DE69406964D1 - Verbinden von Schichten einer lichtemittierenden Diode mit einem Substrat - Google Patents

Verbinden von Schichten einer lichtemittierenden Diode mit einem Substrat

Info

Publication number
DE69406964D1
DE69406964D1 DE69406964T DE69406964T DE69406964D1 DE 69406964 D1 DE69406964 D1 DE 69406964D1 DE 69406964 T DE69406964 T DE 69406964T DE 69406964 T DE69406964 T DE 69406964T DE 69406964 D1 DE69406964 D1 DE 69406964D1
Authority
DE
Germany
Prior art keywords
substrate
light emitting
emitting diode
bonding layers
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69406964T
Other languages
English (en)
Other versions
DE69406964T2 (de
Inventor
Fred A Kish
Frank M Steranka
Dennis C Defever
Virginia M Robbins
John Uebbing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumileds LLC
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=21889110&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69406964(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE69406964D1 publication Critical patent/DE69406964D1/de
Application granted granted Critical
Publication of DE69406964T2 publication Critical patent/DE69406964T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0083—Processes for devices with an active region comprising only II-VI compounds
    • H01L33/0087—Processes for devices with an active region comprising only II-VI compounds with a substrate not being a II-VI compound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/14—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
    • H01L33/145—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure with a current-blocking structure
DE69406964T 1993-03-19 1994-01-21 Verbinden von Schichten einer lichtemittierenden Diode mit einem Substrat Expired - Lifetime DE69406964T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/036,532 US5376580A (en) 1993-03-19 1993-03-19 Wafer bonding of light emitting diode layers

Publications (2)

Publication Number Publication Date
DE69406964D1 true DE69406964D1 (de) 1998-01-08
DE69406964T2 DE69406964T2 (de) 1998-06-04

Family

ID=21889110

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69406964T Expired - Lifetime DE69406964T2 (de) 1993-03-19 1994-01-21 Verbinden von Schichten einer lichtemittierenden Diode mit einem Substrat
DE69432426T Expired - Lifetime DE69432426T2 (de) 1993-03-19 1994-01-21 Verbinden von Schichten einer lichtemittierenden Diode

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69432426T Expired - Lifetime DE69432426T2 (de) 1993-03-19 1994-01-21 Verbinden von Schichten einer lichtemittierenden Diode

Country Status (6)

Country Link
US (2) US5376580A (de)
EP (4) EP0730311A3 (de)
JP (4) JP3532953B2 (de)
KR (4) KR100338180B1 (de)
DE (2) DE69406964T2 (de)
TW (1) TW280039B (de)

