DE69302944T2 - Poliervorrichtung und Verfahren zur Ableitung deren Wärme - Google Patents

Poliervorrichtung und Verfahren zur Ableitung deren Wärme

Info

Publication number
DE69302944T2
DE69302944T2 DE69302944T DE69302944T DE69302944T2 DE 69302944 T2 DE69302944 T2 DE 69302944T2 DE 69302944 T DE69302944 T DE 69302944T DE 69302944 T DE69302944 T DE 69302944T DE 69302944 T2 DE69302944 T2 DE 69302944T2
Authority
DE
Germany
Prior art keywords
dissipating
heat
polishing device
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69302944T
Other languages
English (en)
Other versions
DE69302944D1 (de
Inventor
Kohichi Tanaka
Hiromasa Hashimoto
Fumio Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Application granted granted Critical
Publication of DE69302944D1 publication Critical patent/DE69302944D1/de
Publication of DE69302944T2 publication Critical patent/DE69302944T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
DE69302944T 1992-02-28 1993-02-24 Poliervorrichtung und Verfahren zur Ableitung deren Wärme Expired - Fee Related DE69302944T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4078290A JP2985490B2 (ja) 1992-02-28 1992-02-28 研磨機の除熱方法

Publications (2)

Publication Number Publication Date
DE69302944D1 DE69302944D1 (de) 1996-07-11
DE69302944T2 true DE69302944T2 (de) 1997-02-06

Family

ID=13657811

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69302944T Expired - Fee Related DE69302944T2 (de) 1992-02-28 1993-02-24 Poliervorrichtung und Verfahren zur Ableitung deren Wärme

Country Status (4)

Country Link
US (2) US5400547A (de)
EP (1) EP0562718B1 (de)
JP (1) JP2985490B2 (de)
DE (1) DE69302944T2 (de)

