DE69330450D1 - Dreidimensionaler Multichipmodul - Google Patents
Dreidimensionaler MultichipmodulInfo
- Publication number
- DE69330450D1 DE69330450D1 DE69330450T DE69330450T DE69330450D1 DE 69330450 D1 DE69330450 D1 DE 69330450D1 DE 69330450 T DE69330450 T DE 69330450T DE 69330450 T DE69330450 T DE 69330450T DE 69330450 D1 DE69330450 D1 DE 69330450D1
- Authority
- DE
- Germany
- Prior art keywords
- multichip module
- dimensional multichip
- dimensional
- module
- multichip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US92596292A | 1992-08-05 | 1992-08-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69330450D1 true DE69330450D1 (de) | 2001-08-23 |
| DE69330450T2 DE69330450T2 (de) | 2001-11-08 |
Family
ID=25452498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69330450T Expired - Fee Related DE69330450T2 (de) | 1992-08-05 | 1993-08-05 | Dreidimensionaler Multichipmodul |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US5426563A (de) |
| EP (1) | EP0586888B1 (de) |
| DE (1) | DE69330450T2 (de) |
Families Citing this family (124)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0586888B1 (de) * | 1992-08-05 | 2001-07-18 | Fujitsu Limited | Dreidimensionaler Multichipmodul |
| US5544017A (en) * | 1992-08-05 | 1996-08-06 | Fujitsu Limited | Multichip module substrate |
| US5644714A (en) | 1994-01-14 | 1997-07-01 | Elonex Plc, Ltd. | Video collection and distribution system with interested item notification and download on demand |
| US5515510A (en) * | 1994-01-14 | 1996-05-07 | Consilium Overseas Limited | Communications internetwork system connecting a client node array to a resource array |
| US5861666A (en) * | 1995-08-30 | 1999-01-19 | Tessera, Inc. | Stacked chip assembly |
| US5841638A (en) * | 1996-02-15 | 1998-11-24 | L3 Communications | Stacked memory for flight recorders |
| US5870823A (en) * | 1996-11-27 | 1999-02-16 | International Business Machines Corporation | Method of forming a multilayer electronic packaging substrate with integral cooling channels |
| US6225688B1 (en) | 1997-12-11 | 2001-05-01 | Tessera, Inc. | Stacked microelectronic assembly and method therefor |
| US7149095B2 (en) * | 1996-12-13 | 2006-12-12 | Tessera, Inc. | Stacked microelectronic assemblies |
| US6121676A (en) * | 1996-12-13 | 2000-09-19 | Tessera, Inc. | Stacked microelectronic assembly and method therefor |
| SE511425C2 (sv) * | 1996-12-19 | 1999-09-27 | Ericsson Telefon Ab L M | Packningsanordning för integrerade kretsar |
| US6018465A (en) * | 1996-12-31 | 2000-01-25 | Intel Corporation | Apparatus for mounting a chip package to a chassis of a computer |
| US5978228A (en) * | 1996-12-31 | 1999-11-02 | Intel Corporation | Apparatus for mounting a very large scale integration (VLSI) chip to a computer chassis for cooling |
| US6137688A (en) * | 1996-12-31 | 2000-10-24 | Intel Corporation | Apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply |
| US5969944A (en) * | 1996-12-31 | 1999-10-19 | Intel Corporation | Method and apparatus for mounting a very large scale integration (VLSI) chip package to a computer chasis for cooling |
| US5818107A (en) * | 1997-01-17 | 1998-10-06 | International Business Machines Corporation | Chip stacking by edge metallization |
| US5903437A (en) * | 1997-01-17 | 1999-05-11 | International Business Machines Corporation | High density edge mounting of chips |
| US5825631A (en) * | 1997-04-16 | 1998-10-20 | Starkey Laboratories | Method for connecting two substrates in a thick film hybrid circuit |
