DE69401078D1 - Gedruckte Schaltung - Google Patents

Gedruckte Schaltung

Info

Publication number
DE69401078D1
DE69401078D1 DE69401078T DE69401078T DE69401078D1 DE 69401078 D1 DE69401078 D1 DE 69401078D1 DE 69401078 T DE69401078 T DE 69401078T DE 69401078 T DE69401078 T DE 69401078T DE 69401078 D1 DE69401078 D1 DE 69401078D1
Authority
DE
Germany
Prior art keywords
printed circuit
printed
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69401078T
Other languages
English (en)
Inventor
Jorge Enrique Muyshondt
Gary Arnold Parker
Bruce James Wilkie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69401078D1 publication Critical patent/DE69401078D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
DE69401078T 1993-03-05 1994-03-03 Gedruckte Schaltung Expired - Lifetime DE69401078D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/026,888 US5475606A (en) 1993-03-05 1993-03-05 Faraday cage for a printed circuit card

Publications (1)

Publication Number Publication Date
DE69401078D1 true DE69401078D1 (de) 1997-01-23

Family

ID=21834382

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69401078T Expired - Lifetime DE69401078D1 (de) 1993-03-05 1994-03-03 Gedruckte Schaltung

Country Status (4)

Country Link
US (3) US5475606A (de)
EP (1) EP0614331B1 (de)
JP (1) JP3194507B2 (de)
DE (1) DE69401078D1 (de)

Families Citing this family (157)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5768109A (en) * 1991-06-26 1998-06-16 Hughes Electronics Multi-layer circuit board and semiconductor flip chip connection
JPH07235775A (ja) * 1994-02-21 1995-09-05 Mitsubishi Electric Corp 多層プリント配線基板
US5758177A (en) * 1995-09-11 1998-05-26 Advanced Microsystems, Inc. Computer system having separate digital and analog system chips for improved performance
US5797028A (en) * 1995-09-11 1998-08-18 Advanced Micro Devices, Inc. Computer system having an improved digital and analog configuration
DE19536848A1 (de) * 1995-10-02 1997-04-03 Bosch Gmbh Robert Baugruppenträger für ein elektronisches Steuergerät mit signalverarbeitenden Bauelementen und schnell arbeitenden digitalen Bauelementen
US5682298A (en) * 1996-06-13 1997-10-28 Hewlett-Packard Company Balancing power distribution in a power supply system with redundant power sources
US6143990A (en) * 1996-06-25 2000-11-07 Fuji Xerox Co., Ltd. Printed wiring board with two ground planes connected by resistor
US7634529B2 (en) 1996-11-29 2009-12-15 Ellis Iii Frampton E Personal and server computers having microchips with multiple processing units and internal firewalls
US7506020B2 (en) 1996-11-29 2009-03-17 Frampton E Ellis Global network computers
US20050180095A1 (en) 1996-11-29 2005-08-18 Ellis Frampton E. Global network computers
US6725250B1 (en) 1996-11-29 2004-04-20 Ellis, Iii Frampton E. Global network computers
US7926097B2 (en) 1996-11-29 2011-04-12 Ellis Iii Frampton E Computer or microchip protected from the internet by internal hardware
US6167428A (en) 1996-11-29 2000-12-26 Ellis; Frampton E. Personal computer microprocessor firewalls for internet distributed processing
US8225003B2 (en) * 1996-11-29 2012-07-17 Ellis Iii Frampton E Computers and microchips with a portion protected by an internal hardware firewall
US7805756B2 (en) 1996-11-29 2010-09-28 Frampton E Ellis Microchips with inner firewalls, faraday cages, and/or photovoltaic cells
US8312529B2 (en) 1996-11-29 2012-11-13 Ellis Frampton E Global network computers
US6054758A (en) * 1996-12-18 2000-04-25 Texas Instruments Incorporated Differential pair geometry for integrated circuit chip packages
JPH10198778A (ja) * 1997-01-14 1998-07-31 Rohm Co Ltd Ｉｃカード
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US6738249B1 (en) 1997-04-08 2004-05-18 X2Y Attenuators, Llc Universal energy conditioning interposer with circuit architecture
US6603646B2 (en) 1997-04-08 2003-08-05 X2Y Attenuators, Llc Multi-functional energy conditioner
US6580595B2 (en) * 1997-04-08 2003-06-17 X2Y Attenuators, Llc Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US6509807B1 (en) * 1997-04-08 2003-01-21 X2Y Attenuators, Llc Energy conditioning circuit assembly
US7274549B2 (en) * 2000-12-15 2007-09-25 X2Y Attenuators, Llc Energy pathway arrangements for energy conditioning
US6687108B1 (en) 1997-04-08 2004-02-03 X2Y Attenuators, Llc Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial shielded energy pathways
US6650525B2 (en) 1997-04-08 2003-11-18 X2Y Attenuators, Llc Component carrier
US6018448A (en) 1997-04-08 2000-01-25 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US20030161086A1 (en) * 2000-07-18 2003-08-28 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US6636406B1 (en) 1997-04-08 2003-10-21 X2Y Attenuators, Llc Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning
US6373673B1 (en) 1997-04-08 2002-04-16 X2Y Attenuators, Llc Multi-functional energy conditioner
US6498710B1 (en) 1997-04-08 2002-12-24 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US6606011B2 (en) 1998-04-07 2003-08-12 X2Y Attenuators, Llc Energy conditioning circuit assembly
US6995983B1 (en) 1997-04-08 2006-02-07 X2Y Attenuators, Llc Component carrier
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US5901040A (en) * 1997-07-30 1999-05-04 Hewlett-Packard Company Heat sink and Faraday Cage assembly for a semiconductor module and a power converter
US6191945B1 (en) 1997-07-30 2001-02-20 Hewlett-Packard Company Cold plate arrangement for cooling processor and companion voltage regulator
US6084178A (en) * 1998-02-27 2000-07-04 Hewlett-Packard Company Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
US6072375A (en) * 1998-05-12 2000-06-06 Harris Corporation Waveguide with edge grounding
CN1180667C (zh) * 1998-07-20 2004-12-15 三星电子株式会社 无线电-电子部件
US6163233A (en) * 1998-07-30 2000-12-19 Harris Corporation Waveguide with signal track cross-over and variable features
US5926370A (en) * 1998-10-29 1999-07-20 Hewlett-Packard Company Method and apparatus for a modular integrated apparatus for multi-function components
US6282692B1 (en) * 1998-12-03 2001-08-28 International Business Machines Corporation Structure for improved capacitance and inductance calculation
US6198630B1 (en) 1999-01-20 2001-03-06 Hewlett-Packard Company Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
SE516087C2 (sv) * 1999-02-02 2001-11-19 Ericsson Telefon Ab L M Anordning vid ledningsbärare och förfaranden för tillverkning av sådana ledningsbärare
DE19926763A1 (de) * 1999-04-26 2000-11-16 Temic Telefunken Hochfrequenzt HF-Baugruppe mit Tuner und HF-Sendeempfänger
US6295631B1 (en) * 1999-09-13 2001-09-25 Compeq Manufacturing Company Limited Method for determining the compensation value of the width of a wire by measuring the resistance of the wire
JP2001102817A (ja) * 1999-09-29 2001-04-13 Nec Corp 高周波回路及び該高周波回路を用いたシールディドループ型磁界検出器
US6400015B1 (en) * 2000-03-31 2002-06-04 Intel Corporation Method of creating shielded structures to protect semiconductor devices
US6510058B1 (en) 2000-07-14 2003-01-21 Sensormatic Electronics Corporation Printed circuit board configuration having reduced EMC/EMI interference in electromechanical relay circuits
US6509640B1 (en) * 2000-09-29 2003-01-21 Intel Corporation Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction
AU1335602A (en) * 2000-10-17 2002-04-29 X2Y Attenuators Llc Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
US7193831B2 (en) * 2000-10-17 2007-03-20 X2Y Attenuators, Llc Energy pathway arrangement
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US8623709B1 (en) 2000-11-28 2014-01-07 Knowles Electronics, Llc Methods of manufacture of top port surface mount silicon condenser microphone packages
EP1821570B1 (de) * 2000-11-28 2017-02-08 Knowles Electronics, LLC Miniatursiliciumkondensatormikrofon und Herstellungsverfahren dafür
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7439616B2 (en) * 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
US6863149B2 (en) * 2000-12-12 2005-03-08 Japan Science And Technology Corporation Steering mechanism of electric car
US6489663B2 (en) 2001-01-02 2002-12-03 International Business Machines Corporation Spiral inductor semiconducting device with grounding strips and conducting vias
US6486534B1 (en) * 2001-02-16 2002-11-26 Ashvattha Semiconductor, Inc. Integrated circuit die having an interference shield
US6747879B2 (en) * 2001-02-28 2004-06-08 Andrew Corporation High power amplifier and chassis
US6760230B2 (en) * 2001-02-28 2004-07-06 Andrew Corporation Compact, high efficiency, high isolation power amplifier
US6515861B1 (en) * 2001-04-02 2003-02-04 Advanced Micro Devices, Inc. Method and apparatus for shielding electromagnetic emissions from an integrated circuit
US6740959B2 (en) * 2001-08-01 2004-05-25 International Business Machines Corporation EMI shielding for semiconductor chip carriers
WO2003035281A2 (en) * 2001-10-23 2003-05-01 Schindel David W Ultrasonic printed circuit board transducer
US7039102B2 (en) * 2002-01-24 2006-05-02 Broadcom Corporation Highly integrated asymmetric digital subscriber line (ADSL) circuit
US6653557B2 (en) 2002-02-27 2003-11-25 Jds Uniphase Corporation Faraday cage and ceramic walls for shielding EMI
GB0212141D0 (en) * 2002-05-27 2002-07-03 Sendo Int Ltd Audio ground plane
JP2004031389A (ja) * 2002-06-21 2004-01-29 Fujitsu Ltd 半導体回路設計方法、半導体回路設計装置、プログラム及び半導体装置
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
EP1432297A3 (de) * 2002-12-20 2005-08-10 Siemens Aktiengesellschaft Flachbaugruppe
US7180718B2 (en) * 2003-01-31 2007-02-20 X2Y Attenuators, Llc Shielded energy conditioner
US7016198B2 (en) * 2003-04-08 2006-03-21 Lexmark International, Inc. Printed circuit board having outer power planes
JP3781736B2 (ja) * 2003-05-09 2006-05-31 ローム株式会社 半導体装置及びこれを用いたオーディオ機器
