DE69309565T2 - Feldeffekttransistor mit Graben mit niedrig dotiertem epitaktischen Gebiet an dessen Oberflächenbereich - Google Patents

Feldeffekttransistor mit Graben mit niedrig dotiertem epitaktischen Gebiet an dessen Oberflächenbereich

Info

Publication number
DE69309565T2
DE69309565T2 DE69309565T DE69309565T DE69309565T2 DE 69309565 T2 DE69309565 T2 DE 69309565T2 DE 69309565 T DE69309565 T DE 69309565T DE 69309565 T DE69309565 T DE 69309565T DE 69309565 T2 DE69309565 T2 DE 69309565T2
Authority
DE
Germany
Prior art keywords
trench
surface area
field effect
effect transistor
epitaxial region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69309565T
Other languages
English (en)
Other versions
DE69309565D1 (de
Inventor
Mike F Chang
Fwu-Iuan Hshieh
Sze-Hon Kwan
King Owyang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay Siliconix Inc
Original Assignee
Siliconix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconix Inc filed Critical Siliconix Inc
Application granted granted Critical
Publication of DE69309565D1 publication Critical patent/DE69309565D1/de
Publication of DE69309565T2 publication Critical patent/DE69309565T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7813Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843Source or drain regions of field-effect devices
    • H01L29/0847Source or drain regions of field-effect devices of field-effect transistors with insulated gate
    • H01L29/0852Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
    • H01L29/0873Drain regions
    • H01L29/0878Impurity concentration or distribution
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42356Disposition, e.g. buried gate electrode
    • H01L29/4236Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
DE69309565T 1992-07-24 1993-07-23 Feldeffekttransistor mit Graben mit niedrig dotiertem epitaktischen Gebiet an dessen Oberflächenbereich Expired - Fee Related DE69309565T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/918,954 US5910669A (en) 1992-07-24 1992-07-24 Field effect Trench transistor having lightly doped epitaxial region on the surface portion thereof

Publications (2)

Publication Number Publication Date
DE69309565D1 DE69309565D1 (de) 1997-05-15
DE69309565T2 true DE69309565T2 (de) 1997-07-24

Family

ID=25441223

Family Applications (2)

Application Number Title Priority Date Filing Date
DE0580452T Pending DE580452T1 (de) 1992-07-24 1993-07-23 Feldeffekttransistor mit Graben mit niedrig dotiertem epitaktischen Gebiet an dessen Oberflächenbereich.
DE69309565T Expired - Fee Related DE69309565T2 (de) 1992-07-24 1993-07-23 Feldeffekttransistor mit Graben mit niedrig dotiertem epitaktischen Gebiet an dessen Oberflächenbereich

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE0580452T Pending DE580452T1 (de) 1992-07-24 1993-07-23 Feldeffekttransistor mit Graben mit niedrig dotiertem epitaktischen Gebiet an dessen Oberflächenbereich.

Country Status (5)

Country Link
US (2) US5910669A (de)
EP (1) EP0580452B1 (de)
JP (1) JP3387563B2 (de)
KR (1) KR100305978B1 (de)
DE (2) DE580452T1 (de)

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6603173B1 (en) 1991-07-26 2003-08-05 Denso Corporation Vertical type MOSFET
US6015737A (en) * 1991-07-26 2000-01-18 Denso Corporation Production method of a vertical type MOSFET
US5558313A (en) * 1992-07-24 1996-09-24 Siliconix Inorporated Trench field effect transistor with reduced punch-through susceptibility and low RDSon
EP0675529A3 (de) * 1994-03-30 1998-06-03 Denso Corporation Verfahren zur Herstellung von vertikalen MOS-Transistoren
US5780324A (en) * 1994-03-30 1998-07-14 Denso Corporation Method of manufacturing a vertical semiconductor device
US5688725A (en) * 1994-12-30 1997-11-18 Siliconix Incorporated Method of making a trench mosfet with heavily doped delta layer to provide low on-resistance
US5674766A (en) * 1994-12-30 1997-10-07 Siliconix Incorporated Method of making a trench MOSFET with multi-resistivity drain to provide low on-resistance by varying dopant concentration in epitaxial layer
EP0735591B1 (de) * 1995-03-31 1999-09-08 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno DMOS-Anordnung-Struktur und Verfahren zur Herstellung
US5567634A (en) * 1995-05-01 1996-10-22 National Semiconductor Corporation Method of fabricating self-aligned contact trench DMOS transistors
US6049108A (en) * 1995-06-02 2000-04-11 Siliconix Incorporated Trench-gated MOSFET with bidirectional voltage clamping
US5629543A (en) * 1995-08-21 1997-05-13 Siliconix Incorporated Trenched DMOS transistor with buried layer for reduced on-resistance and ruggedness
EP0853818A4 (de) * 1995-08-21 1998-11-11 Siliconix Inc Niederspannungs-kurzkanal-graben-dmos-transistor
US6163051A (en) * 1995-08-24 2000-12-19 Kabushiki Kaisha Toshiba High breakdown voltage semiconductor device
US5821583A (en) * 1996-03-06 1998-10-13 Siliconix Incorporated Trenched DMOS transistor with lightly doped tub
US5814858A (en) * 1996-03-15 1998-09-29 Siliconix Incorporated Vertical power MOSFET having reduced sensitivity to variations in thickness of epitaxial layer
JP3217690B2 (ja) * 1996-03-22 2001-10-09 株式会社東芝 半導体装置の製造方法
US5818084A (en) * 1996-05-15 1998-10-06 Siliconix Incorporated Pseudo-Schottky diode
US5719409A (en) * 1996-06-06 1998-02-17 Cree Research, Inc. Silicon carbide metal-insulator semiconductor field effect transistor
KR100225409B1 (ko) * 1997-03-27 1999-10-15 김덕중 트렌치 디-모오스 및 그의 제조 방법
US6096608A (en) * 1997-06-30 2000-08-01 Siliconix Incorporated Bidirectional trench gated power mosfet with submerged body bus extending underneath gate trench
JP3342412B2 (ja) * 1997-08-08 2002-11-11 三洋電機株式会社 半導体装置およびその製造方法
US6103635A (en) * 1997-10-28 2000-08-15 Fairchild Semiconductor Corp. Trench forming process and integrated circuit device including a trench
JP2011035410A (ja) * 1997-10-31 2011-02-17 Siliconix Inc 保護用ダイオードを備えるトレンチゲート形パワーmosfet
US6429481B1 (en) * 1997-11-14 2002-08-06 Fairchild Semiconductor Corporation Field effect transistor and method of its manufacture
GB9808234D0 (en) * 1998-04-17 1998-06-17 Koninkl Philips Electronics Nv Mnufacture of trench-gate semiconductor devices
US5937297A (en) * 1998-06-01 1999-08-10 Chartered Semiconductor Manufacturing, Ltd. Method for making sub-quarter-micron MOSFET
US6614074B2 (en) 1998-06-05 2003-09-02 International Business Machines Corporation Grooved planar DRAM transfer device using buried pocket
US6621121B2 (en) 1998-10-26 2003-09-16 Silicon Semiconductor Corporation Vertical MOSFETs having trench-based gate electrodes within deeper trench-based source electrodes
US5998833A (en) * 1998-10-26 1999-12-07 North Carolina State University Power semiconductor devices having improved high frequency switching and breakdown characteristics
US6084264A (en) * 1998-11-25 2000-07-04 Siliconix Incorporated Trench MOSFET having improved breakdown and on-resistance characteristics
US6191447B1 (en) 1999-05-28 2001-02-20 Micro-Ohm Corporation Power semiconductor devices that utilize tapered trench-based insulating regions to improve electric field profiles in highly doped drift region mesas and methods of forming same
TW411553B (en) * 1999-08-04 2000-11-11 Mosel Vitelic Inc Method for forming curved oxide on bottom of trench
US6902987B1 (en) 2000-02-16 2005-06-07 Ziptronix, Inc. Method for low temperature bonding and bonded structure
JP4738562B2 (ja) * 2000-03-15 2011-08-03 三菱電機株式会社 半導体装置の製造方法
KR100327323B1 (ko) * 2000-05-30 2002-03-06 김덕중 래치 업이 억제된 트랜치 게이트 구조의 전력용반도체소자 및 그 제조방법
US6472678B1 (en) * 2000-06-16 2002-10-29 General Semiconductor, Inc. Trench MOSFET with double-diffused body profile
US20020105009A1 (en) 2000-07-13 2002-08-08 Eden Richard C. Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor
US6593620B1 (en) 2000-10-06 2003-07-15 General Semiconductor, Inc. Trench DMOS transistor with embedded trench schottky rectifier
US6916745B2 (en) 2003-05-20 2005-07-12 Fairchild Semiconductor Corporation Structure and method for forming a trench MOSFET having self-aligned features
US7345342B2 (en) 2001-01-30 2008-03-18 Fairchild Semiconductor Corporation Power semiconductor devices and methods of manufacture
JP4073176B2 (ja) * 2001-04-02 2008-04-09 新電元工業株式会社 半導体装置およびその製造方法
US20060038223A1 (en) * 2001-07-03 2006-02-23 Siliconix Incorporated Trench MOSFET having drain-drift region comprising stack of implanted regions
US7033876B2 (en) * 2001-07-03 2006-04-25 Siliconix Incorporated Trench MIS device having implanted drain-drift region and thick bottom oxide and process for manufacturing the same
US7291884B2 (en) * 2001-07-03 2007-11-06 Siliconix Incorporated Trench MIS device having implanted drain-drift region and thick bottom oxide
US7009247B2 (en) * 2001-07-03 2006-03-07 Siliconix Incorporated Trench MIS device with thick oxide layer in bottom of gate contact trench
US20030198672A1 (en) * 2001-08-14 2003-10-23 Franz G. Andrew Levothyroxine compositions having unique triidothyronine plasma AUC properties
US7045859B2 (en) * 2001-09-05 2006-05-16 International Rectifier Corporation Trench fet with self aligned source and contact
KR100859701B1 (ko) 2002-02-23 2008-09-23 페어차일드코리아반도체 주식회사 고전압 수평형 디모스 트랜지스터 및 그 제조 방법
GB0208833D0 (en) * 2002-04-18 2002-05-29 Koninkl Philips Electronics Nv Trench-gate semiconductor devices
US7161208B2 (en) * 2002-05-14 2007-01-09 International Rectifier Corporation Trench mosfet with field relief feature
US7576388B1 (en) 2002-10-03 2009-08-18 Fairchild Semiconductor Corporation Trench-gate LDMOS structures
US7282302B2 (en) * 2002-10-15 2007-10-16 Polyplus Battery Company Ionically conductive composites for protection of active metal anodes
TW583748B (en) * 2003-03-28 2004-04-11 Mosel Vitelic Inc The termination structure of DMOS device
TWI230456B (en) * 2003-05-14 2005-04-01 Promos Technologies Inc Shallow trench isolation and dynamic random access memory and fabricating methods thereof
US7638841B2 (en) 2003-05-20 2009-12-29 Fairchild Semiconductor Corporation Power semiconductor devices and methods of manufacture
US7075147B2 (en) * 2003-06-11 2006-07-11 International Rectifier Corporation Low on resistance power MOSFET with variably spaced trenches and offset contacts
JP3954541B2 (ja) * 2003-08-05 2007-08-08 株式会社東芝 半導体装置及びその製造方法
DE10341793B4 (de) * 2003-09-10 2021-09-23 Infineon Technologies Ag Halbleiterbauelement und Verfahren zu dessen Herstellung
TWI222685B (en) * 2003-12-18 2004-10-21 Episil Technologies Inc Metal oxide semiconductor device and fabricating method thereof
US7368777B2 (en) 2003-12-30 2008-05-06 Fairchild Semiconductor Corporation Accumulation device with charge balance structure and method of forming the same
US20090050958A1 (en) * 2004-05-21 2009-02-26 Qi Wang Semiconductor device having a spacer layer doped with slower diffusing atoms than substrate
US7352036B2 (en) 2004-08-03 2008-04-01 Fairchild Semiconductor Corporation Semiconductor power device having a top-side drain using a sinker trench
WO2006108011A2 (en) 2005-04-06 2006-10-12 Fairchild Semiconductor Corporation Trenched-gate field effect transistors and methods of forming the same
JP5008046B2 (ja) 2005-06-14 2012-08-22 ローム株式会社 半導体デバイス
US7385248B2 (en) 2005-08-09 2008-06-10 Fairchild Semiconductor Corporation Shielded gate field effect transistor with improved inter-poly dielectric
US7446374B2 (en) * 2006-03-24 2008-11-04 Fairchild Semiconductor Corporation High density trench FET with integrated Schottky diode and method of manufacture
US7319256B1 (en) 2006-06-19 2008-01-15 Fairchild Semiconductor Corporation Shielded gate trench FET with the shield and gate electrodes being connected together
US8896093B2 (en) * 2012-12-19 2014-11-25 Alpha And Omega Semiconductor Incorporated Circuit configuration and manufacturing processes for vertical transient voltage suppressor (TVS) and EMI filter
JP2008218711A (ja) * 2007-03-05 2008-09-18 Renesas Technology Corp 半導体装置およびその製造方法、ならびに電源装置
JP5767430B2 (ja) * 2007-08-10 2015-08-19 ローム株式会社 半導体装置および半導体装置の製造方法
US7772668B2 (en) 2007-12-26 2010-08-10 Fairchild Semiconductor Corporation Shielded gate trench FET with multiple channels
JP5721308B2 (ja) 2008-03-26 2015-05-20 ローム株式会社 半導体装置
US8174067B2 (en) 2008-12-08 2012-05-08 Fairchild Semiconductor Corporation Trench-based power semiconductor devices with increased breakdown voltage characteristics
US8067304B2 (en) * 2009-01-20 2011-11-29 Alpha And Omega Semiconductor, Inc. Method for forming a patterned thick metallization atop a power semiconductor chip
US10026835B2 (en) 2009-10-28 2018-07-17 Vishay-Siliconix Field boosted metal-oxide-semiconductor field effect transistor
US9653597B2 (en) * 2010-05-20 2017-05-16 Infineon Technologies Americas Corp. Method for fabricating a shallow and narrow trench FET and related structures
US8432000B2 (en) 2010-06-18 2013-04-30 Fairchild Semiconductor Corporation Trench MOS barrier schottky rectifier with a planar surface using CMP techniques
CN103035645B (zh) * 2012-08-10 2015-08-19 上海华虹宏力半导体制造有限公司 一种沟槽栅型mos管及其制造方法
US9349856B2 (en) * 2013-03-26 2016-05-24 Toyoda Gosei Co., Ltd. Semiconductor device including first interface and second interface as an upper surface of a convex protruded from first interface and manufacturing device thereof
WO2014207793A1 (ja) * 2013-06-24 2014-12-31 株式会社日立製作所 半導体装置およびその製造方法
JP6613610B2 (ja) 2015-05-14 2019-12-04 富士電機株式会社 半導体装置および半導体装置の製造方法
DE102015221054A1 (de) * 2015-10-28 2017-05-04 Robert Bosch Gmbh Leistungs-MOSFET und Verfahren zur Herstellung eines Leistungs-MOSFETs
JP6520785B2 (ja) 2016-03-24 2019-05-29 豊田合成株式会社 半導体装置の製造方法
JP6531691B2 (ja) 2016-03-24 2019-06-19 豊田合成株式会社 縦型トレンチmosfetの製造方法
JP6766512B2 (ja) * 2016-08-05 2020-10-14 富士電機株式会社 半導体装置および半導体装置の製造方法
JP6809330B2 (ja) 2017-03-28 2021-01-06 豊田合成株式会社 半導体装置の製造方法
JP6693020B2 (ja) 2017-03-28 2020-05-13 豊田合成株式会社 半導体装置の製造方法
CN109273529A (zh) * 2017-07-18 2019-01-25 比亚迪股份有限公司 Mos型功率器件及其制备方法
US10438813B2 (en) 2017-11-13 2019-10-08 Alpha And Omega Semiconductor (Cayman) Ltd. Semiconductor device having one or more titanium interlayers and method of making the same
CN116469923B (zh) * 2023-04-25 2023-10-20 南京第三代半导体技术创新中心有限公司 高可靠性沟槽型碳化硅mosfet器件及其制造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55146976A (en) * 1979-05-02 1980-11-15 Nec Corp Insulating gate field effect transistor
JPS5658267A (en) * 1979-10-17 1981-05-21 Nippon Telegr & Teleph Corp <Ntt> Insulated gate type field-effect transistor
US4593302B1 (en) * 1980-08-18 1998-02-03 Int Rectifier Corp Process for manufacture of high power mosfet laterally distributed high carrier density beneath the gate oxide
US4680853A (en) * 1980-08-18 1987-07-21 International Rectifier Corporation Process for manufacture of high power MOSFET with laterally distributed high carrier density beneath the gate oxide
JPS5984474A (ja) * 1982-11-05 1984-05-16 Nec Corp 電力用縦型電界効果トランジスタ
US4803532A (en) * 1982-11-27 1989-02-07 Nissan Motor Co., Ltd. Vertical MOSFET having a proof structure against puncture due to breakdown
JPS62176168A (ja) * 1986-01-30 1987-08-01 Nippon Denso Co Ltd 縦型mosトランジスタ
US5017504A (en) * 1986-12-01 1991-05-21 Mitsubishi Denki Kabushiki Kaisha Vertical type MOS transistor and method of formation thereof
US4941026A (en) * 1986-12-05 1990-07-10 General Electric Company Semiconductor devices exhibiting minimum on-resistance
JPS6442177A (en) * 1987-08-10 1989-02-14 Hitachi Ltd Insulated gate transistor
US5138422A (en) * 1987-10-27 1992-08-11 Nippondenso Co., Ltd. Semiconductor device which includes multiple isolated semiconductor segments on one chip
US4893160A (en) * 1987-11-13 1990-01-09 Siliconix Incorporated Method for increasing the performance of trenched devices and the resulting structure
JPH0783118B2 (ja) * 1988-06-08 1995-09-06 三菱電機株式会社 半導体装置およびその製造方法
US5072266A (en) * 1988-12-27 1991-12-10 Siliconix Incorporated Trench DMOS power transistor with field-shaping body profile and three-dimensional geometry
US5168331A (en) * 1991-01-31 1992-12-01 Siliconix Incorporated Power metal-oxide-semiconductor field effect transistor
GB9215653D0 (en) * 1992-07-23 1992-09-09 Philips Electronics Uk Ltd A method of manufacturing a semiconductor device comprising an insulated gate field effect device
KR940004847A (ko) * 1992-08-04 1994-03-16 리차드 제이. 컬 낮은 드레쉬 홀드 전압을 갖는 에피택셜 이중 확산형 금속 산화 실리콘(dmos) 트랜지스터 구조체 형성방법
US5341011A (en) * 1993-03-15 1994-08-23 Siliconix Incorporated Short channel trenched DMOS transistor
JPH07122749A (ja) * 1993-09-01 1995-05-12 Toshiba Corp 半導体装置及びその製造方法
US5405794A (en) * 1994-06-14 1995-04-11 Philips Electronics North America Corporation Method of producing VDMOS device of increased power density

Also Published As

Publication number Publication date
KR940003092A (ko) 1994-02-19
EP0580452A1 (de) 1994-01-26
JP3387563B2 (ja) 2003-03-17
US5532179A (en) 1996-07-02
KR100305978B1 (ko) 2001-12-15
DE69309565D1 (de) 1997-05-15
US5910669A (en) 1999-06-08
DE580452T1 (de) 1994-10-06
JPH06224437A (ja) 1994-08-12
EP0580452B1 (de) 1997-04-09

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