DE69326184T2 - Strahlungsempfindliche Zusammensetzungen - Google Patents

Strahlungsempfindliche Zusammensetzungen

Info

Publication number
DE69326184T2
DE69326184T2 DE69326184T DE69326184T DE69326184T2 DE 69326184 T2 DE69326184 T2 DE 69326184T2 DE 69326184 T DE69326184 T DE 69326184T DE 69326184 T DE69326184 T DE 69326184T DE 69326184 T2 DE69326184 T2 DE 69326184T2
Authority
DE
Germany
Prior art keywords
radiation sensitive
sensitive compositions
compositions
radiation
sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69326184T
Other languages
English (en)
Other versions
DE69326184D1 (de
Inventor
Philip D Knudsen
Charles R Shipley
Daniel Y Pai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Application granted granted Critical
Publication of DE69326184D1 publication Critical patent/DE69326184D1/de
Publication of DE69326184T2 publication Critical patent/DE69326184T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
DE69326184T 1992-04-02 1993-03-09 Strahlungsempfindliche Zusammensetzungen Expired - Fee Related DE69326184T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/862,343 US5262280A (en) 1992-04-02 1992-04-02 Radiation sensitive compositions

Publications (2)

Publication Number Publication Date
DE69326184D1 DE69326184D1 (de) 1999-10-07
DE69326184T2 true DE69326184T2 (de) 2000-04-27

Family

ID=25338269

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69326184T Expired - Fee Related DE69326184T2 (de) 1992-04-02 1993-03-09 Strahlungsempfindliche Zusammensetzungen

Country Status (4)

Country Link
US (3) US5262280A (de)
EP (1) EP0565858B1 (de)
JP (1) JP3865321B2 (de)
DE (1) DE69326184T2 (de)

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US6204453B1 (en) 1998-12-02 2001-03-20 International Business Machines Corporation Two signal one power plane circuit board
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US5648196A (en) * 1995-07-14 1997-07-15 Cornell Research Foundation, Inc. Water-soluble photoinitiators
US5693691A (en) * 1995-08-21 1997-12-02 Brewer Science, Inc. Thermosetting anti-reflective coatings compositions
US5827386A (en) * 1996-06-14 1998-10-27 International Business Machines Corporation Method for forming a multi-layered circuitized substrate member
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US6008266A (en) * 1996-08-14 1999-12-28 International Business Machines Corporation Photosensitive reworkable encapsulant
DE69731542T2 (de) * 1996-09-19 2005-05-19 Nippon Soda Co. Ltd. Photokatalytische zusammensetzung
US6350387B2 (en) * 1997-02-14 2002-02-26 Teledyne Industries, Inc. Multilayer combined rigid/flex printed circuit board containing flexible soldermask
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JP3473887B2 (ja) * 1997-07-16 2003-12-08 東京応化工業株式会社 反射防止膜形成用組成物及びそれを用いたレジストパターンの形成方法
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US6191952B1 (en) 1998-04-28 2001-02-20 International Business Machines Corporation Compliant surface layer for flip-chip electronic packages and method for forming same
US6177728B1 (en) 1998-04-28 2001-01-23 International Business Machines Corporation Integrated circuit chip device having balanced thermal expansion
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JP4397601B2 (ja) * 2003-02-06 2010-01-13 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． フェノール−ビフェニレン樹脂を含むネガ型感光性樹脂組成物
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JP5108210B2 (ja) * 2004-06-21 2012-12-26 三星電子株式会社 有機絶縁膜組成物およびこれを用いた有機絶縁膜のパターン形成方法および有機薄膜トランジスタおよびこれを含む表示素子
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DE602005011394D1 (de) 2004-12-22 2009-01-15 Rohm & Haas Elect Mat Optische Trockenfilme und Verfahren zur Herstellung optischer Vorrichtungen mit Trockenfilmen
DE602005011393D1 (de) 2004-12-22 2009-01-15 Rohm & Haas Elect Mat Optische Trockenfilme und Verfahren zur Herstellung optischer Vorrichtungen mit Trockenfilmen
EP1674905B1 (de) 2004-12-22 2008-10-15 Rohm and Haas Electronic Materials, L.L.C. Verfahren zur Herstellung optischer Vorrichtungen mit Polymerschichten
JP4633500B2 (ja) * 2005-03-01 2011-02-16 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
JP4662793B2 (ja) * 2005-03-01 2011-03-30 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
US20060289469A1 (en) * 2005-04-21 2006-12-28 Noble Fiber Technologies Llc Flexible electrically conductive circuits
KR20080104308A (ko) * 2006-03-16 2008-12-02 아사히 가라스 가부시키가이샤 네거티브형 감광성 함불소 방향족계 수지 조성물
JP2008166798A (ja) 2006-12-31 2008-07-17 Rohm & Haas Electronic Materials Llc 光学的機能を有するプリント回路板の形成方法
US7655366B2 (en) 2007-06-13 2010-02-02 Xerox Corporation Inkless reimageable printing paper and method
US7588878B2 (en) * 2007-06-13 2009-09-15 Xerox Corporation Inkless printing paper and method
US7572569B2 (en) * 2007-06-13 2009-08-11 Xerox Corporation Inkless printing paper and method
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US7852366B2 (en) * 2007-06-13 2010-12-14 Xerox Corporation System and method for printing reimageable transient documents
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US7867672B2 (en) * 2007-06-13 2011-01-11 Xerox Corporation Reimageable paper protected against UV light
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JP5884521B2 (ja) * 2011-02-09 2016-03-15 信越化学工業株式会社 パターン形成方法
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EP2812391A1 (de) 2012-02-10 2014-12-17 The University Of Birmingham Spin-on-hartmaskenmaterial
JP6188235B2 (ja) * 2014-04-25 2017-08-30 関西ペイント株式会社 塗料組成物及び塗装金属缶
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CN111876017A (zh) * 2020-09-02 2020-11-03 赵俊 一种疏水耐磨型环保油墨及其制备方法和应用
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Also Published As

Publication number Publication date
EP0565858A1 (de) 1993-10-20
EP0565858B1 (de) 1999-09-01
US5691395A (en) 1997-11-25
US5366846A (en) 1994-11-22
JP3865321B2 (ja) 2007-01-10
JPH0641398A (ja) 1994-02-15
US5262280A (en) 1993-11-16
DE69326184D1 (de) 1999-10-07

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