DE69411914T2 - Pixelanordnung, welche die bilderzeugenden pixelelemente integral mit den peripheren schaltkreiselementen hat - Google Patents

Pixelanordnung, welche die bilderzeugenden pixelelemente integral mit den peripheren schaltkreiselementen hat

Info

Publication number
DE69411914T2
DE69411914T2 DE69411914T DE69411914T DE69411914T2 DE 69411914 T2 DE69411914 T2 DE 69411914T2 DE 69411914 T DE69411914 T DE 69411914T DE 69411914 T DE69411914 T DE 69411914T DE 69411914 T2 DE69411914 T2 DE 69411914T2
Authority
DE
Germany
Prior art keywords
elements
pixel
integral
image
peripheral circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69411914T
Other languages
English (en)
Other versions
DE69411914D1 (de
Inventor
Donald Sauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Digital Imaging Systems GmbH
Original Assignee
Sarnoff Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sarnoff Corp filed Critical Sarnoff Corp
Publication of DE69411914D1 publication Critical patent/DE69411914D1/de
Application granted granted Critical
Publication of DE69411914T2 publication Critical patent/DE69411914T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/767—Horizontal readout lines, multiplexers or registers

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Facsimile Heads (AREA)
DE69411914T 1993-05-28 1994-05-27 Pixelanordnung, welche die bilderzeugenden pixelelemente integral mit den peripheren schaltkreiselementen hat Expired - Fee Related DE69411914T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/068,340 US5336879A (en) 1993-05-28 1993-05-28 Pixel array having image forming pixel elements integral with peripheral circuit elements
PCT/US1994/005801 WO1994028583A1 (en) 1993-05-28 1994-05-27 Pixel array having image forming pixel elements integral with peripheral circuit elements

Publications (2)

Publication Number Publication Date
DE69411914D1 DE69411914D1 (de) 1998-08-27
DE69411914T2 true DE69411914T2 (de) 1999-03-04

Family

ID=22081937

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69411914T Expired - Fee Related DE69411914T2 (de) 1993-05-28 1994-05-27 Pixelanordnung, welche die bilderzeugenden pixelelemente integral mit den peripheren schaltkreiselementen hat

Country Status (6)

Country Link
US (1) US5336879A (de)
EP (1) EP0700582B1 (de)
JP (1) JP3552233B2 (de)
DE (1) DE69411914T2 (de)
ES (1) ES2119208T3 (de)
WO (1) WO1994028583A1 (de)

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US6498592B1 (en) 1999-02-16 2002-12-24 Sarnoff Corp. Display tile structure using organic light emitting materials
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US6795367B1 (en) * 2000-05-16 2004-09-21 Micron Technology, Inc. Layout technique for address signal lines in decoders including stitched blocks
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US6717151B2 (en) * 2000-07-10 2004-04-06 Canon Kabushiki Kaisha Image pickup apparatus
JP2002112117A (ja) * 2000-09-27 2002-04-12 Sakai Yasue 固体撮像装置およびシステム、相関二重サンプリング回路
JP4089340B2 (ja) * 2001-08-02 2008-05-28 セイコーエプソン株式会社 電子装置、電気光学装置及び電子機器
JP4209606B2 (ja) * 2001-08-17 2009-01-14 株式会社半導体エネルギー研究所 半導体装置の作製方法
GB0120110D0 (en) 2001-08-17 2001-10-10 Koninkl Philips Electronics Nv Active matrix liquid crystal display
JP4681774B2 (ja) * 2001-08-30 2011-05-11 キヤノン株式会社 撮像素子、その撮像素子を用いた撮像装置、及びその撮像装置を用いた撮像システム
TWI282126B (en) * 2001-08-30 2007-06-01 Semiconductor Energy Lab Method for manufacturing semiconductor device
US7317205B2 (en) * 2001-09-10 2008-01-08 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method of manufacturing a semiconductor device
US7112517B2 (en) * 2001-09-10 2006-09-26 Semiconductor Energy Laboratory Co., Ltd. Laser treatment device, laser treatment method, and semiconductor device fabrication method
US7138696B2 (en) 2001-10-19 2006-11-21 Canon Kabushiki Kaisha Image pickup apparatus, radiation image pickup apparatus and radiation image pickup system
US7205526B2 (en) * 2003-12-22 2007-04-17 Micron Technology, Inc. Methods of fabricating layered lens structures
CN1654977A (zh) * 2004-02-10 2005-08-17 西门子公司 用于x射线计算机层析摄影仪中的探测器模块和探测器
US7634061B1 (en) * 2004-03-26 2009-12-15 Nova R & D, Inc. High resolution imaging system
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US8054371B2 (en) * 2007-02-19 2011-11-08 Taiwan Semiconductor Manufacturing Company, Ltd. Color filter for image sensor
US7615754B2 (en) * 2007-03-08 2009-11-10 Fairchild Imaging, Inc. Compact CMOS-based x-ray detector adapted for dental applications
US7916836B2 (en) * 2007-09-26 2011-03-29 General Electric Company Method and apparatus for flexibly binning energy discriminating data
ATE555505T1 (de) * 2008-02-26 2012-05-15 Soitec Silicon On Insulator Verfahren zur herstellung eines halbleitersubstrats
EP2202795A1 (de) * 2008-12-24 2010-06-30 S.O.I. TEC Silicon Verfahren zur Herstellung eines Halbleitersubstrats und Halbleitersubstrat
CN102109698A (zh) * 2009-12-23 2011-06-29 鸿富锦精密工业（深圳）有限公司 相机模组、液晶显示器及该相机模组的封装方法
US9357972B2 (en) 2012-07-17 2016-06-07 Cyber Medical Imaging, Inc. Intraoral radiographic sensors with cables having increased user comfort and methods of using the same
JP5424371B1 (ja) 2013-05-08 2014-02-26 誠 雫石 固体撮像素子及び撮像装置
JP6188433B2 (ja) 2013-06-07 2017-08-30 浜松ホトニクス株式会社 固体撮像装置
US9571765B2 (en) 2015-06-25 2017-02-14 General Electric Company Universal four-side buttable digital CMOS imager
US10283557B2 (en) 2015-12-31 2019-05-07 General Electric Company Radiation detector assembly
US10686003B2 (en) * 2015-12-31 2020-06-16 General Electric Company Radiation detector assembly
JP6255527B1 (ja) * 2017-08-01 2017-12-27 浜松ホトニクス株式会社 固体撮像装置
GB2574619B (en) 2018-06-12 2022-10-12 Res & Innovation Uk Image sensor

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Also Published As

Publication number Publication date
JPH08510883A (ja) 1996-11-12
WO1994028583A1 (en) 1994-12-08
DE69411914D1 (de) 1998-08-27
JP3552233B2 (ja) 2004-08-11
EP0700582A1 (de) 1996-03-13
US5336879A (en) 1994-08-09
ES2119208T3 (es) 1998-10-01
EP0700582B1 (de) 1998-07-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: DIALOG IMAGING SYSTEMS GMBH, 73230 KIRCHHEIM, DE

8339 Ceased/non-payment of the annual fee