DE69314760T2 - Oberflächenmontierbares IC-Gehäuse mit integriert montierter Batterie - Google Patents

Oberflächenmontierbares IC-Gehäuse mit integriert montierter Batterie

Info

Publication number
DE69314760T2
DE69314760T2 DE69314760T DE69314760T DE69314760T2 DE 69314760 T2 DE69314760 T2 DE 69314760T2 DE 69314760 T DE69314760 T DE 69314760T DE 69314760 T DE69314760 T DE 69314760T DE 69314760 T2 DE69314760 T2 DE 69314760T2
Authority
DE
Germany
Prior art keywords
package
surface mount
integrated battery
battery
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69314760T
Other languages
English (en)
Other versions
DE69314760D1 (de
Inventor
Craig D Dixon
Michael J Hundt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics lnc USA
Original Assignee
SGS Thomson Microelectronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics Inc filed Critical SGS Thomson Microelectronics Inc
Application granted granted Critical
Publication of DE69314760D1 publication Critical patent/DE69314760D1/de
Publication of DE69314760T2 publication Critical patent/DE69314760T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49593—Battery in combination with a leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
    • H01M50/216—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for button or coin cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/924—Active solid-state devices, e.g. transistors, solid-state diodes with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
DE69314760T 1992-12-21 1993-12-20 Oberflächenmontierbares IC-Gehäuse mit integriert montierter Batterie Expired - Fee Related DE69314760T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/995,665 US5403782A (en) 1992-12-21 1992-12-21 Surface mountable integrated circuit package with integrated battery mount

Publications (2)

Publication Number Publication Date
DE69314760D1 DE69314760D1 (de) 1997-11-27
DE69314760T2 true DE69314760T2 (de) 1998-03-12

Family

ID=25542083

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69314760T Expired - Fee Related DE69314760T2 (de) 1992-12-21 1993-12-20 Oberflächenmontierbares IC-Gehäuse mit integriert montierter Batterie

Country Status (4)

Country Link
US (2) US5403782A (de)
EP (1) EP0605987B1 (de)
JP (1) JP3554350B2 (de)
DE (1) DE69314760T2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2677167B2 (ja) * 1993-07-08 1997-11-17 日本電気株式会社 駆動回路内蔵型液晶表示装置の製造方法
US5642265A (en) * 1994-11-29 1997-06-24 Sgs-Thomson Microelectronics, Inc. Ball grid array package with detachable module
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5586907A (en) * 1995-08-25 1996-12-24 The Whitaker Corporation Battery connector
US6395991B1 (en) 1996-07-29 2002-05-28 International Business Machines Corporation Column grid array substrate attachment with heat sink stress relief
US5796169A (en) * 1996-11-19 1998-08-18 International Business Machines Corporation Structurally reinforced ball grid array semiconductor package and systems
US5972734A (en) * 1997-09-17 1999-10-26 Lsi Logic Corporation Interposer for ball grid array (BGA) package
US6053394A (en) * 1998-01-13 2000-04-25 International Business Machines Corporation Column grid array substrate attachment with heat sink stress relief
TW382079B (en) * 1998-08-28 2000-02-11 Via Tech Inc Integrated real time clock integrated circuit device and manufacturing method thereof
US6052045A (en) * 1999-03-12 2000-04-18 Kearney-National, Inc. Electromechanical switching device package with controlled impedance environment
JP2002026173A (ja) * 2000-07-10 2002-01-25 Fuji Photo Film Co Ltd Ｉｃ装置、基板、およびｉｃ組付基板
USRE38381E1 (en) 2000-07-21 2004-01-13 Kearney-National Inc. Inverted board mounted electromechanical device
JP3609741B2 (ja) * 2001-03-30 2005-01-12 三洋電機株式会社 パック電池
US7088074B2 (en) * 2002-01-02 2006-08-08 International Business Machines Corporation System level device for battery and integrated circuit integration
AU2003230602A1 (en) * 2002-03-08 2003-09-22 Kearney-National, Inc. Surface mount molded relay package and method of manufacturing same
US20040081860A1 (en) * 2002-10-29 2004-04-29 Stmicroelectronics, Inc. Thin-film battery equipment
JP2005117887A (ja) * 2003-09-19 2005-04-28 Auto Network Gijutsu Kenkyusho:Kk 車載用回路ユニットの取付構造及び車載用回路ユニット
US7557433B2 (en) 2004-10-25 2009-07-07 Mccain Joseph H Microelectronic device with integrated energy source
US7230321B2 (en) * 2003-10-13 2007-06-12 Mccain Joseph Integrated circuit package with laminated power cell having coplanar electrode
EP1544917A1 (de) * 2003-12-15 2005-06-22 Dialog Semiconductor GmbH Integriertes Batteriepack mit Verbindung zu einem Leiterrahmen
JP2009170575A (ja) * 2008-01-15 2009-07-30 Panasonic Corp 面実装用方形蓄電セル
US8666505B2 (en) 2010-10-26 2014-03-04 Medtronic, Inc. Wafer-scale package including power source
JP5281121B2 (ja) * 2011-06-14 2013-09-04 三菱電機株式会社 車載電子装置の基板収納筐体
KR101321277B1 (ko) * 2011-07-04 2013-10-28 삼성전기주식회사 전력 모듈 패키지 및 그 제조방법
US11852957B2 (en) 2020-09-22 2023-12-26 Google Llc Thermal-control system for a security camera and associated security camera
US11457545B2 (en) 2020-09-28 2022-09-27 Google Llc Thermal-control system of a media-streaming device and associated media-streaming devices
KR20230066460A (ko) 2020-10-02 2023-05-15 구글 엘엘씨 이미지 캡처 도어벨 장치
US11277941B1 (en) 2020-10-02 2022-03-15 Google Llc Thermal-control system of a video-recording doorbell and associated video-recording doorbells

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4053688A (en) * 1975-12-08 1977-10-11 Perkins Carroll R Battery holder
CH638653B (fr) * 1979-08-21 Ebauchesfabrik Eta Ag Dispositif de maintien d'une pile dans une montre-bracelet electronique.
US4998888A (en) * 1984-07-23 1991-03-12 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with battery housing
US4487820A (en) * 1983-07-25 1984-12-11 Memory Protection Devices, Inc. Battery holder for coin cells
US4645943A (en) * 1984-10-15 1987-02-24 Dallas Semiconductor Corporation Space-saving back-up power supply
JPS61164249A (ja) * 1985-01-16 1986-07-24 Fujitsu Ltd 半導体装置
US4985870A (en) * 1986-07-02 1991-01-15 Dallas Semiconductor Corporation Apparatus for connecting electronic modules containing integrated circuits and backup batteries
US5289034A (en) * 1990-01-26 1994-02-22 Sgs-Thomson Microelectronics, Inc. IC package having replaceable backup battery
US5294829A (en) * 1990-01-26 1994-03-15 Sgs-Thomson Microelectronics, Inc. IC package having direct attach backup battery
US5196374A (en) * 1990-01-26 1993-03-23 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with molded cell
US5008776A (en) * 1990-06-06 1991-04-16 Sgs-Thomson Microelectronics, Inc. Zero power IC module
US5153710A (en) * 1991-07-26 1992-10-06 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with laminated backup cell
JPH0644769A (ja) * 1992-05-26 1994-02-18 Konica Corp 不揮発メモリ基板

Also Published As

Publication number Publication date
EP0605987B1 (de) 1997-10-22
EP0605987A3 (de) 1995-02-15
EP0605987A2 (de) 1994-07-13
US5498903A (en) 1996-03-12
JPH06275773A (ja) 1994-09-30
DE69314760D1 (de) 1997-11-27
US5403782A (en) 1995-04-04
JP3554350B2 (ja) 2004-08-18

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8339 Ceased/non-payment of the annual fee