DE69308103T2 - Verfahren und Vorrichtung zum schnellen Abgeben von geringen Mengen von viskosen Materialien - Google Patents

Verfahren und Vorrichtung zum schnellen Abgeben von geringen Mengen von viskosen Materialien

Info

Publication number
DE69308103T2
DE69308103T2 DE69308103T DE69308103T DE69308103T2 DE 69308103 T2 DE69308103 T2 DE 69308103T2 DE 69308103 T DE69308103 T DE 69308103T DE 69308103 T DE69308103 T DE 69308103T DE 69308103 T2 DE69308103 T2 DE 69308103T2
Authority
DE
Germany
Prior art keywords
chamber
nozzle
viscous material
refill
diaphragm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69308103T
Other languages
English (en)
Other versions
DE69308103D1 (de
Inventor
Duong La
Robert L Ciardella
Alec J Babiarz
Carlos E Bouras
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nordson Corp
Original Assignee
Nordson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordson Corp filed Critical Nordson Corp
Application granted granted Critical
Publication of DE69308103D1 publication Critical patent/DE69308103D1/de
Publication of DE69308103T2 publication Critical patent/DE69308103T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/085—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to flow or pressure of liquid or other fluent material to be discharged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
DE69308103T 1992-11-19 1993-06-09 Verfahren und Vorrichtung zum schnellen Abgeben von geringen Mengen von viskosen Materialien Expired - Fee Related DE69308103T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/978,783 US5320250A (en) 1991-12-02 1992-11-19 Method for rapid dispensing of minute quantities of viscous material

Publications (2)

Publication Number Publication Date
DE69308103D1 DE69308103D1 (de) 1997-03-27
DE69308103T2 true DE69308103T2 (de) 1997-06-26

Family

ID=25526383

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69308103T Expired - Fee Related DE69308103T2 (de) 1992-11-19 1993-06-09 Verfahren und Vorrichtung zum schnellen Abgeben von geringen Mengen von viskosen Materialien

Country Status (5)

Country Link
US (4) US5320250A (de)
EP (1) EP0598182B1 (de)
JP (1) JPH0768203A (de)
AT (1) ATE148978T1 (de)
DE (1) DE69308103T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010043192A1 (de) * 2010-10-29 2012-05-03 Leica Biosystems Nussloch Gmbh Dosierpumpe zur Förderung eines Eindeckmediums durch Volumenänderung eines Förderraums

Families Citing this family (227)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
US6245189B1 (en) 1994-12-05 2001-06-12 Nordson Corporation High Throughput plasma treatment system
JP3241251B2 (ja) * 1994-12-16 2001-12-25 キヤノン株式会社 電子放出素子の製造方法及び電子源基板の製造方法
US6186192B1 (en) * 1995-09-25 2001-02-13 Rapid Analysis And Development Company Jet soldering system and method
US5868305A (en) * 1995-09-25 1999-02-09 Mpm Corporation Jet soldering system and method
US5894985A (en) * 1995-09-25 1999-04-20 Rapid Analysis Development Company Jet soldering system and method
US5894980A (en) * 1995-09-25 1999-04-20 Rapid Analysis Development Comapny Jet soldering system and method
US6276589B1 (en) 1995-09-25 2001-08-21 Speedline Technologies, Inc. Jet soldering system and method
US5938102A (en) 1995-09-25 1999-08-17 Muntz; Eric Phillip High speed jet soldering system
DE69631428T2 (de) * 1995-10-13 2004-12-02 Nordson Corp., Westlake System und verfahren zur beschichtung der unterseite von flip chips
US6267266B1 (en) 1995-11-16 2001-07-31 Nordson Corporation Non-contact liquid material dispenser having a bellows valve assembly and method for ejecting liquid material onto a substrate
US5747102A (en) * 1995-11-16 1998-05-05 Nordson Corporation Method and apparatus for dispensing small amounts of liquid material
DE69632795T8 (de) * 1995-11-16 2005-10-20 Nordson Corp., Westlake Verfahren und Vorrichtung zur Ausgabe von kleinen Mengen eines flüssigen Materials
US6253957B1 (en) 1995-11-16 2001-07-03 Nordson Corporation Method and apparatus for dispensing small amounts of liquid material
JP3516284B2 (ja) * 1995-12-21 2004-04-05 富士写真フイルム株式会社 液体噴射装置
JP3753767B2 (ja) * 1995-12-21 2006-03-08 富士写真フイルム株式会社 画像形成装置
US5699934A (en) * 1996-01-29 1997-12-23 Universal Instruments Corporation Dispenser and method for dispensing viscous fluids
JP3697315B2 (ja) * 1996-05-13 2005-09-21 松下電器産業株式会社 接着剤塗布装置
US5916524A (en) 1997-07-23 1999-06-29 Bio-Dot, Inc. Dispensing apparatus having improved dynamic range
WO1998009142A1 (en) * 1996-08-27 1998-03-05 Volk Enterprises, Inc. Adhesive seal for timer flange
JP3587627B2 (ja) * 1996-09-05 2004-11-10 松下電器産業株式会社 接着剤塗布方法
DE19641151A1 (de) 1996-10-07 1998-04-09 Focke & Co Weichbecher-Verpackung sowie Verfahren und Vorrichtung zum Herstellen derselben und anderer Verpackungen
US6112588A (en) * 1996-10-25 2000-09-05 Speedline Technologies, Inc. Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system
US6412328B1 (en) 1996-10-25 2002-07-02 Speedline Technologies, Inc. Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system
US5837892A (en) * 1996-10-25 1998-11-17 Camelot Systems, Inc. Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system
US5855323A (en) * 1996-11-13 1999-01-05 Sandia Corporation Method and apparatus for jetting, manufacturing and attaching uniform solder balls
US6132809A (en) 1997-01-16 2000-10-17 Precision Valve & Automation, Inc. Conformal coating using multiple applications
US5820772A (en) * 1997-01-21 1998-10-13 Ford Motor Company Valveless diaphragm pump for dispensing molten metal
JP3333417B2 (ja) * 1997-02-04 2002-10-15 松下電器産業株式会社 Ｉｃチップの封止方法及び装置
US6224180B1 (en) 1997-02-21 2001-05-01 Gerald Pham-Van-Diep High speed jet soldering system
US6093251A (en) 1997-02-21 2000-07-25 Speedline Technologies, Inc. Apparatus for measuring the height of a substrate in a dispensing system
US5918648A (en) * 1997-02-21 1999-07-06 Speedline Techologies, Inc. Method and apparatus for measuring volume
JP3352385B2 (ja) 1997-03-21 2002-12-03 キヤノン株式会社 電子源基板およびそれを用いた電子装置の製造方法
FR2761627B1 (fr) * 1997-04-04 1999-07-09 Proner Comatel Sa Procede de realisation d'une bande metallique a brasure incorporee, pour constituer des pieces de contact
US5927851A (en) * 1997-04-07 1999-07-27 Raytheon Company Vibrating dispenser and method for dispensing filled epoxy adhesives
US6283461B1 (en) * 1997-06-20 2001-09-04 Ceramatec, Inc. Automatic cyclic fluid delivery device and associated process
US5957343A (en) * 1997-06-30 1999-09-28 Speedline Technologies, Inc. Controllable liquid dispensing device
US6085943A (en) * 1997-06-30 2000-07-11 Speedline Technologies, Inc. Controllable liquid dispensing device
DE19732040A1 (de) * 1997-07-25 1999-01-28 Bayern Freistaat Dispenser für ein Medium
US5915591A (en) * 1997-09-10 1999-06-29 Illinois Tool Works Inc. Electric solenoid valve for hot melt adhesive and method therefor
US6453810B1 (en) 1997-11-07 2002-09-24 Speedline Technologies, Inc. Method and apparatus for dispensing material in a printer
US5947022A (en) * 1997-11-07 1999-09-07 Speedline Technologies, Inc. Apparatus for dispensing material in a printer
US6324973B2 (en) 1997-11-07 2001-12-04 Speedline Technologies, Inc. Method and apparatus for dispensing material in a printer
US6022583A (en) * 1997-12-16 2000-02-08 Nordson Corporation Method of encapsulating a wire bonded die
US7470547B2 (en) * 2003-07-31 2008-12-30 Biodot, Inc. Methods and systems for dispensing sub-microfluidic drops
JP3329725B2 (ja) * 1998-03-18 2002-09-30 富士写真フイルム株式会社 液体噴射装置
JP2002523221A (ja) * 1998-08-24 2002-07-30 ロックタイト コーポレーション 単一ストローク流体定量吐出装置
DE19840992A1 (de) * 1998-09-08 2000-03-09 Disetronic Licensing Ag Drucküberwachung eines bei einer Infusion oder Injektion dosiert zu verabreichenden Produktfluids
AU1123300A (en) 1998-10-16 2000-05-08 Micro Robotics Systems, Inc. Dispensing apparatus
US6475282B1 (en) * 1999-01-08 2002-11-05 Fastar, Ltd. Intelligent control system for extrusion head dispensement
US6577912B1 (en) 1999-01-13 2003-06-10 Matsushita Electric Industrial Co., Ltd Computer device for production equipment
IL128283A0 (en) * 1999-01-28 1999-11-30 Neo Stitch Ltd Sewing apparatus
US6518996B1 (en) * 1999-02-22 2003-02-11 Optical Gaging Products, Inc. Compact video inspection apparatus with Y, Z, X compounded measurement axes
US20020014688A1 (en) * 1999-03-03 2002-02-07 Suresh Ramalingam Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials
SE9901253D0 (sv) * 1999-04-08 1999-04-08 Mydata Automation Ab Dispensing assembly
US6499629B1 (en) * 1999-05-28 2002-12-31 Nordson Corporation Dispensing apparatus for viscous liquids
DE19931113A1 (de) * 1999-07-06 2001-01-25 Ekra Eduard Kraft Gmbh Verfahren zum Aufbringen von Verbindungsmaterialien für eine Verbindung zwischen einem Mikrochip und einem Substrat, Verfahren zum Herstellen einer elektrischen und mechanischen Verbindung zwischen einem Mikrochip und einem Substrat sowie Verwendung eines nach dem Tintendruckprinzip arbeitenden Druckkopfes
US6238613B1 (en) 1999-07-14 2001-05-29 Stratasys, Inc. Apparatus and method for thermoplastic extrusion
US6379464B1 (en) * 1999-07-30 2002-04-30 K-G Devices Corporation Apparatus for applying material to a target in relative motion to a dispenser
US6478547B1 (en) * 1999-10-18 2002-11-12 Integrated Designs L.P. Method and apparatus for dispensing fluids
US6541063B1 (en) 1999-11-04 2003-04-01 Speedline Technologies, Inc. Calibration of a dispensing system
US6605315B1 (en) * 1999-11-05 2003-08-12 Matsushita Electric Industrial Co., Ltd. Bonding paste applicator and method of using it
FR2800997B1 (fr) * 1999-11-12 2002-02-15 Valois Sa Pompe a cadence rapide
US6578596B1 (en) 2000-04-18 2003-06-17 Stratasys, Inc. Apparatus and method for thermoplastic extrusion
AU2001274985A1 (en) * 2000-05-25 2001-12-03 Burleigh Automation, Inc. Adhesive dispensing and vision system for an automatic assembly system
EP1161880A1 (de) * 2000-06-09 2001-12-12 Brains in motion N.V. Verfahren ind Vorrichtung zum Auftragen eines viskosen Materials auf die Oberfläche eines Gegenstandes
SE518642C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel
SE518640C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning
AU2001282679A1 (en) * 2000-07-19 2002-01-30 Customix B.V. System for dispensing portions of various substances
JP2002072767A (ja) * 2000-08-25 2002-03-12 Fuji Denki Gazo Device Kk 円筒状電子写真感光体の製造方法及びその感光体開口端部の接着剤の検出方法
JP2002096013A (ja) * 2000-09-26 2002-04-02 Fujitsu Ltd 樹脂塗布方法
JP4502496B2 (ja) * 2000-11-16 2010-07-14 富士通株式会社 Ｂｇａ実装時におけるはんだ形状評価方法及びｂｇａ実装時におけるはんだ形状評価装置及びｂｇａ実装時におけるはんだ形状評価プログラムを収納したコンピュータ読み取り可能な記録媒体
JP3742000B2 (ja) * 2000-11-30 2006-02-01 富士通株式会社 プレス装置
FR2817618B1 (fr) * 2000-12-04 2003-03-07 Renault Procede et dispositif pour le depot d'un cordon de matiere sur des pieces
US6513897B2 (en) 2000-12-29 2003-02-04 3M Innovative Properties Co. Multiple resolution fluid applicator and method
JP2002239435A (ja) * 2001-02-16 2002-08-27 Matsushita Electric Ind Co Ltd 粘性材料塗布装置、及び粘性材料塗布方法
US6689219B2 (en) * 2001-03-15 2004-02-10 Michael Antoine Birmingham Apparatus and method for dispensing viscous liquid material
TW483792B (en) * 2001-03-21 2002-04-21 Hannstar Display Corp Stroke and pressure adjusting device for welding operation in soldering machine
US20050016451A1 (en) * 2001-06-01 2005-01-27 Edwards Charles O. Interchangeable microdesition head apparatus and method
KR20040024558A (ko) * 2001-06-01 2004-03-20 리트렉스 코오포레이션 압전 미세증착을 이용한 인쇄회로보드 구조물의 형성
US7449070B2 (en) * 2001-06-01 2008-11-11 Ulvac, Inc. Waveform generator for microdeposition control system
US7244310B2 (en) * 2001-06-01 2007-07-17 Litrex Corporation Over-clocking in a microdeposition control system to improve resolution
US20040231594A1 (en) * 2001-06-01 2004-11-25 Edwards Charles O. Microdeposition apparatus
US6620246B2 (en) * 2001-06-14 2003-09-16 Nylok Corporation Process controller for coating fasteners
US20030059520A1 (en) * 2001-09-27 2003-03-27 Yung-Ming Chen Apparatus for regulating temperature of a composition and a method of coating implantable devices
US6857543B2 (en) * 2001-12-01 2005-02-22 Shipley Company, L.L.C. Low volume dispense unit and method of using
US6463879B1 (en) * 2001-12-07 2002-10-15 Jan A. Czekajewski Ingestion monitoring system
US6711466B2 (en) * 2002-01-07 2004-03-23 International Business Machines Corporation Method and system for maintaining a desired distance between a dispenser and a surface
US6913182B2 (en) 2002-01-18 2005-07-05 Precision Dispensing Equipment, Inc. Method and apparatus for controlled application of flux
EP1432526B1 (de) * 2002-01-22 2011-12-07 Nordson Corporation Verfahren und vorrichtung zur erfassung eines flüssigkeitsstrahlmusters
US20080172026A1 (en) 2006-10-17 2008-07-17 Blomquist Michael L Insulin pump having a suspension bolus
DE10307719A1 (de) * 2002-03-01 2003-09-11 Vmt Bildverarbeitungssysteme G Verfahren zur Qualitätssicherung eines als Zielauftrag auf ein Zielobjekt aufzubringenden Auftrags eines Mediums
NL1020312C2 (nl) * 2002-04-05 2003-10-07 Otb Groep B V Werkwijze en inrichting voor het vervaardigen van een display, zoals bijvoorbeeld een polymere OLED display, een display en een substraat ten gebruike bij de werkwijze.
US6991825B2 (en) * 2002-05-10 2006-01-31 Asm Assembly Automation Ltd. Dispensation of controlled quantities of material onto a substrate
US20040173144A1 (en) * 2002-05-31 2004-09-09 Edwards Charles O. Formation of printed circuit board structures using piezo microdeposition
WO2003101369A2 (en) * 2002-06-04 2003-12-11 Matrix Technologies Corporation Liquid transfer device
US20040023439A1 (en) * 2002-07-03 2004-02-05 Kazunari Kimino Apparatus and method for manufacturing semiconductor device
JP4137725B2 (ja) * 2002-07-10 2008-08-20 松下電器産業株式会社 接合部材の加工寸法決定方法および装置
SE0202247D0 (sv) * 2002-07-18 2002-07-18 Mydata Automation Ab Jetting device and method at a jetting device
US20040148763A1 (en) * 2002-12-11 2004-08-05 Peacock David S. Dispensing system and method
JP2006519699A (ja) * 2003-03-06 2006-08-31 デンツプライ インターナショナル インコーポレーテッド 分配及び混合用チップ
US20040186621A1 (en) * 2003-03-19 2004-09-23 Nordson Corporation Method of implementing multiple pump speeds for dispensing a viscous material
JP2004283714A (ja) * 2003-03-20 2004-10-14 Fujitsu Display Technologies Corp 液剤吐出ディスペンサ
WO2004098258A1 (en) * 2003-05-02 2004-11-11 Marconi Communications Gmbh Gluing method and device
DE10327195A1 (de) * 2003-05-02 2004-11-25 Marconi Communications Gmbh Klebeverfahren und -vorrichtung
US20040224086A1 (en) * 2003-05-05 2004-11-11 Wright Ryan Erin Automated hot melt application apparatus and method
US7201294B2 (en) * 2003-05-05 2007-04-10 Conair Corporation Dispensing apparatus for receiving a number of differently sized foam canisters
US20050001869A1 (en) * 2003-05-23 2005-01-06 Nordson Corporation Viscous material noncontact jetting system
KR100540633B1 (ko) * 2003-06-20 2006-01-11 주식회사 탑 엔지니어링 페이스트 도포기 및 그 제어 방법
EP2095885B1 (de) * 2003-07-14 2017-08-02 Nordson Corporation Vorrichtung zur Abgabe einzelner Mengen von viskosem Material
US20050048195A1 (en) * 2003-08-26 2005-03-03 Akihiro Yanagita Dispensing system and method of controlling the same
US20050082670A1 (en) * 2003-09-11 2005-04-21 Nordson Corporation Method for preapplying a viscous material to strengthen solder connections in microelectronic packaging and microelectronic packages formed thereby
US20050056946A1 (en) * 2003-09-16 2005-03-17 Cookson Electronics, Inc. Electrical circuit assembly with improved shock resistance
US20050095366A1 (en) * 2003-10-31 2005-05-05 Liang Fang Method of conformal coating using noncontact dispensing
US20050095367A1 (en) * 2003-10-31 2005-05-05 Babiarz Alec J. Method of noncontact dispensing of viscous material
SE0302985D0 (sv) * 2003-11-13 2003-11-13 Mydata Automation Ab A method for generating a jetting program
DE102004009386A1 (de) * 2004-02-24 2005-09-08 Cavis Microcaps Gmbh Gerät und Anordnung zur Erzeugung von Einzeltropfen aus Flüssigkeiten unterschiedlicher Viskosität in gasförmigen und/oder flüssigen Medien
US7033007B2 (en) * 2004-03-11 2006-04-25 Hewlett-Packard Development Company, L.P. Inkjet printer, ink pump mechanism and actuator
US8534499B2 (en) * 2005-10-21 2013-09-17 Ch&I Technologies, Inc. Integrated material transfer and dispensing system
KR100710683B1 (ko) * 2004-05-12 2007-04-24 주식회사 탑 엔지니어링 씰런트 디스펜서
US8101244B2 (en) * 2004-06-09 2012-01-24 Smithkline Beecham Corporation Apparatus and method for producing or processing a product or sample
TWI356036B (en) * 2004-06-09 2012-01-11 Smithkline Beecham Corp Apparatus and method for pharmaceutical production
US20060002986A1 (en) * 2004-06-09 2006-01-05 Smithkline Beecham Corporation Pharmaceutical product
JP4489524B2 (ja) * 2004-07-23 2010-06-23 株式会社ルネサステクノロジ 半導体装置の製造方法およびペースト塗布装置
US20060029724A1 (en) * 2004-08-06 2006-02-09 Nordson Corporation System for jetting phosphor for optical displays
US7510895B2 (en) * 2004-10-29 2009-03-31 Nordson Corporation Inferential temperature control system
US20060193969A1 (en) * 2005-02-25 2006-08-31 Speedline Technologies, Inc. Method and apparatus for streaming a viscous material on a substrate
US20060214028A1 (en) * 2005-03-25 2006-09-28 Hynes Anthony J Dispensing device for atomized reactive material, system and method of use thereof
US20070036902A1 (en) * 2005-08-12 2007-02-15 O'neal Hubert R Method for applying chemical coatings
US7707961B2 (en) * 2005-08-12 2010-05-04 Tmc-Ip, Llc Apparatus for applying chemical coatings
US20070069041A1 (en) * 2005-09-27 2007-03-29 Nordson Corporation Viscous material dispensing systems with parameter monitoring and methods of operating such systems
US20070145164A1 (en) * 2005-12-22 2007-06-28 Nordson Corporation Jetting dispenser with multiple jetting nozzle outlets
US20070164089A1 (en) * 2006-01-19 2007-07-19 Nordson Corporation Method of dispensing small amounts of liquid material
US20070264130A1 (en) * 2006-01-27 2007-11-15 Phluid, Inc. Infusion Pumps and Methods for Use
GB0610720D0 (en) * 2006-06-01 2006-07-12 Reckitt Benckiser Uk Ltd Material detection
GB0610719D0 (en) * 2006-06-01 2006-07-12 Reckitt Benckiser Uk Ltd Material detection
US7980197B2 (en) * 2006-11-03 2011-07-19 Illinois Tool Works, Inc. Method and apparatus for dispensing a viscous material on a substrate
US20080138408A1 (en) * 2006-11-13 2008-06-12 Siddharth Venkatesh Drug delivery system and method
TWI323189B (en) * 2006-12-29 2010-04-11 Ind Tech Res Inst Real-time dispenser fault detection and classification method
US7785667B2 (en) * 2007-01-04 2010-08-31 Nordson Corporation Method of controlling edge definition of viscous materials
US20080227663A1 (en) 2007-01-19 2008-09-18 Biodot, Inc. Systems and methods for high speed array printing and hybridization
JP2010022881A (ja) * 2007-03-30 2010-02-04 Musashi Eng Co Ltd 液材吐出装置および液材吐出方法
DE102007027168A1 (de) * 2007-06-13 2008-12-18 Marco Systemanalyse Und Entwicklung Gmbh Dosiervorrichtung
US8765212B2 (en) 2007-09-21 2014-07-01 Nordson Corporation Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material
CN101873989A (zh) * 2007-11-29 2010-10-27 诺信公司 分配粘性材料的方法
KR100899674B1 (ko) * 2008-01-22 2009-05-28 주식회사 탑 엔지니어링 시린지 장착이 가능한 변위 센서 및 이를 구비한 디스펜서
US8986253B2 (en) 2008-01-25 2015-03-24 Tandem Diabetes Care, Inc. Two chamber pumps and related methods
US9498790B2 (en) * 2008-04-16 2016-11-22 Imbox Shoecare A/S Apparatus for impregnation of items with an impregnating agent
US20090287180A1 (en) * 2008-05-19 2009-11-19 Diperna Paul M Disposable pump reservoir and related methods
US8408421B2 (en) 2008-09-16 2013-04-02 Tandem Diabetes Care, Inc. Flow regulating stopcocks and related methods
WO2010033758A1 (en) 2008-09-18 2010-03-25 Nordson Corporation Automated vacuum assisted valve priming system and methods of use
EP2334234A4 (de) 2008-09-19 2013-03-20 Tandem Diabetes Care Inc Vorrichtung zur messung der konzentration eines gelösten stoffs und entsprechende verfahren
US9162249B2 (en) * 2008-10-01 2015-10-20 Panasonic Intellectual Property Management Co., Ltd. Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same
EP2198974B1 (de) * 2008-12-16 2013-07-17 Bausch + Ströbel Maschinenfabrik Ilshofen GmbH + Co. KG Abgabevorrichtung mit optischer Sensoranordung
DE102009006378A1 (de) * 2009-01-07 2010-07-08 Linde Aktiengesellschaft Düse für eine Reinigungseinrichtung zum Reinigen mit einem Gemisch aus cryogenem Medium und Luft und Verfahren zum Reinigen mit einem Gemisch aus cryogenem Medium und Luft
US8608699B2 (en) 2009-03-31 2013-12-17 Tandem Diabetes Care, Inc. Systems and methods to address air, leaks and occlusions in an insulin pump system
US8221826B2 (en) * 2009-05-19 2012-07-17 The Procter & Gamble Company Method for applying adhesive to a web substrate
WO2011014704A2 (en) * 2009-07-30 2011-02-03 Tandem Diabetes Care, Inc. Infusion pump system with disposable cartridge having pressure venting and pressure feedback
GB0919059D0 (en) * 2009-10-30 2009-12-16 Sencon Europ Ltd Application and inspection system
CN103502781B (zh) * 2009-12-08 2016-08-24 诺信公司 力放大驱动系统，喷射分配器，以及分配流体的方法
US8757511B2 (en) 2010-01-11 2014-06-24 AdvanJet Viscous non-contact jetting method and apparatus
US8352089B2 (en) 2010-03-31 2013-01-08 Fishman Corporation Remotely controlled fluid dispenser
US8753713B2 (en) 2010-06-05 2014-06-17 Nordson Corporation Jetting dispenser and method of jetting highly cohesive adhesives
USD647380S1 (en) 2010-06-29 2011-10-25 Nordson Corporation Cover for an adhesive dispensing gun
US8210398B2 (en) 2010-06-29 2012-07-03 Nordson Corporation Thermally insulated applicator
WO2012059322A1 (en) * 2010-11-05 2012-05-10 Oce-Technologies B.V. Device for ejecting droplets of an electrically non-conductive fluid at high temperature
WO2012100205A2 (en) 2011-01-21 2012-07-26 Biodot, Inc. Piezoelectric dispenser with a longitudinal transducer and replaceable capillary tube
DE102011108799A1 (de) * 2011-07-29 2013-01-31 Vermes Microdispensing GmbH Dosiersystem und Dosierverfahren
US9346075B2 (en) 2011-08-26 2016-05-24 Nordson Corporation Modular jetting devices
JP5535155B2 (ja) * 2011-09-05 2014-07-02 株式会社コガネイ 流路切換弁およびそれを用いた流動性材料の吐出制御装置
GB201116143D0 (en) 2011-09-16 2011-11-02 Univ Greenwich Method of coating microneedle devices
WO2013038137A1 (en) 2011-09-16 2013-03-21 University Of Greenwich Method of coating microneedle devices
US8708246B2 (en) 2011-10-28 2014-04-29 Nordson Corporation Positive displacement dispenser and method for dispensing discrete amounts of liquid
CN103128031A (zh) * 2011-11-24 2013-06-05 鸿富锦精密工业（深圳）有限公司 点胶组件及应用该点胶组件的点胶机
US20130133574A1 (en) * 2011-11-29 2013-05-30 Illinois Tool Works Inc. Material deposition system for depositing materials on a substrate
US20130136850A1 (en) * 2011-11-29 2013-05-30 Illinois Tool Works Inc. Method for depositing materials on a substrate
US9254642B2 (en) 2012-01-19 2016-02-09 AdvanJet Control method and apparatus for dispensing high-quality drops of high-viscosity material
US9180242B2 (en) 2012-05-17 2015-11-10 Tandem Diabetes Care, Inc. Methods and devices for multiple fluid transfer
KR101290744B1 (ko) 2012-05-24 2013-07-29 주식회사 프로텍 밸브 충격형 디스펜싱 펌프
KR101306997B1 (ko) 2012-05-24 2013-09-09 주식회사 프로텍 밸브 가속형 디스펜싱 펌프
US20130319861A1 (en) * 2012-05-30 2013-12-05 Berkeley Lights, Inc. Outputting A Droplet Of Liquid Medium From A Device For Processing Micro-Objects In The Medium
US10422614B2 (en) 2012-09-14 2019-09-24 Henkel IP & Holding GmbH Dispenser for applying an adhesive to a remote surface
US20140093638A1 (en) * 2012-09-28 2014-04-03 Jonathan Joel Bloom Method of dispensing material based on angular locate feature
WO2014053005A1 (en) * 2012-10-01 2014-04-10 Tagsys Sas Improvements in rfid tag assemblies and process
CN102962170B (zh) * 2012-11-16 2015-10-14 上海交通大学 压电驱动膜片式高温热熔微喷点胶装置
US9057642B2 (en) * 2012-12-03 2015-06-16 Illinois Tool Works Inc. Method and apparatus for calibrating a dispenser
US9832428B2 (en) 2012-12-27 2017-11-28 Kateeva, Inc. Fast measurement of droplet parameters in industrial printing system
US9352561B2 (en) 2012-12-27 2016-05-31 Kateeva, Inc. Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances
KR20220001519A (ko) 2012-12-27 2022-01-05 카티바, 인크. 정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피 제어를 위한 기법
US11141752B2 (en) 2012-12-27 2021-10-12 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
US11673155B2 (en) 2012-12-27 2023-06-13 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
US9700908B2 (en) 2012-12-27 2017-07-11 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
EP2974566B1 (de) 2013-03-13 2018-05-09 Mycronic AB Verfahren und vorrichtung zur erzeugung eines tröpfchenstrahls
US9173998B2 (en) 2013-03-14 2015-11-03 Tandem Diabetes Care, Inc. System and method for detecting occlusions in an infusion pump
US9349405B1 (en) 2013-05-22 2016-05-24 Western Digital Technologies, Inc. Methods, devices and systems for dispensing material on an electronic device
KR102073188B1 (ko) * 2013-06-21 2020-02-04 삼성에스디아이 주식회사 전지용 활물질 도포장치 및 이용방법
TWI496623B (zh) * 2013-07-09 2015-08-21 All Ring Tech Co Ltd Method and device for measuring the amount of residual glue in valve
KR102034420B1 (ko) 2013-12-12 2019-11-08 카티바, 인크. 두께를 제어하기 위해 하프토닝을 이용하는 잉크-기반 층 제조
US10504758B2 (en) * 2014-02-14 2019-12-10 Taiwan Semiconductor Manufacturing Company Ltd. Nozzle having real time inspection functions
US11193523B2 (en) 2014-05-16 2021-12-07 Applied Bolting Technology Direct tension indicating washer with enhanced indicating material and method of manufacturing
CN104588236B (zh) * 2015-01-23 2016-09-21 无锡华能表面处理有限公司 双层输送涂装机
US9286922B1 (en) 2015-06-26 2016-03-15 Western Digital Technologies, Inc. Adaptive tacking of head gimbal assembly long tail and HSA arm slot
WO2017009375A1 (en) * 2015-07-10 2017-01-19 Ginolis Oy Positive displacement pump system and methods for the dispensing of droplets
US10286415B2 (en) 2015-07-10 2019-05-14 Ginolis Oy Dispensing device and method
CN105251664B (zh) * 2015-10-30 2019-08-16 东莞市嘉腾仪器仪表有限公司 在线式自动点胶机及其使用方法
CN105363636A (zh) * 2015-12-04 2016-03-02 江阴乐圩光电股份有限公司 自动点胶机
US9724473B2 (en) * 2016-01-12 2017-08-08 Nickolas Peter Demas Multi-directional low-displacement force sensor
CN105772347A (zh) * 2016-05-06 2016-07-20 张广山 一种蠕动式点胶控制机力度控制器
FR3052086B1 (fr) * 2016-06-07 2018-06-15 Louis Vuitton Malletier Systeme pour tester un parfum
US9787002B1 (en) 2016-06-29 2017-10-10 Delphi Technologies, Inc. Sealed electric terminal assembly
CN107824229B (zh) * 2016-09-23 2020-06-26 中国科学技术大学 电动微流控液滴分配器
DE102016119627A1 (de) 2016-10-14 2018-04-19 Marco Systemanalyse Und Entwicklung Gmbh Vorrichtung und Verfahren zum Aufbringen eines Fluids auf eine Objektoberfläche
DE102016119619B4 (de) 2016-10-14 2020-06-10 Marco Systemanalyse Und Entwicklung Gmbh Dosierroboter
CN108057574A (zh) * 2016-11-08 2018-05-22 宁波方太厨具有限公司 涂胶机
US10276937B2 (en) 2017-02-17 2019-04-30 Te Connectivity Corporation Jet dispensing electrically conductive inks
US10574014B2 (en) 2017-03-27 2020-02-25 Aptiv Technologies Limited Method for sealing electric terminal assembly
JP7291117B2 (ja) 2017-07-12 2023-06-14 マイクロニック アクティエボラーグ エネルギ出力装置を伴う噴射装置およびその制御方法
US10017659B1 (en) 2017-10-09 2018-07-10 Delphi Technologies, Inc Robust sealed electric terminal assembly
WO2019084348A1 (en) 2017-10-27 2019-05-02 Nordson Corporation SYSTEMS AND METHODS FOR CONTROLLING THE SPEED OF A CLOSED LOOP LIQUID FOR EJECTION
CN108453009B (zh) * 2018-03-26 2019-10-22 东莞高伟光学电子有限公司 一种动态控制htcc板背部环氧树脂胶量的方法及系统
US10935156B2 (en) 2019-02-11 2021-03-02 Cantok International Inc. Fluid control valve system and device for intermittently stopping fluid flow
