DE69309817D1 - Herstellungsverfahren einer lichtemittierenden Halbleitervorrichtung - Google Patents

Herstellungsverfahren einer lichtemittierenden Halbleitervorrichtung

Info

Publication number
DE69309817D1
DE69309817D1 DE69309817T DE69309817T DE69309817D1 DE 69309817 D1 DE69309817 D1 DE 69309817D1 DE 69309817 T DE69309817 T DE 69309817T DE 69309817 T DE69309817 T DE 69309817T DE 69309817 D1 DE69309817 D1 DE 69309817D1
Authority
DE
Germany
Prior art keywords
manufacturing
emitting device
semiconductor light
semiconductor
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69309817T
Other languages
English (en)
Other versions
DE69309817T2 (de
Inventor
Toshiyuki Nitta
Takashi Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of DE69309817D1 publication Critical patent/DE69309817D1/de
Application granted granted Critical
Publication of DE69309817T2 publication Critical patent/DE69309817T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE69309817T 1992-07-10 1993-07-08 Herstellungsverfahren einer lichtemittierenden Halbleitervorrichtung Expired - Fee Related DE69309817T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20748792A JPH0629577A (ja) 1992-07-10 1992-07-10 半導体発光素子の製造方法

Publications (2)

Publication Number Publication Date
DE69309817D1 true DE69309817D1 (de) 1997-05-22
DE69309817T2 DE69309817T2 (de) 1997-07-24

Family

ID=16540552

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69309817T Expired - Fee Related DE69309817T2 (de) 1992-07-10 1993-07-08 Herstellungsverfahren einer lichtemittierenden Halbleitervorrichtung

Country Status (6)