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US5700180A (en) 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
US5595529A (en) * 1994-03-28 1997-01-21 Speedfam Corporation Dual column abrading machine
JPH07314325A (ja) * 1994-05-20 1995-12-05 Nippon Seiko Kk 球体研磨装置
JPH07328915A (ja) * 1994-06-03 1995-12-19 Ebara Corp ポリッシング装置
TW349896B (en) * 1996-05-02 1999-01-11 Applied Materials Inc Apparatus and chemical mechanical polishing system for polishing a substrate
US6093081A (en) * 1996-05-09 2000-07-25 Canon Kabushiki Kaisha Polishing method and polishing apparatus using the same
JP3611404B2 (ja) * 1996-06-21 2005-01-19 株式会社荏原製作所 ポリッシング装置
JPH10235552A (ja) 1997-02-24 1998-09-08 Ebara Corp ポリッシング装置
US5873769A (en) * 1997-05-30 1999-02-23 Industrial Technology Research Institute Temperature compensated chemical mechanical polishing to achieve uniform removal rates
DE19748020A1 (de) * 1997-10-30 1999-05-06 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
JP3693483B2 (ja) * 1998-01-30 2005-09-07 株式会社荏原製作所 研磨装置
EP0956924A1 (de) * 1998-04-17 1999-11-17 OMD Officina Meccanica Domaso S.p.A. Werkzeughalter für eine Doppelspindelschleifmaschine
JP3920465B2 (ja) 1998-08-04 2007-05-30 信越半導体株式会社 研磨方法および研磨装置
US6174221B1 (en) * 1998-09-01 2001-01-16 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
US6491570B1 (en) 1999-02-25 2002-12-10 Applied Materials, Inc. Polishing media stabilizer
US6176764B1 (en) 1999-03-10 2001-01-23 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, simiconductor wafer polishing methods, and methods of forming polishing chucks
US6220942B1 (en) * 1999-04-02 2001-04-24 Applied Materials, Inc. CMP platen with patterned surface
US20040072518A1 (en) * 1999-04-02 2004-04-15 Applied Materials, Inc. Platen with patterned surface for chemical mechanical polishing
US6217426B1 (en) 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US20040053566A1 (en) * 2001-01-12 2004-03-18 Applied Materials, Inc. CMP platen with patterned surface
US7530877B1 (en) 1999-06-03 2009-05-12 Micron Technology, Inc. Semiconductor processor systems, a system configured to provide a semiconductor workpiece process fluid
US7180591B1 (en) * 1999-06-03 2007-02-20 Micron Technology, Inc Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece processing methods, and turbidity monitoring methods
US6290576B1 (en) 1999-06-03 2001-09-18 Micron Technology, Inc. Semiconductor processors, sensors, and semiconductor processing systems
US6358119B1 (en) * 1999-06-21 2002-03-19 Taiwan Semiconductor Manufacturing Company Way to remove CU line damage after CU CMP
EP1197293B1 (de) * 2000-01-31 2007-06-06 Shin-Etsu Handotai Company Limited Polierverfahren und vorrichtung
US7048607B1 (en) * 2000-05-31 2006-05-23 Applied Materials System and method for chemical mechanical planarization
US6561884B1 (en) * 2000-08-29 2003-05-13 Applied Materials, Inc. Web lift system for chemical mechanical planarization
GB0025745D0 (en) * 2000-10-20 2000-12-06 H K Founders Ltd Semiconductor wafer manufacturing equipment
US6592439B1 (en) 2000-11-10 2003-07-15 Applied Materials, Inc. Platen for retaining polishing material
US6443817B1 (en) * 2001-02-06 2002-09-03 Mccarter Technology, Inc. Method of finishing a silicon part
US6599175B2 (en) 2001-08-06 2003-07-29 Speedfam-Ipeca Corporation Apparatus for distributing a fluid through a polishing pad
US6503131B1 (en) 2001-08-16 2003-01-07 Applied Materials, Inc. Integrated platen assembly for a chemical mechanical planarization system
US6746318B2 (en) 2001-10-11 2004-06-08 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
KR100413493B1 (ko) * 2001-10-17 2004-01-03 주식회사 하이닉스반도체 화학적 기계적 연마 장치의 연마 플래튼 및 그를 이용한평탄화방법
US7169014B2 (en) * 2002-07-18 2007-01-30 Micron Technology, Inc. Apparatuses for controlling the temperature of polishing pads used in planarizing micro-device workpieces
US6796890B1 (en) * 2003-02-20 2004-09-28 Edward K Goldrick Extendable wet saw water shield
JP2006520273A (ja) * 2003-03-14 2006-09-07 株式会社荏原製作所 研磨工具および研磨装置
JP4484466B2 (ja) * 2003-07-10 2010-06-16 パナソニック株式会社 研磨方法およびその研磨方法に用いる粘弾性ポリッシャー
US6913515B2 (en) * 2003-09-30 2005-07-05 Hitachi Global Storage Technologies Netherlands B.V. System and apparatus for achieving very high crown-to-camber ratios on magnetic sliders
US6942544B2 (en) * 2003-09-30 2005-09-13 Hitachi Global Storage Technologies Netherlands B.V. Method of achieving very high crown-to-camber ratios on magnetic sliders
DE502005006727D1 (de) * 2005-09-06 2009-04-09 Trumpf Werkzeugmaschinen Gmbh Vorrichtung zur aufnahme von plattenförmigen materialien für zumindest einen trennvorgang
CN101437651B (zh) * 2006-03-16 2012-09-26 专业工具制造有限责任公司 磨削切割工具的装置和方法
US20070227901A1 (en) * 2006-03-30 2007-10-04 Applied Materials, Inc. Temperature control for ECMP process
JP4654209B2 (ja) * 2007-02-27 2011-03-16 信越半導体株式会社 研磨装置
CN102615583A (zh) * 2011-01-28 2012-08-01 鸿富锦精密工业（深圳）有限公司 研磨装置
JP5628067B2 (ja) * 2011-02-25 2014-11-19 株式会社荏原製作所 研磨パッドの温度調整機構を備えた研磨装置
CN105437052B (zh) * 2015-11-28 2019-02-05 郑臣钏 一种连续加工自修复式研抛装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1104941A (fr) * 1954-05-19 1955-11-25 Perfectionnement aux meules notamment aux meules diamant
US3121982A (en) * 1960-08-25 1964-02-25 Cons Diamond Dev Company Ltd Grinding wheel with adjustable abrasive segments
DE2045515A1 (de) * 1970-09-07 1972-03-09 Burmah Oll Trading Ltd , London Maschine zum Lappen, Polieren und dergleichen
FR2106809A5 (de) * 1970-09-24 1972-05-05 Burmah Oil Trading Ltd
CH517558A (de) * 1971-01-04 1972-01-15 Laeppag Laepp Maschinen Ag Anordnung zur Kühlung der Läppscheibe an einer Flachläppmaschine
DE3128880A1 (de) * 1981-07-22 1983-02-10 Fa. Peter Wolters, 2370 Rendsburg Maschine zum laeppen oder polieren
JPS5840265A (ja) * 1981-08-28 1983-03-09 Toshiba Corp 両面ポリシング装置
DE3411120A1 (de) * 1983-03-26 1984-11-08 TOTO Ltd., Kitakyushyu, Fukuoka Laeppvorrichtung
JPS60242975A (ja) * 1984-05-14 1985-12-02 Kanebo Ltd 平面研磨装置
JPS60217062A (ja) * 1985-02-28 1985-10-30 Kanebo Ltd 平面研磨装置
JPS63237865A (ja) * 1987-03-25 1988-10-04 Matsushima Kogyo Co Ltd 回転式研磨機の定盤
FR2639278B1 (fr) * 1988-11-22 1991-01-11 Lam Plan Sa Plateau de polissage
US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
JPH0469160A (ja) * 1990-07-10 1992-03-04 Mitsubishi Materials Corp 研磨装置
US5076024A (en) * 1990-08-24 1991-12-31 Intelmatec Corporation Disk polisher assembly

Also Published As

Publication number Publication date
EP0562718B1 (de) 1996-06-05
DE69302944D1 (de) 1996-07-11
US5718620A (en) 1998-02-17
JPH05237761A (ja) 1993-09-17
EP0562718A1 (de) 1993-09-29
US5400547A (en) 1995-03-28
JP2985490B2 (ja) 1999-11-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee