DE69401174D1 - Sende-Empfängermodul mit voneinander elektromagnetisch isolierten Sende-Empfängerbereichen - Google Patents

Sende-Empfängermodul mit voneinander elektromagnetisch isolierten Sende-Empfängerbereichen

Info

Publication number
DE69401174D1
DE69401174D1 DE69401174T DE69401174T DE69401174D1 DE 69401174 D1 DE69401174 D1 DE 69401174D1 DE 69401174 T DE69401174 T DE 69401174T DE 69401174 T DE69401174 T DE 69401174T DE 69401174 D1 DE69401174 D1 DE 69401174D1
Authority
DE
Germany
Prior art keywords
transceiver
areas
electromagnetically isolated
mutually electromagnetically
transceiver module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69401174T
Other languages
English (en)
Other versions
DE69401174T2 (de
Inventor
Tetsuro Hiraki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69401174D1 publication Critical patent/DE69401174D1/de
Publication of DE69401174T2 publication Critical patent/DE69401174T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
DE69401174T 1993-07-16 1994-07-14 Sende-Empfängermodul mit voneinander elektromagnetisch isolierten Sende-Empfängerbereichen Expired - Fee Related DE69401174T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5199279A JPH0738271A (ja) 1993-07-16 1993-07-16 送受信回路モジュール

Publications (2)

Publication Number Publication Date
DE69401174D1 true DE69401174D1 (de) 1997-01-30
DE69401174T2 DE69401174T2 (de) 1997-05-15

Family

ID=16405153

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69401174T Expired - Fee Related DE69401174T2 (de) 1993-07-16 1994-07-14 Sende-Empfängermodul mit voneinander elektromagnetisch isolierten Sende-Empfängerbereichen

Country Status (6)

Country Link
US (1) US5628058A (de)
EP (1) EP0634891B1 (de)
JP (1) JPH0738271A (de)
KR (2) KR950004763A (de)
DE (1) DE69401174T2 (de)
TW (1) TW239241B (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5794159A (en) * 1996-08-07 1998-08-11 Nokia Mobile Phones Limited Dual band mobile station employing cross-connected transmitter and receiver circuits
US5903829A (en) * 1996-12-06 1999-05-11 Adc Telecommunications, Inc. RF equalizer module
US6049709A (en) * 1996-12-06 2000-04-11 Adc Telecommunications, Inc. RF circuit module
US6137688A (en) 1996-12-31 2000-10-24 Intel Corporation Apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply
JP3373753B2 (ja) * 1997-03-28 2003-02-04 株式会社東芝 超高周波帯無線通信装置
US5966648A (en) * 1997-12-10 1999-10-12 Adc Telecommunications, Inc RF circuit module and chassis including amplifier
EP1049260A3 (de) * 1999-04-26 2003-07-30 Microtune GmbH & Co KG HF-Baugruppe mit Tuner und HF-Sendeempfänger
DE19926763A1 (de) * 1999-04-26 2000-11-16 Temic Telefunken Hochfrequenzt HF-Baugruppe mit Tuner und HF-Sendeempfänger
US6643501B1 (en) * 1999-12-02 2003-11-04 Sierra Wireless, Inc. Flexible ferrite gasket for receiver second image protection
US6700638B1 (en) * 2000-01-31 2004-03-02 Nokia Mobile Phones Ltd. Temperature stabilizer for liquid crystal displays (LCD)
JP3875458B2 (ja) * 2000-06-30 2007-01-31 株式会社東芝 送受信一体型高周波装置
JP2002291019A (ja) * 2001-03-23 2002-10-04 Japan Radio Co Ltd 移動体用データ通信装置
US7671803B2 (en) * 2003-07-25 2010-03-02 Hewlett-Packard Development Company, L.P. Wireless communication system
JP4944024B2 (ja) * 2006-03-22 2012-05-30 三菱電機株式会社 送受信装置
US20100203922A1 (en) * 2009-02-10 2010-08-12 Knecht Thomas A Time Division Duplex Front End Module
JP2012527185A (ja) * 2009-05-15 2012-11-01 シーティーエス・コーポレーション 高性能ＲＦＲｘモジュール
US20140204539A1 (en) * 2013-01-24 2014-07-24 Bradley Dean Loomis Package and tray system for interchanging device components
US9439307B2 (en) * 2014-02-06 2016-09-06 Tektronix, Inc. Laminated punched sheet metal electronic enclosure/shield with integrated gaskets
TWI612638B (zh) * 2017-01-25 2018-01-21 矽品精密工業股份有限公司 電子封裝件及其製法
US20180228016A1 (en) * 2017-02-09 2018-08-09 Qualcomm Incorporated Wire-bond cage in conformal shielding
CN107592126B (zh) * 2017-09-18 2023-03-28 贵州航天天马机电科技有限公司 一种射频收发信道单元
CN110896315A (zh) 2018-09-12 2020-03-20 宁德时代新能源科技股份有限公司 无线射频通信系统
US10879191B2 (en) 2019-01-07 2020-12-29 Qualcomm Incorporated Conformal shielding for solder ball array

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO851937L (no) * 1984-05-24 1985-11-25 Siemens Ag Flat kapsel for radioapparat.
JP2546347B2 (ja) * 1988-08-15 1996-10-23 日本電気株式会社 無線送受信装置
AU5365890A (en) * 1989-04-20 1990-10-25 Nec Corporation Miniature mobile radio communication equipment having a shield structure
US5107404A (en) * 1989-09-14 1992-04-21 Astec International Ltd. Circuit board assembly for a cellular telephone system or the like
JPH04160926A (ja) * 1990-10-25 1992-06-04 Sony Corp 送受信装置
JP2825670B2 (ja) * 1990-12-14 1998-11-18 富士通株式会社 高周波回路装置のシールド構造
FR2674078B1 (fr) * 1991-03-12 1994-10-07 Thomson Trt Defense Emetteur-recepteur hyperfrequence utilisant la technique des circuits imprimes multicouches.
DE9109072U1 (de) * 1991-07-23 1991-10-24 Siemens Ag, 8000 Muenchen, De
DE69217147T2 (de) * 1991-09-04 1997-06-05 Nec Corp Funksendeempfänger

Also Published As

Publication number Publication date
TW239241B (de) 1995-01-21
KR19990011623U (ko) 1999-03-25
JPH0738271A (ja) 1995-02-07
DE69401174T2 (de) 1997-05-15
KR200156351Y1 (ko) 1999-09-01
US5628058A (en) 1997-05-06
EP0634891B1 (de) 1996-12-18
EP0634891A1 (de) 1995-01-18
KR950004763A (ko) 1995-02-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee