DE69332140T2 - Leiterrahmen-Kondensator - Google Patents

Leiterrahmen-Kondensator

Info

Publication number
DE69332140T2
DE69332140T2 DE69332140T DE69332140T DE69332140T2 DE 69332140 T2 DE69332140 T2 DE 69332140T2 DE 69332140 T DE69332140 T DE 69332140T DE 69332140 T DE69332140 T DE 69332140T DE 69332140 T2 DE69332140 T2 DE 69332140T2
Authority
DE
Germany
Prior art keywords
leadframe
capacitor
leadframe capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69332140T
Other languages
English (en)
Other versions
DE69332140D1 (de
Inventor
Robert C Dobkin
Robert L Reay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linear Technology LLC
Original Assignee
Linear Technology LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linear Technology LLC filed Critical Linear Technology LLC
Publication of DE69332140D1 publication Critical patent/DE69332140D1/de
Application granted granted Critical
Publication of DE69332140T2 publication Critical patent/DE69332140T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49589—Capacitor integral with or on the leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/903—FET configuration adapted for use as static memory cell
    • Y10S257/904—FET configuration adapted for use as static memory cell with passive components,, e.g. polysilicon resistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
DE69332140T 1992-12-03 1993-12-02 Leiterrahmen-Kondensator Expired - Lifetime DE69332140T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/985,881 US5444600A (en) 1992-12-03 1992-12-03 Lead frame capacitor and capacitively-coupled isolator circuit using the same

Publications (2)

Publication Number Publication Date
DE69332140D1 DE69332140D1 (de) 2002-08-29
DE69332140T2 true DE69332140T2 (de) 2003-03-20

Family

ID=25531882

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69332140T Expired - Lifetime DE69332140T2 (de) 1992-12-03 1993-12-02 Leiterrahmen-Kondensator

Country Status (4)

Country Link
US (5) US5444600A (de)
EP (1) EP0600488B1 (de)
JP (1) JP2690264B2 (de)
DE (1) DE69332140T2 (de)

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5444600A (en) * 1992-12-03 1995-08-22 Linear Technology Corporation Lead frame capacitor and capacitively-coupled isolator circuit using the same
EP0650739B1 (de) 1993-10-28 2003-02-26 Medrad, Inc. System zur Kontrastmittelabgabe
US5491360A (en) * 1994-12-28 1996-02-13 National Semiconductor Corporation Electronic package for isolated circuits
JP3565991B2 (ja) * 1996-06-26 2004-09-15 株式会社ルネサステクノロジ 半導体集積回路および半導体集積回路の製造方法
US5939766A (en) * 1996-07-24 1999-08-17 Advanced Micro Devices, Inc. High quality capacitor for sub-micrometer integrated circuits
DE19639369A1 (de) * 1996-09-25 1998-03-26 Philips Patentverwaltung Leiterplatte
US6137827A (en) * 1997-04-22 2000-10-24 Silicon Laboratories, Inc. Isolation system with digital communication across a capacitive barrier
US5982018A (en) * 1997-05-23 1999-11-09 Micron Technology, Inc. Thin film capacitor coupons for memory modules and multi-chip modules
US6084285A (en) * 1997-10-20 2000-07-04 The Board Of Trustees Of The Leland Stanford Junior University Lateral flux capacitor having fractal-shaped perimeters
US20030042571A1 (en) * 1997-10-23 2003-03-06 Baoxing Chen Chip-scale coils and isolators based thereon
US6054908A (en) * 1997-12-12 2000-04-25 Trw Inc. Variable bandwidth filter
US6268643B1 (en) * 1997-12-22 2001-07-31 Texas Instruments Incorporated Lead frame device for delivering electrical power to a semiconductor die
DE19805785C1 (de) * 1998-02-12 1999-06-17 Siemens Ag Leistungshalbleiter-Modul mit thermischer Laststromsicherung
KR19990072936A (ko) 1998-02-27 1999-09-27 가나이 쓰도무 아이솔레이터및그것을사용하는모뎀장치
US6300617B1 (en) 1998-03-04 2001-10-09 Nonvolatile Electronics, Incorporated Magnetic digital signal coupler having selected/reversal directions of magnetization
US6114756A (en) 1998-04-01 2000-09-05 Micron Technology, Inc. Interdigitated capacitor design for integrated circuit leadframes
KR100294449B1 (ko) * 1998-07-15 2001-07-12 윤종용 본딩패드하부에형성되는커패시터를구비한반도체집적회로장치
US6087882A (en) * 1998-12-04 2000-07-11 Analog Devices, Inc. Ultra-low power magnetically coupled digital isolator using spin valve resistors
US6351033B1 (en) 1999-10-06 2002-02-26 Agere Systems Guardian Corp. Multifunction lead frame and integrated circuit package incorporating the same
US6362972B1 (en) 2000-04-13 2002-03-26 Molex Incorporated Contactless interconnection system
US6612852B1 (en) 2000-04-13 2003-09-02 Molex Incorporated Contactless interconnection system
KR20030084256A (ko) * 2002-04-26 2003-11-01 삼화전기주식회사 고체 전해 콘덴서 및 그에 사용되는 리드 프레임
DE10262239B4 (de) 2002-09-18 2011-04-28 Infineon Technologies Ag Digitales Signalübertragungsverfahren
JP3916072B2 (ja) * 2003-02-04 2007-05-16 住友電気工業株式会社 交流結合回路
US6880134B2 (en) * 2003-04-09 2005-04-12 Freescale Semiconductor, Inc. Method for improving capacitor noise and mismatch constraints in a semiconductor device
EP1618712A2 (de) * 2003-04-30 2006-01-25 Analog Devices, Inc. Signalisolatoren mit mikrotransformatoren
US7253506B2 (en) * 2003-06-23 2007-08-07 Power-One, Inc. Micro lead frame package
US7489219B2 (en) * 2003-07-16 2009-02-10 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7307502B2 (en) * 2003-07-16 2007-12-11 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7023313B2 (en) * 2003-07-16 2006-04-04 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7760525B2 (en) * 2003-08-21 2010-07-20 Marvell World Trade Ltd. Voltage regulator
US7872454B2 (en) * 2003-08-21 2011-01-18 Marvell World Trade Ltd. Digital low dropout regulator
US6929485B1 (en) * 2004-03-16 2005-08-16 Agilent Technologies, Inc. Lead frame with interdigitated pins
US8324872B2 (en) * 2004-03-26 2012-12-04 Marvell World Trade, Ltd. Voltage regulator with coupled inductors having high coefficient of coupling
US7577223B2 (en) * 2004-06-03 2009-08-18 Silicon Laboratories Inc. Multiplexed RF isolator circuit
US7737871B2 (en) 2004-06-03 2010-06-15 Silicon Laboratories Inc. MCU with integrated voltage isolator to provide a galvanic isolation between input and output
US7460604B2 (en) * 2004-06-03 2008-12-02 Silicon Laboratories Inc. RF isolator for isolating voltage sensing and gate drivers
US8441325B2 (en) 2004-06-03 2013-05-14 Silicon Laboratories Inc. Isolator with complementary configurable memory
US7447492B2 (en) * 2004-06-03 2008-11-04 Silicon Laboratories Inc. On chip transformer isolator
US8169108B2 (en) * 2004-06-03 2012-05-01 Silicon Laboratories Inc. Capacitive isolator
US7421028B2 (en) * 2004-06-03 2008-09-02 Silicon Laboratories Inc. Transformer isolator for digital power supply
US7302247B2 (en) * 2004-06-03 2007-11-27 Silicon Laboratories Inc. Spread spectrum isolator
US7376212B2 (en) * 2004-06-03 2008-05-20 Silicon Laboratories Inc. RF isolator with differential input/output
US7821428B2 (en) * 2004-06-03 2010-10-26 Silicon Laboratories Inc. MCU with integrated voltage isolator and integrated galvanically isolated asynchronous serial data link
US7738568B2 (en) * 2004-06-03 2010-06-15 Silicon Laboratories Inc. Multiplexed RF isolator
US7902627B2 (en) 2004-06-03 2011-03-08 Silicon Laboratories Inc. Capacitive isolation circuitry with improved common mode detector
US8198951B2 (en) * 2004-06-03 2012-06-12 Silicon Laboratories Inc. Capacitive isolation circuitry
US7190152B2 (en) * 2004-07-13 2007-03-13 Marvell World Trade Ltd. Closed-loop digital control system for a DC/DC converter
US7557562B2 (en) * 2004-09-17 2009-07-07 Nve Corporation Inverted magnetic isolator
US7535262B2 (en) 2004-10-19 2009-05-19 International Rectifier Corporation High voltage level shifting by capacitive coupling
US7761719B2 (en) * 2005-03-28 2010-07-20 Akros Silicon Inc. Ethernet module
US7719305B2 (en) * 2006-07-06 2010-05-18 Analog Devices, Inc. Signal isolator using micro-transformers
US8093983B2 (en) * 2006-08-28 2012-01-10 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Narrowbody coil isolator
US9105391B2 (en) 2006-08-28 2015-08-11 Avago Technologies General Ip (Singapore) Pte. Ltd. High voltage hold-off coil transducer
US7468547B2 (en) * 2007-05-11 2008-12-23 Intersil Americas Inc. RF-coupled digital isolator
US7960845B2 (en) 2008-01-03 2011-06-14 Linear Technology Corporation Flexible contactless wire bonding structure and methodology for semiconductor device
US8089311B2 (en) * 2008-01-22 2012-01-03 Analog Devices, Inc. Signal amplifier
US8084894B2 (en) * 2008-02-04 2011-12-27 Analog Devices, Inc. Solid state relay
US7741935B2 (en) * 2008-02-15 2010-06-22 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. High voltage isolation semiconductor capacitor digital communication device and corresponding package
US7741896B2 (en) * 2008-02-15 2010-06-22 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. High voltage drive circuit employing capacitive signal coupling and associated devices and methods
US8188814B2 (en) * 2008-02-15 2012-05-29 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. High voltage isolation dual capacitor communication system
US7902665B2 (en) * 2008-09-02 2011-03-08 Linear Technology Corporation Semiconductor device having a suspended isolating interconnect
US7983059B2 (en) * 2008-09-02 2011-07-19 Analog Devices, Inc. High frequency power converter based on transformers
US8582669B2 (en) * 2008-10-30 2013-11-12 Analog Devices, Inc. Noise reduction circuit in a digital isolator system
EP2315043B1 (de) * 2009-10-21 2019-07-24 STMicroelectronics Srl Prüfen elektronischer Vorrichtungen mittels einer kapazitativen Schnittstelle
EP2315364B1 (de) * 2009-10-21 2016-12-07 STMicroelectronics Srl Signalübertragung durch LC Schwingkreisen
US8451032B2 (en) 2010-12-22 2013-05-28 Silicon Laboratories Inc. Capacitive isolator with schmitt trigger
US8497700B2 (en) 2011-10-21 2013-07-30 Samsung Electro-Mechanics Systems and methods for propagating digital data across an isolation barrier
US9087713B2 (en) 2012-10-12 2015-07-21 Power Integrations, Inc. Semiconductor device with shared region
US8976561B2 (en) 2012-11-14 2015-03-10 Power Integrations, Inc. Switch mode power converters using magnetically coupled galvanically isolated lead frame communication
US8818296B2 (en) 2012-11-14 2014-08-26 Power Integrations, Inc. Noise cancellation for a magnetically coupled communication link utilizing a lead frame
US9035435B2 (en) 2012-11-14 2015-05-19 Power Integrations, Inc. Magnetically coupled galvanically isolated communication using lead frame
US20140162575A1 (en) * 2012-12-07 2014-06-12 Anayas360.Com, Llc Highly integrated millimeter-wave soc layout techniques for improved performance and modeling accuracy
US9276479B2 (en) 2013-01-22 2016-03-01 Power Integrations, Inc. Receive circuit for use in a power converter
US9374011B2 (en) 2013-01-22 2016-06-21 Power Integrations, Inc. Secondary controller for use in synchronous flyback converter
US9178411B2 (en) 2013-01-22 2015-11-03 Power Integrations, Inc. Charging circuit for a power converter controller
US9331587B2 (en) 2013-01-22 2016-05-03 Power Integrations, Inc. Power converter controller with multiple power sources
US9166575B2 (en) 2013-03-08 2015-10-20 Power Integrations, Inc. Low threshold voltage comparator
US9166486B2 (en) 2013-03-08 2015-10-20 Power Integrations, Inc. Power converter using multiple controllers
US9136765B2 (en) 2013-03-08 2015-09-15 Power Integrations, Inc. Techniques for controlling a power converter using multiple controllers
US9019728B2 (en) 2013-03-08 2015-04-28 Power Integrations, Inc. Power converter output voltage clamp and supply terminal
US9337253B2 (en) * 2013-03-09 2016-05-10 Microchip Technology Incorporated Method and apparatus for constructing an isolation capacitor in an integrated circuit
US9071146B2 (en) 2013-03-13 2015-06-30 Power Integrations, Inc. AC voltage sensor with low power consumption
US9246392B2 (en) 2013-03-13 2016-01-26 Power Integrations, Inc. Switched mode power converter controller with ramp time modulation
US9401657B2 (en) 2013-03-13 2016-07-26 Power Integrations, Inc. Input voltage sensor responsive to load conditions
US9293997B2 (en) 2013-03-14 2016-03-22 Analog Devices Global Isolated error amplifier for isolated power supplies
US9496926B2 (en) 2013-05-24 2016-11-15 Texas Instruments Incorporated Galvanic isolator
CN103280442A (zh) * 2013-05-27 2013-09-04 苏州贝克微电子有限公司 使用同一引线框架的电容和电容耦合隔离电路
CN103617992A (zh) * 2013-11-27 2014-03-05 苏州贝克微电子有限公司 一种引线框架电容器和电容耦合隔离器电路
US10270630B2 (en) 2014-09-15 2019-04-23 Analog Devices, Inc. Demodulation of on-off-key modulated signals in signal isolator systems
US10536309B2 (en) 2014-09-15 2020-01-14 Analog Devices, Inc. Demodulation of on-off-key modulated signals in signal isolator systems
US9660848B2 (en) 2014-09-15 2017-05-23 Analog Devices Global Methods and structures to generate on/off keyed carrier signals for signal isolators
US9998301B2 (en) 2014-11-03 2018-06-12 Analog Devices, Inc. Signal isolator system with protection for common mode transients
US9257834B1 (en) 2015-02-13 2016-02-09 The Silanna Group Pty Ltd. Single-laminate galvanic isolator assemblies
EP3293888B1 (de) 2016-09-13 2020-08-26 Allegro MicroSystems, LLC Signalisolator mit bidirektionaler kommunikation zwischen chips
JP6923248B2 (ja) * 2017-03-31 2021-08-18 新日本無線株式会社 半導体装置
US10243442B1 (en) 2017-11-22 2019-03-26 Power Integrations, Inc. Controller with frequency to on-time converter
TWI642147B (zh) * 2018-01-29 2018-11-21 新加坡商光寶新加坡有限公司 用於電容耦合隔離器的電容耦合封裝結構
CN111801842B (zh) * 2018-03-07 2022-03-22 住友电工光电子器件创新株式会社 半导体装置
US11115244B2 (en) 2019-09-17 2021-09-07 Allegro Microsystems, Llc Signal isolator with three state data transmission
US11205611B1 (en) 2020-06-15 2021-12-21 Texas Instruments Incorporated Leadframe capacitors
CN112039517B (zh) * 2020-09-04 2024-03-22 上海川土微电子有限公司 基于Pulse-Coding的超低功耗电容式数字隔离器电路
CN114121865A (zh) * 2021-10-20 2022-03-01 上海闻泰信息技术有限公司 一种系统级封装结构及其制作方法

Family Cites Families (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2600343A (en) * 1948-10-07 1952-06-10 Kenyon Instr Company Inc Method of making conductive patterns
US2777110A (en) * 1952-10-07 1957-01-08 Sprague Electric Co Miniature high dielectric multicapacitor unit
US2885601A (en) * 1954-05-28 1959-05-05 Rca Corp Insulation of printed circuits
US2896028A (en) * 1954-09-30 1959-07-21 Rca Corp Printed circuit for high frequency amplifier apparatus
NL237700A (de) * 1958-04-02
NL269422A (de) * 1960-09-21
US3168704A (en) * 1961-03-06 1965-02-02 Clevite Corp Multivibrator amplifier with time delay modulating audio input
US3264569A (en) * 1964-12-07 1966-08-02 Tia Electric Company Transiently regenerative amplifier with a. c. and d. c. regeneration
US3316458A (en) * 1965-01-29 1967-04-25 Hughes Aircraft Co Electronic circuit assembly with recessed substrate mounting means
US3437943A (en) * 1965-03-16 1969-04-08 Leeds & Northrup Co Synchronized modulator-demodulator system
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
US3489952A (en) * 1967-05-15 1970-01-13 Singer Co Encapsulated microelectronic devices
US3537022A (en) * 1968-01-10 1970-10-27 Hewlett Packard Co Signal translating circuit
US3593208A (en) * 1969-03-17 1971-07-13 Bell Telephone Labor Inc Microwave quadrature coupler having lumped-element capacitors
US3679941A (en) * 1969-09-22 1972-07-25 Gen Electric Composite integrated circuits including semiconductor chips mounted on a common substrate with connections made through a dielectric encapsulator
DE2114940C3 (de) * 1970-09-21 1973-09-13 Veb Kombinat Mess- Und Regelungstechnik, X 4500 Dessau Schaltungsanordnung für hochohmige Gleichspannungsverstärker
US3714540A (en) * 1970-11-10 1973-01-30 Oxy Metal Finishing Corp Isolation and transforming circuit
US3757175A (en) * 1971-01-06 1973-09-04 Soo Kim Chang Tor chips mounted on a single substrate composite integrated circuits with coplnaar connections to semiconduc
US3675095A (en) * 1971-06-10 1972-07-04 Rca Corp Capacitors of constant capacitance
US3745508A (en) * 1972-05-25 1973-07-10 Bourns Inc Selectable fixed impedance device
US3764938A (en) * 1972-08-28 1973-10-09 Bell Telephone Labor Inc Resonance suppression in interdigital capacitors useful as dc bias breaks in diode oscillator circuits
US3833838A (en) * 1972-11-13 1974-09-03 A Christiansen Electronic component mounting wafers for repeated connection in a variety of circuit designs
US4167647A (en) * 1974-10-02 1979-09-11 Santa Barbara Research Center Hybrid microelectronic circuit package
US4023053A (en) * 1974-12-16 1977-05-10 Tokyo Shibaura Electric Co., Ltd. Variable capacity diode device
GB1469944A (en) * 1975-04-21 1977-04-06 Decca Ltd Planar capacitor
US4038488A (en) * 1975-05-12 1977-07-26 Cambridge Memories, Inc. Multilayer ceramic multi-chip, dual in-line packaging assembly
JPS51150068A (en) * 1975-06-19 1976-12-23 Citizen Watch Co Ltd Electronic circuit block
US4173033A (en) * 1975-12-04 1979-10-30 Daikin Kogyo Co., Ltd. Polymeric dielectric for capacitors and the like consisting essentially of a vinylidene fluoride-trifluoroethylene copolymer
JPS59814Y2 (ja) * 1977-04-22 1984-01-11 ブライアン・ア−ネスト・アトウツド Ｄ級増幅器
DE2723363A1 (de) * 1977-05-24 1978-11-30 Philips Patentverwaltung Kondensator mit einem zylinderfoermigen traegerkoerper
US4117411A (en) * 1977-09-26 1978-09-26 Moore Products Co. Isolation circuit with duty cycle feedback
US4188651A (en) * 1978-03-27 1980-02-12 Sprague Electric Company Ceramic capacitor with surface electrodes
US4193028A (en) * 1978-05-05 1980-03-11 Honeywell Inc. Eddy current instrumentation circuitry for distinguishing flaw signals from spurious noise signals
US4292595A (en) * 1979-11-13 1981-09-29 Burr-Brown Research Corporation Capacitance coupled isolation amplifier and method
US4249135A (en) * 1980-03-25 1981-02-03 Fisher Charles B Amplifier with switched capacitors
NL8104353A (nl) * 1980-10-01 1982-05-03 Communications Patents Ltd Transformator in de vorm van een gedrukte schakeling.
US4391531A (en) * 1980-12-19 1983-07-05 Timex Corporation Electrooptical display/lead frame subassembly and timepiece module including same
JPS57178353A (en) * 1981-04-27 1982-11-02 Alps Electric Co Ltd Thick film printed circuit
US4410905A (en) * 1981-08-14 1983-10-18 Amp Incorporated Power, ground and decoupling structure for chip carriers
JPS58197962A (ja) * 1982-05-13 1983-11-17 Matsushita Electric Ind Co Ltd 同期装置
SU1048485A1 (ru) * 1982-05-13 1983-10-15 Предприятие П/Я В-2119 Операционный усилитель
JPS58197862A (ja) * 1982-05-14 1983-11-17 Nec Corp 半導体装置用気密容器
US4536638A (en) * 1982-09-30 1985-08-20 Witold Krynicki Chip assembly
US4551747A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation
US4506108A (en) * 1983-04-01 1985-03-19 Sperry Corporation Copper body power hybrid package and method of manufacture
US4680613A (en) * 1983-12-01 1987-07-14 Fairchild Semiconductor Corporation Low impedance package for integrated circuit die
US4600907A (en) * 1985-03-07 1986-07-15 Tektronix, Inc. Coplanar microstrap waveguide interconnector and method of interconnection
US4622619A (en) * 1985-03-13 1986-11-11 Rogers Corporation Decoupling capacitor and method of manufacture thereof
US4705917A (en) * 1985-08-27 1987-11-10 Hughes Aircraft Company Microelectronic package
JPS62108553A (ja) * 1985-11-06 1987-05-19 Nec Corp 樹脂封止型半導体装置
US4697858A (en) * 1986-02-07 1987-10-06 National Semiconductor Corporation Active bus backplane
US4835486A (en) * 1986-04-28 1989-05-30 Burr-Brown Corporation Isolation amplifier with precise timing of signals coupled across isolation barrier
FR2598032B1 (fr) * 1986-04-28 1991-08-09 Burr Brown Corp Circuit integre hybride pour amplificateur d'isolation
US4780795A (en) * 1986-04-28 1988-10-25 Burr-Brown Corporation Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture
US4748419A (en) * 1986-04-28 1988-05-31 Burr-Brown Corporation Isolation amplifier with precise timing of signals coupled across isolation barrier
JPH01215030A (ja) * 1988-02-24 1989-08-29 Hitachi Ltd 樹脂封止型半導体装置
JP2601867B2 (ja) * 1988-03-31 1997-04-16 株式会社東芝 半導体集積回路実装基板、その製造方法および半導体集積回路装置
JP2714056B2 (ja) * 1988-10-19 1998-02-16 キヤノン株式会社 廃インク容器を着脱可能にするインクジェット記録装置及びそれに用いられる廃インク容器
JPH02238655A (ja) * 1989-03-10 1990-09-20 Nec Corp 半導体パッケージ
JP2785324B2 (ja) * 1989-05-08 1998-08-13 株式会社デンソー マルチチップパッケージ構造
DE3915998A1 (de) * 1989-05-17 1990-11-29 Vdo Schindling Elektronisches bauelement
US5233220A (en) * 1989-06-30 1993-08-03 Texas Instruments Incorporated Balanced capacitance lead frame for integrated circuits and integrated circuit device with separate conductive layer
JPH0378248A (ja) * 1989-08-22 1991-04-03 Seiko Instr Inc 半導体装置
US5223220A (en) * 1990-03-27 1993-06-29 Pacific Biotech, Inc. Solid phase immunoassay device and method of making same
JPH0425036A (ja) * 1990-05-16 1992-01-28 Mitsubishi Electric Corp マイクロ波半導体装置
JPH0444242A (ja) * 1990-06-07 1992-02-14 Fuji Electric Co Ltd 半導体装置の製造方法
JPH04162657A (ja) * 1990-10-26 1992-06-08 Hitachi Ltd 半導体装置用リードフレーム
JP3178068B2 (ja) * 1991-05-31 2001-06-18 セイコーエプソン株式会社 圧電発振器
US5229640A (en) * 1992-09-01 1993-07-20 Avx Corporation Surface mountable clock oscillator module
US5444600A (en) * 1992-12-03 1995-08-22 Linear Technology Corporation Lead frame capacitor and capacitively-coupled isolator circuit using the same

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US5926358A (en) 1999-07-20
JPH06283662A (ja) 1994-10-07
US5945728A (en) 1999-08-31
US5444600A (en) 1995-08-22
DE69332140D1 (de) 2002-08-29
JP2690264B2 (ja) 1997-12-10
EP0600488A2 (de) 1994-06-08
US5589709A (en) 1996-12-31
EP0600488A3 (de) 1995-02-01
EP0600488B1 (de) 2002-07-24
US5650357A (en) 1997-07-22

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