CN111842014B (zh) * 2019-04-25 2021-12-14 鸿富锦精密电子（成都）有限公司 自动点胶机构
CN110369219B (zh) * 2019-06-05 2021-05-04 苏州和瑞科自动化科技有限公司 一种点胶设备
EP4037907A4 (de) 2019-10-04 2023-11-08 Kana Holdings, LLC System zur bereitstellung von dreidimensionalen merkmalen auf grossformatigen druckerzeugnissen
US20210354361A1 (en) * 2020-05-12 2021-11-18 Xtpl S.A. Metallic nanoparticle composition dispenser and method of dispensing metallic nanoparticle composition
CN111954459B (zh) * 2020-09-08 2021-10-08 惠州市合创电子科技有限公司 一种集成电路加工贴片装置
CN117483902A (zh) * 2023-12-26 2024-02-02 天津卡雷尔机器人技术有限公司 一种恒定推力电动注锡器

Family Cites Families (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2898860A (en) * 1953-11-24 1959-08-11 Pleuger K G Electro-magnetic device for pumping liquids
BE568988A (de) * 1957-05-23
US3329347A (en) * 1965-10-19 1967-07-04 Vitramon Inc Valved liquid ejector capable of emitting intermittent spurts
US3485417A (en) * 1968-06-19 1969-12-23 Eric H Cocks Hand-held applicator for hot-melt adhesives
US3646521A (en) * 1970-07-06 1972-02-29 Amtron Multilevel spray control
US3690518A (en) * 1970-11-13 1972-09-12 Nordson Corp Modular applicator system
US3682131A (en) * 1971-01-20 1972-08-08 Nordson Corp Coating apparatus control with delay-duration timer having constant current charging circuit and bistable trigger circuit
CH556692A (de) * 1971-02-15 1974-12-13 Roth Oscar Spritzpistole zum aufspritzen von leim.
US3936030A (en) * 1972-05-08 1976-02-03 Itt Industries, Inc. Electromagnetic valve
US3811601A (en) * 1972-09-11 1974-05-21 Nordson Corp Modular solenoid-operated dispenser
US3950761A (en) * 1973-01-04 1976-04-13 Casio Computer Co., Ltd. Ink pressurizing apparatus for an ink jet recorder
US4030640A (en) * 1975-11-10 1977-06-21 Indicon Inc. Method and apparatus for dispensing viscous materials
US4294381A (en) * 1976-03-18 1981-10-13 Miller Kenneth L Dispenser for and method of dispensing a material from a non-pressurized material reservoir
US4050613A (en) * 1976-08-31 1977-09-27 Corsette Douglas Frank Manual actuated dispensing pump
US4166246A (en) * 1978-01-23 1979-08-28 Nordson Corporation Digital control system for automatically compensating for conveyer movement changes
US4264214A (en) * 1978-06-09 1981-04-28 Nordson Corporation Gear motor/mixer
DE2851751A1 (de) * 1978-11-30 1980-06-19 Basf Ag Farbstoffzubereitungen fuer cellulose oder cellulosehaltiges fasermaterial
US4295198A (en) * 1979-04-02 1981-10-13 Cogit Systems, Inc. Automatic printed circuit dimensioning, routing and inspecting apparatus
US4465212A (en) * 1980-05-09 1984-08-14 Nordson Corporation Liquid dispensing device
US4334637A (en) * 1980-08-25 1982-06-15 Nordson Corporation Extrusion nozzle assembly
EP0063952B1 (de) * 1981-04-29 1986-02-05 Solex (U.K.) Limited Eine elektromagnetische Flüssigkeitseinspritzvorrichtung und ein Einzelpunktkraftstoffeinspritzsystem für eine Verbrennungskraftmaschine
US4380967A (en) * 1981-09-14 1983-04-26 Nordson Corporation System for automatically coating objects with a plurality of quantities of a coating material using a single discharge apparatus
US4447465A (en) * 1981-09-14 1984-05-08 Nordson Corporation Method for automatically coating objects with a plurality of quantities of a coating material using a single discharge apparatus
DE3148541C2 (de) * 1981-12-08 1984-03-01 Ransburg-Gema AG, 9015 St.Gallen Sprühbeschichtungsanlage
US4421800A (en) * 1982-02-02 1983-12-20 Digitronics Inventionering Corp. Spraying apparatus
US4431690A (en) * 1982-04-23 1984-02-14 Nordson Corporation Controller for uniform fluid dispensing
US4437488A (en) * 1982-05-24 1984-03-20 Lockwood Technical Inc. Solenoid valve for hot melt material
US4488665A (en) * 1982-05-24 1984-12-18 Spraymation, Inc. Multiple-outlet adhesive applicator apparatus and method
US4419384A (en) * 1982-09-27 1983-12-06 Armstrong World Industries, Inc. Apparatus and process for ultrasonically identifying and coating articles having differing characteristics
US4500937A (en) * 1982-11-12 1985-02-19 Nordson Corporation Control circuit for a solenoid driver for a dispenser
US4480749A (en) * 1983-05-26 1984-11-06 Nordson Corporation Tamper-evident container and method for making the same
GB2142257B (en) * 1983-07-02 1986-11-26 Gen Motors Overseas Adhesive application apparatus
US4584964A (en) * 1983-12-12 1986-04-29 Engel Harold J Viscous material dispensing machine having programmed positioning
US4736704A (en) * 1983-12-23 1988-04-12 Universal Instruments Corporation Apparatus for applying solder masking to a circuit board
JPS60219791A (ja) * 1984-04-16 1985-11-02 松下電器産業株式会社 厚膜回路の形成装置
JPH07115470B2 (ja) * 1984-05-10 1995-12-13 ウイレツト インターナシヨナル リミテツド 溶融熱可塑性組成物及び該組成物の基質への適用方法
US4572103A (en) * 1984-12-20 1986-02-25 Engel Harold J Solder paste dispenser for SMD circuit boards
US4550325A (en) * 1984-12-26 1985-10-29 Polaroid Corporation Drop dispensing device
US4711379A (en) * 1985-04-03 1987-12-08 Nordson Corporation Proportional flow control dispensing gun
GB8512727D0 (en) * 1985-05-20 1985-06-26 Vickers Plc Optical metrology
US4661368A (en) * 1985-09-18 1987-04-28 Universal Instruments Corporation Surface locating and dispensed dosage sensing method and apparatus
US4710399A (en) * 1986-09-02 1987-12-01 Dennis Richard K Method and mechanism to deposit solder paste upon substrates
US5054650A (en) * 1986-10-30 1991-10-08 Nordson Corporation Method of compensating for changes in the flow characteristics of a dispensed fluid to maintain the volume of dispensed fluid at a setpoint
KR910002998B1 (ko) * 1987-02-09 1991-05-11 산요덴끼 가부시끼가이샤 접착제 도포장치
US4762578A (en) * 1987-04-28 1988-08-09 Universal Instruments Corporation Non-contact sensing and controlling of spacing between a depositing tip and each selected depositing location on a substrate
US4941428A (en) * 1987-07-20 1990-07-17 Engel Harold J Computer controlled viscous material deposition apparatus
US4784582A (en) * 1987-10-02 1988-11-15 Creative Automation Company Fluid dispensing pump
CH675216A5 (de) * 1987-11-30 1990-09-14 Alphasem Ag
US5022629A (en) * 1988-01-04 1991-06-11 Interface, Inc. Valve construction
US4970985A (en) * 1989-05-01 1990-11-20 Slautterback Corporation Apparatus for tailing reduction in hot-melt dispensing of droplet patterns
US4896085A (en) * 1988-07-15 1990-01-23 Patent Research And Development Corp. Impulse actuator system
US4935261A (en) * 1988-10-17 1990-06-19 Micro Robotics Systems Inc. Method for controlling accurate dispensing of adhesive droplets
US4967933A (en) * 1989-02-27 1990-11-06 Asymptotic Technologies, Inc. Method and apparatus for dispensing viscous materials
ES2043306T3 (es) * 1989-05-31 1993-12-16 Conceptair Anstalt Procedimiento y dispositivo electrico, electronico y mecanico para distribuir, dosificr o difundir, en fase liquida o gaseosa, aromas, medicanmentos y otros productos liquidos o viscosos.
US4962871A (en) * 1989-07-24 1990-10-16 Valco Cincinnati, Inc. Applicator utilizing high speed non-contact extrusion valve
US5154319A (en) * 1989-09-22 1992-10-13 The Coca-Cola Company Apparatus for the dispensing of liquids in measured amounts
US5234134A (en) * 1989-09-22 1993-08-10 The Coca-Cola Company Device for the measured dispensing of liquids out of a storage container
US5022556A (en) * 1989-10-25 1991-06-11 Raytheon Company Programmable volume dispensing apparatus
US4951917A (en) * 1989-12-06 1990-08-28 Slautterback Corporation Dynamic response time for electromagnetic valving
US5074443A (en) * 1989-12-20 1991-12-24 Nordson Corporation Adaptor for liquid dispensing syringe
US5052388A (en) * 1989-12-22 1991-10-01 Medtronic, Inc. Method and apparatus for implementing activity sensing in a pulse generator
US5110615A (en) * 1990-01-31 1992-05-05 Asymptotic Technologies, Inc. Method for dispensing viscous materials a constant height above a workpiece surface
SE465756B (sv) * 1990-03-02 1991-10-28 Qenico Ab Anordning foer flaeckvis applicering av loedpasta, lim, e d, paa ett substrat
JP2691789B2 (ja) * 1990-03-08 1997-12-17 三菱電機株式会社 はんだ印刷検査装置
US4985715A (en) * 1990-03-22 1991-01-15 Telesis Controls Corporation Marker assembly for spray marking dot matrix characters and method of fabrication thereof
JPH0828565B2 (ja) * 1990-09-06 1996-03-21 ティーディーケイ株式会社 電子部品のプリント基板への搭載方法
US5186982A (en) * 1990-09-18 1993-02-16 Minnesota Mining And Manufacturing Company Pin transfer applicator and method
US5108024A (en) * 1991-06-03 1992-04-28 Motorola, Inc. Method of inspecting solder joints
US5195656A (en) * 1991-09-03 1993-03-23 Motorola, Inc. Accurately controlled fluid dispenser with upper and lower stroke adjusters
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
US5324359A (en) * 1992-02-25 1994-06-28 Nouvas Manufacturing Technology Co. Material deposition device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010043192A1 (de) * 2010-10-29 2012-05-03 Leica Biosystems Nussloch Gmbh Dosierpumpe zur Förderung eines Eindeckmediums durch Volumenänderung eines Förderraums
DE102010043192B4 (de) * 2010-10-29 2013-08-29 Leica Biosystems Nussloch Gmbh Dosierpumpe zur Förderung eines Eindeckmediums durch Volumenänderung eines Förderraums

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US5913455A (en) 1999-06-22
EP0598182A1 (de) 1994-05-25
JPH0768203A (ja) 1995-03-14
US5505777A (en) 1996-04-09
US5711989A (en) 1998-01-27
DE69308103D1 (de) 1997-03-27
EP0598182B1 (de) 1997-02-12
ATE148978T1 (de) 1997-02-15
US5320250A (en) 1994-06-14

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