Country Link
US (1) US5403773A (de)
EP (1) EP0587277B1 (de)
JP (1) JPH0629577A (de)
KR (1) KR970005155B1 (de)
CA (1) CA2100115C (de)
DE (1) DE69309817T2 (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3412224B2 (ja) * 1994-01-07 2003-06-03 住友電気工業株式会社 レンズ実装方法と装置
US6136626A (en) * 1994-06-09 2000-10-24 Matsushita Electric Industrial Co., Ltd. Semiconductor light-emitting device and production method thereof
EP0772247B1 (de) * 1994-07-21 2004-09-15 Matsushita Electric Industrial Co., Ltd. Lichtemittierende halbleitervorrichtung und herstellungsverfahren
US6809010B1 (en) * 1996-02-29 2004-10-26 Kyocera Corporation Sapphire single crystal, semiconductor laser diode using the same for substrate, and method for manufacturing the same
US6326647B1 (en) * 1999-04-01 2001-12-04 Stmicroelectronics, Inc. Packaging and mounting of spherical semiconductor devices
AU2001253547A1 (en) * 2000-05-23 2001-12-03 Atmel Corporation Integrated ic chip package for electronic image sensor die
JP3538602B2 (ja) * 2000-06-28 2004-06-14 シャープ株式会社 半導体レーザー装置の製造方法および半導体レーザー装置の製造装置
JP2002141556A (ja) 2000-09-12 2002-05-17 Lumileds Lighting Us Llc 改良された光抽出効果を有する発光ダイオード
GB0209016D0 (en) 2002-04-19 2002-05-29 Zarlink Semiconductor Ab Optical transducer with farfield modifier
US7517728B2 (en) * 2004-03-31 2009-04-14 Cree, Inc. Semiconductor light emitting devices including a luminescent conversion element
US7330319B2 (en) * 2004-10-29 2008-02-12 3M Innovative Properties Company High brightness LED package with multiple optical elements
US7329982B2 (en) * 2004-10-29 2008-02-12 3M Innovative Properties Company LED package with non-bonded optical element
US20060091411A1 (en) * 2004-10-29 2006-05-04 Ouderkirk Andrew J High brightness LED package
US7304425B2 (en) * 2004-10-29 2007-12-04 3M Innovative Properties Company High brightness LED package with compound optical element(s)
US20060091412A1 (en) * 2004-10-29 2006-05-04 Wheatley John A Polarized LED
US20060091414A1 (en) * 2004-10-29 2006-05-04 Ouderkirk Andrew J LED package with front surface heat extractor
US7314770B2 (en) * 2004-11-18 2008-01-01 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US20060105483A1 (en) * 2004-11-18 2006-05-18 Leatherdale Catherine A Encapsulated light emitting diodes and methods of making
US7192795B2 (en) * 2004-11-18 2007-03-20 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US20060187653A1 (en) * 2005-02-10 2006-08-24 Olsson Mark S LED illumination devices
US7411668B2 (en) * 2005-09-26 2008-08-12 Zaps Technologies Incorporated Light returning target for a photometer
US20070092737A1 (en) * 2005-10-21 2007-04-26 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US20070092736A1 (en) * 2005-10-21 2007-04-26 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US7595515B2 (en) * 2005-10-24 2009-09-29 3M Innovative Properties Company Method of making light emitting device having a molded encapsulant
CN101297411B (zh) * 2005-10-24 2010-05-19 3M创新有限公司 发光器件的制造方法及发光器件
US7798678B2 (en) * 2005-12-30 2010-09-21 3M Innovative Properties Company LED with compound encapsulant lens
US7953293B2 (en) * 2006-05-02 2011-05-31 Ati Technologies Ulc Field sequence detector, method and video device
US7390117B2 (en) * 2006-05-02 2008-06-24 3M Innovative Properties Company LED package with compound converging optical element
US20070257270A1 (en) * 2006-05-02 2007-11-08 3M Innovative Properties Company Led package with wedge-shaped optical element
US7525126B2 (en) 2006-05-02 2009-04-28 3M Innovative Properties Company LED package with converging optical element
US20070257271A1 (en) * 2006-05-02 2007-11-08 3M Innovative Properties Company Led package with encapsulated converging optical element
US20070258241A1 (en) * 2006-05-02 2007-11-08 3M Innovative Properties Company Led package with non-bonded converging optical element
US7423297B2 (en) * 2006-05-03 2008-09-09 3M Innovative Properties Company LED extractor composed of high index glass
US8141384B2 (en) * 2006-05-03 2012-03-27 3M Innovative Properties Company Methods of making LED extractor arrays
US7655486B2 (en) * 2006-05-17 2010-02-02 3M Innovative Properties Company Method of making light emitting device with multilayer silicon-containing encapsulant
US20070269586A1 (en) * 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
US20080012034A1 (en) * 2006-07-17 2008-01-17 3M Innovative Properties Company Led package with converging extractor
US8092735B2 (en) * 2006-08-17 2012-01-10 3M Innovative Properties Company Method of making a light emitting device having a molded encapsulant
US8172434B1 (en) 2007-02-23 2012-05-08 DeepSea Power and Light, Inc. Submersible multi-color LED illumination system
US20090065792A1 (en) 2007-09-07 2009-03-12 3M Innovative Properties Company Method of making an led device having a dome lens
JP4797081B2 (ja) * 2009-04-10 2011-10-19 シークス株式会社 レンズ部品の実装方法
TWI462340B (zh) * 2010-09-08 2014-11-21 Epistar Corp 一種發光結構及其製造方法
KR102192572B1 (ko) * 2014-06-09 2020-12-18 삼성전자주식회사 광원 모듈의 불량 검사방법, 광원 모듈의 제조 방법 및 광원 모듈 검사장치
JP7165629B2 (ja) * 2019-07-12 2022-11-04 Ｄｏｗａエレクトロニクス株式会社 発光素子ランプ及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6033318B2 (ja) * 1978-07-14 1985-08-02 三菱電機株式会社 半導体発光装置の製造方法
GB2035595B (en) * 1978-11-29 1982-12-01 Plessey Co Ltd Optical positioning apparatus
JPS5729067A (en) * 1980-07-30 1982-02-16 Fuji Xerox Co Ltd Heat fixing device for electrophotographic copier
JPS60413A (ja) * 1983-06-16 1985-01-05 Sumitomo Electric Ind Ltd レンズ装荷方法
JPH0634410B2 (ja) * 1984-02-02 1994-05-02 住友電気工業株式会社 半導体発光素子
NL8403535A (nl) * 1984-11-21 1986-06-16 Philips Nv Inrichting voor het optisch koppelen van een stralingsbron aan een optische transmissievezel.
US4772123A (en) * 1986-11-24 1988-09-20 American Telephone And Telegraph Company, At&T Bell Laboratories Alignment of optical components
US4989051A (en) * 1990-02-13 1991-01-29 The Univ. Of Delaware Bi-directional, feed through emitter-detector for optical fiber transmission lines
US5181263A (en) * 1990-05-21 1993-01-19 Motorola, Inc. Wave-guide I/O for optical or electro-optical components
US5194105A (en) * 1991-08-29 1993-03-16 American Telephone And Telegraph Company Placement and bonding technique for optical elements

Also Published As

Publication number Publication date
KR970005155B1 (ko) 1997-04-12
CA2100115A1 (en) 1994-01-11
EP0587277B1 (de) 1997-04-16
JPH0629577A (ja) 1994-02-04
KR940006297A (ko) 1994-03-23
EP0587277A1 (de) 1994-03-16
US5403773A (en) 1995-04-04
DE69309817T2 (de) 1997-07-24
CA2100115C (en) 1998-06-16

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Legal Events

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8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: WESER & KOLLEGEN, 81245 MUENCHEN

8339 Ceased/non-payment of the annual fee