| US6175161B1 (en) | 1998-05-22 | 2001-01-16 | Alpine Microsystems, Inc. | System and method for packaging integrated circuits |
| JP2001507520A (ja) * | 1997-05-23 | 2001-06-05 | アルパイン・マイクロシステムズ・インコーポレイテッド | 集積回路パッケージングのための構造体及び方法 |
| US6016256A (en) * | 1997-11-14 | 2000-01-18 | The Panda Project | Multi-chip module having interconnect dies |
| US6414391B1 (en) * | 1998-06-30 | 2002-07-02 | Micron Technology, Inc. | Module assembly for stacked BGA packages with a common bus bar in the assembly |
| US6049467A (en) * | 1998-08-31 | 2000-04-11 | Unisys Corporation | Stackable high density RAM modules |
| US6093029A (en) * | 1998-09-08 | 2000-07-25 | S3 Incorporated | Vertically stackable integrated circuit |
| US6111756A (en) * | 1998-09-11 | 2000-08-29 | Fujitsu Limited | Universal multichip interconnect systems |
| US6239485B1 (en) | 1998-11-13 | 2001-05-29 | Fujitsu Limited | Reduced cross-talk noise high density signal interposer with power and ground wrap |
| JP3575001B2 (ja) * | 1999-05-07 | 2004-10-06 | アムコー テクノロジー コリア インコーポレーティド | 半導体パッケージ及びその製造方法 |
| JP3398721B2 (ja) * | 1999-05-20 | 2003-04-21 | アムコー テクノロジー コリア インコーポレーティド | 半導体パッケージ及びその製造方法 |
| USRE40112E1 (en) | 1999-05-20 | 2008-02-26 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| JP2001077301A (ja) * | 1999-08-24 | 2001-03-23 | Amkor Technology Korea Inc | 半導体パッケージ及びその製造方法 |
| US6255899B1 (en) * | 1999-09-01 | 2001-07-03 | International Business Machines Corporation | Method and apparatus for increasing interchip communications rates |
| US6392428B1 (en) * | 1999-11-16 | 2002-05-21 | Eaglestone Partners I, Llc | Wafer level interposer |
| KR20010064907A (ko) | 1999-12-20 | 2001-07-11 | 마이클 디. 오브라이언 | 와이어본딩 방법 및 이를 이용한 반도체패키지 |
| JP3681155B2 (ja) * | 1999-12-22 | 2005-08-10 | 新光電気工業株式会社 | 電子部品の実装構造、電子部品装置、電子部品の実装方法及び電子部品装置の製造方法 |
| US6414396B1 (en) | 2000-01-24 | 2002-07-02 | Amkor Technology, Inc. | Package for stacked integrated circuits |
| KR100559664B1 (ko) | 2000-03-25 | 2006-03-10 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지 |
| JP3407710B2 (ja) * | 2000-04-26 | 2003-05-19 | 株式会社村田製作所 | 誘電体線路の製造方法 |
| US7247932B1 (en) * | 2000-05-19 | 2007-07-24 | Megica Corporation | Chip package with capacitor |
| US6452278B1 (en) | 2000-06-30 | 2002-09-17 | Amkor Technology, Inc. | Low profile package for plural semiconductor dies |
| US6726505B2 (en) | 2000-07-20 | 2004-04-27 | Silicon Graphics, Inc. | Memory daughter card apparatus, configurations, and methods |
| US6812048B1 (en) * | 2000-07-31 | 2004-11-02 | Eaglestone Partners I, Llc | Method for manufacturing a wafer-interposer assembly |
| US6537831B1 (en) * | 2000-07-31 | 2003-03-25 | Eaglestone Partners I, Llc | Method for selecting components for a matched set using a multi wafer interposer |
| US6552416B1 (en) | 2000-09-08 | 2003-04-22 | Amkor Technology, Inc. | Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring |
| US6815712B1 (en) | 2000-10-02 | 2004-11-09 | Eaglestone Partners I, Llc | Method for selecting components for a matched set from a wafer-interposer assembly |
| US6686657B1 (en) * | 2000-11-07 | 2004-02-03 | Eaglestone Partners I, Llc | Interposer for improved handling of semiconductor wafers and method of use of same |
| JP4608763B2 (ja) * | 2000-11-09 | 2011-01-12 | 日本電気株式会社 | 半導体装置 |
| US20020076854A1 (en) * | 2000-12-15 | 2002-06-20 | Pierce John L. | System, method and apparatus for constructing a semiconductor wafer-interposer using B-Stage laminates |
| US6529022B2 (en) * | 2000-12-15 | 2003-03-04 | Eaglestone Pareners I, Llc | Wafer testing interposer for a conventional package |
| US20020078401A1 (en) * | 2000-12-15 | 2002-06-20 | Fry Michael Andrew | Test coverage analysis system |
| US6524885B2 (en) * | 2000-12-15 | 2003-02-25 | Eaglestone Partners I, Llc | Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques |
| US6673653B2 (en) * | 2001-02-23 | 2004-01-06 | Eaglestone Partners I, Llc | Wafer-interposer using a ceramic substrate |
| WO2002068127A2 (en) | 2001-02-28 | 2002-09-06 | Porter Instrument Company, Inc. | Manifolded fluid delivery system |
| US6693348B2 (en) * | 2001-06-15 | 2004-02-17 | Ricoh Company, Ltd. | Semiconductor device with power supplying unit between a semiconductor chip and a supporting substrate |
| US20050156322A1 (en) * | 2001-08-31 | 2005-07-21 | Smith Lee J. | Thin semiconductor package including stacked dies |
| US7056032B2 (en) * | 2001-09-17 | 2006-06-06 | Stratos International, Inc. | Transceiver assembly for use in fiber optics communications |
| US7073954B1 (en) | 2001-09-17 | 2006-07-11 | Stratos International, Inc. | Transceiver assembly for use in fiber optics communications |
| US7073955B1 (en) | 2001-09-17 | 2006-07-11 | Stratos International, Inc. | Transceiver assembly for use in fiber optics communications |
| US7253091B2 (en) * | 2001-09-28 | 2007-08-07 | Hrl Laboratories, Llc | Process for assembling three-dimensional systems on a chip and structure thus obtained |
| US6974604B2 (en) * | 2001-09-28 | 2005-12-13 | Hrl Laboratories, Llc | Method of self-latching for adhesion during self-assembly of electronic or optical components |
| US6910809B2 (en) * | 2001-11-15 | 2005-06-28 | Stratos International, Inc. | Electrical sub-assembly design for parallel optics modules |
| JP4171218B2 (ja) * | 2002-01-23 | 2008-10-22 | 三菱電機株式会社 | 表面実装モジュール |
| US6774475B2 (en) * | 2002-01-24 | 2004-08-10 | International Business Machines Corporation | Vertically stacked memory chips in FBGA packages |
| US6882156B2 (en) * | 2002-02-14 | 2005-04-19 | Teradyne, Inc. | Printed circuit board assembly for automatic test equipment |
| US6940712B2 (en) * | 2002-07-17 | 2005-09-06 | International Business Machines Corporation | Electronic device substrate assembly with multilayer impermeable barrier and method of making |
| US20050167817A1 (en) * | 2002-08-05 | 2005-08-04 | Tessera, Inc. | Microelectronic adaptors, assemblies and methods |
| US6765288B2 (en) * | 2002-08-05 | 2004-07-20 | Tessera, Inc. | Microelectronic adaptors, assemblies and methods |
| SG104348A1 (en) * | 2002-11-21 | 2004-06-21 | Inst Of Microelectronics | Apparatus and method for fluid-based cooling of heat-generating devices |
| US7495179B2 (en) | 2003-10-06 | 2009-02-24 | Tessera, Inc. | Components with posts and pads |
| US8641913B2 (en) | 2003-10-06 | 2014-02-04 | Tessera, Inc. | Fine pitch microcontacts and method for forming thereof |
| US20050087877A1 (en) * | 2003-10-22 | 2005-04-28 | Dong-Ho Han | Differential signal traces coupled with high permittivity material |
| US6938334B2 (en) * | 2003-10-31 | 2005-09-06 | Honeywell International, Inc. | Vibrating beam accelerometer two-wafer fabrication process |
| US7709968B2 (en) * | 2003-12-30 | 2010-05-04 | Tessera, Inc. | Micro pin grid array with pin motion isolation |
| US7180171B1 (en) | 2004-01-08 | 2007-02-20 | Smart Modular Technologies, Inc. | Single IC packaging solution for multi chip modules |
| US7091604B2 (en) * | 2004-06-04 | 2006-08-15 | Cabot Microelectronics Corporation | Three dimensional integrated circuits |
| US7375542B2 (en) * | 2004-06-30 | 2008-05-20 | Teradyne, Inc. | Automated test equipment with DIB mounted three dimensional tester electronics bricks |
| US7586747B2 (en) * | 2005-08-01 | 2009-09-08 | Salmon Technologies, Llc. | Scalable subsystem architecture having integrated cooling channels |
| US20070096345A1 (en) * | 2005-11-03 | 2007-05-03 | Vishay Vitramon Inc. | Frame packaged array electronic component |
| DE102005056907B3 (de) | 2005-11-29 | 2007-08-16 | Infineon Technologies Ag | 3-dimensionales Mehrchip-Modul |
| US7649745B2 (en) * | 2006-11-08 | 2010-01-19 | Intel Corporation | Circuit board including stubless signal paths and method of making same |
| US9466545B1 (en) | 2007-02-21 | 2016-10-11 | Amkor Technology, Inc. | Semiconductor package in package |
| US20080272496A1 (en) | 2007-05-02 | 2008-11-06 | Starkey Laboratories, Inc. | Planar interconnect structure for hybrid circuits |
| US7764498B2 (en) * | 2007-09-24 | 2010-07-27 | Sixis, Inc. | Comb-shaped power bus bar assembly structure having integrated capacitors |
| US7709966B2 (en) * | 2007-09-25 | 2010-05-04 | Sixis, Inc. | Large substrate structural vias |
| US7773381B2 (en) * | 2007-09-26 | 2010-08-10 | Rohm Co., Ltd. | Semiconductor device |
| KR101388538B1 (ko) | 2007-09-28 | 2014-04-23 | 테세라, 인코포레이티드 | 이중 포스트를 사용하여 플립칩 상호연결한 마이크로전자 어셈블리 |
| US7863918B2 (en) * | 2007-11-13 | 2011-01-04 | International Business Machines Corporation | Disposable built-in self-test devices, systems and methods for testing three dimensional integrated circuits |
| US7916480B2 (en) * | 2007-12-19 | 2011-03-29 | GM Global Technology Operations LLC | Busbar assembly with integrated cooling |
| US20090268422A1 (en) * | 2008-04-29 | 2009-10-29 | Bailey Mark J | Scalable electronic package assembly for memory devices and other terminated bus structures |
| US8554136B2 (en) | 2008-12-23 | 2013-10-08 | Waveconnex, Inc. | Tightly-coupled near-field communication-link connector-replacement chips |
| US8129834B2 (en) * | 2009-01-26 | 2012-03-06 | Research Triangle Institute | Integral metal structure with conductive post portions |
| US8289039B2 (en) * | 2009-03-11 | 2012-10-16 | Teradyne, Inc. | Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment |
| US7952875B2 (en) * | 2009-05-29 | 2011-05-31 | GM Global Technology Operations LLC | Stacked busbar assembly with integrated cooling |
| TWI501380B (zh) * | 2010-01-29 | 2015-09-21 | Nat Chip Implementation Ct Nat Applied Res Lab | 多基板晶片模組堆疊之三維系統晶片結構 |
| US8330272B2 (en) | 2010-07-08 | 2012-12-11 | Tessera, Inc. | Microelectronic packages with dual or multiple-etched flip-chip connectors |
| US8580607B2 (en) | 2010-07-27 | 2013-11-12 | Tessera, Inc. | Microelectronic packages with nanoparticle joining |
| US8853558B2 (en) | 2010-12-10 | 2014-10-07 | Tessera, Inc. | Interconnect structure |
| US20120223435A1 (en) * | 2011-03-01 | 2012-09-06 | A Leam Choi | Integrated circuit packaging system with leads and method of manufacture thereof |
| US8654541B2 (en) * | 2011-03-24 | 2014-02-18 | Toyota Motor Engineering & Manufacturing North America, Inc. | Three-dimensional power electronics packages |
| US8516426B2 (en) | 2011-08-25 | 2013-08-20 | International Business Machines Corporation | Vertical power budgeting and shifting for three-dimensional integration |
| US8476771B2 (en) | 2011-08-25 | 2013-07-02 | International Business Machines Corporation | Configuration of connections in a 3D stack of integrated circuits |
| US8576000B2 (en) | 2011-08-25 | 2013-11-05 | International Business Machines Corporation | 3D chip stack skew reduction with resonant clock and inductive coupling |
| US8476953B2 (en) | 2011-08-25 | 2013-07-02 | International Business Machines Corporation | 3D integrated circuit stack-wide synchronization circuit |
| US8381156B1 (en) | 2011-08-25 | 2013-02-19 | International Business Machines Corporation | 3D inter-stratum connectivity robustness |
| US8525569B2 (en) | 2011-08-25 | 2013-09-03 | International Business Machines Corporation | Synchronizing global clocks in 3D stacks of integrated circuits by shorting the clock network |
| US8519735B2 (en) | 2011-08-25 | 2013-08-27 | International Business Machines Corporation | Programming the behavior of individual chips or strata in a 3D stack of integrated circuits |
| US8587357B2 (en) | 2011-08-25 | 2013-11-19 | International Business Machines Corporation | AC supply noise reduction in a 3D stack with voltage sensing and clock shifting |
| US8558394B1 (en) * | 2012-08-29 | 2013-10-15 | Macronix International Co., Ltd. | Chip stack structure and manufacturing method thereof |
| US9531425B2 (en) * | 2012-12-17 | 2016-12-27 | Keyssa, Inc. | Modular electronics |
| US9952279B2 (en) * | 2012-12-21 | 2018-04-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus for three dimensional integrated circuit testing |
| CN105379409B (zh) | 2013-03-15 | 2019-09-27 | 凯萨股份有限公司 | Ehf安全通信设备 |
| TWI544584B (zh) * | 2014-01-17 | 2016-08-01 | Copper substrate with barrier structure and manufacturing method thereof | |
| MY171261A (en) | 2014-02-19 | 2019-10-07 | Carsem M Sdn Bhd | Stacked electronic packages |
| US9881859B2 (en) | 2014-05-09 | 2018-01-30 | Qualcomm Incorporated | Substrate block for PoP package |
| US9633971B2 (en) | 2015-07-10 | 2017-04-25 | Invensas Corporation | Structures and methods for low temperature bonding using nanoparticles |
| US10886250B2 (en) | 2015-07-10 | 2021-01-05 | Invensas Corporation | Structures and methods for low temperature bonding using nanoparticles |
| US10649000B2 (en) * | 2015-12-17 | 2020-05-12 | Panasonic Intellectual Property Management Co., Ltd. | Connection assembly |
| US10178800B2 (en) * | 2017-03-30 | 2019-01-08 | Honeywell International Inc. | Support structure for electronics having fluid passageway for convective heat transfer |
| KR102512004B1 (ko) * | 2018-02-01 | 2023-03-21 | 한온시스템 주식회사 | 전장부품 냉각기 및 그 제조 방법 |
| GB2575038B (en) * | 2018-06-25 | 2023-04-19 | Lumentum Tech Uk Limited | A Semiconductor Separation Device |
| US10607938B1 (en) | 2018-10-26 | 2020-03-31 | International Business Machines Corporation | Power distribution networks for monolithic three-dimensional semiconductor integrated circuit devices |
| KR102538704B1 (ko) * | 2018-12-04 | 2023-06-01 | 에스케이하이닉스 주식회사 | 플렉시블 브리지 다이를 포함한 스택 패키지 |
| US10937764B2 (en) | 2019-03-13 | 2021-03-02 | International Business Machines Corporation | Three-dimensional microelectronic package with embedded cooling channels |
| KR20210029422A (ko) * | 2019-09-06 | 2021-03-16 | 에스케이하이닉스 주식회사 | 전자기간섭 차폐층을 포함하는 반도체 패키지 |
| US11404351B2 (en) | 2020-04-21 | 2022-08-02 | Toyota Motor Engineering & Manufacturing North America, Inc. | Chip-on-chip power card with embedded direct liquid cooling |
Family Cites Families (83)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE216826C (de) * | ||||
| US3643135A (en) * | 1970-06-29 | 1972-02-15 | Ibm | Triaxially expandable circuit arrays |
| US3949274A (en) * | 1974-05-30 | 1976-04-06 | International Business Machines Corporation | Packaging and interconnection for superconductive circuitry |
| US4202007A (en) * | 1978-06-23 | 1980-05-06 | International Business Machines Corporation | Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers |
| US4249302A (en) * | 1978-12-28 | 1981-02-10 | Ncr Corporation | Multilayer printed circuit board |
| US4502098A (en) * | 1981-02-10 | 1985-02-26 | Brown David F | Circuit assembly |
| US4525921A (en) * | 1981-07-13 | 1985-07-02 | Irvine Sensors Corporation | High-density electronic processing package-structure and fabrication |
| FR2519508A1 (fr) * | 1981-12-31 | 1983-07-08 | Thomson Csf | Dispositif de refroidissement pour carte de circuit imprime et procede de fabrication d'un tel dispositif |
| US4638348A (en) * | 1982-08-10 | 1987-01-20 | Brown David F | Semiconductor chip carrier |
| US4499607A (en) * | 1982-09-13 | 1985-02-12 | Higgins David M | Geometrically-integrated architecture of microcircuits for high-speed computers |
| US4489363A (en) * | 1983-01-31 | 1984-12-18 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
| US5007841A (en) * | 1983-05-31 | 1991-04-16 | Trw Inc. | Integrated-circuit chip interconnection system |
| US4581679A (en) * | 1983-05-31 | 1986-04-08 | Trw Inc. | Multi-element circuit construction |
| US5019945A (en) * | 1983-05-31 | 1991-05-28 | Trw Inc. | Backplane interconnection system |
| US4574331A (en) * | 1983-05-31 | 1986-03-04 | Trw Inc. | Multi-element circuit construction |
| US4770640A (en) * | 1983-06-24 | 1988-09-13 | Walter Howard F | Electrical interconnection device for integrated circuits |
| DD216826B1 (de) * | 1983-07-20 | 1989-09-27 | Komb Veb Eaw Berlin Treptow F | Stromrichter in bruecken- oder mittelpunktschaltung mit luftselbstkuehlung |
| US4727410A (en) * | 1983-11-23 | 1988-02-23 | Cabot Technical Ceramics, Inc. | High density integrated circuit package |
| US4631636A (en) * | 1984-03-26 | 1986-12-23 | Harris Corporation | High density packaging technique for electronic systems |
| JPS6199361A (ja) * | 1984-10-22 | 1986-05-17 | Fujitsu Ltd | 半導体装置 |
| JPS61101067A (ja) * | 1984-10-24 | 1986-05-19 | Nec Corp | メモリモジユ−ル |
| US4733461A (en) * | 1984-12-28 | 1988-03-29 | Micro Co., Ltd. | Method of stacking printed circuit boards |
| JPS61168951A (ja) * | 1985-01-22 | 1986-07-30 | Nippon Telegr & Teleph Corp <Ntt> | 半導体集積回路チツプの実装構造 |
| US4894706A (en) * | 1985-02-14 | 1990-01-16 | Nippon Telegraph And Telephone Corporation | Three-dimensional packaging of semiconductor device chips |
| US4640010A (en) * | 1985-04-29 | 1987-02-03 | Advanced Micro Devices, Inc. | Method of making a package utilizing a self-aligning photoexposure process |
| JPS61267398A (ja) * | 1985-05-22 | 1986-11-26 | 株式会社日立製作所 | 電子装置の冷却構造 |
| JPS61288455A (ja) * | 1985-06-17 | 1986-12-18 | Fujitsu Ltd | 多層半導体装置の製造方法 |
| US4774630A (en) * | 1985-09-30 | 1988-09-27 | Microelectronics Center Of North Carolina | Apparatus for mounting a semiconductor chip and making electrical connections thereto |
| JPH0612799B2 (ja) * | 1986-03-03 | 1994-02-16 | 三菱電機株式会社 | 積層型半導体装置およびその製造方法 |
| US4807021A (en) * | 1986-03-10 | 1989-02-21 | Kabushiki Kaisha Toshiba | Semiconductor device having stacking structure |
| US4688151A (en) * | 1986-03-10 | 1987-08-18 | International Business Machines Corporation | Multilayered interposer board for powering high current chip modules |
| KR900008647B1 (ko) * | 1986-03-20 | 1990-11-26 | 후지쓰 가부시끼가이샤 | 3차원 집적회로와 그의 제조방법 |
| US4803592A (en) * | 1986-06-24 | 1989-02-07 | International Business Machines Corporation | Power control and fault isolation indicator |
| US5031072A (en) * | 1986-08-01 | 1991-07-09 | Texas Instruments Incorporated | Baseboard for orthogonal chip mount |
| US4922378A (en) * | 1986-08-01 | 1990-05-01 | Texas Instruments Incorporated | Baseboard for orthogonal chip mount |
| US4695872A (en) * | 1986-08-01 | 1987-09-22 | Texas Instruments Incorporated | High density micropackage for IC chips |
| US4811082A (en) * | 1986-11-12 | 1989-03-07 | International Business Machines Corporation | High performance integrated circuit packaging structure |
| US4803595A (en) * | 1986-11-17 | 1989-02-07 | International Business Machines Corporation | Interposer chip technique for making engineering changes between interconnected semiconductor chips |
| US4801992A (en) * | 1986-12-01 | 1989-01-31 | Motorola Inc. | Three dimensional interconnected integrated circuit |
| US4858073A (en) * | 1986-12-10 | 1989-08-15 | Akzo America Inc. | Metal substrated printed circuit |
| US4868712A (en) * | 1987-02-04 | 1989-09-19 | Woodman John K | Three dimensional integrated circuit package |
| DE3735455A1 (de) * | 1987-03-18 | 1988-09-29 | Telefonbau & Normalzeit Gmbh | Elektrische bauelemente |
| JPS63245952A (ja) * | 1987-04-01 | 1988-10-13 | Hitachi Ltd | マルチチップモジュ−ル構造体 |
| US4862249A (en) * | 1987-04-17 | 1989-08-29 | Xoc Devices, Inc. | Packaging system for stacking integrated circuits |
| US4953005A (en) * | 1987-04-17 | 1990-08-28 | Xoc Devices, Inc. | Packaging system for stacking integrated circuits |
| US4771366A (en) * | 1987-07-06 | 1988-09-13 | International Business Machines Corporation | Ceramic card assembly having enhanced power distribution and cooling |
| JPS6480032A (en) * | 1987-09-21 | 1989-03-24 | Hitachi Maxell | Semiconductor device and manufacture thereof |
| US5016138A (en) * | 1987-10-27 | 1991-05-14 | Woodman John K | Three dimensional integrated circuit package |
| US4983533A (en) * | 1987-10-28 | 1991-01-08 | Irvine Sensors Corporation | High-density electronic modules - process and product |
| US4937659A (en) * | 1987-11-06 | 1990-06-26 | Ford Aerospace Corporation | Interconnection system for integrated circuit chips |
| CA1283225C (en) * | 1987-11-09 | 1991-04-16 | Shinji Mine | Cooling system for three-dimensional ic package |
| US4855809A (en) * | 1987-11-24 | 1989-08-08 | Texas Instruments Incorporated | Orthogonal chip mount system module and method |
| JPH01136360A (ja) * | 1987-11-24 | 1989-05-29 | Mitsubishi Electric Corp | 半導体装置 |
| US4871317A (en) * | 1987-12-02 | 1989-10-03 | A. O. Smith Corporation | Surface mounted component adaptor for interconnecting of surface mounted circuit components |
| FR2625042B1 (fr) * | 1987-12-22 | 1990-04-20 | Thomson Csf | Structure microelectronique hybride modulaire a haute densite d'integration |
| US4873764A (en) * | 1987-12-23 | 1989-10-17 | Zenith Electronics Corporation | Component mounting process for printed circuit boards |
| US4841355A (en) * | 1988-02-10 | 1989-06-20 | Amdahl Corporation | Three-dimensional microelectronic package for semiconductor chips |
| JP2548602B2 (ja) * | 1988-04-12 | 1996-10-30 | 株式会社日立製作所 | 半導体実装モジュール |
| US4937707A (en) * | 1988-05-26 | 1990-06-26 | International Business Machines Corporation | Flexible carrier for an electronic device |
| US5025306A (en) * | 1988-08-09 | 1991-06-18 | Texas Instruments Incorporated | Assembly of semiconductor chips |
| JPH0247892A (ja) * | 1988-08-10 | 1990-02-16 | Hitachi Ltd | セラミック多層配線基板 |
| JP2721223B2 (ja) * | 1989-01-30 | 1998-03-04 | 株式会社東芝 | 電子部品装置及びその製造方法 |
| US5003376A (en) * | 1989-03-28 | 1991-03-26 | Coriolis Corporation | Cooling of large high power semi-conductors |
| US4956746A (en) * | 1989-03-29 | 1990-09-11 | Hughes Aircraft Company | Stacked wafer electronic package |
| DE3911711A1 (de) * | 1989-04-10 | 1990-10-11 | Ibm | Modul-aufbau mit integriertem halbleiterchip und chiptraeger |
| US4953060A (en) * | 1989-05-05 | 1990-08-28 | Ncr Corporation | Stackable integrated circuit chip package with improved heat removal |
| US4956695A (en) * | 1989-05-12 | 1990-09-11 | Rockwell International Corporation | Three-dimensional packaging of focal plane assemblies using ceramic spacers |
| US4992908A (en) * | 1989-07-24 | 1991-02-12 | Grumman Aerospace Corporation | Integrated circuit module |
| US5049982A (en) * | 1989-07-28 | 1991-09-17 | At&T Bell Laboratories | Article comprising a stacked array of electronic subassemblies |
| US5032896A (en) * | 1989-08-31 | 1991-07-16 | Hughes Aircraft Company | 3-D integrated circuit assembly employing discrete chips |
| US4991000A (en) * | 1989-08-31 | 1991-02-05 | Bone Robert L | Vertically interconnected integrated circuit chip system |
| US5006925A (en) * | 1989-11-22 | 1991-04-09 | International Business Machines Corporation | Three dimensional microelectric packaging |
| US5060116A (en) * | 1990-04-20 | 1991-10-22 | Grobman Warren D | Electronics system with direct write engineering change capability |
| US5081563A (en) * | 1990-04-27 | 1992-01-14 | International Business Machines Corporation | Multi-layer package incorporating a recessed cavity for a semiconductor chip |
| US5065277A (en) * | 1990-07-13 | 1991-11-12 | Sun Microsystems, Inc. | Three dimensional packaging arrangement for computer systems and the like |
| WO1992003035A1 (en) * | 1990-08-01 | 1992-02-20 | Staktek Corporation | Ultra high density integrated circuit packages, method and apparatus |
| US5053856A (en) * | 1990-09-04 | 1991-10-01 | Sun Microsystems, Inc. | Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices |
| US5130894A (en) * | 1990-11-26 | 1992-07-14 | At&T Bell Laboratories | Three-dimensional circuit modules |
| US5132613A (en) * | 1990-11-30 | 1992-07-21 | International Business Machines Corporation | Low inductance side mount decoupling test structure |
| US5121297A (en) * | 1990-12-31 | 1992-06-09 | Compaq Computer Corporation | Flexible printed circuits |
| US5177594A (en) * | 1991-01-09 | 1993-01-05 | International Business Machines Corporation | Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance |
| EP0506225A3 (en) * | 1991-03-26 | 1993-11-24 | Ibm | Integrated circuit chip package |
| EP0586888B1 (de) * | 1992-08-05 | 2001-07-18 | Fujitsu Limited | Dreidimensionaler Multichipmodul |
-
1993
- 1993-08-05 EP EP93112596A patent/EP0586888B1/de not_active Expired - Lifetime
- 1993-08-05 DE DE69330450T patent/DE69330450T2/de not_active Expired - Fee Related
- 1993-11-22 US US08/157,332 patent/US5426563A/en not_active Expired - Fee Related
-
1995
- 1995-01-30 US US08/380,083 patent/US5655290A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US5426563A (en) | 1995-06-20 |
| DE69330450T2 (de) | 2001-11-08 |
| US5655290A (en) | 1997-08-12 |
| EP0586888A2 (de) | 1994-03-16 |
| EP0586888B1 (de) | 2001-07-18 |
| EP0586888A3 (en) | 1994-07-13 |
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