DE69232872D1 - Trägerschicht für Aufzeichnungskopf, Aufzeichnungskopf und Herstellungsverfahren dafür - Google Patents

Trägerschicht für Aufzeichnungskopf, Aufzeichnungskopf und Herstellungsverfahren dafür

Info

Publication number
DE69232872D1
DE69232872D1 DE69232872T DE69232872T DE69232872D1 DE 69232872 D1 DE69232872 D1 DE 69232872D1 DE 69232872 T DE69232872 T DE 69232872T DE 69232872 T DE69232872 T DE 69232872T DE 69232872 D1 DE69232872 D1 DE 69232872D1
Authority
DE
Germany
Prior art keywords
recording head
manufacturing
carrier layer
method therefor
recording
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69232872T
Other languages
English (en)
Other versions
DE69232872T2 (de
Inventor
Shigeyuki Matsumoto
Genzo Monma
Seiji Kamei
Yasuhiro Sekine
Yasuhiro Naruse
Kei Fujita
Yutaka Akino
Yukihiro Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP11522291A external-priority patent/JPH0596731A/ja
Priority claimed from JP11524091A external-priority patent/JP3046640B2/ja
Priority claimed from JP11523991A external-priority patent/JP3241060B2/ja
Priority claimed from JP11522391A external-priority patent/JP3173811B2/ja
Priority claimed from JP11522891A external-priority patent/JP2839964B2/ja
Priority claimed from JP11524191A external-priority patent/JP3046641B2/ja
Priority claimed from JP11523891A external-priority patent/JP2846501B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69232872D1 publication Critical patent/DE69232872D1/de
Publication of DE69232872T2 publication Critical patent/DE69232872T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1629Manufacturing processes etching wet etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14088Structure of heating means
    • B41J2/14112Resistive element
    • B41J2/14129Layer structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • B41J2/1604Production of bubble jet print heads of the edge shooter type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1628Manufacturing processes etching dry etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1631Manufacturing processes photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1642Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • H01L21/3213Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32134Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/03Specific materials used
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/13Heads having an integrated circuit
DE69232872T 1991-04-20 1992-04-16 Trägerschicht für Aufzeichnungskopf, Aufzeichnungskopf und Herstellungsverfahren dafür Expired - Fee Related DE69232872T2 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP11524091A JP3046640B2 (ja) 1991-04-20 1991-04-20 記録ヘッド用基体の製造方法および記録ヘッドの製造方法
JP11523991A JP3241060B2 (ja) 1991-04-20 1991-04-20 インクジェット記録ヘッド用基体、インクジェット記録ヘッドおよびインクジェット記録装置
JP11522391A JP3173811B2 (ja) 1991-04-20 1991-04-20 インクジェット記録ヘッド用基体およびインクジェット記録ヘッドの製造方法
JP11522891A JP2839964B2 (ja) 1991-04-20 1991-04-20 記録ヘッド用基体および記録ヘッドの製造方法
JP11524191A JP3046641B2 (ja) 1991-04-20 1991-04-20 インクジェット記録ヘッド用基体の製造方法およびインクジェット記録ヘッドの製造方法
JP11522291A JPH0596731A (ja) 1991-04-20 1991-04-20 記録ヘツド用基体および記録ヘツドの製造方法
JP11523891A JP2846501B2 (ja) 1991-04-20 1991-04-20 記録ヘッド用基体および記録ヘッドの製造方法

Publications (2)

Publication Number Publication Date
DE69232872D1 true DE69232872D1 (de) 2003-01-23
DE69232872T2 DE69232872T2 (de) 2003-09-18

Family

ID=27565823

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69230196T Expired - Fee Related DE69230196T2 (de) 1991-04-20 1992-04-16 Trägerschicht für Aufzeichnungskopf, Aufzeichnungskopf und Herstellungsverfahren dafür
DE69232872T Expired - Fee Related DE69232872T2 (de) 1991-04-20 1992-04-16 Trägerschicht für Aufzeichnungskopf, Aufzeichnungskopf und Herstellungsverfahren dafür

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69230196T Expired - Fee Related DE69230196T2 (de) 1991-04-20 1992-04-16 Trägerschicht für Aufzeichnungskopf, Aufzeichnungskopf und Herstellungsverfahren dafür

Country Status (3)

Country Link
US (1) US5376231A (de)
EP (2) EP0925933B1 (de)
DE (2) DE69230196T2 (de)

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US6164759A (en) * 1990-09-21 2000-12-26 Seiko Epson Corporation Method for producing an electrostatic actuator and an inkjet head using it
US6168263B1 (en) 1990-09-21 2001-01-02 Seiko Epson Corporation Ink jet recording apparatus
US6113218A (en) * 1990-09-21 2000-09-05 Seiko Epson Corporation Ink-jet recording apparatus and method for producing the head thereof
JPH06188108A (ja) * 1992-12-21 1994-07-08 Canon Inc 薄膜抵抗器の製造方法、成膜装置用防着板及び成膜装置
JPH07178911A (ja) * 1993-12-22 1995-07-18 Canon Inc 記録ヘッド用基体及び記録ヘッド
JPH07201864A (ja) * 1993-12-28 1995-08-04 Fujitsu Ltd 突起電極形成方法
JP2844051B2 (ja) 1994-10-31 1999-01-06 セイコーインスツルメンツ株式会社 サーマルヘッド
JP3376128B2 (ja) * 1994-10-31 2003-02-10 能美防災株式会社 火災感知器用作動試験装置
JP3361916B2 (ja) * 1995-06-28 2003-01-07 シャープ株式会社 微小構造の形成方法
US6382775B1 (en) * 1995-06-28 2002-05-07 Canon Kabushiki Kaisha Liquid ejecting printing head, production method thereof and production method for base body employed for liquid ejecting printing head
US5774148A (en) * 1995-10-19 1998-06-30 Lexmark International, Inc. Printhead with field oxide as thermal barrier in chip
US6406641B1 (en) * 1997-06-17 2002-06-18 Luxtron Corporation Liquid etch endpoint detection and process metrology
US6264309B1 (en) * 1997-12-18 2001-07-24 Lexmark International, Inc. Filter formed as part of a heater chip for removing contaminants from a fluid and a method for forming same
US6267251B1 (en) * 1997-12-18 2001-07-31 Lexmark International, Inc. Filter assembly for a print cartridge container for removing contaminants from a fluid
CN1107592C (zh) * 2000-01-12 2003-05-07 威硕科技股份有限公司 喷墨头的芯片制造方法
JP2002062665A (ja) * 2000-08-16 2002-02-28 Koninkl Philips Electronics Nv 金属膜の製造方法、該金属膜を有する薄膜デバイス、及び該薄膜デバイスを備えた液晶表示装置
US20020158945A1 (en) * 2001-04-30 2002-10-31 Miller Richard Todd Heating element of a printhead having resistive layer over conductive layer
JP3697196B2 (ja) 2001-10-22 2005-09-21 キヤノン株式会社 記録ヘッド用基体、記録ヘッド及び記録装置
US6933588B1 (en) * 2002-04-29 2005-08-23 National Semiconductor Corporation High performance SCR-like BJT ESD protection structure
JP4125069B2 (ja) * 2002-08-13 2008-07-23 キヤノン株式会社 インクジェット記録ヘッド用基板、インクジェット記録ヘッドおよび該インクジェット記録ヘッドを用いたインクジェット記録装置
US7152958B2 (en) * 2002-11-23 2006-12-26 Silverbrook Research Pty Ltd Thermal ink jet with chemical vapor deposited nozzle plate
US7086718B2 (en) 2002-11-23 2006-08-08 Silverbrook Research Pty Ltd Thermal ink jet printhead with high nozzle areal density
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US7244370B2 (en) * 2003-08-05 2007-07-17 Canon Kabushiki Kaisha Method for producing circuit substrate
US7862156B2 (en) * 2007-07-26 2011-01-04 Hewlett-Packard Development Company, L.P. Heating element
US7837886B2 (en) * 2007-07-26 2010-11-23 Hewlett-Packard Development Company, L.P. Heating element
US9237992B2 (en) 2009-10-27 2016-01-19 The Procter & Gamble Company Two-step mascara product
US9216145B2 (en) 2009-10-27 2015-12-22 The Procter & Gamble Company Semi-permanent cosmetic concealer
US10034829B2 (en) 2010-10-27 2018-07-31 Noxell Corporation Semi-permanent mascara compositions
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Also Published As

Publication number Publication date
DE69230196D1 (de) 1999-12-02
US5376231A (en) 1994-12-27
EP0925933B1 (de) 2002-12-11
DE69232872T2 (de) 2003-09-18
EP0518467A2 (de) 1992-12-16
EP0925933A3 (de) 1999-09-01
EP0925933A2 (de) 1999-06-30
DE69230196T2 (de) 2000-04-20
EP0518467B1 (de) 1999-10-27
EP0518467A3 (en) 1993-05-12

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee