DE69324112D1 - Verfahren und Gerät zur Verbindung von radiofrequenten (RF) monolithisch integrierten Mikrowellenschaltungen - Google Patents
Verfahren und Gerät zur Verbindung von radiofrequenten (RF) monolithisch integrierten MikrowellenschaltungenInfo
- Publication number
- DE69324112D1 DE69324112D1 DE69324112T DE69324112T DE69324112D1 DE 69324112 D1 DE69324112 D1 DE 69324112D1 DE 69324112 T DE69324112 T DE 69324112T DE 69324112 T DE69324112 T DE 69324112T DE 69324112 D1 DE69324112 D1 DE 69324112D1
- Authority
- DE
- Germany
- Prior art keywords
- frequency
- monolithically integrated
- microwave circuits
- integrated microwave
- connecting radio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/085—Coaxial-line/strip-line transitions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/985,570 US5402088A (en) | 1992-12-03 | 1992-12-03 | Apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69324112D1 true DE69324112D1 (de) | 1999-04-29 |
DE69324112T2 DE69324112T2 (de) | 1999-07-22 |
Family
ID=25531593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69324112T Expired - Fee Related DE69324112T2 (de) | 1992-12-03 | 1993-11-18 | Verfahren und Gerät zur Verbindung von radiofrequenten (RF) monolithisch integrierten Mikrowellenschaltungen |
Country Status (4)
Country | Link |
---|---|
US (2) | US5402088A (de) |
EP (2) | EP0845832A3 (de) |
JP (1) | JPH06268417A (de) |
DE (1) | DE69324112T2 (de) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
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US5618205A (en) * | 1993-04-01 | 1997-04-08 | Trw Inc. | Wideband solderless right-angle RF interconnect |
US5506513A (en) * | 1995-01-13 | 1996-04-09 | Bacher; Helmut | Microwave circuit test fixture |
US5583468A (en) * | 1995-04-03 | 1996-12-10 | Motorola, Inc. | High frequency transition from a microstrip transmission line to an MMIC coplanar waveguide |
JPH0923107A (ja) * | 1995-07-10 | 1997-01-21 | Nippon Telegr & Teleph Corp <Ntt> | シールド型コプレーナガイド伝送線路 |
DE19540614C2 (de) * | 1995-10-31 | 1999-05-27 | Rosenberger Hochfrequenztech | Bauteil zum elektrischen Verbinden einer planaren Struktur mit einer Koaxialstruktur |
US5923234A (en) * | 1997-10-27 | 1999-07-13 | Lockheed Martin Corp. | Hermetic feedthrough using three-via transmission lines |
US6048212A (en) * | 1998-03-19 | 2000-04-11 | Lucent Technologies, Inc. | Radio frequency connector |
US6249439B1 (en) * | 1999-10-21 | 2001-06-19 | Hughes Electronics Corporation | Millimeter wave multilayer assembly |
US6674645B2 (en) * | 2000-05-26 | 2004-01-06 | Matsushita Electric Works, Ltd. | High frequency signal switching unit |
US6302701B1 (en) * | 2000-05-30 | 2001-10-16 | Agere Systems Optoelectronics Guardian Corp. | RF connector with impedance matching tab |
JP2002298938A (ja) * | 2001-03-30 | 2002-10-11 | Jst Mfg Co Ltd | 樹脂ハンダを用いたツイストペアケーブルの電気コネクタ及びこの電気コネクタへの電線接続方法 |
