DE69418122D1 - Speiseleitungen-Anordnung einer Halbleitervorrichtung - Google Patents

Speiseleitungen-Anordnung einer Halbleitervorrichtung

Info

Publication number
DE69418122D1
DE69418122D1 DE69418122T DE69418122T DE69418122D1 DE 69418122 D1 DE69418122 D1 DE 69418122D1 DE 69418122 T DE69418122 T DE 69418122T DE 69418122 T DE69418122 T DE 69418122T DE 69418122 D1 DE69418122 D1 DE 69418122D1
Authority
DE
Germany
Prior art keywords
semiconductor device
feed line
line arrangement
arrangement
feed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69418122T
Other languages
English (en)
Other versions
DE69418122T2 (de
Inventor
Kazumasa Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE69418122D1 publication Critical patent/DE69418122D1/de
Application granted granted Critical
Publication of DE69418122T2 publication Critical patent/DE69418122T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
    • H01L27/0218—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of field effect structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69418122T 1993-09-13 1994-09-12 Speiseleitungen-Anordnung einer Halbleitervorrichtung Expired - Fee Related DE69418122T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5227380A JP2919241B2 (ja) 1993-09-13 1993-09-13 電源配線

Publications (2)

Publication Number Publication Date
DE69418122D1 true DE69418122D1 (de) 1999-06-02
DE69418122T2 DE69418122T2 (de) 1999-11-25

Family

ID=16859908

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69418122T Expired - Fee Related DE69418122T2 (de) 1993-09-13 1994-09-12 Speiseleitungen-Anordnung einer Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US5598029A (de)
EP (1) EP0644594B1 (de)
JP (1) JP2919241B2 (de)
DE (1) DE69418122T2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2287363B (en) * 1994-03-08 1997-12-17 Control Tech Plc Suppression of radio frequency emissions
JP3432963B2 (ja) * 1995-06-15 2003-08-04 沖電気工業株式会社 半導体集積回路
JPH1012825A (ja) * 1996-06-26 1998-01-16 Oki Electric Ind Co Ltd 半導体集積回路装置
US5789791A (en) * 1996-08-27 1998-08-04 National Semiconductor Corporation Multi-finger MOS transistor with reduced gate resistance
US5789807A (en) * 1996-10-15 1998-08-04 International Business Machines Corporation On-chip power distribution for improved decoupling
JPH10284605A (ja) * 1997-04-08 1998-10-23 Mitsubishi Electric Corp 半導体集積回路およびセルベース方式によりレイアウト設計された半導体集積回路
US5917230A (en) * 1997-04-09 1999-06-29 United Memories, Inc. Filter capacitor construction
US6147857A (en) * 1997-10-07 2000-11-14 E. R. W. Optional on chip power supply bypass capacitor
US6146939A (en) * 1998-09-18 2000-11-14 Tritech Microelectronics, Ltd. Metal-polycrystalline silicon-N-well multiple layered capacitor
JP2002532903A (ja) * 1998-12-16 2002-10-02 インフィネオン テクノロジース アクチエンゲゼルシャフト 容量性素子を有する集積回路
JP3522144B2 (ja) * 1999-02-25 2004-04-26 富士通株式会社 容量回路および半導体集積回路装置
EP1071130A3 (de) * 1999-07-14 2005-09-07 Matsushita Electric Industrial Co., Ltd. Verbindungsleiterstruktur für Halbleitervorrichtung mit zusätzlichen Kapazitäten
US6384468B1 (en) 2000-02-07 2002-05-07 International Business Machines Corporation Capacitor and method for forming same
US6362972B1 (en) 2000-04-13 2002-03-26 Molex Incorporated Contactless interconnection system
US6612852B1 (en) 2000-04-13 2003-09-02 Molex Incorporated Contactless interconnection system
JP2002098736A (ja) * 2000-09-26 2002-04-05 Nec Corp 半導体デバイス試験装置
US7170115B2 (en) * 2000-10-17 2007-01-30 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit device and method of producing the same
JP3906809B2 (ja) * 2002-04-08 2007-04-18 日本電気株式会社 線路素子及び半導体回路
EP1369922B1 (de) * 2002-06-07 2011-03-09 STMicroelectronics Srl Mehrschichtige Metallstruktur eines Spannungsversorgungsringes mit großem parasitärem Widerstand
JP4935071B2 (ja) 2003-02-14 2012-05-23 日本電気株式会社 線路素子および線路素子を適用した半導体回路
US6800923B1 (en) * 2003-04-25 2004-10-05 Oki Electric Industry Co., Ltd. Multilayer analog interconnecting line layout for a mixed-signal integrated circuit
US7098523B2 (en) * 2003-12-11 2006-08-29 International Business Machines Corporation Controlled leakage CMOS decoupling capacitor for application specific integrated circuit libraries
US20070235496A1 (en) * 2006-04-07 2007-10-11 Yoganandan Sundar A L N Multi-orifice collet for a pick-and-place machine
US9070670B2 (en) 2009-01-29 2015-06-30 International Rectifier Corporation Electrical connectivity of die to a host substrate
US8692360B1 (en) * 2010-07-06 2014-04-08 International Rectifier Corporation Electrical connectivity for circuit applications
US8581343B1 (en) * 2010-07-06 2013-11-12 International Rectifier Corporation Electrical connectivity for circuit applications

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60192359A (ja) * 1984-03-14 1985-09-30 Nec Corp 半導体メモリ装置
US4737830A (en) * 1986-01-08 1988-04-12 Advanced Micro Devices, Inc. Integrated circuit structure having compensating means for self-inductance effects
JPS62237756A (ja) * 1986-04-08 1987-10-17 New Japan Radio Co Ltd Ｍｏｓ集積回路
JPH0789568B2 (ja) * 1986-06-19 1995-09-27 日本電気株式会社 集積回路装置
JPS6465864A (en) * 1987-09-04 1989-03-13 Mitsubishi Electric Corp Semiconductor integrated circuit device
JPH02144936A (ja) * 1988-11-28 1990-06-04 Hitachi Ltd 半導体集積回路装置
JPH05198742A (ja) * 1992-01-20 1993-08-06 Nec Ic Microcomput Syst Ltd 半導体集積回路装置

Also Published As

Publication number Publication date
EP0644594A1 (de) 1995-03-22
JPH0786513A (ja) 1995-03-31
JP2919241B2 (ja) 1999-07-12
EP0644594B1 (de) 1999-04-28
US5598029A (en) 1997-01-28
DE69418122T2 (de) 1999-11-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee