JP2607055B2
(ja)
*
|
1992-08-14 |
1997-05-07 |
ヒューズ・エアクラフト・カンパニー |
炭素質材料上に窒化チタンを形成するための表面処理および蒸着方法
|
FR2699164B1
(fr)
*
|
1992-12-11 |
1995-02-24 |
Saint Gobain Vitrage Int |
Procédé de traitement de couches minces à base d'oxyde ou de nitrure métallique.
|
DE59309954D1
(de)
*
|
1992-12-21 |
2000-03-16 |
Balzers Hochvakuum |
Optisches Bauelement, Verfahren zur Herstellung einer Schicht, Schicht bzw. Schichtsystem und Verwendung des Bauelementes
|
US5868878A
(en)
*
|
1993-08-27 |
1999-02-09 |
Hughes Electronics Corporation |
Heat treatment by plasma electron heating and solid/gas jet cooling
|
US5476134A
(en)
*
|
1993-12-21 |
1995-12-19 |
Aluminum Company Of America |
CRN coated die-casting tools for casting low aluminum iron alloys and method of making same
|
US5624868A
(en)
*
|
1994-04-15 |
1997-04-29 |
Micron Technology, Inc. |
Techniques for improving adhesion of silicon dioxide to titanium
|
JPH10500451A
(ja)
*
|
1994-05-20 |
1998-01-13 |
ヴィディア ゲゼルシャフト ミット ベシュレンクテル ハフツング |
工具、この工具の製法及び製造装置及びこの工具の使用
|
JPH0853116A
(ja)
*
|
1994-08-11 |
1996-02-27 |
Kirin Brewery Co Ltd |
炭素膜コーティングプラスチック容器
|
EP0760020B1
(de)
*
|
1995-02-16 |
1999-11-03 |
Koninklijke Philips Electronics N.V. |
Vorrichtung mit einem schalter mit einer chrombeschichtung und verfahren zum aufbringen von chromschichten durch sputtern
|
FR2732818B1
(fr)
*
|
1995-04-07 |
1997-06-20 |
Centre Nat Rech Scient |
Procede et dispositif de controle de la polarisation d'un corps plonge dans un plasma
|
JP3315302B2
(ja)
*
|
1995-12-18 |
2002-08-19 |
株式会社神戸製鋼所 |
真空アーク蒸着方法
|
US5770023A
(en)
*
|
1996-02-12 |
1998-06-23 |
Eni A Division Of Astec America, Inc. |
Etch process employing asymmetric bipolar pulsed DC
|
WO1997032672A1
(en)
*
|
1996-03-04 |
1997-09-12 |
Polar Materials, Inc. |
Method for bulk coating using a plasma process
|
US5733418A
(en)
*
|
1996-05-07 |
1998-03-31 |
Pld Advanced Automation Systems, Inc. |
Sputtering method and apparatus
|
US5601654A
(en)
*
|
1996-05-31 |
1997-02-11 |
The Regents Of The University Of California, Office Of Technology Transfer |
Flow-through ion beam source
|
BE1010420A3
(fr)
|
1996-07-12 |
1998-07-07 |
Cockerill Rech & Dev |
Procede pour la formation d'un revetement sur un substrat et installation pour la mise en oeuvre de ce procede.
|
US5911832A
(en)
*
|
1996-10-10 |
1999-06-15 |
Eaton Corporation |
Plasma immersion implantation with pulsed anode
|
DE19651615C1
(de)
*
|
1996-12-12 |
1997-07-10 |
Fraunhofer Ges Forschung |
Verfahren zum Aufbringen von Kohlenstoffschichten durch reaktives Magnetron-Sputtern
|
US6726812B1
(en)
*
|
1997-03-04 |
2004-04-27 |
Canon Kabushiki Kaisha |
Ion beam sputtering apparatus, method for forming a transparent and electrically conductive film, and process for the production of a semiconductor device
|
US6599399B2
(en)
*
|
1997-03-07 |
2003-07-29 |
Applied Materials, Inc. |
Sputtering method to generate ionized metal plasma using electron beams and magnetic field
|
JP4355036B2
(ja)
*
|
1997-03-18 |
2009-10-28 |
キヤノンアネルバ株式会社 |
イオン化スパッタリング装置
|
US5925225A
(en)
*
|
1997-03-27 |
1999-07-20 |
Applied Materials, Inc. |
Method of producing smooth titanium nitride films having low resistivity
|
TW460597B
(en)
|
1997-03-27 |
2001-10-21 |
Applied Materials Inc |
A barrier layer structure for use in semiconductors and a method of producing an aluminum-comprising layer having a 111 crystal orientation
|
US6013980A
(en)
|
1997-05-09 |
2000-01-11 |
Advanced Refractory Technologies, Inc. |
Electrically tunable low secondary electron emission diamond-like coatings and process for depositing coatings
|
JPH111770A
(ja)
*
|
1997-06-06 |
1999-01-06 |
Anelva Corp |
スパッタリング装置及びスパッタリング方法
|
US6077572A
(en)
*
|
1997-06-18 |
2000-06-20 |
Northeastern University |
Method of coating edges with diamond-like carbon
|
US6051114A
(en)
*
|
1997-06-23 |
2000-04-18 |
Applied Materials, Inc. |
Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition
|
US5882399A
(en)
*
|
1997-08-23 |
1999-03-16 |
Applied Materials, Inc. |
Method of forming a barrier layer which enables a consistently highly oriented crystalline structure in a metallic interconnect
|
DE19740793C2
(de)
|
1997-09-17 |
2003-03-20 |
Bosch Gmbh Robert |
Verfahren zur Beschichtung von Oberflächen mittels einer Anlage mit Sputterelektroden und Verwendung des Verfahrens
|
US6039849A
(en)
*
|
1997-10-28 |
2000-03-21 |
Motorola, Inc. |
Method for the manufacture of electronic components
|
US5976327A
(en)
|
1997-12-12 |
1999-11-02 |
Applied Materials, Inc. |
Step coverage and overhang improvement by pedestal bias voltage modulation
|
DE19809122A1
(de)
*
|
1998-03-04 |
1999-09-09 |
Daimler Chrysler Ag |
Beschichtung für Gegenstände aus Grauguß und/oder Gußeisen mit Kugelgraphit, insbesondere für Umformwerkzeuge sowie Verfahren zur Herstellung der Beschichtung
|
US6103320A
(en)
|
1998-03-05 |
2000-08-15 |
Shincron Co., Ltd. |
Method for forming a thin film of a metal compound by vacuum deposition
|
US6217716B1
(en)
|
1998-05-06 |
2001-04-17 |
Novellus Systems, Inc. |
Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
|
US6012830A
(en)
*
|
1998-06-23 |
2000-01-11 |
Valeo Sylvania L.L.C. |
Light shield for a vehicle headlamp
|
US6287977B1
(en)
|
1998-07-31 |
2001-09-11 |
Applied Materials, Inc. |
Method and apparatus for forming improved metal interconnects
|
US6238537B1
(en)
*
|
1998-08-06 |
2001-05-29 |
Kaufman & Robinson, Inc. |
Ion assisted deposition source
|
US6666958B1
(en)
*
|
1998-09-28 |
2003-12-23 |
Bridgestone Corporation |
Method for controlling a refractive index of a dry plating film and method for making a dry plating built-up film
|
US6974629B1
(en)
*
|
1999-08-06 |
2005-12-13 |
Cardinal Cg Company |
Low-emissivity, soil-resistant coating for glass surfaces
|
US6964731B1
(en)
|
1998-12-21 |
2005-11-15 |
Cardinal Cg Company |
Soil-resistant coating for glass surfaces
|
US6660365B1
(en)
|
1998-12-21 |
2003-12-09 |
Cardinal Cg Company |
Soil-resistant coating for glass surfaces
|
DE19860474A1
(de)
|
1998-12-28 |
2000-07-06 |
Fraunhofer Ges Forschung |
Verfahren und Einrichtung zum Beschichten von Substraten mittels bipolarer Puls-Magnetron-Zerstäubung
|
US6387748B1
(en)
|
1999-02-16 |
2002-05-14 |
Micron Technology, Inc. |
Semiconductor circuit constructions, capacitor constructions, and methods of forming semiconductor circuit constructions and capacitor constructions
|
GB2349392B
(en)
|
1999-04-20 |
2003-10-22 |
Trikon Holdings Ltd |
A method of depositing a layer
|
US6620465B2
(en)
*
|
1999-04-23 |
2003-09-16 |
General Electric Company |
Physical properties of thermal barrier coatings using electron beam-physical vapor deposition
|
US6652974B1
(en)
|
1999-05-18 |
2003-11-25 |
Cardinal Ig Company |
Hard, scratch-resistant coatings for substrates
|
KR100345809B1
(ko)
*
|
1999-09-14 |
2002-07-27 |
주식회사 케이피티 |
알루미늄 압출금형의 플라즈마 질화처리 방법
|
US6342132B1
(en)
|
1999-10-29 |
2002-01-29 |
International Business Machines Corporation |
Method of controlling gas density in an ionized physical vapor deposition apparatus
|
US6551471B1
(en)
*
|
1999-11-30 |
2003-04-22 |
Canon Kabushiki Kaisha |
Ionization film-forming method and apparatus
|
US6344419B1
(en)
|
1999-12-03 |
2002-02-05 |
Applied Materials, Inc. |
Pulsed-mode RF bias for sidewall coverage improvement
|
US6478933B1
(en)
*
|
1999-12-17 |
2002-11-12 |
Caterpillar Inc. |
Method for creating surface oil reservoirs on coated iron
|
IL134255A0
(en)
*
|
2000-01-27 |
2001-04-30 |
V I P Vacuum Ion Plasma Techno |
System and method for deposition of coatings on a substrate
|
TW512181B
(en)
*
|
2000-02-03 |
2002-12-01 |
Cosmos Vacuum Technology Corp |
A process for covering a film on the surface of the micro cutting router by coating super micro atomized multi-elements
|
US6554979B2
(en)
|
2000-06-05 |
2003-04-29 |
Applied Materials, Inc. |
Method and apparatus for bias deposition in a modulating electric field
|
JP2002105623A
(ja)
*
|
2000-09-27 |
2002-04-10 |
Kobe Steel Ltd |
カーボンオニオン薄膜およびその製造方法
|
US6696360B2
(en)
*
|
2001-03-15 |
2004-02-24 |
Micron Technology, Inc. |
Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow
|
US7037862B2
(en)
*
|
2001-06-13 |
2006-05-02 |
Micron Technology, Inc. |
Dielectric layer forming method and devices formed therewith
|
US6678082B2
(en)
|
2001-09-12 |
2004-01-13 |
Harris Corporation |
Electro-optical component including a fluorinated poly(phenylene ether ketone) protective coating and related methods
|
US6746591B2
(en)
|
2001-10-16 |
2004-06-08 |
Applied Materials Inc. |
ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature
|
KR20030039649A
(ko)
*
|
2001-11-14 |
2003-05-22 |
조치형 |
볼펜 볼의 코팅장치 및 방법
|
FR325790A
(fr)
|
2002-03-28 |
1903-05-08 |
Kempshall Eleazer |
Balle perfectionnée pour le jeu de golf
|
AU2003265503A1
(en)
*
|
2002-08-16 |
2004-03-03 |
The Regents Of The University Of California |
Process and apparatus for pulsed dc magnetron reactive sputtering of thin film coatings on large substrates using smaller sputter cathodes
|
JP2005036250A
(ja)
*
|
2003-07-16 |
2005-02-10 |
Matsushita Electric Ind Co Ltd |
スパッタ装置
|
US20050202099A1
(en)
*
|
2004-03-10 |
2005-09-15 |
Globe Union Industrial Corp. |
Anti-microbial sanitary ware and method for making the same
|
US7604865B2
(en)
|
2004-07-12 |
2009-10-20 |
Cardinal Cg Company |
Low-maintenance coatings
|
US7790003B2
(en)
*
|
2004-10-12 |
2010-09-07 |
Southwest Research Institute |
Method for magnetron sputter deposition
|
US8092660B2
(en)
|
2004-12-03 |
2012-01-10 |
Cardinal Cg Company |
Methods and equipment for depositing hydrophilic coatings, and deposition technologies for thin films
|
US7923114B2
(en)
|
2004-12-03 |
2011-04-12 |
Cardinal Cg Company |
Hydrophilic coatings, methods for depositing hydrophilic coatings, and improved deposition technology for thin films
|
US20090214787A1
(en)
*
|
2005-10-18 |
2009-08-27 |
Southwest Research Institute |
Erosion Resistant Coatings
|
CN101326303B
(zh)
*
|
2005-10-18 |
2012-07-18 |
西南研究院 |
抗侵蚀涂层
|
JP4525929B2
(ja)
*
|
2006-02-28 |
2010-08-18 |
ノーリツ鋼機株式会社 |
ワーク処理装置
|
WO2007124291A2
(en)
|
2006-04-19 |
2007-11-01 |
Cardinal Cg Company |
Opposed functional coatings having comparable single surface reflectances
|
US20080011599A1
(en)
|
2006-07-12 |
2008-01-17 |
Brabender Dennis M |
Sputtering apparatus including novel target mounting and/or control
|
US8691064B2
(en)
*
|
2007-07-09 |
2014-04-08 |
Raytheon Canada Limited |
Sputter-enhanced evaporative deposition apparatus and method
|
CA2664368A1
(en)
|
2007-09-14 |
2009-03-19 |
Cardinal Cg Company |
Low-maintenance coating technology
|
US20090200494A1
(en)
*
|
2008-02-11 |
2009-08-13 |
Varian Semiconductor Equipment Associates, Inc. |
Techniques for cold implantation of carbon-containing species
|
US8003957B2
(en)
*
|
2008-02-11 |
2011-08-23 |
Varian Semiconductor Equipment Associates, Inc. |
Ethane implantation with a dilution gas
|
DE102008019202A1
(de)
*
|
2008-04-17 |
2009-10-22 |
Kennametal Inc. |
Beschichtungsverfahren , Werkstück oder Werkzeug und dessen Verwendung
|
US20110186420A1
(en)
*
|
2008-06-09 |
2011-08-04 |
Nanofilm Technologies International Pte Ltd |
Method for rapid deposition of a coating on a substrate
|
TWI421361B
(zh)
*
|
2009-10-30 |
2014-01-01 |
Choung Lii Chao |
微結構基板及其成型方法
|
KR101097329B1
(ko)
*
|
2010-01-11 |
2011-12-23 |
삼성모바일디스플레이주식회사 |
스퍼터링 장치
|
US8790791B2
(en)
|
2010-04-15 |
2014-07-29 |
Southwest Research Institute |
Oxidation resistant nanocrystalline MCrAl(Y) coatings and methods of forming such coatings
|
US9511572B2
(en)
|
2011-05-25 |
2016-12-06 |
Southwest Research Institute |
Nanocrystalline interlayer coating for increasing service life of thermal barrier coating on high temperature components
|
US10056237B2
(en)
|
2012-09-14 |
2018-08-21 |
Vapor Technologies, Inc. |
Low pressure arc plasma immersion coating vapor deposition and ion treatment
|
US9412569B2
(en)
*
|
2012-09-14 |
2016-08-09 |
Vapor Technologies, Inc. |
Remote arc discharge plasma assisted processes
|
US9793098B2
(en)
|
2012-09-14 |
2017-10-17 |
Vapor Technologies, Inc. |
Low pressure arc plasma immersion coating vapor deposition and ion treatment
|
PL2778254T3
(pl)
*
|
2013-03-15 |
2016-07-29 |
Vapor Technologies Inc |
Osadzanie z fazy gazowej powłoki w plazmie niskociśnieniowego wyładowania łukowego i obróbka jonowa
|
DE102013210155A1
(de)
|
2013-05-31 |
2014-12-04 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Verfahren zum Abscheiden einer transparenten, elektrisch leitfähigen Metalloxidschicht
|
EP3063571A4
(de)
*
|
2013-10-30 |
2017-10-18 |
Tecport Optics, Inc. |
Augenoptikfilter zur vorbeugung und reduktion von photophoben effekten und reaktionen
|
CN104109830B
(zh)
*
|
2014-07-22 |
2017-01-18 |
桂林电子科技大学 |
一种表面渗铪耐高温奥氏体不锈钢及其制备方法
|
US9523146B1
(en)
|
2015-06-17 |
2016-12-20 |
Southwest Research Institute |
Ti—Si—C—N piston ring coatings
|
EP3541762B1
(de)
|
2016-11-17 |
2022-03-02 |
Cardinal CG Company |
Statisch-dissipative beschichtungstechnologie
|
US11098403B2
(en)
*
|
2017-02-07 |
2021-08-24 |
City University Of Hong Kong |
High entropy alloy thin film coating and method for preparing the same
|
RU2659537C1
(ru)
*
|
2017-09-26 |
2018-07-02 |
Татьяна Сергеевна Картапова |
Способ нанесения смешанного углеродно-азотного защитного покрытия для повышения коррозионной стойкости железа
|
FR3123074B1
(fr)
*
|
2021-05-19 |
2023-08-04 |
Hydromecanique & Frottement |
Procédé de dépôt de chrome dense sur un substrat
|
CN113718219B
(zh)
*
|
2021-08-30 |
2023-11-14 |
长江先进存储产业创新中心有限责任公司 |
薄膜沉积方法及薄膜沉积设备
|
FR3126428A1
(fr)
*
|
2021-08-31 |
2023-03-03 |
Hydromecanique Et Frottement |
Procédé de dépôt de carbone sur un substrat
|
CN113755807B
(zh)
*
|
2021-09-13 |
2024-02-09 |
苏州龙盛电子有限公司 |
一种滤光片镀膜装置及镀膜工艺
|
CN114656033B
(zh)
*
|
2022-02-17 |
2023-03-14 |
西安建筑科技大学 |
一种玉米芯为核基的缓释碳源制备方法
|
CN114908324A
(zh)
*
|
2022-03-23 |
2022-08-16 |
广州益华数字科技有限公司 |
一种Pt热阻薄膜的制备方法
|
CN114774869A
(zh)
*
|
2022-04-08 |
2022-07-22 |
西安热工研究院有限公司 |
一种成分可调的TixCr1-xNy纳米涂层、制备方法及其应用
|
CN115110048B
(zh)
*
|
2022-06-20 |
2023-05-02 |
肇庆市科润真空设备有限公司 |
基于磁控溅射的pecvd镀膜装置及方法
|