JP2002298995A (ja) * | 2001-03-30 | 2002-10-11 | Jst Mfg Co Ltd | 樹脂ハンダを用いた同軸ケーブルの結束部材及び同軸ケーブルの電気コネクタ並びに結束部材の同軸ケーブル又は電気コネクタへの接続方法 |
JP2002298946A (ja) * | 2001-03-30 | 2002-10-11 | Jst Mfg Co Ltd | 樹脂ハンダを用いた電気接続具、電気コネクタ及びこれらへの電線接続方法 |
JP2002298940A (ja) * | 2001-03-30 | 2002-10-11 | Jst Mfg Co Ltd | 樹脂ハンダを用いた電気接触子、電気コネクタ及びこれらのプリント配線板への接続方法 |
JP2002298962A (ja) * | 2001-03-30 | 2002-10-11 | Jst Mfg Co Ltd | 樹脂ハンダを用いた電気接触子、電気コネクタ及びこれらのプリント配線板への接続方法 |
JP2002298993A (ja) * | 2001-03-30 | 2002-10-11 | Jst Mfg Co Ltd | 片方に樹脂ハンダを用いた一対の電気コネクタ |
DE10123684A1 (de) * | 2001-05-15 | 2002-11-21 | Endress & Hauser Gmbh & Co Kg | Leiterplatte mit einer darauf aufgebrachten Kontakthülse |
SE0101756D0 (sv) * | 2001-05-16 | 2001-05-16 | Ericsson Telefon Ab L M | Apparatus for connecting transmissions paths |
US6770822B2 (en) * | 2002-02-22 | 2004-08-03 | Bridgewave Communications, Inc. | High frequency device packages and methods |
US6667549B2 (en) | 2002-05-01 | 2003-12-23 | Bridgewave Communications, Inc. | Micro circuits with a sculpted ground plane |
US6894582B2 (en) * | 2003-02-07 | 2005-05-17 | Harris Corporation | Microwave device having a slotted coaxial cable-to-microstrip connection and related methods |
US6870448B2 (en) * | 2003-03-14 | 2005-03-22 | Agilent Technologies, Inc. | Adjustable coaxial support |
US7094967B2 (en) * | 2003-09-24 | 2006-08-22 | Schlumberger Technology Corporation | Electrical feedthru |
US7498523B2 (en) * | 2006-02-06 | 2009-03-03 | Efficere Inc. | Direct wire attach |
DE102006021569A1 (de) * | 2006-02-09 | 2007-08-16 | Rohde & Schwarz Gmbh & Co. Kg | Prüfsystem für einen Schaltungsträger |
US7977583B2 (en) * | 2007-12-13 | 2011-07-12 | Teradyne, Inc. | Shielded cable interface module and method of fabrication |
US8581113B2 (en) | 2007-12-19 | 2013-11-12 | Bridgewave Communications, Inc. | Low cost high frequency device package and methods |
CN101960676A (zh) * | 2007-12-28 | 2011-01-26 | 欧多诗贝有限公司 | 在高速数据应用中使用的低成本连接器装置和方法 |
US7750764B2 (en) * | 2008-02-27 | 2010-07-06 | Microsemi Corporation | Coaxial-to-microstrip transitions and manufacturing methods |
JP5132505B2 (ja) * | 2008-09-25 | 2013-01-30 | 株式会社東芝 | 同軸ケーブル固定機構 |
US9011177B2 (en) | 2009-01-30 | 2015-04-21 | Molex Incorporated | High speed bypass cable assembly |
US8184440B2 (en) * | 2009-05-01 | 2012-05-22 | Abl Ip Holding Llc | Electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board |
US20100294546A1 (en) * | 2009-05-22 | 2010-11-25 | Sean Nickel | Circuit board and method for a low profile wire connection |
JP5653610B2 (ja) * | 2009-12-02 | 2015-01-14 | オリンパス株式会社 | 電子回路モジュールおよび同軸ケーブルの接続方法 |
JP5379047B2 (ja) * | 2010-03-04 | 2013-12-25 | タイコエレクトロニクスジャパン合同会社 | 結線構造及びケーブルコネクタ組立体 |
US20130258621A1 (en) * | 2011-08-25 | 2013-10-03 | Itsik Refaeli | Microelectronic package having a coaxial connector |
US8939794B2 (en) * | 2012-07-30 | 2015-01-27 | Tyco Electronics Corporation | Coaxial cable assembly |
US9831588B2 (en) | 2012-08-22 | 2017-11-28 | Amphenol Corporation | High-frequency electrical connector |
US9142921B2 (en) | 2013-02-27 | 2015-09-22 | Molex Incorporated | High speed bypass cable for use with backplanes |
US9252468B1 (en) | 2013-05-10 | 2016-02-02 | Signal Microwave, LLC | Microwave signal connector |
WO2015035052A1 (en) | 2013-09-04 | 2015-03-12 | Molex Incorporated | Connector system with cable by-pass |
CN103647127B (zh) | 2013-12-09 | 2017-02-01 | 上海贝尔股份有限公司 | 用于将同轴电缆耦接至带状线的连接器 |
CN107112696B (zh) | 2014-11-12 | 2020-06-09 | 安费诺有限公司 | 在配合区域中具有阻抗控制的非常高速、高密度电互连系统 |
TWI637568B (zh) | 2015-01-11 | 2018-10-01 | 莫仕有限公司 | Circuit board bypass assembly and its components |
WO2016112384A1 (en) | 2015-01-11 | 2016-07-14 | Molex, Llc | Wire to board connectors suitable for use in bypass routing assemblies |
DE112016002059T5 (de) | 2015-05-04 | 2018-01-18 | Molex, Llc | Rechenvorrichtung, die eine Bypass-Einheit verwendet |
TWI625010B (zh) | 2016-01-11 | 2018-05-21 | Molex Llc | Cable connector assembly |
US10424856B2 (en) * | 2016-01-11 | 2019-09-24 | Molex, Llc | Routing assembly and system using same |
TWI597896B (zh) | 2016-01-19 | 2017-09-01 | Molex Llc | Integrated routing components |
US10312638B2 (en) | 2016-05-31 | 2019-06-04 | Amphenol Corporation | High performance cable termination |
CN115296060A (zh) | 2016-10-19 | 2022-11-04 | 安费诺有限公司 | 用于电连接器的安装接口的组件及电连接器 |
US9661753B1 (en) * | 2016-12-01 | 2017-05-23 | Harris Corporation | Coaxial to planar strain relief appliance and method |
US10340233B1 (en) | 2016-12-06 | 2019-07-02 | Lockheed Martin Corporation | Millimeter wave connectors to integrated circuit interposer boards |
US20180191061A1 (en) * | 2017-01-05 | 2018-07-05 | Intel Corporation | Process technology for embedded horn structures with printed circuit boards |
WO2019028373A1 (en) | 2017-08-03 | 2019-02-07 | Amphenol Corporation | CABLE CONNECTOR FOR HIGH SPEED INTERCONNECTIONS |
US10665973B2 (en) | 2018-03-22 | 2020-05-26 | Amphenol Corporation | High density electrical connector |
CN112514175B (zh) | 2018-04-02 | 2022-09-09 | 安达概念股份有限公司 | 受控阻抗顺应性线缆终端头 |
US10931062B2 (en) | 2018-11-21 | 2021-02-23 | Amphenol Corporation | High-frequency electrical connector |
CN113474706B (zh) | 2019-01-25 | 2023-08-29 | 富加宜(美国)有限责任公司 | 被配置用于线缆连接至中间板的i/o连接器 |
WO2020154526A1 (en) | 2019-01-25 | 2020-07-30 | Fci Usa Llc | I/o connector configured for cabled connection to the midboard |
CN113728521A (zh) | 2019-02-22 | 2021-11-30 | 安费诺有限公司 | 高性能线缆连接器组件 |
US20220247060A1 (en) * | 2019-07-03 | 2022-08-04 | Kabushiki Kaisha Toshiba | Coaxial microstrip line conversion circuit |
US11735852B2 (en) | 2019-09-19 | 2023-08-22 | Amphenol Corporation | High speed electronic system with midboard cable connector |
US11482481B2 (en) * | 2019-09-27 | 2022-10-25 | Intel Corporation | Semiconductor device and system |
CN110911795B (zh) * | 2019-11-21 | 2021-10-26 | 南京软赫波誉电子科技有限公司 | 双面平行带线-同轴线转换结构及降低回波损耗的方法 |
TW202135385A (zh) | 2020-01-27 | 2021-09-16 | 美商Fci美國有限責任公司 | 高速連接器 |
WO2021154718A1 (en) | 2020-01-27 | 2021-08-05 | Fci Usa Llc | High speed, high density direct mate orthogonal connector |
CN113258325A (zh) | 2020-01-28 | 2021-08-13 | 富加宜(美国)有限责任公司 | 高频中板连接器 |
CN111370830B (zh) * | 2020-03-23 | 2021-07-16 | 武汉光谷信息光电子创新中心有限公司 | 差分共面波导传输线 |
CN113161699A (zh) * | 2021-03-23 | 2021-07-23 | 中国科学院空天信息创新研究院 | 一种电路转换结构 |
USD1002553S1 (en) | 2021-11-03 | 2023-10-24 | Amphenol Corporation | Gasket for connector |
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GB1245493A (en) * | 1968-03-11 | 1971-09-08 | Texas Instruments Inc | Connector |
DE2700231C3 (de) * | 1977-01-05 | 1981-11-12 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Abgleichbarer Koaxial-Microstrip-Übergang |
US4611186A (en) * | 1983-09-08 | 1986-09-09 | Motorola, Inc. | Noncontacting MIC ground plane coupling using a broadband virtual short circuit gap |
JPS6113583A (ja) * | 1984-06-27 | 1986-01-21 | 日本電気株式会社 | 高周波コネクタ |
DE3444076A1 (de) * | 1984-12-04 | 1986-06-05 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Kontaktierung einer auf einem substrat angeordneten mikrowellenschaltung |
US4626805A (en) * | 1985-04-26 | 1986-12-02 | Tektronix, Inc. | Surface mountable microwave IC package |
US4908939A (en) * | 1985-10-18 | 1990-03-20 | Kollmorgen Corporation | Method of making coaxial interconnection boards |
US4679321A (en) * | 1985-10-18 | 1987-07-14 | Kollmorgen Technologies Corporation | Method for making coaxial interconnection boards |
US4646436A (en) * | 1985-10-18 | 1987-03-03 | Kollmorgen Technologies Corporation | Shielded interconnection boards |
US4724409A (en) * | 1986-07-31 | 1988-02-09 | Raytheon Company | Microwave circuit package connector |
JPH0774841B2 (ja) * | 1988-07-27 | 1995-08-09 | 第一精工株式会社 | ディスプレイ用フィルタの製造方法 |
JP2655430B2 (ja) * | 1989-03-10 | 1997-09-17 | 日本電気株式会社 | 同軸―マイクロストリップ線路変換器 |
DE69122570T2 (de) * | 1990-07-25 | 1997-02-13 | Hitachi Chemical Co Ltd | Leiterplatte mit Verbindung von Koaxialleitern untereinander |
GB9100815D0 (en) * | 1991-01-15 | 1991-02-27 | British Telecomm | Coplanar waveguide ribbon |
-
1992
- 1992-12-03 US US07/985,570 patent/US5402088A/en not_active Expired - Fee Related
-
1993
- 1993-11-18 EP EP98101899A patent/EP0845832A3/de not_active Withdrawn
- 1993-11-18 DE DE69324112T patent/DE69324112T2/de not_active Expired - Fee Related
- 1993-11-18 EP EP93309202A patent/EP0600638B1/de not_active Expired - Lifetime
- 1993-12-03 JP JP5339655A patent/JPH06268417A/ja active Pending
-
1994
- 1994-12-29 US US08/365,676 patent/US5517747A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0600638A3 (en) | 1994-08-24 |
JPH06268417A (ja) | 1994-09-22 |
US5402088A (en) | 1995-03-28 |
EP0600638A2 (de) | 1994-06-08 |
EP0845832A3 (de) | 1998-08-05 |
EP0845832A2 (de) | 1998-06-03 |
DE69324112T2 (de) | 1999-07-22 |
US5517747A (en) | 1996-05-21 |
EP0600638B1 (de) | 1999-03-24 |
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