DE69332490T2 - Polymersubstrate mit polymerischen Mikroelementen - Google Patents

Polymersubstrate mit polymerischen Mikroelementen

Info

Publication number
DE69332490T2
DE69332490T2 DE1993632490 DE69332490T DE69332490T2 DE 69332490 T2 DE69332490 T2 DE 69332490T2 DE 1993632490 DE1993632490 DE 1993632490 DE 69332490 T DE69332490 T DE 69332490T DE 69332490 T2 DE69332490 T2 DE 69332490T2
Authority
DE
Germany
Prior art keywords
polymer substrates
polymeric microelements
microelements
polymeric
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1993632490
Other languages
English (en)
Other versions
DE69332490D1 (de
Inventor
Heinz F Reinhardt
Harry George Mcclain
William D Budinger
John V H Roberts
Elmer William Jensen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rodel Inc
Original Assignee
Rodel Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25461879&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69332490(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Rodel Inc filed Critical Rodel Inc
Publication of DE69332490D1 publication Critical patent/DE69332490D1/de
Application granted granted Critical
Publication of DE69332490T2 publication Critical patent/DE69332490T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
    • B29C70/66—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres the filler comprising hollow constituents, e.g. syntactic foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/736—Grinding or polishing equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/959—Mechanical polishing of wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y10T428/24405—Polymer or resin [e.g., natural or synthetic rubber, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24446—Wrinkled, creased, crinkled or creped
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24537—Parallel ribs and/or grooves
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457—Parallel ribs and/or grooves
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457—Parallel ribs and/or grooves
    • Y10T428/24579—Parallel ribs and/or grooves with particulate matter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249954—With chemically effective material or specified gas other than air, N, or carbon dioxide in void-containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249971—Preformed hollow element-containing
    • Y10T428/249972—Resin or rubber element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/268—Monolayer with structurally defined element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31591—Next to cellulosic
DE1993632490 1992-08-19 1993-08-02 Polymersubstrate mit polymerischen Mikroelementen Expired - Lifetime DE69332490T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US93216192A 1992-08-19 1992-08-19

Publications (2)

Publication Number Publication Date
DE69332490D1 DE69332490D1 (de) 2002-12-19
DE69332490T2 true DE69332490T2 (de) 2003-09-25

Family

ID=25461879

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1993632490 Expired - Lifetime DE69332490T2 (de) 1992-08-19 1993-08-02 Polymersubstrate mit polymerischen Mikroelementen
DE1993619435 Expired - Lifetime DE69319435T2 (de) 1992-08-19 1993-08-02 Polymersubstrate mit polymerischen microelementen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE1993619435 Expired - Lifetime DE69319435T2 (de) 1992-08-19 1993-08-02 Polymersubstrate mit polymerischen microelementen

Country Status (11)

Country Link
US (6) US5578362A (de)
EP (2) EP0656031B1 (de)
JP (2) JP3013105B2 (de)
KR (1) KR100191227B1 (de)
CN (1) CN1059219C (de)
AU (1) AU4798493A (de)
DE (2) DE69332490T2 (de)
MY (1) MY114512A (de)
SG (1) SG43335A1 (de)
TW (1) TW264493B (de)
WO (1) WO1994004599A1 (de)

Families Citing this family (355)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6069080A (en) * 1992-08-19 2000-05-30 Rodel Holdings, Inc. Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
JP2894209B2 (ja) * 1994-06-03 1999-05-24 信越半導体株式会社 シリコンウェーハ研磨用パッド及び研磨方法
EP0692318B1 (de) * 1994-06-28 2001-09-12 Ebara Corporation Verfahren und Vorrichtung zum Reinigen von Werkstücken
US6509084B2 (en) 1994-07-28 2003-01-21 Custom Plastics Molding, Inc. Thermoplastic products having antislip surfaces
US5533923A (en) * 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity
US6099954A (en) 1995-04-24 2000-08-08 Rodel Holdings, Inc. Polishing material and method of polishing a surface
JP3708167B2 (ja) * 1995-05-17 2005-10-19 株式会社荏原製作所 研磨布及び該研磨布を備えたポリッシング装置
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US5958794A (en) * 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5840629A (en) * 1995-12-14 1998-11-24 Sematech, Inc. Copper chemical mechanical polishing slurry utilizing a chromate oxidant
US5624303A (en) * 1996-01-22 1997-04-29 Micron Technology, Inc. Polishing pad and a method for making a polishing pad with covalently bonded particles
TW349896B (en) * 1996-05-02 1999-01-11 Applied Materials Inc Apparatus and chemical mechanical polishing system for polishing a substrate
US5713968A (en) * 1996-05-16 1998-02-03 Speedfam Corporation Abrasive foam grinding composition
US5893754A (en) * 1996-05-21 1999-04-13 Micron Technology, Inc. Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers
US5769691A (en) 1996-06-14 1998-06-23 Speedfam Corp Methods and apparatus for the chemical mechanical planarization of electronic devices
US5866031A (en) * 1996-06-19 1999-02-02 Sematech, Inc. Slurry formulation for chemical mechanical polishing of metals
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US5846398A (en) * 1996-08-23 1998-12-08 Sematech, Inc. CMP slurry measurement and control technique
US5972792A (en) * 1996-10-18 1999-10-26 Micron Technology, Inc. Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
KR100210840B1 (ko) * 1996-12-24 1999-07-15 구본준 기계 화학적 연마 방법 및 그 장치
WO1998030356A1 (en) * 1997-01-13 1998-07-16 Rodel, Inc. Polymeric polishing pad having photolithographically induced surface pattern(s) and methods relating thereto
US5938801A (en) * 1997-02-12 1999-08-17 Micron Technology, Inc. Polishing pad and a method for making a polishing pad with covalently bonded particles
US6328642B1 (en) 1997-02-14 2001-12-11 Lam Research Corporation Integrated pad and belt for chemical mechanical polishing
JP2001518852A (ja) * 1997-04-04 2001-10-16 ローデル ホールディングス インコーポレイテッド 改良研磨パッド及びこれに関連する方法
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
IL132412A0 (en) * 1997-04-18 2001-03-19 Cabot Corp Polishing pad for a semiconductor substrate
US8092707B2 (en) 1997-04-30 2012-01-10 3M Innovative Properties Company Compositions and methods for modifying a surface suited for semiconductor fabrication
KR100571892B1 (ko) * 1997-04-30 2006-04-18 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 반도체 웨이퍼 상부 표면의 평탄화 방법
EP1007283A4 (de) * 1997-05-09 2002-05-08 Rodel Inc Mosaikpolierkissen und entsprechendes verfahren
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6273806B1 (en) 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US6146248A (en) 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6111634A (en) * 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
US6108091A (en) 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US5885312A (en) * 1997-06-17 1999-03-23 Speedfam Corporation Grinding composition using abrasive particles on bubbles
US6224465B1 (en) 1997-06-26 2001-05-01 Stuart L. Meyer Methods and apparatus for chemical mechanical planarization using a microreplicated surface
US6736714B2 (en) 1997-07-30 2004-05-18 Praxair S.T. Technology, Inc. Polishing silicon wafers
JP2001513450A (ja) * 1997-08-06 2001-09-04 ローデル ホールディングス インコーポレイテッド 改良研磨パッド及びこれに関連する方法
US6121143A (en) * 1997-09-19 2000-09-19 3M Innovative Properties Company Abrasive articles comprising a fluorochemical agent for wafer surface modification
US6093651A (en) * 1997-12-23 2000-07-25 Intel Corporation Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
US6139402A (en) 1997-12-30 2000-10-31 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
US6780095B1 (en) 1997-12-30 2004-08-24 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
US6159087A (en) * 1998-02-11 2000-12-12 Applied Materials, Inc. End effector for pad conditioning
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6337280B1 (en) * 1998-05-11 2002-01-08 Kabushiki Kaisha Toshiba Polishing cloth and method of manufacturing semiconductor device using the same
US7718102B2 (en) * 1998-06-02 2010-05-18 Praxair S.T. Technology, Inc. Froth and method of producing froth
US6585574B1 (en) 1998-06-02 2003-07-01 Brian Lombardo Polishing pad with reduced moisture absorption
US6514301B1 (en) 1998-06-02 2003-02-04 Peripheral Products Inc. Foam semiconductor polishing belts and pads
US6117000A (en) * 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
US6220934B1 (en) 1998-07-23 2001-04-24 Micron Technology, Inc. Method for controlling pH during planarization and cleaning of microelectronic substrates
US6203407B1 (en) 1998-09-03 2001-03-20 Micron Technology, Inc. Method and apparatus for increasing-chemical-polishing selectivity
US6390890B1 (en) 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
US6206756B1 (en) 1998-11-10 2001-03-27 Micron Technology, Inc. Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
US6276996B1 (en) 1998-11-10 2001-08-21 Micron Technology, Inc. Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
US6217422B1 (en) 1999-01-20 2001-04-17 International Business Machines Corporation Light energy cleaning of polishing pads
CN1137013C (zh) 1999-01-21 2004-02-04 罗德尔控股公司 改进的抛光垫及其抛光方法
US6641463B1 (en) 1999-02-06 2003-11-04 Beaver Creek Concepts Inc Finishing components and elements
US6413153B1 (en) 1999-04-26 2002-07-02 Beaver Creek Concepts Inc Finishing element including discrete finishing members
US6283836B1 (en) * 1999-03-08 2001-09-04 Speedfam-Ipec Corporation Non-abrasive conditioning for polishing pads
US6238592B1 (en) * 1999-03-10 2001-05-29 3M Innovative Properties Company Working liquids and methods for modifying structured wafers suited for semiconductor fabrication
US20040072518A1 (en) * 1999-04-02 2004-04-15 Applied Materials, Inc. Platen with patterned surface for chemical mechanical polishing
US6217426B1 (en) 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US6656018B1 (en) * 1999-04-13 2003-12-02 Freudenberg Nonwovens Limited Partnership Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
JP2000344902A (ja) 1999-06-04 2000-12-12 Fuji Spinning Co Ltd 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物
TWI228522B (en) 1999-06-04 2005-03-01 Fuji Spinning Co Ltd Urethane molded products for polishing pad and method for making same
US6234875B1 (en) 1999-06-09 2001-05-22 3M Innovative Properties Company Method of modifying a surface
US7516536B2 (en) * 1999-07-08 2009-04-14 Toho Engineering Kabushiki Kaisha Method of producing polishing pad
US6869343B2 (en) * 2001-12-19 2005-03-22 Toho Engineering Kabushiki Kaisha Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
EP1075898A3 (de) * 1999-08-13 2003-11-05 Mitsubishi Materials Corporation Abrichtwerkzeug und Vorrichtung
US6406363B1 (en) 1999-08-31 2002-06-18 Lam Research Corporation Unsupported chemical mechanical polishing belt
US6290883B1 (en) 1999-08-31 2001-09-18 Lucent Technologies Inc. Method for making porous CMP article
US6299516B1 (en) 1999-09-28 2001-10-09 Applied Materials, Inc. Substrate polishing article
US20020068516A1 (en) * 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
US6428586B1 (en) 1999-12-14 2002-08-06 Rodel Holdings Inc. Method of manufacturing a polymer or polymer/composite polishing pad
WO2001045899A1 (fr) * 1999-12-22 2001-06-28 Toray Industries, Inc. Tampon a polir, procede et appareil de polissage
US6533645B2 (en) 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6607428B2 (en) 2000-01-18 2003-08-19 Applied Materials, Inc. Material for use in carrier and polishing pads
US6623341B2 (en) 2000-01-18 2003-09-23 Applied Materials, Inc. Substrate polishing apparatus
DE10004578C1 (de) * 2000-02-03 2001-07-26 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Halbleiterscheibe mit polierter Kante
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US6962524B2 (en) * 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US20030213703A1 (en) * 2002-05-16 2003-11-20 Applied Materials, Inc. Method and apparatus for substrate polishing
US6991526B2 (en) * 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US7066800B2 (en) 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6537144B1 (en) 2000-02-17 2003-03-25 Applied Materials, Inc. Method and apparatus for enhanced CMP using metals having reductive properties
US20040182721A1 (en) * 2003-03-18 2004-09-23 Applied Materials, Inc. Process control in electro-chemical mechanical polishing
EP1263548A1 (de) * 2000-03-15 2002-12-11 Rodel Holdings, Inc. Fensterteil mit einer abgestimmten verschleissgeschwindigkeit
US6616513B1 (en) * 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
US6561891B2 (en) 2000-05-23 2003-05-13 Rodel Holdings, Inc. Eliminating air pockets under a polished pad
US6736709B1 (en) 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6749485B1 (en) 2000-05-27 2004-06-15 Rodel Holdings, Inc. Hydrolytically stable grooved polishing pads for chemical mechanical planarization
US6454634B1 (en) 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
JP3925041B2 (ja) * 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
US6712681B1 (en) * 2000-06-23 2004-03-30 International Business Machines Corporation Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
US6495464B1 (en) * 2000-06-30 2002-12-17 Lam Research Corporation Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool
JP2002018367A (ja) * 2000-06-30 2002-01-22 Inoac Corp 真空チャンバー用拭き取り材およびその製造方法
US6500056B1 (en) 2000-06-30 2002-12-31 Lam Research Corporation Linear reciprocating disposable belt polishing method and apparatus
US6623337B2 (en) 2000-06-30 2003-09-23 Rodel Holdings, Inc. Base-pad for a polishing pad
KR20030020977A (ko) 2000-08-11 2003-03-10 로델 홀딩스 인코포레이티드 금속 기판의 화학적 기계적 평탄화
US6652764B1 (en) 2000-08-31 2003-11-25 Micron Technology, Inc. Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
US6551176B1 (en) 2000-10-05 2003-04-22 Applied Materials, Inc. Pad conditioning disk
EP1324858A1 (de) 2000-10-06 2003-07-09 Cabot Microelectronics Corporation Polierkissen mit durchsichtigem füllmaterial
JP2002190460A (ja) * 2000-10-12 2002-07-05 Toshiba Corp 研磨布、研磨装置および半導体装置の製造方法
US6722950B1 (en) 2000-11-07 2004-04-20 Planar Labs Corporation Method and apparatus for electrodialytic chemical mechanical polishing and deposition
US6773337B1 (en) 2000-11-07 2004-08-10 Planar Labs Corporation Method and apparatus to recondition an ion exchange polish pad
US6905526B1 (en) 2000-11-07 2005-06-14 Planar Labs Corporation Fabrication of an ion exchange polish pad
US6684704B1 (en) 2002-09-12 2004-02-03 Psiloquest, Inc. Measuring the surface properties of polishing pads using ultrasonic reflectance
US20050266226A1 (en) * 2000-11-29 2005-12-01 Psiloquest Chemical mechanical polishing pad and method for selective metal and barrier polishing
US6706383B1 (en) 2001-11-27 2004-03-16 Psiloquest, Inc. Polishing pad support that improves polishing performance and longevity
US7059946B1 (en) 2000-11-29 2006-06-13 Psiloquest Inc. Compacted polishing pads for improved chemical mechanical polishing longevity
EP1211024A3 (de) * 2000-11-30 2004-01-02 JSR Corporation Polierverfahren
CN1224499C (zh) 2000-12-01 2005-10-26 东洋橡膠工业株式会社 研磨垫及其制造方法和研磨垫用缓冲层
US6896776B2 (en) 2000-12-18 2005-05-24 Applied Materials Inc. Method and apparatus for electro-chemical processing
JP2002192456A (ja) * 2000-12-25 2002-07-10 Toyobo Co Ltd 研磨パッド
JP2002192457A (ja) * 2000-12-26 2002-07-10 Toyo Tire & Rubber Co Ltd 研磨材組成物及び研磨シート
US20040143273A1 (en) * 2000-12-29 2004-07-22 Winitsky Kathleen M. Microdermabrasive exfoliator
US6609961B2 (en) 2001-01-09 2003-08-26 Lam Research Corporation Chemical mechanical planarization belt assembly and method of assembly
JP3455187B2 (ja) 2001-02-01 2003-10-14 東洋ゴム工業株式会社 研磨パッド用ポリウレタン発泡体の製造装置
KR100497205B1 (ko) * 2001-08-02 2005-06-23 에스케이씨 주식회사 마이크로홀이 형성된 화학적 기계적 연마패드
US6828373B2 (en) 2001-03-07 2004-12-07 Advanced Ceramics Research, Inc. Water soluble tooling materials for composite structures
US6863774B2 (en) * 2001-03-08 2005-03-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
US20030024169A1 (en) * 2001-03-28 2003-02-06 Kendall Philip E. Abrasive articles with water soluble particles
KR100790427B1 (ko) * 2001-04-09 2008-01-02 도요 고무 고교 가부시키가이샤 폴리우레탄 조성물 및 연마 패드
DE60228784D1 (de) * 2001-04-25 2008-10-23 Jsr Corp Lichtduchlässiges Polierkissen für eine Halbleiterschleife
US6837779B2 (en) * 2001-05-07 2005-01-04 Applied Materials, Inc. Chemical mechanical polisher with grooved belt
US6635211B2 (en) * 2001-06-25 2003-10-21 Taiwan Semiconductor Manufacturing Co. Ltd Reinforced polishing pad for linear chemical mechanical polishing and method for forming
GB0115814D0 (en) * 2001-06-28 2001-08-22 Arjo Wiggins Fine Papers Ltd Production of holographic images
CN1328009C (zh) * 2001-08-02 2007-07-25 株式会社Skc 利用激光制造化学机械抛光垫的方法
US6530829B1 (en) 2001-08-30 2003-03-11 Micron Technology, Inc. CMP pad having isolated pockets of continuous porosity and a method for using such pad
CN1312740C (zh) * 2001-09-28 2007-04-25 信越半导体株式会社 用于研磨的工件保持盘及工件研磨装置及研磨方法
JP2003103455A (ja) * 2001-09-28 2003-04-08 Shin Etsu Handotai Co Ltd ワーク保持盤並びにワークの研磨装置及び研磨方法
US7070480B2 (en) * 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
US6685540B2 (en) 2001-11-27 2004-02-03 Cabot Microelectronics Corporation Polishing pad comprising particles with a solid core and polymeric shell
US7097549B2 (en) * 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
US6702866B2 (en) 2002-01-10 2004-03-09 Speedfam-Ipec Corporation Homogeneous fixed abrasive polishing pad
US6837983B2 (en) * 2002-01-22 2005-01-04 Applied Materials, Inc. Endpoint detection for electro chemical mechanical polishing and electropolishing processes
US6852020B2 (en) * 2003-01-22 2005-02-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same
US7037184B2 (en) * 2003-01-22 2006-05-02 Raytech Innovation Solutions, Llc Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
KR100838673B1 (ko) 2002-05-07 2008-06-16 도요 고무 고교 가부시키가이샤 연마 패드용 폴리우레탄 발포체의 제조 방법, 폴리우레탄 발포체, 및 연마 패드용 폴리우레탄 발포체의 제조 장치
US6783562B2 (en) 2002-05-22 2004-08-31 Reemay, Inc. Nonwoven abrasive composite
US20040021243A1 (en) * 2002-08-02 2004-02-05 Wen-Chang Shih Method for manufacturing auxiliary gas-adding polyurethae/polyurethane-urea polishing pad
US20050061674A1 (en) 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
US7112270B2 (en) * 2002-09-16 2006-09-26 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
US7579071B2 (en) * 2002-09-17 2009-08-25 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
KR100495404B1 (ko) * 2002-09-17 2005-06-14 한국포리올 주식회사 임베디드 액상 미소요소를 함유하는 연마 패드 및 그 제조방법
US20070010169A1 (en) * 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
US6641632B1 (en) * 2002-11-18 2003-11-04 International Business Machines Corporation Polishing compositions and use thereof
AU2003284655A1 (en) * 2002-11-25 2004-07-09 Sumitomo Bakelite Company Limited Method for producing closed cell cellular material for use in polishing, cellular sheet for polishing, laminate for polishing and polishing method, method for producing laminate for polishing, and grooved polishing pad
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
DE602004008880T2 (de) * 2003-02-18 2008-06-26 Parker-Hannifin Corp., Cleveland Polierartikel für elektro-chemisches-mechanisches polieren
US7842169B2 (en) * 2003-03-04 2010-11-30 Applied Materials, Inc. Method and apparatus for local polishing control
US20040224622A1 (en) 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
JP4292025B2 (ja) 2003-05-23 2009-07-08 Ｊｓｒ株式会社 研磨パッド
JP2004358584A (ja) * 2003-06-03 2004-12-24 Fuji Spinning Co Ltd 研磨布及び研磨加工方法
US6998166B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Polishing pad with oriented pore structure
US7086932B2 (en) 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
US8316866B2 (en) * 2003-06-27 2012-11-27 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
US20050032464A1 (en) * 2003-08-07 2005-02-10 Swisher Robert G. Polishing pad having edge surface treatment
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
US20050042976A1 (en) * 2003-08-22 2005-02-24 International Business Machines Corporation Low friction planarizing/polishing pads and use thereof
WO2005028157A1 (en) * 2003-09-15 2005-03-31 Psiloquest Inc. A polishing pad for chemical mechanical polishing
US7186651B2 (en) * 2003-10-30 2007-03-06 Texas Instruments Incorporated Chemical mechanical polishing method and apparatus
US7442116B2 (en) 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
US7335239B2 (en) * 2003-11-17 2008-02-26 Advanced Technology Materials, Inc. Chemical mechanical planarization pad
US7186164B2 (en) 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US7390744B2 (en) 2004-01-29 2008-06-24 Applied Materials, Inc. Method and composition for polishing a substrate
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
US6951509B1 (en) * 2004-03-09 2005-10-04 3M Innovative Properties Company Undulated pad conditioner and method of using same
US7195544B2 (en) 2004-03-23 2007-03-27 Cabot Microelectronics Corporation CMP porous pad with component-filled pores
US6986705B2 (en) * 2004-04-05 2006-01-17 Rimpad Tech Ltd. Polishing pad and method of making same
TWI293266B (en) * 2004-05-05 2008-02-11 Iv Technologies Co Ltd A single-layer polishing pad and a method of producing the same
TWI254354B (en) * 2004-06-29 2006-05-01 Iv Technologies Co Ltd An inlaid polishing pad and a method of producing the same
US7252582B2 (en) * 2004-08-25 2007-08-07 Jh Rhodes Company, Inc. Optimized grooving structure for a CMP polishing pad
US20060046627A1 (en) * 2004-08-25 2006-03-02 Peter Renteln Method of improving planarization of urethane polishing pads, and urethane polishing pad produced by the same
US20060046064A1 (en) * 2004-08-25 2006-03-02 Dwaine Halberg Method of improving removal rate of pads
KR20070057157A (ko) * 2004-08-25 2007-06-04 제이.에이치.로데스 컴퍼니, 인코퍼레이티드 연마 패드 및 패드 제거 속도와 평탄화의 개선 방법
US20060099891A1 (en) * 2004-11-09 2006-05-11 Peter Renteln Method of chemical mechanical polishing, and a pad provided therefore
WO2006025545A1 (en) * 2004-08-30 2006-03-09 Showa Denko K.K. Magnetic disk substrate and production method of magnetic disk
DE602005007125D1 (de) 2004-09-17 2008-07-10 Jsr Corp Chemisch-mechanisches Polierkissen und chemisch-mechanisches Polierverfahren
US7275856B2 (en) * 2004-09-30 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a polishing pad having a reduced striations
US7396497B2 (en) * 2004-09-30 2008-07-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad having reduced striations
JP4475404B2 (ja) 2004-10-14 2010-06-09 Ｊｓｒ株式会社 研磨パッド
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089095A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060108701A1 (en) * 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
US7275928B2 (en) * 2004-11-23 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a striation reduced chemical mechanical polishing pad
US7182677B2 (en) * 2005-01-14 2007-02-27 Applied Materials, Inc. Chemical mechanical polishing pad for controlling polishing slurry distribution
US7655565B2 (en) * 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
US8398463B2 (en) * 2005-03-07 2013-03-19 Rajeev Bajaj Pad conditioner and method
US8148441B2 (en) 2005-03-08 2012-04-03 Toyo Tire & Rubber Co., Ltd. Polishing pad and manufacturing method thereof
KR20060099398A (ko) * 2005-03-08 2006-09-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 수계 연마 패드 및 제조 방법
TWI261878B (en) * 2005-04-20 2006-09-11 Univ Nat Taiwan Science Tech Method for analyzing effective polishing frequency and times for chemical mechanical planarization polishing wafer with different polishing pad profile
KR101134058B1 (ko) 2005-05-17 2012-04-16 도요 고무 고교 가부시키가이샤 연마 패드
US20070010175A1 (en) 2005-07-07 2007-01-11 San Fang Chemical Industry Co., Ltd. Polishing pad and method of producing same
KR100709392B1 (ko) 2005-07-20 2007-04-20 에스케이씨 주식회사 액상의 비닐계 모노머가 상호침투 가교된 형태를 갖는폴리우레탄 연마 패드
US7494519B2 (en) * 2005-07-28 2009-02-24 3M Innovative Properties Company Abrasive agglomerate polishing method
US7169031B1 (en) * 2005-07-28 2007-01-30 3M Innovative Properties Company Self-contained conditioning abrasive article
US20070049169A1 (en) * 2005-08-02 2007-03-01 Vaidya Neha P Nonwoven polishing pads for chemical mechanical polishing
TWI378844B (en) * 2005-08-18 2012-12-11 Rohm & Haas Elect Mat Polishing pad and method of manufacture
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
TW200720017A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat Water-based polishing pads having improved adhesion properties and methods of manufacture
US7226345B1 (en) 2005-12-09 2007-06-05 The Regents Of The University Of California CMP pad with designed surface features
US20070141312A1 (en) * 2005-12-21 2007-06-21 James David B Multilayered polishing pads having improved defectivity and methods of manufacture
TW200744786A (en) 2005-12-28 2007-12-16 Jsr Corp Chemical mechanical polishing pad and chemical mechanical polishing method
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
WO2007086529A1 (ja) 2006-01-25 2007-08-02 Jsr Corporation 化学機械研磨パッドおよびその製造方法
US20080057844A1 (en) * 2006-02-01 2008-03-06 Fred Miekka Discontinuous Abrasive Surfaces Having Controlled Wear Properties
US20080020678A1 (en) * 2006-02-01 2008-01-24 Sierra Madre Marketing Group Discontinuous Abrasive Particle Releasing Surfaces
JP5263481B2 (ja) 2006-02-03 2013-08-14 Ｊｓｒ株式会社 化学機械研磨パッド
EP2001811A4 (de) * 2006-03-30 2011-07-06 Rhodia Modifizierte oberflächen und verfahren zur oberflächenmodifizierung
US8192257B2 (en) * 2006-04-06 2012-06-05 Micron Technology, Inc. Method of manufacture of constant groove depth pads
US7445847B2 (en) * 2006-05-25 2008-11-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7169030B1 (en) 2006-05-25 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7422982B2 (en) * 2006-07-07 2008-09-09 Applied Materials, Inc. Method and apparatus for electroprocessing a substrate with edge profile control
KR100804275B1 (ko) * 2006-07-24 2008-02-18 에스케이씨 주식회사 고분자 쉘로 둘러싸인 액상 유기물 코어를 포함하는 ｃｍｐ연마패드 및 그 제조방법
CN101489721B (zh) 2006-08-28 2014-06-18 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US20080063856A1 (en) * 2006-09-11 2008-03-13 Duong Chau H Water-based polishing pads having improved contact area
US7371160B1 (en) 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7569268B2 (en) * 2007-01-29 2009-08-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
US7458885B1 (en) * 2007-08-15 2008-12-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and methods of making and using same
US7635290B2 (en) 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US7517277B2 (en) 2007-08-16 2009-04-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Layered-filament lattice for chemical mechanical polishing
US7530887B2 (en) 2007-08-16 2009-05-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with controlled wetting
US7828634B2 (en) 2007-08-16 2010-11-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interconnected-multi-element-lattice polishing pad
US20090062414A1 (en) * 2007-08-28 2009-03-05 David Picheng Huang System and method for producing damping polyurethane CMP pads
JP2009117815A (ja) 2007-10-18 2009-05-28 Jsr Corp 化学機械研磨パッドの製造方法
US8052507B2 (en) * 2007-11-20 2011-11-08 Praxair Technology, Inc. Damping polyurethane CMP pads with microfillers
JP2011508462A (ja) * 2007-12-31 2011-03-10 イノパッド，インコーポレイテッド 化学的機械的平坦化パッド
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
EP2271463A4 (de) * 2008-04-01 2013-11-27 Innopad Inc Polierkissen mit gesteuerter hohlraumbildung
JP5189396B2 (ja) * 2008-04-01 2013-04-24 富士紡ホールディングス株式会社 研磨パッドおよび研磨パッドの製造方法
WO2009126171A1 (en) * 2008-04-11 2009-10-15 Innopad, Inc. Chemical mechanical planarization pad with void network
US20090266002A1 (en) * 2008-04-29 2009-10-29 Rajeev Bajaj Polishing pad and method of use
JP5514806B2 (ja) * 2008-04-29 2014-06-04 セミクエスト・インコーポレーテッド 研磨パッド組成物およびその製造方法ならびに使用
TWI409137B (zh) * 2008-06-19 2013-09-21 Bestac Advanced Material Co Ltd 研磨墊及其微型結構形成方法
JP5130138B2 (ja) * 2008-07-18 2013-01-30 富士紡ホールディングス株式会社 研磨パッドおよびその製造方法
US8247327B2 (en) * 2008-07-30 2012-08-21 Cabot Microelectronics Corporation Methods and compositions for polishing silicon-containing substrates
US20100035529A1 (en) * 2008-08-05 2010-02-11 Mary Jo Kulp Chemical mechanical polishing pad
TWM352127U (en) * 2008-08-29 2009-03-01 Bestac Advanced Material Co Ltd Polishing pad
TWM352126U (en) * 2008-10-23 2009-03-01 Bestac Advanced Material Co Ltd Polishing pad
US8585790B2 (en) * 2009-04-23 2013-11-19 Applied Materials, Inc. Treatment of polishing pad window
US7947098B2 (en) 2009-04-27 2011-05-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for manufacturing chemical mechanical polishing pad polishing layers having reduced gas inclusion defects
EP2444433A4 (de) 2009-06-18 2014-06-11 Jsr Corp Polyurethan, zusammensetzung zur bildung von polierschichten damit, tuch für chemisch-mechanische reinigung und chemisch-mechanisches reinigungsverfahren damit
US8697239B2 (en) * 2009-07-24 2014-04-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multi-functional polishing pad
KR101044279B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 Ｃｍｐ 연마패드와 그의 제조방법
KR101044281B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 기공이 형성된 ｃｍｐ 연마패드와 그의 제조방법
US20120322348A1 (en) 2009-12-22 2012-12-20 Jsr Corporation Pad for chemical mechanical polishing and method of chemical mechanical polishing using same
CN102686362A (zh) * 2009-12-30 2012-09-19 3M创新有限公司 包括分相共混聚合物的抛光垫及其制备和使用方法
JP5484145B2 (ja) 2010-03-24 2014-05-07 東洋ゴム工業株式会社 研磨パッド
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
DE102010042040A1 (de) 2010-10-06 2012-04-12 Siltronic Ag Verfahren zum Schleifen einer Halbleiterscheibe
US8702479B2 (en) 2010-10-15 2014-04-22 Nexplanar Corporation Polishing pad with multi-modal distribution of pore diameters
US8357446B2 (en) 2010-11-12 2013-01-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Hollow polymeric-silicate composite
US8257152B2 (en) * 2010-11-12 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Silicate composite polishing pad
US8202334B2 (en) * 2010-11-12 2012-06-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming silicate polishing pad
WO2012116129A1 (en) * 2011-02-25 2012-08-30 3M Innovative Properties Company Front-lit reflective display device
US8444727B2 (en) * 2011-08-16 2013-05-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
US20130168132A1 (en) * 2011-12-29 2013-07-04 Sumsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
US8709114B2 (en) * 2012-03-22 2014-04-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
US8986585B2 (en) 2012-03-22 2015-03-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers having a window
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US8888877B2 (en) 2012-05-11 2014-11-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Forming alkaline-earth metal oxide polishing pad
US9073172B2 (en) 2012-05-11 2015-07-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Alkaline-earth metal oxide-polymeric polishing pad
US8894732B2 (en) 2012-05-11 2014-11-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Hollow polymeric-alkaline earth metal oxide composite
KR101417274B1 (ko) 2012-05-23 2014-07-09 삼성전자주식회사 연마패드 및 그 제조방법
US9034063B2 (en) * 2012-09-27 2015-05-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing grooved chemical mechanical polishing layers
US9144880B2 (en) * 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
KR101744694B1 (ko) * 2012-11-09 2017-06-09 주식회사 리온에스엠아이 혼합 기공 구조를 갖는 ｃｍｐ패드
KR101740748B1 (ko) * 2012-11-09 2017-06-08 주식회사 리온에스엠아이 분산된 기공 구조를 갖는 ｃｍｐ패드 및 그 제조방법
WO2014141889A1 (ja) 2013-03-12 2014-09-18 国立大学法人九州大学 研磨パッド及び研磨方法
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US9238295B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
KR102207743B1 (ko) * 2013-08-10 2021-01-26 어플라이드 머티어리얼스, 인코포레이티드 제어된 컨디셔닝을 용이하게 하는 재료 조성을 갖는 ｃｍｐ 패드들
US9421666B2 (en) 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
US9993907B2 (en) 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
US9463553B2 (en) * 2014-02-19 2016-10-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
US9463550B2 (en) * 2014-02-19 2016-10-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
JP2015185815A (ja) * 2014-03-26 2015-10-22 株式会社東芝 研磨パッド、研磨方法、及び半導体装置の製造方法
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US20150306731A1 (en) 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US10105812B2 (en) * 2014-07-17 2018-10-23 Applied Materials, Inc. Polishing pad configuration and polishing pad support
TWI692385B (zh) * 2014-07-17 2020-05-01 美商應用材料股份有限公司 化學機械硏磨所用的方法、系統與硏磨墊
US9731398B2 (en) 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
JP6483991B2 (ja) * 2014-10-02 2019-03-13 富士紡ホールディングス株式会社 研磨材料の製造方法
JP6480696B2 (ja) * 2014-10-02 2019-03-13 富士紡ホールディングス株式会社 研磨パッド、研磨パッド用シート及び研磨材料の製造方法
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
KR20240015167A (ko) 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US9452507B2 (en) 2014-12-19 2016-09-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled-viscosity CMP casting method
US9586304B2 (en) 2014-12-19 2017-03-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled-expansion CMP PAD casting method
US9481070B2 (en) 2014-12-19 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High-stability polyurethane polishing pad
TW201623381A (zh) 2014-12-29 2016-07-01 陶氏全球科技責任有限公司 製造化學機械拋光墊的方法
TW201629467A (zh) * 2014-12-29 2016-08-16 陶氏全球科技責任有限公司 化學機械拋光墊、拋光層分析器及方法
KR101804119B1 (ko) 2014-12-31 2017-12-04 엠.씨.케이(주) 고분자 수지로 성형된 연마제품에 미세기공을 형성하는 방법 및 그 방법에 따라 제조된 연마제품
TW201627658A (zh) * 2015-01-30 2016-08-01 陶氏全球科技責任有限公司 拋光層分析器及方法
KR101600393B1 (ko) * 2015-05-20 2016-03-07 에프엔에스테크 주식회사 연마 패드 및 이의 제조 방법
US9484212B1 (en) 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US10189143B2 (en) * 2015-11-30 2019-01-29 Taiwan Semiconductor Manufacturing Company Limited Polishing pad, method for manufacturing polishing pad, and polishing method
KR20240015161A (ko) 2016-01-19 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6941618B2 (ja) 2016-03-09 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 付加製造で製造される形状の補正
CN108883515A (zh) 2016-03-24 2018-11-23 应用材料公司 用于化学机械抛光的纹理化的小垫
US10875146B2 (en) 2016-03-24 2020-12-29 Rohm And Haas Electronic Materials Cmp Holdings Debris-removal groove for CMP polishing pad
CN107646138B (zh) 2016-04-06 2020-11-06 Kpx化工有限公司 研磨垫制造方法
KR101826335B1 (ko) * 2016-08-05 2018-02-06 김경태 소방용 대피장치
US11137243B2 (en) 2016-09-20 2021-10-05 Applied Materials, Inc. Two step curing of polishing pad material in additive manufacturing
KR102517629B1 (ko) 2016-11-22 2023-04-05 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물
JP7115807B2 (ja) * 2016-12-19 2022-08-09 スリーエム イノベイティブ プロパティズ カンパニー プラズモン粒子表面コーティングを有する可撓性基材、及びその製造方法
EP3571009A4 (de) * 2017-01-20 2021-01-20 Applied Materials, Inc. Dünner kunststoffpolierartikel für cmp-anwendungen
US20180281076A1 (en) * 2017-03-31 2018-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Gelling reduction tool for grooving chemical mechanical planarization polishing pads
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US11524390B2 (en) * 2017-05-01 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Methods of making chemical mechanical polishing layers having improved uniformity
US10967482B2 (en) 2017-05-25 2021-04-06 Applied Materials, Inc. Fabrication of polishing pad by additive manufacturing onto mold
US11084143B2 (en) 2017-05-25 2021-08-10 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing using modified edge
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10777418B2 (en) 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10518387B2 (en) * 2017-07-18 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd. Grinding element, grinding wheel and manufacturing method of semiconductor package using the same
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
EP3790706A4 (de) 2018-05-07 2022-02-16 Applied Materials, Inc. Chemisch-mechanische polierkissen mt einstellbarem hydrophilem und zeta-potenzial
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
CA3153509A1 (en) 2019-09-05 2021-03-11 Saint-Gobain Abrasives, Inc. Coated abrasives having an improved supersize coating
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
WO2022014978A1 (ko) * 2020-07-16 2022-01-20 한국생산기술연구원 연마 패드, 이를 포함하는 연마 장치, 그리고 연마 패드의 제조 방법
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US20230015668A1 (en) * 2021-07-01 2023-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad
CN114952609A (zh) * 2022-04-22 2022-08-30 万华化学集团电子材料有限公司 一种新旧抛光液含比可控的cmp抛光垫、抛光方法及其应用
US20230390889A1 (en) 2022-06-02 2023-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp pad having polishing layer of low specific gravity
US20230390970A1 (en) * 2022-06-02 2023-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making low specific gravity polishing pads
US20230390888A1 (en) 2022-06-02 2023-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp pad having ultra expanded polymer microspheres
US20240009798A1 (en) 2022-07-11 2024-01-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical Mechanical Planarization Pad Having Polishing Layer with Multi-lobed Embedded Features

Family Cites Families (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1986849A (en) * 1931-02-26 1935-01-08 Pohl Theodor Abrading material and process for preparing the same
FR736216A (fr) * 1931-08-08 1932-11-19 Rhodiaseta Procédé pour l'encollage des fils et fibres en acétate ou autres dérivés organiques de la cellulose
US2701191A (en) 1949-02-02 1955-02-01 American Optical Corp Polishing pads
US2806772A (en) * 1954-09-15 1957-09-17 Electro Refractories & Abrasiv Abrasive bodies
US3100721A (en) 1961-02-21 1963-08-13 Du Pont Process for producing microporous films and coatings
US3067482A (en) 1958-07-03 1962-12-11 Du Pont Sheet material and process of making same
BE636018A (de) 1962-08-13 1900-01-01
US3377151A (en) * 1964-03-26 1968-04-09 Gen Foods Corp Method for making a cleansing aid
DE1694070B2 (de) 1966-08-17 1973-08-02 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung unbrennbarer schaumstoffe
US3857123A (en) * 1970-10-21 1974-12-31 Monsanto Co Apparatus for waxless polishing of thin wafers
US4421526A (en) * 1972-11-13 1983-12-20 Sherwood Research And Development Partnership Polyurethane foam cleaning pads and a process for their manufacture
USRE29808E (en) 1973-09-26 1978-10-24 Norddeutsche Schleifmittel-Indutrie Christiansen & Co. Hollow body grinding materials
NL162006C (nl) * 1973-09-26 Norddeutsche Schleifmittel Ind Slijpwerktuig.
US3959935A (en) 1975-03-18 1976-06-01 Interoptic Laboratories, Inc. Abrasive pad for grinding lenses
US4147766A (en) * 1976-06-09 1979-04-03 Armour Pharmaceutical Company Macrospherical particles of anti-perspirants
ZA77384B (en) * 1977-01-24 1978-08-30 Colgate Palmolive Co Improvements in and relating to soap or detergent cakes,tablets or the like
US4111667A (en) * 1977-04-15 1978-09-05 Norton Company Woven polyester backed flexible coated abrasive having microballoons in backsize
GB1575867A (en) * 1978-02-23 1980-10-01 Brueckner Trockentechnik Kg Article for preparation of critical surfaces
DE2809274A1 (de) * 1978-03-03 1979-09-13 Wacker Chemitronic Verfahren zur vergleichmaessigung des polierabtrages von scheiben beim polieren
JPS5551705A (en) 1978-10-03 1980-04-15 Agency Of Ind Science & Technol Production of nitridosulfate
US4358295A (en) * 1980-03-27 1982-11-09 Matsushita Electric Industrial Co., Ltd. Polishing method
SE439599B (sv) 1981-01-14 1985-06-24 Kema Nord Ab Sett att torka och expandera i vetska dispergerade, termoplastiska mikrosferer innehallande, flyktiga, flytande jesmedel
US4430155A (en) * 1981-01-21 1984-02-07 Armour Pharmaceutical Company Production of macrospherical particles
JPS58192757A (ja) * 1982-05-06 1983-11-10 Nippon Tokushu Kento Kk ポリビニルアセタ−ル系樹脂砥石の製造方法
US4459779A (en) * 1982-09-16 1984-07-17 International Business Machines Corporation Fixed abrasive grinding media
JPS5953290A (ja) 1982-09-21 1984-03-27 株式会社シマノ 自転車用ペダル
US4512113A (en) * 1982-09-23 1985-04-23 Budinger William D Workpiece holder for polishing operation
JPS59129668A (ja) 1983-01-13 1984-07-26 Noritake Co Ltd レジノイド砥石の製造方法
JPS59196328A (ja) 1983-04-20 1984-11-07 Achilles Corp 発泡成形用ゴム組成物
US4550003A (en) 1983-12-13 1985-10-29 Asahi Kasei Kogyo Kabushiki Kaisha Vinylidene chloride type resin expandable particles, foam particles, in-mold foam molding by use thereof and process for producing them
US4576612A (en) 1984-06-01 1986-03-18 Ferro Corporation Fixed ophthalmic lens polishing pad
US4581287A (en) * 1984-06-18 1986-04-08 Creative Products Resource Associates, Ltd. Composite reticulated foam-textile cleaning pad
US4543106A (en) * 1984-06-25 1985-09-24 Carborundum Abrasives Company Coated abrasive product containing hollow microspheres beneath the abrasive grain
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
JPS61214976A (ja) * 1985-03-18 1986-09-24 Nippon Telegr & Teleph Corp <Ntt> ポリシヤ
JPS6299072A (ja) 1985-10-22 1987-05-08 Sumitomo Electric Ind Ltd 半導体ウエ−ハの加工方法
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
JPS6333781A (ja) 1986-07-29 1988-02-13 三菱電機株式会社 画像表示装置
US4799939A (en) * 1987-02-26 1989-01-24 Minnesota Mining And Manufacturing Company Erodable agglomerates and abrasive products containing the same
JPS6471661A (en) * 1987-09-09 1989-03-16 Showa Denko Kk Mirror polishing method for semiconductor wafer
JPH01193166A (ja) * 1988-01-28 1989-08-03 Showa Denko Kk 半導体ウェハ鏡面研磨用パッド
JP2640352B2 (ja) * 1988-02-09 1997-08-13 東京磁気印刷株式会社 研磨材、研磨具及び研磨方法
JPH01210259A (ja) 1988-02-16 1989-08-23 Toshiba Corp 研磨装置
EP0348757B1 (de) * 1988-06-28 1995-01-04 Mitsubishi Materials Silicon Corporation Verfahren zur Polierung eines Halbleiter-Plättchens
JPH0236066A (ja) 1988-07-27 1990-02-06 Hitachi Ltd 研磨布および研磨装置
US5000761A (en) 1988-10-26 1991-03-19 Ferro Corporation Gel producing pad and improved method for surfacing and polishing lenses
JPH02232173A (ja) * 1989-03-02 1990-09-14 Rodeele Nitta Kk 研磨パッド
JP2832024B2 (ja) 1989-03-18 1998-12-02 キヤノン株式会社 符号伝送方法
US5156843A (en) 1989-03-20 1992-10-20 Advanced Polymer Systems, Inc. Fabric impregnated with functional substances for controlled release
US5177908A (en) * 1990-01-22 1993-01-12 Micron Technology, Inc. Polishing pad
US5234867A (en) * 1992-05-27 1993-08-10 Micron Technology, Inc. Method for planarizing semiconductor wafers with a non-circular polishing pad
US5020283A (en) * 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
US5104421B1 (en) * 1990-03-23 1993-11-16 Fujimi Abrasives Co.,Ltd. Polishing method of goods and abrasive pad therefor
US5081051A (en) * 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
US5078753A (en) 1990-10-09 1992-01-07 Minnesota Mining And Manufacturing Company Coated abrasive containing erodable agglomerates
JPH05146969A (ja) 1991-06-24 1993-06-15 Intel Corp 半導体基板上に形成された誘電体層を研磨する装置
US5197999A (en) * 1991-09-30 1993-03-30 National Semiconductor Corporation Polishing pad for planarization
US5527215A (en) * 1992-01-10 1996-06-18 Schlegel Corporation Foam buffing pad having a finishing surface with a splash reducing configuration
US5287663A (en) * 1992-01-21 1994-02-22 National Semiconductor Corporation Polishing pad and method for polishing semiconductor wafers
US5269821A (en) 1992-02-20 1993-12-14 Minnesota Mining And Manufacturing Company Coatable mixtures including erodable filler agglomerates, methods of preparing same, abrasive articles incorporating cured versions of same, and methods of making said articles
US5264010A (en) 1992-04-27 1993-11-23 Rodel, Inc. Compositions and methods for polishing and planarizing surfaces
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5329734A (en) * 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
US5795218A (en) * 1996-09-30 1998-08-18 Micron Technology, Inc. Polishing pad with elongated microcolumns
JP3925041B2 (ja) 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
JP3826702B2 (ja) 2000-10-24 2006-09-27 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
DE60228784D1 (de) 2001-04-25 2008-10-23 Jsr Corp Lichtduchlässiges Polierkissen für eine Halbleiterschleife
JP2003100682A (ja) 2001-09-25 2003-04-04 Jsr Corp 半導体ウエハ用研磨パッド
JP2003133270A (ja) 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
KR100669301B1 (ko) 2002-06-03 2007-01-16 제이에스알 가부시끼가이샤 연마 패드 및 복층형 연마 패드
TWI234503B (en) 2002-08-26 2005-06-21 Jsr Corp Composition for polishing pad and using this polishing pad
JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド

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EP0829328A3 (de) 1998-12-09
DE69332490D1 (de) 2002-12-19
DE69319435D1 (de) 1998-08-06
KR950703019A (ko) 1995-08-23
MY114512A (en) 2002-11-30
DE69319435T2 (de) 1999-02-25
US5900164A (en) 1999-05-04
JP2008238399A (ja) 2008-10-09
CN1059219C (zh) 2000-12-06
SG43335A1 (en) 1997-10-17
WO1994004599A1 (en) 1994-03-03
US5578362A (en) 1996-11-26
US20040224142A1 (en) 2004-11-11
TW264493B (de) 1995-12-01
EP0829328B1 (de) 2002-11-13
EP0656031B1 (de) 1998-07-01
KR100191227B1 (ko) 1999-06-15
AU4798493A (en) 1994-03-15
US6899611B2 (en) 2005-05-31
US20030068960A1 (en) 2003-04-10
JPH08500622A (ja) 1996-01-23
JP3013105B2 (ja) 2000-02-28
US6439989B1 (en) 2002-08-27
EP0656031A1 (de) 1995-06-07
EP0829328A2 (de) 1998-03-18
US6903021B2 (en) 2005-06-07
CN1082567A (zh) 1994-02-23
EP0656031A4 (de) 1995-07-26
US20050221741A1 (en) 2005-10-06

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