DE69322832D1 - Verfahren zur Herstellung einer Verbindungsstruktur für eine elektronische Packungsstruktur - Google Patents

Verfahren zur Herstellung einer Verbindungsstruktur für eine elektronische Packungsstruktur

Info

Publication number
DE69322832D1
DE69322832D1 DE69322832T DE69322832T DE69322832D1 DE 69322832 D1 DE69322832 D1 DE 69322832D1 DE 69322832 T DE69322832 T DE 69322832T DE 69322832 T DE69322832 T DE 69322832T DE 69322832 D1 DE69322832 D1 DE 69322832D1
Authority
DE
Germany
Prior art keywords
producing
electronic packaging
connection structure
packaging structure
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69322832T
Other languages
English (en)
Other versions
DE69322832T2 (de
Inventor
Brian Samuel Beaman
Fuad Elias Doany
Keith Edward Fogel
Jr James Lupton Hedrick
Paul Alfred Lauro
Maurice Heathcote Norcott
John James Ritsko
Leathen Shi
Da-Yuan Shih
George Frederick Walker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69322832D1 publication Critical patent/DE69322832D1/de
Publication of DE69322832T2 publication Critical patent/DE69322832T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
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    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
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    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
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    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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    • G01R31/2851—Testing of integrated circuits [IC]
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    • G01R1/06733—Geometry aspects
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    • Y10T29/49185—Assembling terminal to elongated conductor by deforming of terminal
    • Y10T29/49192—Assembling terminal to elongated conductor by deforming of terminal with insulation removal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
DE69322832T 1992-10-19 1993-10-04 Verfahren zur Herstellung einer Verbindungsstruktur für eine elektronische Packungsstruktur Expired - Lifetime DE69322832T2 (de)

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US20080121879A1 (en) 2008-05-29
EP0593966B1 (de) 1998-12-30
US6334247B1 (en) 2002-01-01
US20020014004A1 (en) 2002-02-07
JP2514305B2 (ja) 1996-07-10
US7538565B1 (en) 2009-05-26
US5821763A (en) 1998-10-13
US20080106291A1 (en) 2008-05-08
US6300780B1 (en) 2001-10-09
JPH06204399A (ja) 1994-07-22
EP0593966A1 (de) 1994-04-27
US5371654A (en) 1994-12-06
DE69322832T2 (de) 1999-08-05
US20090128176A1 (en) 2009-05-21
US20070271781A9 (en) 2007-11-29
US5531022A (en) 1996-07-02
US5635846A (en) 1997-06-03

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