Families Citing this family (349)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5376580A (en) * 1993-03-19 1994-12-27 Hewlett-Packard Company Wafer bonding of light emitting diode layers
JP2576692B2 (ja) * 1993-07-14 1997-01-29 日本電気株式会社 波長多重用光デバイスの製造方法
US5639674A (en) * 1994-03-14 1997-06-17 Kabushiki Kaisha Toshiba Semiconductor light-emitting element and method for manufacturing therefor
JP3318811B2 (ja) * 1994-12-29 2002-08-26 ソニー株式会社 半導体発光素子のパッケージ及びその製造方法
US6277696B1 (en) 1995-06-27 2001-08-21 Hewlett-Packard Company Surface emitting laser using two wafer bonded mirrors
DE19629920B4 (de) * 1995-08-10 2006-02-02 LumiLeds Lighting, U.S., LLC, San Jose Licht-emittierende Diode mit einem nicht-absorbierenden verteilten Braggreflektor
US5869849A (en) * 1995-10-05 1999-02-09 Industry Technology Research Institute Light-emitting diodes with high illumination
KR0165467B1 (ko) * 1995-10-31 1999-02-01 김광호 웨이퍼 디본더 및 이를 이용한 웨이퍼 디본딩법
US5724376A (en) * 1995-11-30 1998-03-03 Hewlett-Packard Company Transparent substrate vertical cavity surface emitting lasers fabricated by semiconductor wafer bonding
GB2347558B (en) * 1995-11-30 2000-11-15 Hewlett Packard Co Vertical cavity surface emitting lasers
JPH09167877A (ja) * 1995-12-15 1997-06-24 Furukawa Electric Co Ltd:The 半導体レーザ装置及びその製造方法
US5917202A (en) * 1995-12-21 1999-06-29 Hewlett-Packard Company Highly reflective contacts for light emitting semiconductor devices
JP2743901B2 (ja) * 1996-01-12 1998-04-28 日本電気株式会社 窒化ガリウムの結晶成長方法
US5977604A (en) 1996-03-08 1999-11-02 The Regents Of The University Of California Buried layer in a semiconductor formed by bonding
SE514380C2 (sv) 1996-03-29 2001-02-19 Sture Pettersson Integrerad halvledardetektorteleskop med låg energitröskel
JPH09283798A (ja) * 1996-04-19 1997-10-31 Rohm Co Ltd 半導体発光素子およびその製法
US6074892A (en) 1996-05-07 2000-06-13 Ciena Corporation Semiconductor hetero-interface photodetector
US5680495A (en) * 1996-07-12 1997-10-21 Bloom; Cary Fiber optic device sealed by compressed metal seals and method for making the same
JP3548654B2 (ja) 1996-09-08 2004-07-28 豊田合成株式会社 半導体発光素子
FR2753577B1 (fr) * 1996-09-13 1999-01-08 Alsthom Cge Alcatel Procede de fabrication d'un composant optoelectronique a semiconducteur et composant et matrice de composants fabriques selon ce procede
WO1998054764A1 (de) * 1997-05-27 1998-12-03 Osram Opto Semiconductors Gmbh & Co. Ohg Verfahren zur herstellung eines lichtemittierenden bauelementes
US6229160B1 (en) 1997-06-03 2001-05-08 Lumileds Lighting, U.S., Llc Light extraction from a semiconductor light-emitting device via chip shaping
US6784463B2 (en) * 1997-06-03 2004-08-31 Lumileds Lighting U.S., Llc III-Phospide and III-Arsenide flip chip light-emitting devices
EP0886326A3 (de) * 1997-06-06 1999-11-24 Hewlett-Packard Company Separate Loch-Injektionsstruktur um die Zuverlässigkeit von lichtemittierenden Halbleiterbauelementen zu erhöhen
US7365369B2 (en) 1997-07-25 2008-04-29 Nichia Corporation Nitride semiconductor device
JPH11154774A (ja) * 1997-08-05 1999-06-08 Canon Inc 面発光半導体デバイスの製造方法、この方法によって製造された面発光半導体デバイス及びこのデバイスを用いた表示装置
US5886401A (en) * 1997-09-02 1999-03-23 General Electric Company Structure and fabrication method for interconnecting light emitting diodes with metallization extending through vias in a polymer film overlying the light emitting diodes
EP2169733B1 (de) * 1997-09-29 2017-07-19 OSRAM Opto Semiconductors GmbH Halbleiterlichtquelle
US6015719A (en) * 1997-10-24 2000-01-18 Hewlett-Packard Company Transparent substrate light emitting diodes with directed light output
US6633120B2 (en) 1998-11-19 2003-10-14 Unisplay S.A. LED lamps
US8587020B2 (en) 1997-11-19 2013-11-19 Epistar Corporation LED lamps
GB2366074A (en) * 2000-02-15 2002-02-27 Hassan Paddy Abdel Salam LED light source with two vertically-stacked LEDs of different colours
US6071795A (en) * 1998-01-23 2000-06-06 The Regents Of The University Of California Separation of thin films from transparent substrates by selective optical processing
US6153495A (en) * 1998-03-09 2000-11-28 Intersil Corporation Advanced methods for making semiconductor devices by low temperature direct bonding
JP4126749B2 (ja) * 1998-04-22 2008-07-30 ソニー株式会社 半導体装置の製造方法
US6888175B1 (en) 1998-05-29 2005-05-03 Massachusetts Institute Of Technology Compound semiconductor structure with lattice and polarity matched heteroepitaxial layers
US20010020703A1 (en) 1998-07-24 2001-09-13 Nathan F. Gardner Algainp light emitting devices with thin active layers
DE19902750A1 (de) * 1999-01-25 2000-08-03 Osram Opto Semiconductors Gmbh Halbleiterbauelement zur Erzeugung von mischfarbiger elektromagnetischer Strahlung
US6280523B1 (en) * 1999-02-05 2001-08-28 Lumileds Lighting, U.S., Llc Thickness tailoring of wafer bonded AlxGayInzN structures by laser melting
US6320206B1 (en) * 1999-02-05 2001-11-20 Lumileds Lighting, U.S., Llc Light emitting devices having wafer bonded aluminum gallium indium nitride structures and mirror stacks
JP3770014B2 (ja) 1999-02-09 2006-04-26 日亜化学工業株式会社 窒化物半導体素子
WO2000052796A1 (fr) * 1999-03-04 2000-09-08 Nichia Corporation Element de laser semiconducteur au nitrure
AU4557300A (en) 1999-04-27 2000-11-10 Karandashov, Sergey Radiation source
US6258699B1 (en) 1999-05-10 2001-07-10 Visual Photonics Epitaxy Co., Ltd. Light emitting diode with a permanent subtrate of transparent glass or quartz and the method for manufacturing the same
TW437104B (en) * 1999-05-25 2001-05-28 Wang Tien Yang Semiconductor light-emitting device and method for manufacturing the same
US6133589A (en) * 1999-06-08 2000-10-17 Lumileds Lighting, U.S., Llc AlGaInN-based LED having thick epitaxial layer for improved light extraction
DE60042187D1 (de) * 1999-06-09 2009-06-25 Toshiba Kawasaki Kk Bond-typ Halbleitersubstrat, lichtemittierendes Halbleiterbauelement und Herstellungsverfahren
US6803603B1 (en) * 1999-06-23 2004-10-12 Kabushiki Kaisha Toshiba Semiconductor light-emitting element
FR2796212B1 (fr) * 1999-07-07 2001-08-31 Commissariat Energie Atomique Dispositif optique a semiconducteur, a cavite resonante accordable en longueur d'onde, application a la modulation d'une intensite lumineuse
WO2001006546A2 (en) 1999-07-16 2001-01-25 Massachusetts Institute Of Technology Silicon on iii-v semiconductor bonding for monolithic optoelectronic integration
US6287882B1 (en) 1999-10-04 2001-09-11 Visual Photonics Epitaxy Co., Ltd. Light emitting diode with a metal-coated reflective permanent substrate and the method for manufacturing the same
US6492661B1 (en) 1999-11-04 2002-12-10 Fen-Ren Chien Light emitting semiconductor device having reflection layer structure
US20020068373A1 (en) * 2000-02-16 2002-06-06 Nova Crystals, Inc. Method for fabricating light emitting diodes
DE10008583A1 (de) 2000-02-24 2001-09-13 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optisch transparenten Substrates und Verfahren zum Herstellen eines lichtemittierenden Halbleiterchips
DE10017336C2 (de) * 2000-04-07 2002-05-16 Vishay Semiconductor Gmbh verfahren zur Herstellung von strahlungsemittierenden Halbleiter-Wafern
DE10017337C2 (de) * 2000-04-07 2002-04-04 Vishay Semiconductor Gmbh Verfahren zum Herstellen lichtaussendender Halbleiterbauelemente
EP1277241B1 (de) * 2000-04-26 2017-12-13 OSRAM Opto Semiconductors GmbH Lumineszenzdiodenchip auf der basis von gan
CN1292494C (zh) * 2000-04-26 2006-12-27 奥斯兰姆奥普托半导体有限责任公司 发光半导体元件及其制造方法
DE10051465A1 (de) * 2000-10-17 2002-05-02 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Halbleiterbauelements auf GaN-Basis
TWI292227B (en) 2000-05-26 2008-01-01 Osram Opto Semiconductors Gmbh Light-emitting-dioed-chip with a light-emitting-epitaxy-layer-series based on gan
US6420732B1 (en) 2000-06-26 2002-07-16 Luxnet Corporation Light emitting diode of improved current blocking and light extraction structure
KR100639199B1 (ko) * 2000-06-28 2006-10-31 주식회사 하이닉스반도체 완전 공핍형 에스오아이 소자의 제조방법
US6274463B1 (en) 2000-07-31 2001-08-14 Hewlett-Packard Company Fabrication of a photoconductive or a cathoconductive device using lateral solid overgrowth method
US20020017652A1 (en) * 2000-08-08 2002-02-14 Stefan Illek Semiconductor chip for optoelectronics
US7547921B2 (en) * 2000-08-08 2009-06-16 Osram Opto Semiconductors Gmbh Semiconductor chip for optoelectronics
DE10040448A1 (de) * 2000-08-18 2002-03-07 Osram Opto Semiconductors Gmbh Halbleiterchip und Verfahren zu dessen Herstellung
US7053419B1 (en) 2000-09-12 2006-05-30 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
US7064355B2 (en) * 2000-09-12 2006-06-20 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
JP2002141556A (ja) * 2000-09-12 2002-05-17 Lumileds Lighting Us Llc 改良された光抽出効果を有する発光ダイオード
JP4091261B2 (ja) * 2000-10-31 2008-05-28 株式会社東芝 半導体発光素子及びその製造方法
US6525335B1 (en) * 2000-11-06 2003-02-25 Lumileds Lighting, U.S., Llc Light emitting semiconductor devices including wafer bonded heterostructures
TW474034B (en) * 2000-11-07 2002-01-21 United Epitaxy Co Ltd LED and the manufacturing method thereof
US8507361B2 (en) * 2000-11-27 2013-08-13 Soitec Fabrication of substrates with a useful layer of monocrystalline semiconductor material
US7065124B2 (en) 2000-11-28 2006-06-20 Finlsar Corporation Electron affinity engineered VCSELs
US6905900B1 (en) 2000-11-28 2005-06-14 Finisar Corporation Versatile method and system for single mode VCSELs
TW493286B (en) * 2001-02-06 2002-07-01 United Epitaxy Co Ltd Light-emitting diode and the manufacturing method thereof
JP2002324919A (ja) 2001-02-26 2002-11-08 Sharp Corp 発光ダイオードおよびその製造方法
US6468824B2 (en) * 2001-03-22 2002-10-22 Uni Light Technology Inc. Method for forming a semiconductor device having a metallic substrate
US6987613B2 (en) * 2001-03-30 2006-01-17 Lumileds Lighting U.S., Llc Forming an optical element on the surface of a light emitting device for improved light extraction
KR100482174B1 (ko) * 2001-08-08 2005-04-13 삼성전기주식회사 기판제거 기술을 이용한 GaN계 LED 제작 방법
TW518771B (en) * 2001-09-13 2003-01-21 United Epitaxy Co Ltd LED and the manufacturing method thereof
US6875268B2 (en) * 2001-09-26 2005-04-05 Hrl Laboratories, Llc Method of improving a surface of a substrate for bonding
ATE525755T1 (de) * 2001-10-12 2011-10-15 Nichia Corp Lichtemittierendes bauelement und verfahren zu seiner herstellung
AU2003207287B2 (en) * 2002-01-28 2007-12-13 Nichia Corporation Nitride semiconductor device having support substrate and its manufacturing method
US6658041B2 (en) 2002-03-20 2003-12-02 Agilent Technologies, Inc. Wafer bonded vertical cavity surface emitting laser systems
US20030189215A1 (en) 2002-04-09 2003-10-09 Jong-Lam Lee Method of fabricating vertical structure leds
US20030198795A1 (en) * 2002-04-17 2003-10-23 Grant William K. Modular material design system and method
US6885781B2 (en) * 2002-05-03 2005-04-26 Fujitsu Limited Thin film electro-optical deflector device and a method of fabrication of such a device
JP2006324685A (ja) * 2002-07-08 2006-11-30 Nichia Chem Ind Ltd 窒化物半導体素子の製造方法及び窒化物半導体素子
KR101030068B1 (ko) 2002-07-08 2011-04-19 니치아 카가쿠 고교 가부시키가이샤 질화물 반도체 소자의 제조방법 및 질화물 반도체 소자
US7928455B2 (en) * 2002-07-15 2011-04-19 Epistar Corporation Semiconductor light-emitting device and method for forming the same
TW567618B (en) * 2002-07-15 2003-12-21 Epistar Corp Light emitting diode with adhesive reflection layer and manufacturing method thereof
TWI241728B (en) 2004-09-01 2005-10-11 Epistar Corp Semiconductor light-emitting device and production method thereof
US6649437B1 (en) 2002-08-20 2003-11-18 United Epitaxy Company, Ltd. Method of manufacturing high-power light emitting diodes
EP1553641B1 (de) * 2002-08-29 2011-03-02 Seoul Semiconductor Co., Ltd. Lichtemittierendes bauelement mit lichtemittierenden dioden
US6965626B2 (en) 2002-09-03 2005-11-15 Finisar Corporation Single mode VCSEL
US6822991B2 (en) 2002-09-30 2004-11-23 Lumileds Lighting U.S., Llc Light emitting devices including tunnel junctions
US20060240640A1 (en) * 2002-10-18 2006-10-26 Vitali Nesterenko Isostatic pressure assisted wafer bonding method
US6813293B2 (en) 2002-11-21 2004-11-02 Finisar Corporation Long wavelength VCSEL with tunnel junction, and implant
KR100506730B1 (ko) * 2002-12-10 2005-08-08 삼성전기주식회사 발광 다이오드의 제조방법
US20040130263A1 (en) * 2003-01-02 2004-07-08 Ray-Hua Horng High brightness led and method for producing the same
US20040227141A1 (en) * 2003-01-30 2004-11-18 Epistar Corporation Light emitting device having a high resistivity cushion layer
TW579610B (en) * 2003-01-30 2004-03-11 Epistar Corp Nitride light-emitting device having adhered reflective layer
JP2004235648A (ja) * 2003-01-31 2004-08-19 Osram Opto Semiconductors Gmbh 光電子デバイス用の半導体基板及びその製造方法
DE10308646B4 (de) * 2003-01-31 2008-07-10 Osram Opto Semiconductors Gmbh Halbleitersubstrat für optoelektronische Bauelemente und Verfahren zu dessen Herstellung
US6786390B2 (en) * 2003-02-04 2004-09-07 United Epitaxy Company Ltd. LED stack manufacturing method and its structure thereof
WO2004082035A1 (en) * 2003-03-13 2004-09-23 Showa Denko K.K. Light-emitting diode and method for production thereof
TWI231054B (en) * 2003-03-13 2005-04-11 Showa Denko Kk Light-emitting diode and its manufacturing method
US7105861B2 (en) * 2003-04-15 2006-09-12 Luminus Devices, Inc. Electronic device contact structures
US7211831B2 (en) 2003-04-15 2007-05-01 Luminus Devices, Inc. Light emitting device with patterned surfaces
US7098589B2 (en) 2003-04-15 2006-08-29 Luminus Devices, Inc. Light emitting devices with high light collimation
US7074631B2 (en) * 2003-04-15 2006-07-11 Luminus Devices, Inc. Light emitting device methods
US7521854B2 (en) * 2003-04-15 2009-04-21 Luminus Devices, Inc. Patterned light emitting devices and extraction efficiencies related to the same
US7274043B2 (en) 2003-04-15 2007-09-25 Luminus Devices, Inc. Light emitting diode systems
US20040259279A1 (en) 2003-04-15 2004-12-23 Erchak Alexei A. Light emitting device methods
US6831302B2 (en) 2003-04-15 2004-12-14 Luminus Devices, Inc. Light emitting devices with improved extraction efficiency
US7667238B2 (en) 2003-04-15 2010-02-23 Luminus Devices, Inc. Light emitting devices for liquid crystal displays
US7084434B2 (en) 2003-04-15 2006-08-01 Luminus Devices, Inc. Uniform color phosphor-coated light-emitting diode
US7083993B2 (en) * 2003-04-15 2006-08-01 Luminus Devices, Inc. Methods of making multi-layer light emitting devices
US20040211972A1 (en) * 2003-04-22 2004-10-28 Gelcore, Llc Flip-chip light emitting diode
US6903381B2 (en) * 2003-04-24 2005-06-07 Opto Tech Corporation Light-emitting diode with cavity containing a filler
JP4140007B2 (ja) * 2003-04-28 2008-08-27 信越半導体株式会社 発光素子及び発光素子の製造方法
EP1620903B1 (de) 2003-04-30 2017-08-16 Cree, Inc. Festkörper-hochleistungslichtquelle
US7298942B2 (en) 2003-06-06 2007-11-20 Finisar Corporation Pluggable optical optic system having a lens fiber stop
US7433381B2 (en) 2003-06-25 2008-10-07 Finisar Corporation InP based long wavelength VCSEL
US7277461B2 (en) 2003-06-27 2007-10-02 Finisar Corporation Dielectric VCSEL gain guide
US7054345B2 (en) 2003-06-27 2006-05-30 Finisar Corporation Enhanced lateral oxidation
US7075962B2 (en) 2003-06-27 2006-07-11 Finisar Corporation VCSEL having thermal management
US6961489B2 (en) 2003-06-30 2005-11-01 Finisar Corporation High speed optical system
US7149383B2 (en) 2003-06-30 2006-12-12 Finisar Corporation Optical system with reduced back reflection
TWI222759B (en) * 2003-07-03 2004-10-21 Epitech Corp Ltd Light emitting diode and method for manufacturing the same
US8999736B2 (en) * 2003-07-04 2015-04-07 Epistar Corporation Optoelectronic system
US7172909B2 (en) * 2003-07-04 2007-02-06 Epistar Corporation Light emitting diode having an adhesive layer and a reflective layer and manufacturing method thereof
US7210857B2 (en) 2003-07-16 2007-05-01 Finisar Corporation Optical coupling system
US6887801B2 (en) 2003-07-18 2005-05-03 Finisar Corporation Edge bead control method and apparatus
DE102004036295A1 (de) * 2003-07-29 2005-03-03 GELcore, LLC (n.d.Ges.d. Staates Delaware), Valley View Flip-Chip-Leuchtdioden-Bauelemente mit Substraten, deren Dicke verringert wurde oder die entfernt wurden
US7009213B2 (en) 2003-07-31 2006-03-07 Lumileds Lighting U.S., Llc Light emitting devices with improved light extraction efficiency
US6847057B1 (en) 2003-08-01 2005-01-25 Lumileds Lighting U.S., Llc Semiconductor light emitting devices
US7019330B2 (en) * 2003-08-28 2006-03-28 Lumileds Lighting U.S., Llc Resonant cavity light emitting device
CN100433377C (zh) * 2003-09-05 2008-11-12 晶元光电股份有限公司 具有粘贴反射层的氮化物发光元件
US7344903B2 (en) 2003-09-17 2008-03-18 Luminus Devices, Inc. Light emitting device processes
US7341880B2 (en) * 2003-09-17 2008-03-11 Luminus Devices, Inc. Light emitting device processes
CN1275337C (zh) * 2003-09-17 2006-09-13 北京工大智源科技发展有限公司 高效高亮度多有源区隧道再生白光发光二极管
TWI223460B (en) * 2003-09-23 2004-11-01 United Epitaxy Co Ltd Light emitting diodes in series connection and method of making the same
US7031363B2 (en) 2003-10-29 2006-04-18 Finisar Corporation Long wavelength VCSEL device processing
JP4393306B2 (ja) * 2003-10-30 2010-01-06 シャープ株式会社 半導体発光素子およびその製造方法並びに半導体装置
JP4332407B2 (ja) 2003-10-31 2009-09-16 シャープ株式会社 半導体発光素子及びその製造方法
FR2862424B1 (fr) * 2003-11-18 2006-10-20 Valeo Electronique Sys Liaison Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif
TWI250669B (en) * 2003-11-26 2006-03-01 Sanken Electric Co Ltd Semiconductor light emitting element and its manufacturing method
US7450311B2 (en) 2003-12-12 2008-11-11 Luminus Devices, Inc. Optical display systems and methods
WO2005062905A2 (en) * 2003-12-24 2005-07-14 Gelcore Llc Laser lift-off of sapphire from a nitride flip-chip
JP4160597B2 (ja) * 2004-01-07 2008-10-01 浜松ホトニクス株式会社 半導体発光素子及びその製造方法
DE102004004765A1 (de) * 2004-01-29 2005-09-01 Rwe Space Solar Power Gmbh Aktive Zonen aufweisende Halbleiterstruktur
WO2005091391A1 (en) * 2004-03-18 2005-09-29 Showa Denko K.K. Group iii nitride semiconductor light-emitting device and method of producing the same
US7202141B2 (en) * 2004-03-29 2007-04-10 J.P. Sercel Associates, Inc. Method of separating layers of material
JP2005286017A (ja) 2004-03-29 2005-10-13 Sumitomo Electric Ind Ltd 半導体発光素子
KR20070028364A (ko) 2004-04-07 2007-03-12 팅기 테크놀러지스 프라이빗 리미티드 반도체 발광 다이오드상의 반사층 제조
JP4116587B2 (ja) * 2004-04-13 2008-07-09 浜松ホトニクス株式会社 半導体発光素子及びその製造方法
US6989555B2 (en) * 2004-04-21 2006-01-24 Lumileds Lighting U.S., Llc Strain-controlled III-nitride light emitting device
US7497754B2 (en) 2004-04-30 2009-03-03 Kabushiki Kaisha Toyota Jidoshokki Method for thinning substrate of EL device
US7332365B2 (en) * 2004-05-18 2008-02-19 Cree, Inc. Method for fabricating group-III nitride devices and devices fabricated using method
US7791061B2 (en) 2004-05-18 2010-09-07 Cree, Inc. External extraction light emitting diode based upon crystallographic faceted surfaces
DE102004026125A1 (de) * 2004-05-28 2005-12-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zu dessen Herstellung
US7553683B2 (en) * 2004-06-09 2009-06-30 Philips Lumiled Lighting Co., Llc Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices
US7534633B2 (en) * 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US20060038188A1 (en) 2004-08-20 2006-02-23 Erchak Alexei A Light emitting diode systems
JP2006066518A (ja) * 2004-08-25 2006-03-09 Sharp Corp 半導体発光素子および半導体発光素子の製造方法
US20060043400A1 (en) * 2004-08-31 2006-03-02 Erchak Alexei A Polarized light emitting device
DE102004045950A1 (de) 2004-09-22 2006-03-30 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
US8513686B2 (en) * 2004-09-22 2013-08-20 Cree, Inc. High output small area group III nitride LEDs
US7259402B2 (en) * 2004-09-22 2007-08-21 Cree, Inc. High efficiency group III nitride-silicon carbide light emitting diode
US8174037B2 (en) * 2004-09-22 2012-05-08 Cree, Inc. High efficiency group III nitride LED with lenticular surface
US7737459B2 (en) * 2004-09-22 2010-06-15 Cree, Inc. High output group III nitride light emitting diodes
US7354355B2 (en) * 2004-10-01 2008-04-08 Nike, Inc. Golf club head or other ball striking device with modifiable feel characteristics
JP2006128202A (ja) * 2004-10-26 2006-05-18 Kyocera Corp 発光素子およびそれを用いた照明装置
US7256483B2 (en) * 2004-10-28 2007-08-14 Philips Lumileds Lighting Company, Llc Package-integrated thin film LED
JP2006156950A (ja) * 2004-10-29 2006-06-15 Sharp Corp 半導体発光素子の製造方法
CN100377377C (zh) * 2004-10-29 2008-03-26 夏普株式会社 半导体发光元件的制造方法
US7419839B2 (en) 2004-11-12 2008-09-02 Philips Lumileds Lighting Company, Llc Bonding an optical element to a light emitting device
US7462502B2 (en) * 2004-11-12 2008-12-09 Philips Lumileds Lighting Company, Llc Color control by alteration of wavelength converting element
DE102004062290A1 (de) * 2004-12-23 2006-07-06 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Halbleiterchips
AU2005322072A1 (en) * 2004-12-27 2006-07-06 Quantum Paper, Inc. Addressable and printable emissive display
US8288942B2 (en) * 2004-12-28 2012-10-16 Cree, Inc. High efficacy white LED
TWI352437B (en) 2007-08-27 2011-11-11 Epistar Corp Optoelectronic semiconductor device
US7932111B2 (en) * 2005-02-23 2011-04-26 Cree, Inc. Substrate removal process for high light extraction LEDs
JP2006237386A (ja) * 2005-02-25 2006-09-07 Sanyo Electric Co Ltd 窒化物系半導体発光ダイオード
US20070045640A1 (en) 2005-08-23 2007-03-01 Erchak Alexei A Light emitting devices for liquid crystal displays
US7125734B2 (en) * 2005-03-09 2006-10-24 Gelcore, Llc Increased light extraction from a nitride LED
US8748923B2 (en) * 2005-03-14 2014-06-10 Philips Lumileds Lighting Company Llc Wavelength-converted semiconductor light emitting device
US7341878B2 (en) * 2005-03-14 2008-03-11 Philips Lumileds Lighting Company, Llc Wavelength-converted semiconductor light emitting device
US7804100B2 (en) * 2005-03-14 2010-09-28 Philips Lumileds Lighting Company, Llc Polarization-reversed III-nitride light emitting device
US7244630B2 (en) * 2005-04-05 2007-07-17 Philips Lumileds Lighting Company, Llc A1InGaP LED having reduced temperature dependence
KR100638825B1 (ko) * 2005-05-23 2006-10-27 삼성전기주식회사 수직구조 반도체 발광 소자 및 그 제조 방법
JP2006339384A (ja) * 2005-06-01 2006-12-14 Kyocera Corp 発光素子およびその製造方法ならびにその発光素子を用いた照明装置
US7736945B2 (en) * 2005-06-09 2010-06-15 Philips Lumileds Lighting Company, Llc LED assembly having maximum metal support for laser lift-off of growth substrate
US7754507B2 (en) * 2005-06-09 2010-07-13 Philips Lumileds Lighting Company, Llc Method of removing the growth substrate of a semiconductor light emitting device
DE102005030466B4 (de) * 2005-06-28 2012-10-25 Infineon Technologies Ag Halbleiterwafer mit Verdrahtungsstrukturen und Halbleiterbauelement sowie Verfahren zur Herstellung desselben
JP4584785B2 (ja) * 2005-06-30 2010-11-24 シャープ株式会社 半導体発光素子の製造方法
TWI269467B (en) * 2005-07-01 2006-12-21 Epitech Technology Corp Light-emitting diode
EP1739210B1 (de) 2005-07-01 2012-03-07 Freiberger Compound Materials GmbH Verfahren zur Herstellung von dotierten Halbleiter-Einkristallen, und III-V-Halbleiter-Einkristall
JP4225510B2 (ja) 2005-07-06 2009-02-18 昭和電工株式会社 化合物半導体発光ダイオードおよびその製造方法
US7384808B2 (en) * 2005-07-12 2008-06-10 Visual Photonics Epitaxy Co., Ltd. Fabrication method of high-brightness light emitting diode having reflective layer
US7335924B2 (en) * 2005-07-12 2008-02-26 Visual Photonics Epitaxy Co., Ltd. High-brightness light emitting diode having reflective layer
US8674375B2 (en) * 2005-07-21 2014-03-18 Cree, Inc. Roughened high refractive index layer/LED for high light extraction
JP2007059873A (ja) * 2005-07-26 2007-03-08 Sharp Corp 半導体発光素子及びその製造方法
JP2007035990A (ja) * 2005-07-28 2007-02-08 Kyocera Corp 窒化ガリウム系化合物半導体発光素子及びその製造方法
JP2007067257A (ja) * 2005-09-01 2007-03-15 Kyocera Corp 発光素子
SG130975A1 (en) 2005-09-29 2007-04-26 Tinggi Tech Private Ltd Fabrication of semiconductor devices for light emission
DE102006023685A1 (de) * 2005-09-29 2007-04-05 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
DE102005047168A1 (de) * 2005-09-30 2007-04-12 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
JP4857702B2 (ja) * 2005-10-13 2012-01-18 三菱電機株式会社 集積型光半導体装置の製造方法
SG131803A1 (en) 2005-10-19 2007-05-28 Tinggi Tech Private Ltd Fabrication of transistors
US7718449B2 (en) * 2005-10-28 2010-05-18 Lumination Llc Wafer level package for very small footprint and low profile white LED devices
US20070096121A1 (en) * 2005-10-28 2007-05-03 Ni Ying C Light emitting diode and method for manufacturing the same
DE602006008256D1 (de) * 2005-12-15 2009-09-17 Lg Electronics Inc LED mit vertikaler Struktur und deren Herstellungsverfahren
SG133432A1 (en) 2005-12-20 2007-07-30 Tinggi Tech Private Ltd Localized annealing during semiconductor device fabrication
US7915619B2 (en) 2005-12-22 2011-03-29 Showa Denko K.K. Light-emitting diode and method for fabrication thereof
WO2007083829A1 (en) 2006-01-23 2007-07-26 Showa Denko K.K. Light-emitting diode and method for fabrication thereof
US20070181905A1 (en) * 2006-02-07 2007-08-09 Hui-Heng Wang Light emitting diode having enhanced side emitting capability
WO2007091704A1 (en) 2006-02-08 2007-08-16 Showa Denko K.K. Light-emitting diode and fabrication method thereof
WO2007094476A1 (en) 2006-02-14 2007-08-23 Showa Denko K.K. Light-emitting diode
JP2007221051A (ja) * 2006-02-20 2007-08-30 Sanyo Electric Co Ltd 窒化物系半導体素子の製造方法
US20070240631A1 (en) * 2006-04-14 2007-10-18 Applied Materials, Inc. Epitaxial growth of compound nitride semiconductor structures
WO2007139894A2 (en) 2006-05-26 2007-12-06 Cree Led Lighting Solutions, Inc. Solid state light emitting device and method of making same
CN100452460C (zh) * 2006-05-29 2009-01-14 金芃 通孔垂直结构的半导体芯片及其制造方法
KR20140116536A (ko) 2006-05-31 2014-10-02 크리, 인코포레이티드 조명 장치 및 조명 방법
US8174025B2 (en) * 2006-06-09 2012-05-08 Philips Lumileds Lighting Company, Llc Semiconductor light emitting device including porous layer
TWI305960B (en) * 2006-06-16 2009-02-01 Opto Tech Corp Light emitting diode and method manufacturing the same
JP2008004587A (ja) * 2006-06-20 2008-01-10 Sharp Corp 半導体発光素子及びその製造方法並びに化合物半導体発光ダイオード
SG140473A1 (en) 2006-08-16 2008-03-28 Tinggi Tech Private Ltd Improvements in external light efficiency of light emitting diodes
US8310143B2 (en) * 2006-08-23 2012-11-13 Cree, Inc. Lighting device and lighting method
SG140512A1 (en) 2006-09-04 2008-03-28 Tinggi Tech Private Ltd Electrical current distribution in light emitting devices
US20100224890A1 (en) * 2006-09-18 2010-09-09 Cree, Inc. Light emitting diode chip with electrical insulation element
US8350279B2 (en) 2006-09-25 2013-01-08 Seoul Opto Device Co., Ltd. Light emitting diode having AlInGaP active layer and method of fabricating the same
JP2008091789A (ja) * 2006-10-04 2008-04-17 Hitachi Cable Ltd 発光ダイオード
US20080092819A1 (en) * 2006-10-24 2008-04-24 Applied Materials, Inc. Substrate support structure with rapid temperature change
TWI324403B (en) * 2006-11-07 2010-05-01 Opto Tech Corp Light emitting diode and method manufacturing the same
US8283683B2 (en) 2006-11-07 2012-10-09 Opto Tech Corporation Chip-bonding light emitting diode chip
JP5306589B2 (ja) * 2006-11-17 2013-10-02 シャープ株式会社 半導体発光素子及びその製造方法
CN101622493A (zh) * 2006-12-04 2010-01-06 科锐Led照明科技公司 照明装置和照明方法
EP2095011A1 (de) 2006-12-04 2009-09-02 Cree Led Lighting Solutions, Inc. Beleuchtungsanordnung und beleuchtungsverfahren
TW201448263A (zh) 2006-12-11 2014-12-16 Univ California 透明發光二極體
TWI331411B (en) * 2006-12-29 2010-10-01 Epistar Corp High efficiency light-emitting diode and method for manufacturing the same
TWI370555B (en) * 2006-12-29 2012-08-11 Epistar Corp Light-emitting diode and method for manufacturing the same
US8110425B2 (en) 2007-03-20 2012-02-07 Luminus Devices, Inc. Laser liftoff structure and related methods
JP5346443B2 (ja) 2007-04-16 2013-11-20 ローム株式会社 半導体発光素子およびその製造方法
US8133768B2 (en) * 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8846457B2 (en) 2007-05-31 2014-09-30 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8889216B2 (en) * 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US8415879B2 (en) 2007-05-31 2013-04-09 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9425357B2 (en) 2007-05-31 2016-08-23 Nthdegree Technologies Worldwide Inc. Diode for a printable composition
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US8674593B2 (en) 2007-05-31 2014-03-18 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8456393B2 (en) 2007-05-31 2013-06-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US20080303033A1 (en) * 2007-06-05 2008-12-11 Cree, Inc. Formation of nitride-based optoelectronic and electronic device structures on lattice-matched substrates
US8148733B2 (en) 2007-06-12 2012-04-03 SemiLEDs Optoelectronics Co., Ltd. Vertical LED with current guiding structure
US7759670B2 (en) * 2007-06-12 2010-07-20 SemiLEDs Optoelectronics Co., Ltd. Vertical LED with current guiding structure
US8546818B2 (en) 2007-06-12 2013-10-01 SemiLEDs Optoelectronics Co., Ltd. Vertical LED with current-guiding structure
JP5123573B2 (ja) * 2007-06-13 2013-01-23 ローム株式会社 半導体発光素子およびその製造方法
US20080314311A1 (en) * 2007-06-24 2008-12-25 Burrows Brian H Hvpe showerhead design
US7867793B2 (en) * 2007-07-09 2011-01-11 Koninklijke Philips Electronics N.V. Substrate removal during LED formation
EP2171502B1 (de) 2007-07-17 2016-09-14 Cree, Inc. Optische elemente mit internen optischen funktionen und herstellungsverfahren dafür
US8617997B2 (en) * 2007-08-21 2013-12-31 Cree, Inc. Selective wet etching of gold-tin based solder
US11114594B2 (en) 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size
JP4892445B2 (ja) 2007-10-01 2012-03-07 昭和電工株式会社 半導体発光素子および半導体発光素子の製造方法
US20090149008A1 (en) * 2007-10-05 2009-06-11 Applied Materials, Inc. Method for depositing group iii/v compounds
JP5236924B2 (ja) * 2007-10-11 2013-07-17 ローム株式会社 半導体発光素子およびその製造方法
US8692286B2 (en) * 2007-12-14 2014-04-08 Philips Lumileds Lighing Company LLC Light emitting device with bonded interface
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
US7985979B2 (en) 2007-12-19 2011-07-26 Koninklijke Philips Electronics, N.V. Semiconductor light emitting device with light extraction structures
US20090194026A1 (en) * 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
JP5315070B2 (ja) * 2008-02-07 2013-10-16 昭和電工株式会社 化合物半導体発光ダイオード
DE102008013900A1 (de) * 2008-03-12 2009-09-17 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip
TWI362769B (en) 2008-05-09 2012-04-21 Univ Nat Chiao Tung Light emitting device and fabrication method therefor
US7992332B2 (en) 2008-05-13 2011-08-09 Nthdegree Technologies Worldwide Inc. Apparatuses for providing power for illumination of a display object
US8127477B2 (en) 2008-05-13 2012-03-06 Nthdegree Technologies Worldwide Inc Illuminating display systems
CN101635324B (zh) * 2008-07-24 2015-08-26 晶元光电股份有限公司 发光元件及其制造方法
US20100001312A1 (en) * 2008-07-01 2010-01-07 Epistar Corporation Light-emitting device and method for manufacturing the same
US8329295B2 (en) 2008-07-11 2012-12-11 Freiberger Compound Materials Gmbh Process for producing doped gallium arsenide substrate wafers having low optical absorption coefficient
DE102008032628A1 (de) * 2008-07-11 2010-01-28 Freiberger Compound Materials Gmbh Verfahren zur Herstellung von dotierten Galliumarsenidsubstratwafern mit niedrigem optischen Absorptionskoeffizienten
TWI420693B (zh) * 2008-07-17 2013-12-21 Advanced Optoelectronic Tech 發光二極體及其製程
US10147843B2 (en) 2008-07-24 2018-12-04 Lumileds Llc Semiconductor light emitting device including a window layer and a light-directing structure
DE102008039360B4 (de) * 2008-08-22 2021-05-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
JP5097057B2 (ja) * 2008-08-29 2012-12-12 株式会社沖データ 表示装置
US20100139554A1 (en) * 2008-12-08 2010-06-10 Applied Materials, Inc. Methods and apparatus for making gallium nitride and gallium aluminum nitride thin films
JP2010192701A (ja) 2009-02-18 2010-09-02 Showa Denko Kk 発光ダイオード、発光ダイオードランプ及び発光ダイオードの製造方法
US20100273291A1 (en) * 2009-04-28 2010-10-28 Applied Materials, Inc. Decontamination of mocvd chamber using nh3 purge after in-situ cleaning
US20110079251A1 (en) * 2009-04-28 2011-04-07 Olga Kryliouk Method for in-situ cleaning of deposition systems
TW201039381A (en) * 2009-04-29 2010-11-01 Applied Materials Inc Method of forming in-situ pre-GaN deposition layer in HVPE
US20110027973A1 (en) * 2009-07-31 2011-02-03 Applied Materials, Inc. Method of forming led structures
US20110104843A1 (en) * 2009-07-31 2011-05-05 Applied Materials, Inc. Method of reducing degradation of multi quantum well (mqw) light emitting diodes
WO2011017222A2 (en) * 2009-08-04 2011-02-10 Applied Materials, Inc. Method and apparatus for dry cleaning a cooled showerhead
KR20120090996A (ko) * 2009-08-27 2012-08-17 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 챔버 세정 후 프로세스 챔버의 제염 방법
US20110064545A1 (en) * 2009-09-16 2011-03-17 Applied Materials, Inc. Substrate transfer mechanism with preheating features
US20110062469A1 (en) 2009-09-17 2011-03-17 Koninklijke Philips Electronics N.V. Molded lens incorporating a window element
US20110076400A1 (en) * 2009-09-30 2011-03-31 Applied Materials, Inc. Nanocrystalline diamond-structured carbon coating of silicon carbide
KR20120099632A (ko) * 2009-10-07 2012-09-11 어플라이드 머티어리얼스, 인코포레이티드 Ｌｅｄ 제조를 위한 개선된 다중 챔버 분할 프로세스
KR101616905B1 (ko) * 2009-10-22 2016-04-29 엘지디스플레이 주식회사 반도체 발광 소자
JP5343018B2 (ja) 2010-02-08 2013-11-13 昭和電工株式会社 発光ダイオード及びその製造方法、並びに発光ダイオードランプ
US20110204376A1 (en) * 2010-02-23 2011-08-25 Applied Materials, Inc. Growth of multi-junction led film stacks with multi-chambered epitaxy system
US20110207256A1 (en) * 2010-02-24 2011-08-25 Applied Materials, Inc. In-situ acceptor activation with nitrogen and/or oxygen plasma treatment
US8425715B2 (en) 2010-04-12 2013-04-23 Suss Microtec Lithography, Gmbh Apparatus for high throughput wafer bonding
US8329482B2 (en) 2010-04-30 2012-12-11 Cree, Inc. White-emitting LED chips and method for making same
CN101835085A (zh) * 2010-05-10 2010-09-15 瑞声声学科技(深圳)有限公司 硅基电容麦克风的制作方法
CA2802539A1 (en) 2010-06-18 2011-12-22 Glo Ab Nanowire led structure and method for manufacturing the same
US9076827B2 (en) 2010-09-14 2015-07-07 Applied Materials, Inc. Transfer chamber metrology for improved device yield
KR20120040448A (ko) * 2010-10-19 2012-04-27 삼성엘이디 주식회사 수직형 발광 소자
US8664067B2 (en) * 2010-11-18 2014-03-04 Monolithic Power Systems, Inc. CMOS devices with reduced short channel effects
US8822817B2 (en) 2010-12-03 2014-09-02 The Boeing Company Direct wafer bonding
KR20120099318A (ko) * 2011-01-26 2012-09-10 엘지이노텍 주식회사 발광 소자 및 그 제조방법
DE102011011862A1 (de) * 2011-02-21 2012-08-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Vielzahl optoelektronischer Halbleiterchips
FR2964498A1 (fr) * 2011-03-21 2012-03-09 Soitec Silicon On Insulator Empilement de led de couleur
JP5095840B2 (ja) * 2011-04-26 2012-12-12 株式会社東芝 半導体発光素子
JP5095848B1 (ja) * 2011-05-18 2012-12-12 株式会社東芝 半導体発光素子
US8778783B2 (en) 2011-05-20 2014-07-15 Applied Materials, Inc. Methods for improved growth of group III nitride buffer layers
US8980002B2 (en) 2011-05-20 2015-03-17 Applied Materials, Inc. Methods for improved growth of group III nitride semiconductor compounds
US8853086B2 (en) 2011-05-20 2014-10-07 Applied Materials, Inc. Methods for pretreatment of group III-nitride depositions
US9142743B2 (en) 2011-08-02 2015-09-22 Kabushiki Kaisha Toshiba High temperature gold-free wafer bonding for light emitting diodes
US20130075769A1 (en) * 2011-09-22 2013-03-28 Ledengin, Inc. Selection of phosphors and leds in a multi-chip emitter for a single white color bin
US8350251B1 (en) 2011-09-26 2013-01-08 Glo Ab Nanowire sized opto-electronic structure and method for manufacturing the same
JP2013093412A (ja) * 2011-10-25 2013-05-16 Showa Denko Kk 発光ダイオード、発光ダイオードの製造方法、発光ダイオードランプ及び照明装置
US20130161669A1 (en) * 2011-12-23 2013-06-27 Fu-Bang CHEN Light-emitting diode with current diffusion structure and a method for fabricating the same
US9269696B2 (en) 2012-04-25 2016-02-23 Epistar Corporation Light-emitting device
JP5957358B2 (ja) 2012-10-16 2016-07-27 昭和電工株式会社 発光ダイオード、発光ダイオードランプ及び照明装置
JP2014120695A (ja) 2012-12-19 2014-06-30 Rohm Co Ltd 半導体発光素子
JP6100567B2 (ja) * 2013-03-18 2017-03-22 スタンレー電気株式会社 半導体発光素子とその製造方法
JP6074309B2 (ja) * 2013-04-16 2017-02-01 京セラ株式会社 半導体接着用熱硬化型樹脂組成物及びそれを用いた半導体装置
US8896008B2 (en) 2013-04-23 2014-11-25 Cree, Inc. Light emitting diodes having group III nitride surface features defined by a mask and crystal planes
US10312731B2 (en) 2014-04-24 2019-06-04 Westrock Shared Services, Llc Powered shelf system for inductively powering electrical components of consumer product packages
US9865769B2 (en) 2015-03-23 2018-01-09 International Business Machines Corporation Back contact LED through spalling
KR102465406B1 (ko) * 2016-01-07 2022-11-09 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자
WO2017139317A1 (en) 2016-02-09 2017-08-17 Lumeova, Inc Ultra-wideband, wireless optical high speed communication devices and systems
US9859470B2 (en) * 2016-03-10 2018-01-02 Epistar Corporation Light-emitting device with adjusting element
US10249786B2 (en) * 2016-11-29 2019-04-02 Palo Alto Research Center Incorporated Thin film and substrate-removed group III-nitride based devices and method
CN109216511A (zh) * 2017-07-03 2019-01-15 上海芯元基半导体科技有限公司 P面出光的薄膜led芯片及其制造方法
US11402672B2 (en) 2018-05-03 2022-08-02 X Development Llc Quantum confined nanostructures with improved homogeneity and methods for making the same
DE102018132955A1 (de) * 2018-12-19 2020-06-25 Osram Opto Semiconductors Gmbh Strahlungsemittierendes bauelement
US10847569B2 (en) * 2019-02-26 2020-11-24 Raytheon Company Wafer level shim processing
US11637219B2 (en) 2019-04-12 2023-04-25 Google Llc Monolithic integration of different light emitting structures on a same substrate
US20210066547A1 (en) 2019-08-28 2021-03-04 Tslc Corporation Semiconductor Components And Semiconductor Structures And Methods Of Fabrication
US20220293820A1 (en) * 2019-09-27 2022-09-15 New Silicon Corporation Pte Ltd Method for fabricating a semiconductor device and the semiconductor device thereof
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4179702A (en) * 1978-03-09 1979-12-18 Research Triangle Institute Cascade solar cells
JPS5669880A (en) * 1979-11-12 1981-06-11 Toshiba Corp Semiconductor luminous device
JPS60136788A (ja) * 1983-12-26 1985-07-20 日本ビクター株式会社 Ｌｅｄ平面パネルデイスプレイの製作法
JPS6195591A (ja) * 1984-10-16 1986-05-14 Sony Corp 半導体レ−ザ
JPS61183986A (ja) * 1985-02-08 1986-08-16 Toshiba Corp 半導体発光装置の製造方法
JPS61182280A (ja) * 1985-02-08 1986-08-14 Toshiba Corp 青色発光素子の製造方法
NL8700033A (nl) * 1987-01-09 1988-08-01 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting van het type halfgeleider op isolator.
US4914667A (en) * 1987-01-21 1990-04-03 American Telephone And Telegraph Company, At&T Bell Laboratories Hybrid laser for optical communications, and transmitter, system, and method
US4771016A (en) * 1987-04-24 1988-09-13 Harris Corporation Using a rapid thermal process for manufacturing a wafer bonded soi semiconductor
JPS6415913A (en) * 1987-07-09 1989-01-19 Mitsubishi Monsanto Chem Epitaxial growth method of substrate for high-brightness led
US4864371A (en) * 1987-11-18 1989-09-05 Hewlett-Packard Company Partially opaque substrate red LED
JPH0770755B2 (ja) * 1988-01-21 1995-07-31 三菱化学株式会社 高輝度ｌｅｄ用エピタキシャル基板及びその製造方法
US4883561A (en) * 1988-03-29 1989-11-28 Bell Communications Research, Inc. Lift-off and subsequent bonding of epitaxial films
US4846931A (en) * 1988-03-29 1989-07-11 Bell Communications Research, Inc. Method for lifting-off epitaxial films
US4864369A (en) * 1988-07-05 1989-09-05 Hewlett-Packard Company P-side up double heterojunction AlGaAs light-emitting diode
US4992837A (en) * 1988-11-15 1991-02-12 Kokusai Denshin Denwa Co., Ltd. Light emitting semiconductor device
US5153889A (en) * 1989-05-31 1992-10-06 Kabushiki Kaisha Toshiba Semiconductor light emitting device
US5048035A (en) * 1989-05-31 1991-09-10 Kabushiki Kaisha Toshiba Semiconductor light emitting device
JPH0344067A (ja) * 1989-07-11 1991-02-25 Nec Corp 半導体基板の積層方法
US5103271A (en) * 1989-09-28 1992-04-07 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method of fabricating the same
US5008718A (en) * 1989-12-18 1991-04-16 Fletcher Robert M Light-emitting diode with an electrically conductive window
JPH04130675A (ja) * 1990-09-20 1992-05-01 Fujitsu Ltd 面発光ダイオード及び発光ダイオードの製造方法
US5135877A (en) * 1990-10-09 1992-08-04 Eastman Kodak Company Method of making a light-emitting diode with anti-reflection layer optimization
US5110748A (en) * 1991-03-28 1992-05-05 Honeywell Inc. Method for fabricating high mobility thin film transistors as integrated drivers for active matrix display
US5166761A (en) * 1991-04-01 1992-11-24 Midwest Research Institute Tunnel junction multiple wavelength light-emitting diodes
US5280184A (en) * 1992-04-08 1994-01-18 Georgia Tech Research Corporation Three dimensional integrated circuits with lift-off
US5244817A (en) * 1992-08-03 1993-09-14 Eastman Kodak Company Method of making backside illuminated image sensors
JP3230638B2 (ja) * 1993-02-10 2001-11-19 シャープ株式会社 発光ダイオードの製造方法
US5376580A (en) * 1993-03-19 1994-12-27 Hewlett-Packard Company Wafer bonding of light emitting diode layers

Also Published As

Publication number Publication date
EP0730311A3 (de) 1997-01-29
JP2004006986A (ja) 2004-01-08
EP0727829A3 (de) 1997-01-29
KR100338180B1 (ko) 2002-08-24
EP0727830A2 (de) 1996-08-21
KR100339963B1 (ko) 2002-06-22
EP0727829A2 (de) 1996-08-21
KR100401370B1 (ko) 2003-10-17
EP0730311A2 (de) 1996-09-04
TW280039B (de) 1996-07-01
KR940022932A (ko) 1994-10-22
JP2006319374A (ja) 2006-11-24
JPH06302857A (ja) 1994-10-28
US5376580A (en) 1994-12-27
JP3532953B2 (ja) 2004-05-31
US5502316A (en) 1996-03-26
JP3708938B2 (ja) 2005-10-19
EP0616376A1 (de) 1994-09-21
EP0727830B1 (de) 2003-04-02
EP0616376B1 (de) 1997-11-26
JP2004080042A (ja) 2004-03-11
DE69432426D1 (de) 2003-05-08
DE69432426T2 (de) 2004-03-11
KR100342749B1 (ko) 2002-07-04
EP0727830A3 (de) 1997-01-29
DE69406964T2 (de) 1998-06-04

Similar Documents

Publication Publication Date Title
DE69406964D1 (de) Verbinden von Schichten einer lichtemittierenden Diode mit einem Substrat
DE69229991D1 (de) Lichtemittierende Diode mit einer dicken transparenten Schicht
DE69416012T2 (de) Verfahren zum Herstellen einer lichtemittierenden Diode mit transparentem Substrat
DE59309755D1 (de) Lichtquelle mit einer lumineszierenden Schicht
DE69025273D1 (de) Lichtemittierende Diode mit lichtreflektierender Schicht
DE69214423T2 (de) Verwendung einer Halbleiterstruktur als lichtemittierende Diode
DE69226848D1 (de) Lichtemittierende Diode mit verästelter Oberflächenelektrode
DE69511609D1 (de) Verbinden von einem Halbleiter mit einem Substrat
DE69331554T2 (de) Lichtemittierende Diode
DE29724849U9 (de) Lichtabstrahlendes optisches Bauelement mit einer wellenlängenkonvertierenden Vergußmasse
DE69125127D1 (de) Einzeln ansprechbare oberflächenemittierende Zeile von Halbleiterlasern/lichtemittierenden Dioden mit hoher Packungsdichte
DE69325045T2 (de) Oberflächenemittierender Halbleiterlaser mit verbesserter optischer Begrenzung
DE69607817T2 (de) Ausrichtung einer Leuchtdiodenanordnung
DE69718263T2 (de) Mit einem Substrat verbundene Gegenstände aus PTFE
DE69609905D1 (de) Monolytische Montage von Halbleiterbauteilen mit einer Hochgeschwindigkeitsdiode
FR2631102B1 (fr) Lanterne a diodes electroluminescentes
DE69223091D1 (de) Verfahren zur Herstellung einer lichtemittierenden Diode
DE69526403D1 (de) Spektrophotometer mit Lichtquelle in Form einer lichtemittierenden Diodenanordnung
DE69424689T2 (de) Halbleiterlaser mit gestuftem Substrat zur Lichtemission aus einem schrägstehenden Abschnitt
DE69521024T2 (de) Optoelektronische halbleitervorrichtung mit einer halbleiter-laserdiode
DE68919551T2 (de) Herstellungsverfahren einer grünes Licht emittierenden Diode.
KR940023586U (ko) 타원형 패캐이지의 발광다이오드 소자
KR940021514U (ko) 발광 다이오드(led)의 구동회로
DE69521900T2 (de) Klebstoffe zum Kleben einer Vinylidenfluoridharz mit einem Substrat

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES DELA

8327 Change in the person/name/address of the patent owner

Owner name: LUMILEDS LIGHTING, U.S., LLC, SAN JOSE, CALIF., US

8327 Change in the person/name/address of the patent owner

Owner name: PHILIPS LUMILEDS LIGHTING COMPANY,LLC, SAN JOS, US