DE69305426D1 - Verfahren zum Montieren von Bauteilen und Vorrichtung dafür - Google Patents

Verfahren zum Montieren von Bauteilen und Vorrichtung dafür

Info

Publication number
DE69305426D1
DE69305426D1 DE69305426T DE69305426T DE69305426D1 DE 69305426 D1 DE69305426 D1 DE 69305426D1 DE 69305426 T DE69305426 T DE 69305426T DE 69305426 T DE69305426 T DE 69305426T DE 69305426 D1 DE69305426 D1 DE 69305426D1
Authority
DE
Germany
Prior art keywords
device therefor
assembling components
assembling
components
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69305426T
Other languages
English (en)
Other versions
DE69305426T2 (de
Inventor
Hiroshi Sakurai
Hiroyuki Ohta
Hitoshi Onodera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15963032&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69305426(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Application granted granted Critical
Publication of DE69305426D1 publication Critical patent/DE69305426D1/de
Publication of DE69305426T2 publication Critical patent/DE69305426T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
DE69305426T 1992-07-01 1993-07-01 Verfahren zum Montieren von Bauteilen und Vorrichtung dafür Expired - Lifetime DE69305426T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4173571A JPH0618215A (ja) 1992-07-01 1992-07-01 部品装着方法及び装置

Publications (2)

Publication Number Publication Date
DE69305426D1 true DE69305426D1 (de) 1996-11-21
DE69305426T2 DE69305426T2 (de) 1997-02-13

Family

ID=15963032

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69305426T Expired - Lifetime DE69305426T2 (de) 1992-07-01 1993-07-01 Verfahren zum Montieren von Bauteilen und Vorrichtung dafür

Country Status (4)

Country Link
US (1) US5384956A (de)
EP (1) EP0577128B1 (de)
JP (1) JPH0618215A (de)
DE (1) DE69305426T2 (de)

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DE4332236A1 (de) * 1992-11-26 1995-03-23 F E S Used Electronics Elektro Anlage zur automatischen Entstückung
KR100329586B1 (ko) * 1993-10-29 2002-09-19 산요 덴키 가부시키가이샤 전자부품자동장착장치및전자부품의장착방법
JPH07193397A (ja) * 1993-12-27 1995-07-28 Yamaha Motor Co Ltd 実装機の吸着ポイント補正装置
JP3090567B2 (ja) * 1993-12-29 2000-09-25 ヤマハ発動機株式会社 実装機における部品認識方法および同装置
WO1996005477A1 (en) * 1994-08-11 1996-02-22 Cyberoptics Corporation High precision semiconductor component alignment systems
JP3222334B2 (ja) * 1994-10-19 2001-10-29 ヤマハ発動機株式会社 表面実装機における認識用ノズル高さ調整方法及び同装置
KR0140167B1 (ko) * 1994-12-28 1998-08-17 배순훈 칩마운트 시스템의 카메라 편차각도 보정방법
JP3558396B2 (ja) * 1995-01-06 2004-08-25 富士重工業株式会社 チューブレスタイヤ用タイヤバルブ自動挿入装置
US6118538A (en) * 1995-01-13 2000-09-12 Cyberoptics Corporation Method and apparatus for electronic component lead measurement using light based sensors on a component placement machine
JPH08279697A (ja) * 1995-04-10 1996-10-22 Fuji Mach Mfg Co Ltd 電子部品装着ヘッド，電子部品装着装置および電子部品装着方法
US5933349A (en) * 1995-12-29 1999-08-03 Compaq Computer Corporation Component placement
JPH1051198A (ja) * 1996-05-08 1998-02-20 Tenryu Technic:Kk 電子部品実装方法
US5787577A (en) * 1996-08-16 1998-08-04 Motorola, Inc. Method for adjusting an electronic part template
KR19980039103A (ko) * 1996-11-27 1998-08-17 배순훈 임의 각도설정이 가능한 표면실장 부품용 장착 좌표 입력장치 및 방법
JP3523972B2 (ja) * 1996-12-26 2004-04-26 松下電器産業株式会社 部品実装方法及び部品実装装置
US5953812A (en) * 1997-07-03 1999-09-21 Schlumberger Technologies, Inc. Misinsert sensing in pick and place tooling
US6230393B1 (en) * 1997-07-07 2001-05-15 Matsushita Electric Industrial Co., Ltd. Method and device for mounting electronic component
JPH1140907A (ja) * 1997-07-17 1999-02-12 Fuji Photo Film Co Ltd プリント配線板及び部品取り付け方法
JP3760274B2 (ja) * 1997-07-18 2006-03-29 山形カシオ株式会社 電子部品の装着方法及び装置
US6538750B1 (en) 1998-05-22 2003-03-25 Cyberoptics Corporation Rotary sensor system with a single detector
US6292261B1 (en) 1998-05-22 2001-09-18 Cyberoptics Corporation Rotary sensor system with at least two detectors
JP4358991B2 (ja) 1998-08-04 2009-11-04 サイバーオプティクス コーポレーション 強化されたセンサ
US6490048B1 (en) * 1998-11-03 2002-12-03 Cyberoptics Corporation Tomographic reconstruction of electronic components from shadow image sensor data
US6587743B1 (en) * 1999-01-29 2003-07-01 B P Microsystems, Inc. Pick and place teaching method and apparatus for implementing the same
SG83785A1 (en) * 1999-04-30 2001-10-16 Esec Trading Sa Apparatus and method for mounting semiconductor chips on a substrate
JP2002164699A (ja) * 2000-11-28 2002-06-07 Juki Corp 電子部品搭載装置
US7239399B2 (en) * 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
US7555831B2 (en) 2001-11-13 2009-07-07 Cyberoptics Corporation Method of validating component feeder exchanges
US7813559B2 (en) 2001-11-13 2010-10-12 Cyberoptics Corporation Image analysis for pick and place machines with in situ component placement inspection
JP2004103923A (ja) 2002-09-11 2004-04-02 Tdk Corp 電子部品の実装装置および実装方法
JP4147923B2 (ja) * 2002-12-03 2008-09-10 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
US7559134B2 (en) * 2003-11-04 2009-07-14 Cyberoptics Corporation Pick and place machine with improved component placement inspection
US7706595B2 (en) * 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
US20050125993A1 (en) * 2003-11-07 2005-06-16 Madsen David D. Pick and place machine with improved setup and operation procedure
US7533459B2 (en) * 2004-04-27 2009-05-19 Hitachi High-Tech Instruments, Co., Ltd. Electronic component mounting method and electronic component mounting apparatus
US20060016066A1 (en) * 2004-07-21 2006-01-26 Cyberoptics Corporation Pick and place machine with improved inspection
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
US20070003126A1 (en) * 2005-05-19 2007-01-04 Case Steven K Method and apparatus for evaluating a component pick action in an electronics assembly machine
US7545514B2 (en) * 2005-09-14 2009-06-09 Cyberoptics Corporation Pick and place machine with improved component pick image processing
US20070130755A1 (en) * 2005-10-31 2007-06-14 Duquette David W Electronics assembly machine with embedded solder paste inspection
US20070276867A1 (en) * 2006-05-23 2007-11-29 David Fishbaine Embedded inspection image archival for electronics assembly machines
WO2008115532A1 (en) 2007-03-20 2008-09-25 Cyberoptics Corporation Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam
US8068664B2 (en) * 2007-06-05 2011-11-29 Cyberoptics Corporation Component sensor for pick and place machine using improved shadow imaging
WO2017004575A1 (en) 2015-07-02 2017-01-05 Serenity Data Services, Inc. Hard drive dismantling system
US11167384B2 (en) 2015-07-02 2021-11-09 Serenity Data Security, Llc Hard drive non-destructive dismantling system
WO2017004573A1 (en) 2015-07-02 2017-01-05 Serenity Data Services, Inc. Product verification for hard drive data destroying device

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Also Published As

Publication number Publication date
EP0577128B1 (de) 1996-10-16
DE69305426T2 (de) 1997-02-13
JPH0618215A (ja) 1994-01-25
US5384956A (en) 1995-01-31
EP0577128A1 (de) 1994-01-05

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Legal Events

Date Code Title Description
8363 Opposition against the patent