DE69408282D1 - Mit einem Reparatursystem für halbleiter-integrierte Schaltung verbundenes automatisches Reparaturdateneditiersystem - Google Patents

Mit einem Reparatursystem für halbleiter-integrierte Schaltung verbundenes automatisches Reparaturdateneditiersystem

Info

Publication number
DE69408282D1
DE69408282D1 DE69408282T DE69408282T DE69408282D1 DE 69408282 D1 DE69408282 D1 DE 69408282D1 DE 69408282 T DE69408282 T DE 69408282T DE 69408282 T DE69408282 T DE 69408282T DE 69408282 D1 DE69408282 D1 DE 69408282D1
Authority
DE
Germany
Prior art keywords
repair
integrated circuit
repair data
semiconductor integrated
data editing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69408282T
Other languages
English (en)
Other versions
DE69408282T2 (de
Inventor
Tetsunori Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69408282D1 publication Critical patent/DE69408282D1/de
Publication of DE69408282T2 publication Critical patent/DE69408282T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31912—Tester/user interface
DE69408282T 1993-11-22 1994-11-15 Mit einem Reparatursystem für halbleiter-integrierte Schaltung verbundenes automatisches Reparaturdateneditiersystem Expired - Fee Related DE69408282T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5315988A JP2616413B2 (ja) 1993-11-22 1993-11-22 リペアデータの編集装置およびリペアデータの編集方法

Publications (2)

Publication Number Publication Date
DE69408282D1 true DE69408282D1 (de) 1998-03-05
DE69408282T2 DE69408282T2 (de) 1998-09-03

Family

ID=18071995

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69408282T Expired - Fee Related DE69408282T2 (de) 1993-11-22 1994-11-15 Mit einem Reparatursystem für halbleiter-integrierte Schaltung verbundenes automatisches Reparaturdateneditiersystem

Country Status (4)

Country Link
US (1) US5568408A (de)
EP (1) EP0654739B1 (de)
JP (1) JP2616413B2 (de)
DE (1) DE69408282T2 (de)

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US5751582A (en) * 1995-09-25 1998-05-12 Texas Instruments Incorporated Controlling process modules using site models and monitor wafer control
US5761064A (en) * 1995-10-06 1998-06-02 Advanced Micro Devices, Inc. Defect management system for productivity and yield improvement
US5745389A (en) * 1996-04-04 1998-04-28 Bull Hn Information Systems Inc. System and mechanism for assigning pre-established electronic addresses to printed circuit boards
US6100486A (en) 1998-08-13 2000-08-08 Micron Technology, Inc. Method for sorting integrated circuit devices
US5927512A (en) 1997-01-17 1999-07-27 Micron Technology, Inc. Method for sorting integrated circuit devices
US5844803A (en) * 1997-02-17 1998-12-01 Micron Technology, Inc. Method of sorting a group of integrated circuit devices for those devices requiring special testing
US5915231A (en) 1997-02-26 1999-06-22 Micron Technology, Inc. Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture
US5856923A (en) * 1997-03-24 1999-01-05 Micron Technology, Inc. Method for continuous, non lot-based integrated circuit manufacturing
US7120513B1 (en) 1997-06-06 2006-10-10 Micron Technology, Inc. Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs
US5907492A (en) 1997-06-06 1999-05-25 Micron Technology, Inc. Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
US6049624A (en) 1998-02-20 2000-04-11 Micron Technology, Inc. Non-lot based method for assembling integrated circuit devices
US6313658B1 (en) 1998-05-22 2001-11-06 Micron Technology, Inc. Device and method for isolating a short-circuited integrated circuit (IC) from other IC's on a semiconductor wafer
US6240329B1 (en) * 1998-11-09 2001-05-29 Chin-Yang Sun Method and apparatus for a semiconductor wafer inspection system using a knowledge-based system
KR100303321B1 (ko) 1999-05-20 2001-09-26 박종섭 반도체 라인 자동화 시스템에서의 오류발생 로트 제어 장치 및그 방법
DE10024734A1 (de) 1999-05-20 2001-01-18 Hyundai Electronics Ind Halbleiterfabrikautomatisierungssystem und Verfahren zum Transportieren von Halbleiterwafern
KR100538812B1 (ko) 1999-06-22 2005-12-23 주식회사 하이닉스반도체 반도체 제조를 위한 확산공정에서 자동반송 로봇의 큐 생성시 문제점 해결방법 및 기록매체
KR100510068B1 (ko) 1999-06-22 2005-08-26 주식회사 하이닉스반도체 반도체 라인관리용 통합 자동화시스템의 감시 시스템 및 방법
US6438441B1 (en) 1999-06-28 2002-08-20 Hyundai Electronics Industries Co., Ltd. Semiconductor factory automation system and method for resetting process recipe by employing trace file
KR100510066B1 (ko) 1999-06-30 2005-08-26 주식회사 하이닉스반도체 반도체 생산라인의 스토커 오류 감시 방법
US7062425B1 (en) * 1999-09-30 2006-06-13 Cypress Semiconductor Corp. Method and apparatus for automated enumeration, simulation, identification and/or irradiation of device attributes
JP2001155980A (ja) * 1999-11-25 2001-06-08 Nec Corp 検査補修システム、製品製造システム、部材検査装置、データ処理装置、部材補修装置、情報記憶媒体
JP2002073129A (ja) * 2000-08-30 2002-03-12 Mitsubishi Electric Corp レーザトリミング用プログラム作成装置、方法、記録媒体およびレーザトリミング装置
US7127409B2 (en) * 2001-03-01 2006-10-24 General Electric Company Methods and systems for aviation nonconformance component management
US7055074B2 (en) * 2001-04-25 2006-05-30 Hewlett-Packard Development Company, L.P. Device to inhibit duplicate cache repairs
US6898545B2 (en) * 2002-06-28 2005-05-24 Agilent Technologies Inc Semiconductor test data analysis system
US7187603B2 (en) 2003-02-12 2007-03-06 Sony Corporation Semiconductor memory device, repair search method, and self-repair method
JP4254334B2 (ja) 2003-05-01 2009-04-15 ソニー株式会社 半導体記憶装置およびそのセルフリペア方法
JP4254333B2 (ja) 2003-05-01 2009-04-15 ソニー株式会社 半導体記憶装置およびそのセルフリペア方法
US7148716B2 (en) * 2004-06-10 2006-12-12 Texas Instruments Incorporated System and method for the probing of a wafer
JP2006114149A (ja) * 2004-10-15 2006-04-27 Fujitsu Ltd 半導体試験システム
US8076605B2 (en) * 2007-06-25 2011-12-13 Electro Scientific Industries, Inc. Systems and methods for adapting parameters to increase throughput during laser-based wafer processing
US8131531B2 (en) * 2007-11-30 2012-03-06 Verigy (Singapore) Pte. Ltd. System and method for simulating a semiconductor wafer prober and a class memory test handler
US8438431B2 (en) * 2009-11-10 2013-05-07 International Business Machines Corporation Support element office mode array repair code verification
JP2012099603A (ja) * 2010-11-01 2012-05-24 Elpida Memory Inc ウェハテスト装置、ウェハテスト方法およびプログラム
US8903122B2 (en) 2013-03-15 2014-12-02 HGST Netherlands B.V. Verifying a slider tray map

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4876685A (en) * 1987-06-08 1989-10-24 Teradyne, Inc. Failure information processing in automatic memory tester
JPH0212079A (ja) * 1988-03-31 1990-01-17 Tektronix Inc 試験方法
US5103557A (en) * 1988-05-16 1992-04-14 Leedy Glenn J Making and testing an integrated circuit using high density probe points
JPH0252446A (ja) * 1988-08-17 1990-02-22 Nec Kyushu Ltd 集積回路の試験装置
JPH02208949A (ja) * 1989-02-09 1990-08-20 Mitsubishi Electric Corp 半導体製造装置
JPH0480939A (ja) * 1990-07-24 1992-03-13 Hitachi Ltd 半導体集積回路装置の製造方法
US5219765A (en) * 1990-09-12 1993-06-15 Hitachi, Ltd. Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process
US5240866A (en) * 1992-02-03 1993-08-31 At&T Bell Laboratories Method for characterizing failed circuits on semiconductor wafers
US5355320A (en) * 1992-03-06 1994-10-11 Vlsi Technology, Inc. System for controlling an integrated product process for semiconductor wafers and packages
US5408405A (en) * 1993-09-20 1995-04-18 Texas Instruments Incorporated Multi-variable statistical process controller for discrete manufacturing

Also Published As

Publication number Publication date
JPH07146340A (ja) 1995-06-06
JP2616413B2 (ja) 1997-06-04
DE69408282T2 (de) 1998-09-03
EP0654739A1 (de) 1995-05-24
US5568408A (en) 1996-10-22
EP0654739B1 (de) 1998-01-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NEC ELECTRONICS CORP., KAWASAKI, KANAGAWA, JP

8339 Ceased/non-payment of the annual fee