DE69414753D1 - Montagevorrichtung und Verfahren zum Verbinden von miniaturisierten elektronischen Bauteilen mittels Höckerverbindungen - Google Patents

Montagevorrichtung und Verfahren zum Verbinden von miniaturisierten elektronischen Bauteilen mittels Höckerverbindungen

Info

Publication number
DE69414753D1
DE69414753D1 DE69414753T DE69414753T DE69414753D1 DE 69414753 D1 DE69414753 D1 DE 69414753D1 DE 69414753 T DE69414753 T DE 69414753T DE 69414753 T DE69414753 T DE 69414753T DE 69414753 D1 DE69414753 D1 DE 69414753D1
Authority
DE
Germany
Prior art keywords
electronic components
assembly device
miniaturized electronic
bump connections
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69414753T
Other languages
English (en)
Other versions
DE69414753T2 (de
Inventor
Thomas W C O Sony Corp Goodman
Hiroyuki Fujita
Yoshikazu Murakami
Arthur T Murphy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of DE69414753D1 publication Critical patent/DE69414753D1/de
Application granted granted Critical
Publication of DE69414753T2 publication Critical patent/DE69414753T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
DE69414753T 1993-04-08 1994-04-07 Montagevorrichtung und Verfahren zum Verbinden von miniaturisierten elektronischen Bauteilen mittels Höckerverbindungen Expired - Fee Related DE69414753T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5104920A JPH06296080A (ja) 1993-04-08 1993-04-08 電子部品実装基板及び電子部品実装方法

Publications (2)

Publication Number Publication Date
DE69414753D1 true DE69414753D1 (de) 1999-01-07
DE69414753T2 DE69414753T2 (de) 1999-07-01

Family

ID=14393546

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69414753T Expired - Fee Related DE69414753T2 (de) 1993-04-08 1994-04-07 Montagevorrichtung und Verfahren zum Verbinden von miniaturisierten elektronischen Bauteilen mittels Höckerverbindungen

Country Status (4)

Country Link
US (1) US5477419A (de)
EP (1) EP0624053B1 (de)
JP (1) JPH06296080A (de)
DE (1) DE69414753T2 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5790078A (en) * 1993-10-22 1998-08-04 Nec Corporation Superconducting mixer antenna array
FR2734983B1 (fr) * 1995-05-29 1997-07-04 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
FR2734984B1 (fr) * 1995-05-29 1997-08-22 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
US5872051A (en) * 1995-08-02 1999-02-16 International Business Machines Corporation Process for transferring material to semiconductor chip conductive pads using a transfer substrate
US5597110A (en) * 1995-08-25 1997-01-28 Motorola, Inc. Method for forming a solder bump by solder-jetting or the like
US5996222A (en) * 1997-01-16 1999-12-07 Ford Motor Company Soldering process with minimal thermal impact on substrate
US6299055B1 (en) * 1997-05-09 2001-10-09 Lear Automotive Dearborn, Inc. Manufacturing processes of service boxes and their parts
US6162661A (en) * 1997-05-30 2000-12-19 Tessera, Inc. Spacer plate solder ball placement fixture and methods therefor
JP3081559B2 (ja) * 1997-06-04 2000-08-28 ニッコー株式会社 ボールグリッドアレイ型半導体装置およびその製造方法ならびに電子装置
US6082610A (en) 1997-06-23 2000-07-04 Ford Motor Company Method of forming interconnections on electronic modules
US6243944B1 (en) * 1997-12-08 2001-06-12 Unisys Corporation Residue-free method of assembling and disassembling a pressed joint with low thermal resistance
SE511330C2 (sv) * 1997-12-29 1999-09-13 Ericsson Telefon Ab L M Förfarande för framställning av ett kretskort jämte skärmningselement för skärmning av komponenter på ett dylikt kretskort
JP3381601B2 (ja) * 1998-01-26 2003-03-04 松下電器産業株式会社 バンプ付電子部品の実装方法
JP3625646B2 (ja) * 1998-03-23 2005-03-02 東レエンジニアリング株式会社 フリップチップ実装方法
US6189208B1 (en) * 1998-09-11 2001-02-20 Polymer Flip Chip Corp. Flip chip mounting technique
US6410415B1 (en) 1999-03-23 2002-06-25 Polymer Flip Chip Corporation Flip chip mounting technique
JP3539315B2 (ja) * 1999-06-22 2004-07-07 株式会社村田製作所 電子デバイス素子の実装方法、および弾性表面波装置の製造方法
US6519842B2 (en) * 1999-12-10 2003-02-18 Ebara Corporation Method for mounting semiconductor device
JP2001267733A (ja) * 2000-03-17 2001-09-28 Mitsumi Electric Co Ltd はんだ付け方法
US6296169B1 (en) * 2000-06-07 2001-10-02 Advanced Interconnect Solutions Flux-application fixture for a ball-grid-array (BGA) assembly process
JP2002124756A (ja) * 2000-10-18 2002-04-26 Nitto Denko Corp 回路基板および回路基板の端子部の接続構造
US20040084206A1 (en) * 2002-11-06 2004-05-06 I-Chung Tung Fine pad pitch organic circuit board for flip chip joints and board to board solder joints and method
JP4389471B2 (ja) * 2003-05-19 2009-12-24 パナソニック株式会社 電子回路の接続構造とその接続方法
JP2007059652A (ja) * 2005-08-25 2007-03-08 Matsushita Electric Ind Co Ltd 電子部品実装方法
FR2897503B1 (fr) * 2006-02-16 2014-06-06 Valeo Sys Controle Moteur Sas Procede de fabrication d'un module electronique par fixation sequentielle des composants et ligne de production correspondante
JP2008071812A (ja) * 2006-09-12 2008-03-27 Fujikura Ltd 基板間接続構造
JP5534155B2 (ja) * 2009-11-13 2014-06-25 日本電気株式会社 デバイス、及びデバイス製造方法
KR101830193B1 (ko) * 2010-07-02 2018-02-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
CN104737630B (zh) * 2012-10-15 2016-02-03 千住金属工业株式会社 低温焊膏的焊接方法
CN103533753A (zh) * 2013-10-23 2014-01-22 江苏彤明高科汽车电器有限公司 防止器件短路的印刷电路板
CN105323975B (zh) * 2014-07-30 2018-10-12 上海儒竞电子科技有限公司 一种贴片机
CN105007695B (zh) * 2015-07-29 2018-06-19 无锡市同步电子制造有限公司 一种印制板加工中的lga焊接工艺方法
JP6329212B2 (ja) * 2015-09-11 2018-05-23 Ｎｅｃスペーステクノロジー株式会社 鉛半田接合構造及び製造方法
US9877399B2 (en) 2015-09-11 2018-01-23 Nec Space Technologies, Ltd. Lead solder joint structure and manufacturing method thereof
US20190247944A1 (en) * 2018-02-11 2019-08-15 Powertech Technology Inc. Flux transfer method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4914814A (en) * 1989-05-04 1990-04-10 International Business Machines Corporation Process of fabricating a circuit package
US5186383A (en) * 1991-10-02 1993-02-16 Motorola, Inc. Method for forming solder bump interconnections to a solder-plated circuit trace

Also Published As

Publication number Publication date
JPH06296080A (ja) 1994-10-21
EP0624053B1 (de) 1998-11-25
EP0624053A3 (de) 1995-01-11
DE69414753T2 (de) 1999-07-01
US5477419A (en) 1995-12-19
EP0624053A2 (de) 1994-11-09

Similar Documents

Publication Publication Date Title
DE69414753T2 (de) Montagevorrichtung und Verfahren zum Verbinden von miniaturisierten elektronischen Bauteilen mittels Höckerverbindungen
DE69306493T2 (de) Verfahren zum Montieren von Chip-Bauteilen und Gerät dafür
DE69305426D1 (de) Verfahren zum Montieren von Bauteilen und Vorrichtung dafür
DE69300850D1 (de) Verfahren zum Montieren von Komponenten und Vorrichtung dafür.
DE69401233D1 (de) Kapillar für ein Drahtschweissgerät und Verfahren zum Formen von elektrischen Verbindungshöckern mittels Kapillares
DE69839866D1 (de) Verfahren zum empfangen von faksimile und elektronischer post via internet
DE69300853D1 (de) Verfahren zum Montieren von Bauteilen und Vorrichtung dafür.
DE3884039D1 (de) Verbindungsverfahren zum Testen und Montieren von elektronischen Bauelementen.
DE69712174T2 (de) Lot für elektroden zum verbinden von elektronischen teilen und lötverfahren
DE69432377D1 (de) Verfahren und Gerät zum Verbinden von Metallstücken
DE69637838D1 (de) System und Verfahren zur Beschichtung der Unterseite von Flip-Chips
DE59302702D1 (de) Vorrichtung und verfahren zum auflöten von bauelementen auf platinen
DE69125571T2 (de) Verfahren und Apparat zum Prüfen der Verlötung von Halbleiterbauteilen durch den Nachweis von Leckstrom
DE69010561T2 (de) Verfahren and Apparat zum Verbinden elektrischer Bauelemente mittels Lötelementen.
DE69205217D1 (de) Vorrichtung und Verfahren zum Zusammenbau von Schaltungsstrukturen.
DE69125311T2 (de) Verfahren und Gerät zum Testen von Delta-Sigma-Modulatoren
DE69724194D1 (de) Verfahren und Vorrichtung zum Aufbringen von Lötflux auf Leiterplatten
DE59802650D1 (de) Verfahren und vorrichtung zum erzeugen von testpattern beim lotpastenauftrag mittels siebdruckverfahrens auf leiterplatten
DE69506585D1 (de) Verfahren und gerät zur prüfung von halbleiterplatten
DK0696381T3 (da) Fremgangsmåde til indretning til kontaktetableringfra viklegods til tilslutningselementer
DE69304493T2 (de) Verfahren und Gerät zum Montieren von Verbindern
DE69816763D1 (de) Verfahren und Vorrichtung zum Zusammenfügen von ausgerichteten Gegenständen mittels Klebebändern
DE69412175D1 (de) Lötverfahren und Apparat zum Verbinden elektronischer Schaltungsanordnungen
DE9420460U1 (de) Vorrichtung zum Abdichten von Fugen zwischen starren Bauelementen
FI972083A (fi) Menetelmä ja laite elektronisten komponenttien testaamiseen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee