DE69316111D1 - Topografische, selektive Muster - Google Patents
Topografische, selektive MusterInfo
- Publication number
- DE69316111D1 DE69316111D1 DE69316111T DE69316111T DE69316111D1 DE 69316111 D1 DE69316111 D1 DE 69316111D1 DE 69316111 T DE69316111 T DE 69316111T DE 69316111 T DE69316111 T DE 69316111T DE 69316111 D1 DE69316111 D1 DE 69316111D1
- Authority
- DE
- Germany
- Prior art keywords
- topographic
- selective patterns
- selective
- patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US91498192A | 1992-07-16 | 1992-07-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69316111D1 true DE69316111D1 (de) | 1998-02-12 |
DE69316111T2 DE69316111T2 (de) | 1998-08-20 |
Family
ID=25435040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69316111T Expired - Fee Related DE69316111T2 (de) | 1992-07-16 | 1993-07-15 | Topografische, selektive Muster |
Country Status (9)
Country | Link |
---|---|
US (1) | US5830376A (de) |
EP (1) | EP0583997B1 (de) |
JP (1) | JPH06104099A (de) |
KR (1) | KR940005324A (de) |
CA (1) | CA2097388A1 (de) |
DE (1) | DE69316111T2 (de) |
HK (1) | HK1008141A1 (de) |
MX (1) | MX9303577A (de) |
MY (1) | MY131499A (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69527962T2 (de) * | 1994-06-21 | 2003-04-10 | Minnesota Mining & Mfg | Verbundschicht für lichtsteuerung und geheimhaltung |
TW348227B (en) * | 1994-12-28 | 1998-12-21 | Nisshin Denki Kk | Method of orientation treatment of orientation film |
US6049419A (en) * | 1998-01-13 | 2000-04-11 | 3M Innovative Properties Co | Multilayer infrared reflecting optical body |
US7223364B1 (en) * | 1999-07-07 | 2007-05-29 | 3M Innovative Properties Company | Detection article having fluid control film |
JP2003510824A (ja) * | 1999-09-28 | 2003-03-18 | ジエテツク,インコーポレーテツド | 大きい深さ対幅アスペクト比をもつホールから、ポリマーを制御下にかつ急速に除去するための大気内プロセスおよびシステム |
US7365019B2 (en) * | 1999-11-01 | 2008-04-29 | Jetek, Llc | Atmospheric process and system for controlled and rapid removal of polymers from high aspect ratio holes |
US6762136B1 (en) | 1999-11-01 | 2004-07-13 | Jetek, Inc. | Method for rapid thermal processing of substrates |
US6955991B2 (en) * | 1999-11-01 | 2005-10-18 | Jetek, Inc. | Atmospheric process and system for controlled and rapid removal of polymers from high depth to width aspect ratio holes |
US6962025B1 (en) | 2001-05-29 | 2005-11-08 | H.B. Fuller Licensing & Financing, Inc. | Metal plasma surface-modified thermal barrier channel |
US7767928B2 (en) * | 2001-09-05 | 2010-08-03 | Lasertec Gmbh | Depth measurement and depth control or automatic depth control for a hollow to be produced by a laser processing device |
TWI245817B (en) * | 2003-04-09 | 2005-12-21 | Htc Corp | Process for forming interface at plated and un-plated area |
US7323699B2 (en) * | 2005-02-02 | 2008-01-29 | Rave, Llc | Apparatus and method for modifying an object |
JP6181463B2 (ja) * | 2013-08-20 | 2017-08-16 | 株式会社アスカネット | 対向する壁面への選択的蒸着方法 |
EP3724704A4 (de) | 2017-12-13 | 2021-12-22 | 3M Innovative Properties Company | Steuerungsfilm mit hoher lichtdurchlässigkeit |
CN111465894A (zh) | 2017-12-13 | 2020-07-28 | 3M创新有限公司 | 高透射率光控膜 |
JP2021533407A (ja) | 2018-08-01 | 2021-12-02 | スリーエム イノベイティブ プロパティズ カンパニー | 高透過率の光制御フィルム |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3860783A (en) * | 1970-10-19 | 1975-01-14 | Bell Telephone Labor Inc | Ion etching through a pattern mask |
US3873371A (en) * | 1972-11-07 | 1975-03-25 | Hughes Aircraft Co | Small geometry charge coupled device and process for fabricating same |
CA1009607A (en) * | 1972-11-29 | 1977-05-03 | Heinz Dimigen | Method of manufacturing etched structures in substrates by ion etching |
US4016062A (en) * | 1975-09-11 | 1977-04-05 | International Business Machines Corporation | Method of forming a serrated surface topography |
US4126712A (en) * | 1976-07-30 | 1978-11-21 | Rca Corporation | Method of transferring a surface relief pattern from a wet poly(olefin sulfone) layer to a metal layer |
US4097618A (en) * | 1977-03-09 | 1978-06-27 | Rca Corporation | Method of transferring a surface relief pattern from a poly(1-methyl-1-cyclopropene sulfone) layer to a non-metallic inorganic layer |
US4289381A (en) * | 1979-07-02 | 1981-09-15 | Hughes Aircraft Company | High selectivity thin film polarizer |
US4465551A (en) * | 1980-05-07 | 1984-08-14 | Horwitz Christopher M | Graded microstructured layers formed by vacuum etching |
US4388517A (en) * | 1980-09-22 | 1983-06-14 | Texas Instruments Incorporated | Sublimation patterning process |
US4414059A (en) * | 1982-12-09 | 1983-11-08 | International Business Machines Corporation | Far UV patterning of resist materials |
NL8502765A (nl) * | 1985-10-10 | 1987-05-04 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting. |
US4684437A (en) * | 1985-10-31 | 1987-08-04 | International Business Machines Corporation | Selective metal etching in metal/polymer structures |
US4761394A (en) * | 1986-10-31 | 1988-08-02 | Shell Oil Company | Ethylene oxide catalyst and process for preparing the catalyst |
US4764394A (en) * | 1987-01-20 | 1988-08-16 | Wisconsin Alumni Research Foundation | Method and apparatus for plasma source ion implantation |
DE3733135C1 (de) * | 1987-10-01 | 1988-09-22 | Leybold Ag | Vorrichtung zum Beschichten oder AEtzen mittels eines Plasmas |
GB2212974B (en) * | 1987-11-25 | 1992-02-12 | Fuji Electric Co Ltd | Plasma processing apparatus |
JPH01170558A (ja) * | 1987-12-24 | 1989-07-05 | Nippon Steel Corp | 注入ノズル直接通電加熱の制御方法 |
US4822451A (en) * | 1988-04-27 | 1989-04-18 | Minnesota Mining And Manufacturing Company | Process for the surface modification of semicrystalline polymers |
US4918031A (en) * | 1988-12-28 | 1990-04-17 | American Telephone And Telegraph Company,At&T Bell Laboratories | Processes depending on plasma generation using a helical resonator |
US5091626A (en) * | 1990-02-02 | 1992-02-25 | Hadassah Medical Organization | Method for the ablative reshaping of material surfaces |
JPH0785289B2 (ja) * | 1990-03-19 | 1995-09-13 | シャープ株式会社 | 磁気ヘッドの製造方法 |
JP2932650B2 (ja) * | 1990-09-17 | 1999-08-09 | 松下電器産業株式会社 | 微細構造物の製造方法 |
US5139967A (en) * | 1991-02-20 | 1992-08-18 | Micron Technology, Inc. | Process for planarizing insulating dielectric material |
US5178726A (en) * | 1991-03-07 | 1993-01-12 | Minnesota Mining And Manufacturing Company | Process for producing a patterned metal surface |
GB9114018D0 (en) * | 1991-06-28 | 1991-08-14 | Philips Electronic Associated | Thin-film transistor manufacture |
-
1993
- 1993-05-31 CA CA002097388A patent/CA2097388A1/en not_active Abandoned
- 1993-06-10 MY MYPI93001131A patent/MY131499A/en unknown
- 1993-06-15 MX MX9303577A patent/MX9303577A/es not_active IP Right Cessation
- 1993-06-23 JP JP5152031A patent/JPH06104099A/ja active Pending
- 1993-07-15 DE DE69316111T patent/DE69316111T2/de not_active Expired - Fee Related
- 1993-07-15 EP EP93401823A patent/EP0583997B1/de not_active Expired - Lifetime
- 1993-07-15 KR KR1019930013371A patent/KR940005324A/ko active IP Right Grant
-
1996
- 1996-11-22 US US08/754,468 patent/US5830376A/en not_active Expired - Fee Related
-
1998
- 1998-07-07 HK HK98108993A patent/HK1008141A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5830376A (en) | 1998-11-03 |
CA2097388A1 (en) | 1994-01-17 |
EP0583997B1 (de) | 1998-01-07 |
MY131499A (en) | 2007-08-30 |
KR940005324A (ko) | 1994-03-21 |
MX9303577A (es) | 1994-02-28 |
EP0583997A1 (de) | 1994-02-23 |
DE69316111T2 (de) | 1998-08-20 |
HK1008141A1 (en) | 1999-04-30 |
JPH06104099A (ja) | 1994-04-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |