DE69331511D1 - Zweiseitig gedruckte Leiterplatte, mehrschichtige Leiterplatte und Verfahren zur Herstellung - Google Patents
Zweiseitig gedruckte Leiterplatte, mehrschichtige Leiterplatte und Verfahren zur HerstellungInfo
- Publication number
- DE69331511D1 DE69331511D1 DE69331511T DE69331511T DE69331511D1 DE 69331511 D1 DE69331511 D1 DE 69331511D1 DE 69331511 T DE69331511 T DE 69331511T DE 69331511 T DE69331511 T DE 69331511T DE 69331511 D1 DE69331511 D1 DE 69331511D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- double
- manufacturing
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10234—Metallic balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4252594A JP3057924B2 (ja) | 1992-09-22 | 1992-09-22 | 両面プリント基板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69331511D1 true DE69331511D1 (de) | 2002-03-14 |
DE69331511T2 DE69331511T2 (de) | 2002-06-20 |
Family
ID=17239545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69331511T Expired - Lifetime DE69331511T2 (de) | 1992-09-22 | 1993-09-22 | Zweiseitig gedruckte Leiterplatte, mehrschichtige Leiterplatte und Verfahren zur Herstellung |
Country Status (4)
Country | Link |
---|---|
US (2) | US5440075A (de) |
EP (1) | EP0591761B1 (de) |
JP (1) | JP3057924B2 (de) |
DE (1) | DE69331511T2 (de) |
Families Citing this family (84)
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---|---|---|---|---|
US5627345A (en) * | 1991-10-24 | 1997-05-06 | Kawasaki Steel Corporation | Multilevel interconnect structure |
US5600103A (en) * | 1993-04-16 | 1997-02-04 | Kabushiki Kaisha Toshiba | Circuit devices and fabrication method of the same |
US5652042A (en) * | 1993-10-29 | 1997-07-29 | Matsushita Electric Industrial Co., Ltd. | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste |
US6484585B1 (en) | 1995-02-28 | 2002-11-26 | Rosemount Inc. | Pressure sensor for a pressure transmitter |
KR0174976B1 (ko) * | 1995-07-07 | 1999-04-01 | 김광호 | 확장 슬롯 전용 듀얼 버스 라이저 카드 |
EP0805614B1 (de) * | 1995-11-17 | 2005-04-13 | Kabushiki Kaisha Toshiba | Mehrschichtige leiterplatte, vorgefertigtes material für diese leiterplatte, verfahren zur herstellung einer mehrschichtigen leiterplatte, packung elektronischer bauelemente und verfahren zur herstellung vertikaler, elektrisch leitender verbindungen |
US6263198B1 (en) * | 1996-06-14 | 2001-07-17 | Wj Communications, Inc. | Multi-layer printed wiring board having integrated broadside microwave coupled baluns |
US5744285A (en) * | 1996-07-18 | 1998-04-28 | E. I. Du Pont De Nemours And Company | Composition and process for filling vias |
US5873161A (en) * | 1996-07-23 | 1999-02-23 | Minnesota Mining And Manufacturing Company | Method of making a Z axis interconnect circuit |
US6703565B1 (en) | 1996-09-06 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board |
US5900674A (en) * | 1996-12-23 | 1999-05-04 | General Electric Company | Interface structures for electronic devices |
US6194053B1 (en) | 1998-02-26 | 2001-02-27 | International Business Machines Corporation | Apparatus and method fabricating buried and flat metal features |
US6598291B2 (en) * | 1998-03-20 | 2003-07-29 | Viasystems, Inc. | Via connector and method of making same |
US6139777A (en) * | 1998-05-08 | 2000-10-31 | Matsushita Electric Industrial Co., Ltd. | Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same |
SG86345A1 (en) | 1998-05-14 | 2002-02-19 | Matsushita Electric Ind Co Ltd | Circuit board and method of manufacturing the same |
US6565954B2 (en) * | 1998-05-14 | 2003-05-20 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method of manufacturing the same |
JP3553405B2 (ja) * | 1999-03-03 | 2004-08-11 | ローム株式会社 | チップ型電子部品 |
US6717819B1 (en) * | 1999-06-01 | 2004-04-06 | Amerasia International Technology, Inc. | Solderable flexible adhesive interposer as for an electronic package, and method for making same |
EP1744609B1 (de) * | 1999-06-02 | 2012-12-12 | Ibiden Co., Ltd. | Gedruckte mehrlagige Schaltungsplatte und Verfahren zur Herstellung |
AU6531600A (en) * | 1999-08-27 | 2001-03-26 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
US7695644B2 (en) * | 1999-08-27 | 2010-04-13 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles |
US7825491B2 (en) | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
US7446030B2 (en) * | 1999-08-27 | 2008-11-04 | Shocking Technologies, Inc. | Methods for fabricating current-carrying structures using voltage switchable dielectric materials |
US6505516B1 (en) | 2000-01-06 | 2003-01-14 | Rosemount Inc. | Capacitive pressure sensing with moving dielectric |
US6520020B1 (en) | 2000-01-06 | 2003-02-18 | Rosemount Inc. | Method and apparatus for a direct bonded isolated pressure sensor |
US6508129B1 (en) | 2000-01-06 | 2003-01-21 | Rosemount Inc. | Pressure sensor capsule with improved isolation |
US6561038B2 (en) | 2000-01-06 | 2003-05-13 | Rosemount Inc. | Sensor with fluid isolation barrier |
DE60108217T2 (de) | 2000-01-06 | 2005-12-29 | Rosemount Inc., Eden Prairie | Kornwachstumsverfahren zur herstellung einer elektrischen verbindung für mikroelektromechanische systeme (mems) |
JP2001257453A (ja) * | 2000-03-09 | 2001-09-21 | Shinko Electric Ind Co Ltd | 配線基板、半導体装置及びそれらの製造方法 |
US6518514B2 (en) * | 2000-08-21 | 2003-02-11 | Matsushita Electric Industrial Co., Ltd. | Circuit board and production of the same |
JP2002176237A (ja) * | 2000-12-06 | 2002-06-21 | Ibiden Co Ltd | プリント配線板 |
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JP2002319761A (ja) * | 2001-04-23 | 2002-10-31 | Nitto Denko Corp | 配線基板の製造方法 |
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JP2003008201A (ja) * | 2001-06-18 | 2003-01-10 | Nitto Denko Corp | 金属箔積層体の製造方法及び配線基板の製造方法 |
US6982387B2 (en) * | 2001-06-19 | 2006-01-03 | International Business Machines Corporation | Method and apparatus to establish circuit layers interconnections |
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US7279355B2 (en) * | 2003-06-27 | 2007-10-09 | Avago Technologies Ecbuip (Singapore) Pte Ltd | Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating same |
US7919787B2 (en) * | 2003-06-27 | 2011-04-05 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Semiconductor device with a light emitting semiconductor die |
US7256486B2 (en) | 2003-06-27 | 2007-08-14 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Packaging device for semiconductor die, semiconductor device incorporating same and method of making same |
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US7286325B2 (en) * | 2004-02-26 | 2007-10-23 | Sae Magnetics (H.K.) Ltd | Method and apparatus for connecting metal structures on opposing sides of a circuit |
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JP4992428B2 (ja) * | 2004-09-24 | 2012-08-08 | イビデン株式会社 | めっき方法及びめっき装置 |
JP2006294725A (ja) * | 2005-04-07 | 2006-10-26 | Fujikura Ltd | 配線基板、多層配線基板およびそれらの製造方法 |
JPWO2006118059A1 (ja) * | 2005-04-27 | 2008-12-18 | 日立化成工業株式会社 | 複合体、プリプレグ、金属箔張積層板、回路基板接続材、並びに、多層プリント配線板及びその製造方法 |
US7759582B2 (en) * | 2005-07-07 | 2010-07-20 | Ibiden Co., Ltd. | Multilayer printed wiring board |
US7834273B2 (en) | 2005-07-07 | 2010-11-16 | Ibiden Co., Ltd. | Multilayer printed wiring board |
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JP2008258357A (ja) * | 2007-04-04 | 2008-10-23 | Fujikura Ltd | リジッドフレキ基板とその製造方法 |
JP2008258358A (ja) * | 2007-04-04 | 2008-10-23 | Fujikura Ltd | リジッドフレキ基板とその製造方法 |
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JP2009059814A (ja) * | 2007-08-30 | 2009-03-19 | Denso Corp | 多層プリント基板の製造方法 |
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JP4561891B2 (ja) * | 2008-07-09 | 2010-10-13 | 株式会社デンソー | 層間接続用導電体の製造方法 |
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CN101686607B (zh) * | 2008-09-22 | 2012-09-26 | 天津普林电路股份有限公司 | 可抑制翘曲的四层电路板 |
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US9208931B2 (en) | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
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KR101679099B1 (ko) | 2009-03-26 | 2016-11-23 | 쇼킹 테크놀로지스 인코포레이티드 | 전압 스위칭형 유전 물질을 갖는 소자 |
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US8773820B1 (en) | 2013-02-21 | 2014-07-08 | Magnecomp Corporation | PZT microactuator for disk drive suspension having electrical via and wrap-around electrode |
GB2552982B (en) | 2016-08-17 | 2019-12-11 | Ge Aviat Systems Ltd | Method and apparatus for arranging fuses in a printed circuit board |
GB2552983B (en) | 2016-08-17 | 2021-04-07 | Ge Aviat Systems Ltd | Method and apparatus for detecting an electrical fault in a printed circuit board |
US11600421B2 (en) * | 2017-04-14 | 2023-03-07 | The Diller Corporation | Laminate with induction coils |
US11276618B2 (en) * | 2018-04-30 | 2022-03-15 | Intel Corporation | Bi-layer prepreg for reduced dielectric thickness |
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DE2306236C2 (de) * | 1973-02-08 | 1982-11-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung von Schichtschaltungen mit leitenden Schichten auf beiden Seiten eines Keramiksubstrates |
JPS5438562A (en) * | 1977-09-01 | 1979-03-23 | Sharp Kk | Method of providing conduction between both surfaces of bilateral printed wiring board |
JPS59158582A (ja) * | 1983-02-28 | 1984-09-08 | シャープ株式会社 | 両面配線基板の製造方法 |
JPS59175191A (ja) * | 1983-03-24 | 1984-10-03 | 大日本印刷株式会社 | プリント配線基板 |
JPS60136400A (ja) * | 1983-12-26 | 1985-07-19 | 株式会社日立製作所 | 多層配線基板 |
JPS60200595A (ja) * | 1984-03-26 | 1985-10-11 | 株式会社東芝 | 多層印刷配線板 |
JPS618987A (ja) * | 1984-06-22 | 1986-01-16 | シャープ株式会社 | 複合プリント配線基板 |
JPS6124298A (ja) * | 1984-07-12 | 1986-02-01 | 富士通株式会社 | 多層プリント板の製造方法 |
JPS6347991A (ja) * | 1986-08-18 | 1988-02-29 | 古河電気工業株式会社 | プリント回路基板の製造方法 |
US4791248A (en) * | 1987-01-22 | 1988-12-13 | The Boeing Company | Printed wire circuit board and its method of manufacture |
DE3723236A1 (de) * | 1987-07-14 | 1989-01-26 | Hartmuth F Ing Grad Thaler | Verfahren zur herstellung einer schaltungsplatte |
JPH01202440A (ja) * | 1988-02-08 | 1989-08-15 | Matsushita Electric Works Ltd | 電気用積層板 |
US5235741A (en) * | 1989-08-18 | 1993-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Electrical connection and method for making the same |
JPH0817109B2 (ja) * | 1989-08-18 | 1996-02-21 | 株式会社半導体エネルギー研究所 | 電気配線およびその接続方法 |
JP2767645B2 (ja) * | 1990-03-07 | 1998-06-18 | 富士通株式会社 | 多層配線基板の製造方法 |
DE69232606T2 (de) * | 1991-02-25 | 2004-08-05 | Canon K.K. | Elektrischer Verbindungskörper und Herstellungsverfahren dafür |
JPH05251121A (ja) * | 1991-12-18 | 1993-09-28 | Xerox Corp | 多層配線組立体 |
JP3037493B2 (ja) * | 1992-01-13 | 2000-04-24 | イビデン株式会社 | スルーホールを有するセラミックス基板の製造方法 |
JP2601128B2 (ja) * | 1992-05-06 | 1997-04-16 | 松下電器産業株式会社 | 回路形成用基板の製造方法および回路形成用基板 |
US5328087A (en) * | 1993-03-29 | 1994-07-12 | Microelectronics And Computer Technology Corporation | Thermally and electrically conductive adhesive material and method of bonding with same |
US5435480A (en) * | 1993-12-23 | 1995-07-25 | International Business Machines Corporation | Method for filling plated through holes |
-
1992
- 1992-09-22 JP JP4252594A patent/JP3057924B2/ja not_active Expired - Lifetime
-
1993
- 1993-09-20 US US08/124,317 patent/US5440075A/en not_active Expired - Lifetime
- 1993-09-22 EP EP93115257A patent/EP0591761B1/de not_active Expired - Lifetime
- 1993-09-22 DE DE69331511T patent/DE69331511T2/de not_active Expired - Lifetime
-
1995
- 1995-05-05 US US08/437,085 patent/US5588207A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69331511T2 (de) | 2002-06-20 |
US5588207A (en) | 1996-12-31 |
US5440075A (en) | 1995-08-08 |
EP0591761B1 (de) | 2002-01-30 |
EP0591761A2 (de) | 1994-04-13 |
JP3057924B2 (ja) | 2000-07-04 |
EP0591761A3 (en) | 1995-12-27 |
JPH06104545A (ja) | 1994-04-15 |
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Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |
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8320 | Willingness to grant licences declared (paragraph 23) |