | 2015-04-14 | The Procter & Gamble Company | Package for multiple personal care compositions |
US9173824B2 (en) | 2011-05-17 | 2015-11-03 | The Procter & Gamble Company | Mascara and applicator |
WO2013173452A2 (en) | 2012-05-15 | 2013-11-21 | The Procter & Gamble Company | Method for quantitatively determining eyelash clumping |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1127227A (en) * | 1977-10-03 | 1982-07-06 | Ichiro Endo | Liquid jet recording process and apparatus therefor |
JPS5936879B2 (ja) * | 1977-10-14 | 1984-09-06 | キヤノン株式会社 | 熱転写記録用媒体 |
US4330787A (en) * | 1978-10-31 | 1982-05-18 | Canon Kabushiki Kaisha | Liquid jet recording device |
US4345262A (en) * | 1979-02-19 | 1982-08-17 | Canon Kabushiki Kaisha | Ink jet recording method |
US4463359A (en) * | 1979-04-02 | 1984-07-31 | Canon Kabushiki Kaisha | Droplet generating method and apparatus thereof |
US4313124A (en) * | 1979-05-18 | 1982-01-26 | Canon Kabushiki Kaisha | Liquid jet recording process and liquid jet recording head |
US4429321A (en) | 1980-10-23 | 1984-01-31 | Canon Kabushiki Kaisha | Liquid jet recording device |
JPS5772867A (en) | 1980-10-23 | 1982-05-07 | Canon Inc | Liquid injecting recording apparatus |
US4558333A (en) * | 1981-07-09 | 1985-12-10 | Canon Kabushiki Kaisha | Liquid jet recording head |
JPS59123670A (ja) * | 1982-12-28 | 1984-07-17 | Canon Inc | インクジエツトヘツド |
JPS59138461A (ja) * | 1983-01-28 | 1984-08-08 | Canon Inc | 液体噴射記録装置 |
US4425183A (en) * | 1983-08-08 | 1984-01-10 | Ncr Corporation | Metal bevel process for multi-level metal semiconductor applications |
JPS6071260A (ja) * | 1983-09-28 | 1985-04-23 | Erumu:Kk | 記録装置 |
US4522681A (en) * | 1984-04-23 | 1985-06-11 | General Electric Company | Method for tapered dry etching |
JPH0729431B2 (ja) * | 1986-03-04 | 1995-04-05 | キヤノン株式会社 | 液体噴射記録ヘツドの作成方法 |
US4698128A (en) * | 1986-11-17 | 1987-10-06 | Motorola, Inc. | Sloped contact etch process |
US5007984A (en) * | 1987-09-28 | 1991-04-16 | Mitsubishi Denki Kabushiki Kaisha | Method for etching chromium film formed on substrate |
DE69015651T2 (de) * | 1989-01-13 | 1995-06-08 | Canon Kk | Aufzeichnungskopf. |
US4957592A (en) * | 1989-12-27 | 1990-09-18 | Xerox Corporation | Method of using erodable masks to produce partially etched structures in ODE wafer structures |
-
1992
- 1992-04-16 DE DE69230196T patent/DE69230196T2/de not_active Expired - Fee Related
- 1992-04-16 EP EP99200646A patent/EP0925933B1/de not_active Expired - Lifetime
- 1992-04-16 EP EP92303449A patent/EP0518467B1/de not_active Expired - Lifetime
- 1992-04-16 DE DE69232872T patent/DE69232872T2/de not_active Expired - Fee Related
- 1992-04-20 US US07/871,188 patent/US5376231A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69230196D1 (de) | 1999-12-02 |
US5376231A (en) | 1994-12-27 |
EP0925933B1 (de) | 2002-12-11 |
DE69232872T2 (de) | 2003-09-18 |
EP0518467A2 (de) | 1992-12-16 |
EP0925933A3 (de) | 1999-09-01 |
EP0925933A2 (de) | 1999-06-30 |
DE69230196T2 (de) | 2000-04-20 |
EP0518467B1 (de) | 1999-10-27 |
EP0518467A3 (en) | 1993-05-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |