DE69410772T2 - In-Situ-Kontrolltechnik und Gerät zum Bestimmen des Endes eines chemisch-mechanischen Planiervorganges - Google Patents

In-Situ-Kontrolltechnik und Gerät zum Bestimmen des Endes eines chemisch-mechanischen Planiervorganges

Info

Publication number
DE69410772T2
DE69410772T2 DE69410772T DE69410772T DE69410772T2 DE 69410772 T2 DE69410772 T2 DE 69410772T2 DE 69410772 T DE69410772 T DE 69410772T DE 69410772 T DE69410772 T DE 69410772T DE 69410772 T2 DE69410772 T2 DE 69410772T2
Authority
DE
Germany
Prior art keywords
chemical
determining
control technology
leveling process
situ control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69410772T
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English (en)
Other versions
DE69410772D1 (de
Inventor
Naftali Eliahu Lustig
Katherine Lynn Saenger
Ho-Ming Tong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE69410772D1 publication Critical patent/DE69410772D1/de
Application granted granted Critical
Publication of DE69410772T2 publication Critical patent/DE69410772T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • B24B37/013Devices or means for detecting lapping completion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
DE69410772T 1993-12-22 1994-11-24 In-Situ-Kontrolltechnik und Gerät zum Bestimmen des Endes eines chemisch-mechanischen Planiervorganges Expired - Lifetime DE69410772T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/173,294 US5433651A (en) 1993-12-22 1993-12-22 In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing

Publications (2)

Publication Number Publication Date
DE69410772D1 DE69410772D1 (de) 1998-07-09
DE69410772T2 true DE69410772T2 (de) 1999-02-25

Family

ID=22631367

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69410772T Expired - Lifetime DE69410772T2 (de) 1993-12-22 1994-11-24 In-Situ-Kontrolltechnik und Gerät zum Bestimmen des Endes eines chemisch-mechanischen Planiervorganges

Country Status (4)

Country Link
US (1) US5433651A (de)
EP (1) EP0663265B1 (de)
JP (1) JP2561812B2 (de)
DE (1) DE69410772T2 (de)

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US5433651A (en) 1995-07-18
DE69410772D1 (de) 1998-07-09
JP2561812B2 (ja) 1996-12-11
EP0663265B1 (de) 1998-06-03
EP0663265A1 (de) 1995-07-19
JPH07235520A (ja) 1995-09-05

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