DE69416905T2 - Herstellungsverfahren für eine selbstjustierende optische Baugruppe - Google Patents
Herstellungsverfahren für eine selbstjustierende optische BaugruppeInfo
- Publication number
- DE69416905T2 DE69416905T2 DE69416905T DE69416905T DE69416905T2 DE 69416905 T2 DE69416905 T2 DE 69416905T2 DE 69416905 T DE69416905 T DE 69416905T DE 69416905 T DE69416905 T DE 69416905T DE 69416905 T2 DE69416905 T2 DE 69416905T2
- Authority
- DE
- Germany
- Prior art keywords
- self
- manufacturing process
- optical assembly
- adjusting optical
- adjusting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
- G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/3085—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by their behaviour during the process, e.g. soluble masks, redeposited masks
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/071,427 US5550088A (en) | 1993-06-02 | 1993-06-02 | Fabrication process for a self-aligned optical subassembly |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69416905D1 DE69416905D1 (de) | 1999-04-15 |
DE69416905T2 true DE69416905T2 (de) | 1999-10-28 |
Family
ID=22101255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69416905T Expired - Fee Related DE69416905T2 (de) | 1993-06-02 | 1994-05-25 | Herstellungsverfahren für eine selbstjustierende optische Baugruppe |
Country Status (4)
Country | Link |
---|---|
US (1) | US5550088A (de) |
EP (1) | EP0635876B1 (de) |
JP (1) | JP3268120B2 (de) |
DE (1) | DE69416905T2 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5851928A (en) * | 1995-11-27 | 1998-12-22 | Motorola, Inc. | Method of etching a semiconductor substrate |
US5793913A (en) * | 1996-07-10 | 1998-08-11 | Northern Telecom Limited | Method for the hybrid integration of discrete elements on a semiconductor substrate |
US5935451A (en) * | 1997-02-24 | 1999-08-10 | Lucent Technologies Inc. | Fabrication of etched features |
US6265240B1 (en) * | 1998-03-24 | 2001-07-24 | Lucent Technologies, Inc. | Method and apparatus for passively aligning components on semiconductor dies |
US6258403B1 (en) | 1999-09-16 | 2001-07-10 | Lucent Technologies, Inc. | Method for coating facet edges of an optoelectrical device |
US6325551B1 (en) | 1999-12-08 | 2001-12-04 | New Focus, Inc. | Method and apparatus for optically aligning optical fibers with optical devices |
US6632029B1 (en) | 1999-12-22 | 2003-10-14 | New Focus, Inc. | Method & apparatus for packaging high frequency components |
US6480661B2 (en) | 2000-03-03 | 2002-11-12 | The Whitaker Corporation | Optical ADD/DROP filter and method of making same |
US6811853B1 (en) | 2000-03-06 | 2004-11-02 | Shipley Company, L.L.C. | Single mask lithographic process for patterning multiple types of surface features |
US6627096B2 (en) | 2000-05-02 | 2003-09-30 | Shipley Company, L.L.C. | Single mask technique for making positive and negative micromachined features on a substrate |
US6477303B1 (en) | 2000-05-15 | 2002-11-05 | Litton Systems, Inc. | MEMS optical backplane interface |
US7086134B2 (en) * | 2000-08-07 | 2006-08-08 | Shipley Company, L.L.C. | Alignment apparatus and method for aligning stacked devices |
US6737223B2 (en) * | 2000-08-07 | 2004-05-18 | Shipley Company, L.L.C. | Fiber optic chip with lenslet array and method of fabrication |
EP1186916A1 (de) | 2000-09-06 | 2002-03-13 | Corning Incorporated | Herstellung von Gittern in Bauteilen mit planaren Wellenleitern |
US6841486B2 (en) * | 2000-10-06 | 2005-01-11 | Tyco Electronics Corporation | Optical substrate having alignment fiducials |
US6754427B2 (en) * | 2001-02-08 | 2004-06-22 | Shipley Company, L.L.C. | Method and device passively locating a fiber stub in a groove |
US6956999B2 (en) | 2001-02-20 | 2005-10-18 | Cyberoptics Corporation | Optical device |
US6443631B1 (en) | 2001-02-20 | 2002-09-03 | Avanti Optics Corporation | Optical module with solder bond |
US6546173B2 (en) * | 2001-02-20 | 2003-04-08 | Avanti Optics Corporation | Optical module |
US20040212802A1 (en) * | 2001-02-20 | 2004-10-28 | Case Steven K. | Optical device with alignment compensation |
US6546172B2 (en) | 2001-02-20 | 2003-04-08 | Avanti Optics Corporation | Optical device |
US6721479B2 (en) * | 2001-03-07 | 2004-04-13 | Zygo Corporation | Fiber collimator |
KR100416762B1 (ko) * | 2001-05-08 | 2004-01-31 | 삼성전자주식회사 | 광학 모듈 및 그 제조 방법 |
GB0201969D0 (en) * | 2002-01-29 | 2002-03-13 | Qinetiq Ltd | Integrated optics devices |
KR20030065908A (ko) * | 2002-02-01 | 2003-08-09 | 주식회사 옵토*온 | 수동 및 능동정렬이 가능한 실리콘광학테이블 |
KR100442615B1 (ko) * | 2002-03-05 | 2004-08-02 | 삼성전자주식회사 | 정전용량 감소를 위한 적층구조 및 그 제조방법 |
WO2004019094A1 (en) * | 2002-08-20 | 2004-03-04 | Cyberoptics Corporation | Optical alignment mount with height adjustment |
US7688689B2 (en) * | 2004-02-26 | 2010-03-30 | Seagate Technology Llc | Head with optical bench for use in data storage devices |
TWI251355B (en) * | 2004-12-22 | 2006-03-11 | Opto Tech Corp | A LED array package structure and method thereof |
US7985681B2 (en) * | 2007-06-22 | 2011-07-26 | Micron Technology, Inc. | Method for selectively forming symmetrical or asymmetrical features using a symmetrical photomask during fabrication of a semiconductor device and electronic systems including the semiconductor device |
US8515221B2 (en) * | 2010-01-25 | 2013-08-20 | Axsun Technologies, Inc. | Silicon optical bench OCT probe for medical imaging |
EP2572219A4 (de) | 2010-05-21 | 2017-05-03 | Kaiam Corp. | Mems-basierte hebel und ihre verwendung zur ausrichtung optischer elemente |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4765865A (en) * | 1987-05-04 | 1988-08-23 | Ford Motor Company | Silicon etch rate enhancement |
US4810557A (en) * | 1988-03-03 | 1989-03-07 | American Telephone And Telegraph Company, At&T Bell Laboratories | Method of making an article comprising a tandem groove, and article produced by the method |
US4863560A (en) * | 1988-08-22 | 1989-09-05 | Xerox Corp | Fabrication of silicon structures by single side, multiple step etching process |
DE58909602D1 (de) * | 1989-09-22 | 1996-03-21 | Siemens Ag | Verfahren zum anisotropen Ätzen von Silizium |
US4957592A (en) * | 1989-12-27 | 1990-09-18 | Xerox Corporation | Method of using erodable masks to produce partially etched structures in ODE wafer structures |
US5131978A (en) * | 1990-06-07 | 1992-07-21 | Xerox Corporation | Low temperature, single side, multiple step etching process for fabrication of small and large structures |
US5113404A (en) * | 1990-07-05 | 1992-05-12 | At&T Bell Laboratories | Silicon-based optical subassembly |
US5123073A (en) * | 1991-05-31 | 1992-06-16 | At&T Bell Laboratories | Precision optical fiber connector |
US5257332A (en) * | 1992-09-04 | 1993-10-26 | At&T Bell Laboratories | Optical fiber expanded beam coupler |
-
1993
- 1993-06-02 US US08/071,427 patent/US5550088A/en not_active Expired - Lifetime
-
1994
- 1994-05-25 DE DE69416905T patent/DE69416905T2/de not_active Expired - Fee Related
- 1994-05-25 EP EP94303766A patent/EP0635876B1/de not_active Expired - Lifetime
- 1994-06-02 JP JP12046194A patent/JP3268120B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH07168044A (ja) | 1995-07-04 |
JP3268120B2 (ja) | 2002-03-25 |
EP0635876A1 (de) | 1995-01-25 |
EP0635876B1 (de) | 1999-03-10 |
DE69416905D1 (de) | 1999-04-15 |
US5550088A (en) | 1996-08-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |