DE69413456D1 - Gehäuse mit einer Anschlussreihe für senkrechte Montierung auf einer Leiterplatte - Google Patents

Gehäuse mit einer Anschlussreihe für senkrechte Montierung auf einer Leiterplatte

Info

Publication number
DE69413456D1
DE69413456D1 DE69413456T DE69413456T DE69413456D1 DE 69413456 D1 DE69413456 D1 DE 69413456D1 DE 69413456 T DE69413456 T DE 69413456T DE 69413456 T DE69413456 T DE 69413456T DE 69413456 D1 DE69413456 D1 DE 69413456D1
Authority
DE
Germany
Prior art keywords
connections
row
housing
circuit board
vertical mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69413456T
Other languages
English (en)
Other versions
DE69413456T2 (de
Inventor
Kazuto Tsuji
Junichi Kasai
Michio Sono
Norio Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE69413456D1 publication Critical patent/DE69413456D1/de
Application granted granted Critical
Publication of DE69413456T2 publication Critical patent/DE69413456T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10696—Single-in-line [SIL] package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
DE69413456T 1993-06-25 1994-03-23 Gehäuse mit einer Anschlussreihe für senkrechte Montierung auf einer Leiterplatte Expired - Fee Related DE69413456T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15572593A JP3253765B2 (ja) 1993-06-25 1993-06-25 半導体装置

Publications (2)

Publication Number Publication Date
DE69413456D1 true DE69413456D1 (de) 1998-10-29
DE69413456T2 DE69413456T2 (de) 1999-02-11

Family

ID=15612108

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69413456T Expired - Fee Related DE69413456T2 (de) 1993-06-25 1994-03-23 Gehäuse mit einer Anschlussreihe für senkrechte Montierung auf einer Leiterplatte

Country Status (5)

Country Link
US (1) US5451815A (de)
EP (1) EP0631312B1 (de)
JP (1) JP3253765B2 (de)
KR (1) KR950002003A (de)
DE (1) DE69413456T2 (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5786985A (en) * 1991-05-31 1998-07-28 Fujitsu Limited Semiconductor device and semiconductor device unit
JP3035403B2 (ja) * 1992-03-09 2000-04-24 富士通株式会社 半導体装置
AU5924196A (en) 1995-05-26 1996-12-11 Rambus Inc. Chip socket assembly and chip file assembly for semiconducto r chips
US20020055285A1 (en) * 1999-12-20 2002-05-09 Rambus, Inc. Chip socket assembly and chip file assembly for semiconductor chips
DE59812350D1 (de) * 1997-04-24 2005-01-13 Tyco Electronics Logistics Ag Anschlussanordnung für eine SMD - fähige Hybridschaltung
JP3996668B2 (ja) 1997-05-27 2007-10-24 富士通株式会社 半導体装置用ソケット
JPH10335374A (ja) * 1997-06-04 1998-12-18 Fujitsu Ltd 半導体装置及び半導体装置モジュール
US6043558A (en) * 1997-09-12 2000-03-28 Micron Technology, Inc. IC packages including separated signal and power supply edge connections, systems and devices including such packages, and methods of connecting such packages
DE19757612C1 (de) * 1997-12-23 1999-07-08 Siemens Ag Hybridschaltung mit einem System zur Wärmeableitung
US6235551B1 (en) 1997-12-31 2001-05-22 Micron Technology, Inc. Semiconductor device including edge bond pads and methods
US6191474B1 (en) 1997-12-31 2001-02-20 Micron Technology, Inc. Vertically mountable interposer assembly and method
US5995378A (en) * 1997-12-31 1999-11-30 Micron Technology, Inc. Semiconductor device socket, assembly and methods
US6342731B1 (en) * 1997-12-31 2002-01-29 Micron Technology, Inc. Vertically mountable semiconductor device, assembly, and methods
US6803656B2 (en) * 1997-12-31 2004-10-12 Micron Technology, Inc. Semiconductor device including combed bond pad opening
US5940277A (en) 1997-12-31 1999-08-17 Micron Technology, Inc. Semiconductor device including combed bond pad opening, assemblies and methods
US6140696A (en) 1998-01-27 2000-10-31 Micron Technology, Inc. Vertically mountable semiconductor device and methods
US6087723A (en) * 1998-03-30 2000-07-11 Micron Technology, Inc. Vertical surface mount assembly and methods
US6147411A (en) 1998-03-31 2000-11-14 Micron Technology, Inc. Vertical surface mount package utilizing a back-to-back semiconductor device module
US6089920A (en) 1998-05-04 2000-07-18 Micron Technology, Inc. Modular die sockets with flexible interconnects for packaging bare semiconductor die
EP1104584A1 (de) * 1998-07-28 2001-06-06 Siemens Aktiengesellschaft Leiterbahnrahmen, platine mit leiterbahnrahmen und verfahren zur herstellung eines leiterbahnrahmens
US6224936B1 (en) 1998-10-07 2001-05-01 Micron Technology, Inc. Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
US6419517B1 (en) 1999-02-26 2002-07-16 Micron Technology, Inc. Apparatus and method for packaging circuits
US6784372B1 (en) * 2000-05-26 2004-08-31 Albert T. Yuen Orthogonal electrical connection using a ball edge array
US6711947B2 (en) * 2001-06-13 2004-03-30 Rem Scientific Enterprises, Inc. Conductive fluid logging sensor and method
US6870261B2 (en) * 2003-02-26 2005-03-22 Comchip Technology Co., Ltd. Discrete circuit component having an up-right circuit die with lateral electrical connections
JP2005005409A (ja) * 2003-06-11 2005-01-06 Matsushita Electric Ind Co Ltd 半導体装置
US20050093896A1 (en) * 2003-11-05 2005-05-05 Beat Stadelmann Remapping signals
US7303443B1 (en) * 2006-10-12 2007-12-04 International Business Machines Corporation Socket and method for compensating for differing coefficients of thermal expansion
US7472477B2 (en) * 2006-10-12 2009-01-06 International Business Machines Corporation Method for manufacturing a socket that compensates for differing coefficients of thermal expansion
US8493744B2 (en) * 2007-04-03 2013-07-23 Tdk Corporation Surface mount devices with minimum lead inductance and methods of manufacturing the same
US7864544B2 (en) * 2007-08-01 2011-01-04 Delphi Technologies, Inc. Printed circuit board assembly
TWI403231B (zh) * 2008-03-11 2013-07-21 Delta Electronics Inc 表面黏著型電路板件模組及其製法
US8703543B2 (en) * 2009-07-14 2014-04-22 Honeywell International Inc. Vertical sensor assembly method
US8344842B1 (en) 2010-01-20 2013-01-01 Vlt, Inc. Vertical PCB surface mount inductors and power converters
DE102015108909B4 (de) * 2015-06-05 2021-02-18 Infineon Technologies Ag Anordnung mehrerer Leistungshalbleiterchips und Verfahren zur Herstellung derselben
JP6451655B2 (ja) * 2016-01-15 2019-01-16 株式会社村田製作所 複合電子部品
US10510636B2 (en) 2017-07-14 2019-12-17 Shindengen Electric Manufacturing Co., Ltd. Electronic module
US11658109B2 (en) 2017-07-14 2023-05-23 Shindengen Electric Manufacturing Co., Ltd. Electronic module
US10321564B2 (en) 2017-11-09 2019-06-11 International Business Machines Corporation Solder assembly of pins to the peripheral end face of a printed circuit board

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Publication number Priority date Publication date Assignee Title
JPS62257756A (ja) * 1986-04-30 1987-11-10 Nec Corp シリコン基板
US5287000A (en) * 1987-10-20 1994-02-15 Hitachi, Ltd. Resin-encapsulated semiconductor memory device useful for single in-line packages
JPH0472750A (ja) * 1990-07-13 1992-03-06 Nec Corp ガラス封止型半導体装置
JPH04243155A (ja) * 1991-01-17 1992-08-31 Nec Corp 混成集積回路装置
JPH04302495A (ja) * 1991-03-29 1992-10-26 Toshiba Lighting & Technol Corp 高周波用集積回路
JPH04354363A (ja) * 1991-05-31 1992-12-08 Fujitsu Ltd 半導体装置ユニット

Also Published As

Publication number Publication date
KR950002003A (ko) 1995-01-04
US5451815A (en) 1995-09-19
JP3253765B2 (ja) 2002-02-04
EP0631312B1 (de) 1998-09-23
DE69413456T2 (de) 1999-02-11
EP0631312A1 (de) 1994-12-28
JPH0738010A (ja) 1995-02-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee