DE69427989D1 - Verfahren und vorrichtung zur prüfung von leiterplatten mit verschiedenen vergrösserungen - Google Patents

Verfahren und vorrichtung zur prüfung von leiterplatten mit verschiedenen vergrösserungen

Info

Publication number
DE69427989D1
DE69427989D1 DE69427989T DE69427989T DE69427989D1 DE 69427989 D1 DE69427989 D1 DE 69427989D1 DE 69427989 T DE69427989 T DE 69427989T DE 69427989 T DE69427989 T DE 69427989T DE 69427989 D1 DE69427989 D1 DE 69427989D1
Authority
DE
Germany
Prior art keywords
printed circuit
circuit board
inspection
inspection system
size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69427989T
Other languages
English (en)
Other versions
DE69427989T2 (de
Inventor
Harold Wasserman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Control Automation Inc
Original Assignee
Control Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Control Automation Inc filed Critical Control Automation Inc
Publication of DE69427989D1 publication Critical patent/DE69427989D1/de
Application granted granted Critical
Publication of DE69427989T2 publication Critical patent/DE69427989T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
DE69427989T 1993-11-03 1994-11-03 Verfahren und vorrichtung zur prüfung von leiterplatten mit verschiedenen vergrösserungen Expired - Fee Related DE69427989T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/147,342 US5517235A (en) 1993-11-03 1993-11-03 Method and apparatus for inspecting printed circuit boards at different magnifications
PCT/US1994/012703 WO1995012952A1 (en) 1993-11-03 1994-11-03 Method and apparatus for inspecting printed circuit boards at different magnifications

Publications (2)

Publication Number Publication Date
DE69427989D1 true DE69427989D1 (de) 2001-09-20
DE69427989T2 DE69427989T2 (de) 2002-04-11

Family

ID=22521186

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69427989T Expired - Fee Related DE69427989T2 (de) 1993-11-03 1994-11-03 Verfahren und vorrichtung zur prüfung von leiterplatten mit verschiedenen vergrösserungen

Country Status (6)

Country Link
US (1) US5517235A (de)
EP (1) EP0728399B1 (de)
AT (1) ATE204424T1 (de)
CA (1) CA2175696A1 (de)
DE (1) DE69427989T2 (de)
WO (1) WO1995012952A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5442443A (en) * 1993-04-08 1995-08-15 Polaroid Corporation Stereoscopic photon tunneling microscope
KR0168243B1 (ko) * 1994-12-19 1999-05-01 다떼이시 요시오 관측 영역 설정 방법 및 그 장치와, 이 관측 영역 설정 방법을 이용한 외관 검사 방법 및 그 장치
US5739846A (en) * 1996-02-05 1998-04-14 Universal Instruments Corporation Method of inspecting component placement accuracy for each first selected circuit board to be assembled of a batch
IE80676B1 (en) * 1996-08-02 1998-11-18 M V Research Limited A measurement system
US6075883A (en) * 1996-11-12 2000-06-13 Robotic Vision Systems, Inc. Method and system for imaging an object or pattern
US5760893A (en) * 1996-12-24 1998-06-02 Teradyne, Inc. Method and apparatus for inspecting component placement and solder connection in printed circuit board manufacture
JPH10267628A (ja) * 1997-01-23 1998-10-09 Hitachi Ltd ３次元形状検出方法およびその装置並びに基板の製造方法
US5862973A (en) * 1997-01-30 1999-01-26 Teradyne, Inc. Method for inspecting solder paste in printed circuit board manufacture
US5995648A (en) * 1997-03-18 1999-11-30 Cognex Corporation Image processing system and method using subsampling with constraints such as time and uncertainty constraints
US6084663A (en) * 1997-04-07 2000-07-04 Hewlett-Packard Company Method and an apparatus for inspection of a printed circuit board assembly
EP0871027A3 (de) * 1997-04-07 1999-05-19 Hewlett-Packard Company Prüfung gedruckter Leiterplatten
US6381355B1 (en) 1997-08-19 2002-04-30 The Hong Kong University Of Science And Technology Inspection method for comparison of articles
US6061086A (en) * 1997-09-11 2000-05-09 Canopular East Inc. Apparatus and method for automated visual inspection of objects
US6674888B1 (en) * 1998-02-27 2004-01-06 Applied Materials, Inc. Tuning method for a processing machine
DE10025751A1 (de) * 2000-05-24 2001-12-06 Atg Test Systems Gmbh Verfahren zum Untersuchen einer leiterplatte an einem vorbestimmten Bereich der Leiterplatte und Vorrichtung zum Durchführen des Verfahrens
US6963076B1 (en) * 2000-07-31 2005-11-08 Xerox Corporation System and method for optically sensing defects in OPC devices
US20030031596A1 (en) * 2001-08-09 2003-02-13 Yokogawa Electric Corporation Biochip reader and fluorometric imaging apparatus
JP4179079B2 (ja) * 2002-08-30 2008-11-12 株式会社ニコン 電子カメラ及びその制御プログラム
US6996264B2 (en) * 2002-10-18 2006-02-07 Leco Corporation Indentation hardness test system
US20040150822A1 (en) * 2003-01-30 2004-08-05 Samsung Electronics Co., Ltd. Soldering inspection apparatus
US7869645B2 (en) * 2008-07-22 2011-01-11 Seiko Epson Corporation Image capture and calibratiion
US8090184B2 (en) 2008-07-23 2012-01-03 Seiko Epson Corporation Fault detection of a printed dot-pattern bitmap
US8269836B2 (en) * 2008-07-24 2012-09-18 Seiko Epson Corporation Image capture, alignment, and registration
KR101445625B1 (ko) 2008-12-10 2014-10-07 어플라이드 머티어리얼스, 인코포레이티드 스크린 프린팅 패턴 정렬을 위한 향상된 비젼 시스템
US11610390B2 (en) * 2019-05-15 2023-03-21 Getac Technology Corporation System for detecting surface type of object and artificial neural network-based method for detecting surface type of object

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4160263A (en) * 1978-05-15 1979-07-03 George R. Cogar Dual or multiple objective video microscope for superimposing spaced images
US4389669A (en) * 1981-02-27 1983-06-21 Ilc Data Device Corporation Opto-video inspection system
US4485409A (en) * 1982-03-29 1984-11-27 Measuronics Corporation Data acquisition system for large format video display
US4673988A (en) * 1985-04-22 1987-06-16 E.I. Du Pont De Nemours And Company Electronic mosaic imaging process
US4978220A (en) * 1988-03-04 1990-12-18 Cimflex Teknowledge Corporation Compensating system for inspecting potentially warped printed circuit boards
US5060065A (en) * 1990-02-23 1991-10-22 Cimflex Teknowledge Corporation Apparatus and method for illuminating a printed circuit board for inspection
US5245421A (en) * 1990-09-19 1993-09-14 Control Automation, Incorporated Apparatus for inspecting printed circuit boards with surface mounted components

Also Published As

Publication number Publication date
WO1995012952A1 (en) 1995-05-11
EP0728399B1 (de) 2001-08-16
EP0728399A1 (de) 1996-08-28
US5517235A (en) 1996-05-14
DE69427989T2 (de) 2002-04-11
CA2175696A1 (en) 1995-05-11
ATE204424T1 (de) 2001-09-15
EP0728399A4 (de) 1996-07-10

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Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Representative=s name: HEBING, N., DIPL.-PHYS., PAT.-ANW., 61231 BAD NAUH

8339 Ceased/non-payment of the annual fee