DE69330607T2 - Kunststoff-halbleiterpackung mit aluminium-waermesenke - Google Patents

Kunststoff-halbleiterpackung mit aluminium-waermesenke

Info

Publication number
DE69330607T2
DE69330607T2 DE69330607T DE69330607T DE69330607T2 DE 69330607 T2 DE69330607 T2 DE 69330607T2 DE 69330607 T DE69330607 T DE 69330607T DE 69330607 T DE69330607 T DE 69330607T DE 69330607 T2 DE69330607 T2 DE 69330607T2
Authority
DE
Germany
Prior art keywords
heat sink
aluminum heat
plastic semiconductor
pack
semiconductor pack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69330607T
Other languages
English (en)
Other versions
DE69330607D1 (de
Inventor
Deepak Mahulikar
S Braden
F Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of DE69330607D1 publication Critical patent/DE69330607D1/de
Application granted granted Critical
Publication of DE69330607T2 publication Critical patent/DE69330607T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L2924/06—Polymers
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    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
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    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
DE69330607T 1992-09-17 1993-09-02 Kunststoff-halbleiterpackung mit aluminium-waermesenke Expired - Fee Related DE69330607T2 (de)

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US07/946,119 US5367196A (en) 1992-09-17 1992-09-17 Molded plastic semiconductor package including an aluminum alloy heat spreader
PCT/US1993/008215 WO1994007263A1 (en) 1992-09-17 1993-09-02 Plastic semiconductor package with aluminum heat spreader

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KR (1) KR100258543B1 (de)
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CA (1) CA2144881A1 (de)
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CA2144881A1 (en) 1994-03-31
KR950703794A (ko) 1995-09-20
DE69330607D1 (de) 2001-09-20
MX9305446A (es) 1994-05-31
WO1994007263A1 (en) 1994-03-31
US5367196A (en) 1994-11-22
EP0662244A1 (de) 1995-07-12
KR100258543B1 (ko) 2000-06-15
EP0662244B1 (de) 2001-08-16
AU4842893A (en) 1994-04-12
JPH08501414A (ja) 1996-02-13
TW250583B (de) 1995-07-01
EP0662244A4 (de) 1995-09-13
PH30198A (en) 1997-02-05

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