TWI220787B (en) * 2003-10-24 2004-09-01 Asustek Comp Inc Electric device with electrostatic discharge protection structure thereof
TW595275B (en) * 2003-11-05 2004-06-21 Tatung Co Low noise printed circuit board
CN1890854A (zh) 2003-12-22 2007-01-03 X2Y艾泰钮埃特有限责任公司 内屏蔽式能量调节装置
US7383525B2 (en) * 2004-01-09 2008-06-03 Matsushita Electric Industrial Co., Ltd. Design review output apparatus, design review support apparatus, design review system, design review output method, and design review support method
JP4525099B2 (ja) * 2004-02-10 2010-08-18 船井電機株式会社 液晶表示装置
KR100635060B1 (ko) * 2004-03-09 2006-10-17 삼성에스디아이 주식회사 유기전계발광표시장치의 구동장치
JP2005276957A (ja) * 2004-03-23 2005-10-06 Fujitsu Ltd プリント基板
US8345433B2 (en) * 2004-07-08 2013-01-01 Avx Corporation Heterogeneous organic laminate stack ups for high frequency applications
JP2006032783A (ja) * 2004-07-20 2006-02-02 Hitachi Cable Ltd 電子部品実装構造及びそれを用いた光トランシーバ
TWI290449B (en) * 2004-11-03 2007-11-21 Tatung Co Multi-layer printed circuit with low noise
TWI255159B (en) * 2004-11-03 2006-05-11 Tatung Co Ltd Low-noise multilayer printed-circuit board (PCB)
US8256147B2 (en) 2004-11-22 2012-09-04 Frampton E. Eliis Devices with internal flexibility sipes, including siped chambers for footwear
KR100651559B1 (ko) * 2004-12-30 2006-11-29 삼성전기주식회사 잡음 특성이 개선된 고주파 신호 전송 선로
DE102005008514B4 (de) * 2005-02-24 2019-05-16 Tdk Corporation Mikrofonmembran und Mikrofon mit der Mikrofonmembran
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008511B4 (de) * 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
US7817397B2 (en) 2005-03-01 2010-10-19 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
GB2439862A (en) 2005-03-01 2008-01-09 X2Y Attenuators Llc Conditioner with coplanar conductors
US8959762B2 (en) 2005-08-08 2015-02-24 Rf Micro Devices, Inc. Method of manufacturing an electronic module
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
DE102005053767B4 (de) * 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
US8399968B2 (en) * 2005-11-18 2013-03-19 Stats Chippac Ltd. Non-leaded integrated circuit package system
WO2007079263A2 (en) * 2005-12-30 2007-07-12 Vogley Wilbur C Method and apparatus for eye-safe transmittal of electrical power in vehicles using white light via plastic optical fiber
EP1991996A1 (de) 2006-03-07 2008-11-19 X2Y Attenuators, L.L.C. Energiekonditionierungsstrukturen
US8003443B2 (en) * 2006-03-10 2011-08-23 Stats Chippac Ltd. Non-leaded integrated circuit package system with multiple ground sites
TW200743433A (en) * 2006-05-09 2007-11-16 Mitac Int Corp Circuit board with EMI isolation and layout method thereof
US8062934B2 (en) * 2006-06-22 2011-11-22 Stats Chippac Ltd. Integrated circuit package system with ground bonds
US7495930B2 (en) * 2006-06-26 2009-02-24 Siemens Medical Solutions Usa, Inc. Circuit board structure for high density processing of analog and digital signals
US7925166B2 (en) * 2006-07-19 2011-04-12 Vogley Wilbur C Method and apparatus for phostonic stack system for vehicle control/sense
TW200810651A (en) * 2006-08-09 2008-02-16 Tatung Co Ltd Low-noise multilayered PCB
US20080042223A1 (en) * 2006-08-17 2008-02-21 Lu-Lee Liao Microelectromechanical system package and method for making the same
US20080075308A1 (en) * 2006-08-30 2008-03-27 Wen-Chieh Wei Silicon condenser microphone
US20080083957A1 (en) * 2006-10-05 2008-04-10 Wen-Chieh Wei Micro-electromechanical system package
US7894622B2 (en) 2006-10-13 2011-02-22 Merry Electronics Co., Ltd. Microphone
US20080170378A1 (en) * 2007-01-17 2008-07-17 Cheng-Yi Ou-Yang Circuit structure having independent ground plane layouts implemented in circuit board
KR100838246B1 (ko) * 2007-06-22 2008-06-17 삼성전기주식회사 전자기 밴드갭 구조물이 구비된 인쇄회로기판
JP5173298B2 (ja) * 2007-07-25 2013-04-03 キヤノン株式会社 プリント配線板およびそれを用いた電子機器
US8125796B2 (en) 2007-11-21 2012-02-28 Frampton E. Ellis Devices with faraday cages and internal flexibility sipes
US8284115B2 (en) 2008-02-29 2012-10-09 Sierra Wireless, Inc. Coupling and counterpoise apparatus for radio communication device
JP5241358B2 (ja) * 2008-07-11 2013-07-17 キヤノン株式会社 プリント基板設計支援プログラム、プリント基板設計支援方法及びプリント基板設計支援装置
US9179235B2 (en) 2008-11-07 2015-11-03 Adobe Systems Incorporated Meta-parameter control for digital audio data
JP2010135374A (ja) * 2008-12-02 2010-06-17 Sanyo Electric Co Ltd 多層プリント配線基板
US8749032B2 (en) * 2008-12-05 2014-06-10 Sige Semiconductor, Inc. Integrated circuit with improved transmission line structure and electromagnetic shielding between radio frequency circuit paths
EP2209172A1 (de) * 2009-01-15 2010-07-21 3M Innovative Properties Company Telekommunikationsbuchse mit einer Mehrschicht-Leiterplatte
US8072056B2 (en) 2009-06-10 2011-12-06 Medtronic, Inc. Apparatus for restricting moisture ingress
US8172760B2 (en) 2009-06-18 2012-05-08 Medtronic, Inc. Medical device encapsulated within bonded dies
KR101072591B1 (ko) * 2009-08-10 2011-10-11 삼성전기주식회사 Ｅｍｉ 노이즈 저감 인쇄회로기판
US9210799B2 (en) * 2009-09-17 2015-12-08 Hewlett-Packard Development Company, L.P. Apparatus and method for reproducing an audio signal
CN102123559B (zh) * 2010-01-07 2012-09-19 宏碁股份有限公司 通讯装置及其电路板结构
US8429735B2 (en) 2010-01-26 2013-04-23 Frampton E. Ellis Method of using one or more secure private networks to actively configure the hardware of a computer or microchip
JP5126286B2 (ja) * 2010-05-20 2013-01-23 株式会社村田製作所 積層型高周波モジュール
TW201206256A (en) * 2010-07-22 2012-02-01 Hon Hai Prec Ind Co Ltd Printed circuit board
KR101179399B1 (ko) * 2010-10-04 2012-09-04 삼성전기주식회사 크로스토크를 저감하기 위한 인쇄회로기판
US8666505B2 (en) 2010-10-26 2014-03-04 Medtronic, Inc. Wafer-scale package including power source
US8903047B1 (en) 2010-11-02 2014-12-02 Moxtek, Inc. High voltage circuit with arc protection
US8424388B2 (en) 2011-01-28 2013-04-23 Medtronic, Inc. Implantable capacitive pressure sensor apparatus and methods regarding same
US8835226B2 (en) 2011-02-25 2014-09-16 Rf Micro Devices, Inc. Connection using conductive vias
US9374643B2 (en) 2011-11-04 2016-06-21 Knowles Electronics, Llc Embedded dielectric as a barrier in an acoustic device and method of manufacture
CN102539943B (zh) * 2011-12-20 2014-05-07 北京卫星环境工程研究所 介质内部充电电荷的测量探头结构
US8803005B2 (en) * 2012-04-20 2014-08-12 General Electric Company Electromagnetic interference blocking cabinet with integrated input/output panel
US8974077B2 (en) 2012-07-30 2015-03-10 Ultravision Technologies, Llc Heat sink for LED light source
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US9807890B2 (en) * 2013-05-31 2017-10-31 Qorvo Us, Inc. Electronic modules having grounded electromagnetic shields
DE102013106353B4 (de) * 2013-06-18 2018-06-28 Tdk Corporation Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
US9457743B2 (en) 2013-09-06 2016-10-04 Johnson Controls Technology Company Battery terminal post system and method of manufacture
US9241432B1 (en) 2013-09-27 2016-01-19 The United States Of America, As Represented By The Secretary Of The Navy Seawater faraday cage
US9651585B2 (en) * 2013-12-18 2017-05-16 National Instruments Corporation Via layout techniques for improved low current measurements
US9195281B2 (en) 2013-12-31 2015-11-24 Ultravision Technologies, Llc System and method for a modular multi-panel display
US9510439B2 (en) 2014-03-13 2016-11-29 Honeywell International Inc. Fault containment routing
US9554214B2 (en) * 2014-10-02 2017-01-24 Knowles Electronics, Llc Signal processing platform in an acoustic capture device
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
US9790085B1 (en) 2016-06-16 2017-10-17 Nxp Usa, Inc. Actively preventing charge induced leakage of semiconductor devices
WO2018052465A1 (en) * 2016-09-15 2018-03-22 Google Llc Multilayer printed circuit board for reducing quantum signal crosstalk
CN107300956B (zh) * 2017-07-03 2020-05-19 英业达科技有限公司 噪声抑制组件及具有此噪声抑制组件的主机板
US11127689B2 (en) 2018-06-01 2021-09-21 Qorvo Us, Inc. Segmented shielding using wirebonds
US11219144B2 (en) 2018-06-28 2022-01-04 Qorvo Us, Inc. Electromagnetic shields for sub-modules
US11114363B2 (en) 2018-12-20 2021-09-07 Qorvo Us, Inc. Electronic package arrangements and related methods
US11515282B2 (en) 2019-05-21 2022-11-29 Qorvo Us, Inc. Electromagnetic shields with bonding wires for sub-modules
US11523502B2 (en) 2020-05-06 2022-12-06 Veea Inc. Method and procedure for miniaturing a multi-layer PCB
CN114980476A (zh) * 2021-02-18 2022-08-30 十铨科技股份有限公司 耐用型计算机存储装置
CN117119348A (zh) * 2022-09-05 2023-11-24 深圳市Tcl云创科技有限公司 音频电路、电路板及电子设备

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3848174A (en) * 1973-05-21 1974-11-12 Radiation Dynamics High voltage solid-state rectifier system
US4019141A (en) * 1976-03-22 1977-04-19 Motorola, Inc. Preselector cavity arrangement and RF selectivity assembly
DE3118298A1 (de) * 1981-05-08 1982-12-02 Gao Ges Automation Org Ausweiskarte mit eingelagertem ic-baustein
US4593813A (en) * 1985-04-08 1986-06-10 Powel Stephen S Protective container for assembled printed circuit boards
JPS6230400U (de) * 1985-08-07 1987-02-24
CA1286724C (en) * 1986-03-27 1991-07-23 Richard Ralph Goulette Method and apparatus for monitoring electromagnetic emission levels
DE3639402A1 (de) * 1986-11-18 1988-05-19 Siemens Ag Verfahren zur herstellung einer mehrschichtigen leiterplatte sowie danach hergestellte leiterplatte
FR2615319B1 (fr) * 1987-05-15 1989-07-07 Bull Sa Transformateur a fort couplage adapte a un circuit d'alimentation a decoupage et circuit d'alimentation a decoupage comportant un tel transformateur
JPS64399U (de) * 1987-06-19 1989-01-05
US5033032A (en) * 1988-10-05 1991-07-16 Microsonics, Inc. Air-gap hydrophone
US4922059A (en) * 1988-12-29 1990-05-01 Motorola, Inc. Origami composite EMI/TEMPEST proof electronics module
JPH02187093A (ja) * 1989-01-13 1990-07-23 Toshiba Corp 印刷配線板
JPH02198198A (ja) * 1989-01-27 1990-08-06 Cmk Corp 電磁波シールド層を備えるプリント配線板
JP2631544B2 (ja) * 1989-01-27 1997-07-16 日本シイエムケイ株式会社 プリント配線板
US4942400A (en) * 1990-02-09 1990-07-17 General Electric Company Analog to digital converter with multilayer printed circuit mounting
JPH07109946B2 (ja) * 1990-05-08 1995-11-22 松下電器産業株式会社 プリント配線板
US5079845A (en) * 1990-08-31 1992-01-14 Futurity Technologies, Inc. Dual readout analog/digital magnetic compass
US5262594A (en) * 1990-10-12 1993-11-16 Compaq Computer Corporation Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same
JP2777747B2 (ja) * 1990-11-26 1998-07-23 東亞合成株式会社 電磁波シールド層を有するプリント抵抗器内蔵多層プリント回路板
JPH04261097A (ja) * 1991-01-25 1992-09-17 Mitsubishi Electric Corp 多層プリント基板
JPH04313300A (ja) * 1991-04-10 1992-11-05 Sumitomo Electric Ind Ltd フレキシブルプリント配線板
US5165055A (en) * 1991-06-28 1992-11-17 Digital Equipment Corporation Method and apparatus for a PCB and I/O integrated electromagnetic containment
US5278720A (en) * 1991-09-20 1994-01-11 Atlantic Scientific Corp. Printed circuit-mounted surge suppressor matched to characteristic impedance of high frequency transmission line
US5247735A (en) * 1991-12-18 1993-09-28 International Business Machines Corporation Electrical wire deletion
US5315069A (en) * 1992-10-02 1994-05-24 Compaq Computer Corp. Electromagnetic radiation reduction technique using grounded conductive traces circumscribing internal planes of printed circuit boards

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US5587920A (en) 1996-12-24
US5475606A (en) 1995-12-12
US5592391A (en) 1997-01-07
EP0614331B1 (de) 1996-12-11
JP3194507B2 (ja) 2001-07-30
JPH06274246A (ja) 1994-09-30
EP0614331A3 (de) 1995-05-10
EP0614331A2 (de) 1994-09-07

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