DE69435230D1 - Verbundfolie mit schaltungsförmiger Metallfolie oder dergleichen und Verfahren zur Herstellung - Google Patents

Verbundfolie mit schaltungsförmiger Metallfolie oder dergleichen und Verfahren zur Herstellung

Info

Publication number
DE69435230D1
DE69435230D1 DE69435230T DE69435230T DE69435230D1 DE 69435230 D1 DE69435230 D1 DE 69435230D1 DE 69435230 T DE69435230 T DE 69435230T DE 69435230 T DE69435230 T DE 69435230T DE 69435230 D1 DE69435230 D1 DE 69435230D1
Authority
DE
Germany
Prior art keywords
circuit
metallic foil
laminate
support
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69435230T
Other languages
English (en)
Inventor
Shinya Uchibori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyake Inc
Original Assignee
Miyake Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5354105A external-priority patent/JP2899781B2/ja
Application filed by Miyake Inc filed Critical Miyake Inc
Application granted granted Critical
Publication of DE69435230D1 publication Critical patent/DE69435230D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/0672—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with resonating marks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Burglar Alarm Systems (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69435230T 1993-12-30 1994-12-30 Verbundfolie mit schaltungsförmiger Metallfolie oder dergleichen und Verfahren zur Herstellung Expired - Lifetime DE69435230D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5354105A JP2899781B2 (ja) 1993-12-30 1993-12-30 共振タグ
JP32350694 1994-12-01

Publications (1)

Publication Number Publication Date
DE69435230D1 true DE69435230D1 (de) 2009-10-01

Family

ID=26571214

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69435230T Expired - Lifetime DE69435230D1 (de) 1993-12-30 1994-12-30 Verbundfolie mit schaltungsförmiger Metallfolie oder dergleichen und Verfahren zur Herstellung

Country Status (4)

Country Link
US (1) US5645932A (de)
EP (1) EP0665705B1 (de)
AT (1) ATE440480T1 (de)
DE (1) DE69435230D1 (de)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5751256A (en) * 1994-03-04 1998-05-12 Flexcon Company Inc. Resonant tag labels and method of making same
US5945201A (en) * 1995-10-25 1999-08-31 Holat; Barry Holographic identifier for garments
DE19548421B4 (de) * 1995-12-22 2004-06-03 Celanese Ventures Gmbh Verfahren zur kontinuierlichen Herstellung von Membranelektrodeneinheiten
DE59706903D1 (de) * 1996-11-04 2002-05-08 Meto International Gmbh Sicherungselement für die elektronische artikelüberwachung
US6222452B1 (en) * 1996-12-16 2001-04-24 Confidence International Ab Electronic identification tag
EP0901745A1 (de) * 1997-02-21 1999-03-17 Koninklijke Philips Electronics N.V. Ein verfahren zum selektiven metallisieren eines substratesunter verwendung einheissfolienstanztechnik
WO1999008245A1 (en) * 1997-08-08 1999-02-18 Ird A/S Polymeric radio frequency resonant tags and method for manufacture
EP1051885A1 (de) * 1998-02-06 2000-11-15 FLEXcon Company, Inc. Übertragbare dünnschichtige elektronische komponenten
US6618939B2 (en) * 1998-02-27 2003-09-16 Kabushiki Kaisha Miyake Process for producing resonant tag
EP0967568B1 (de) * 1998-06-23 2006-08-30 Meto International GmbH Identifizierungselement
AU765772B2 (en) * 1999-01-23 2003-09-25 J & J Cash Limited Security and garment label
DE19905886A1 (de) * 1999-02-11 2000-08-17 Meto International Gmbh Identifizierungselement und Verfahren zur Herstellung eines Identifizierungselements
ATE312391T1 (de) * 1999-06-21 2005-12-15 Bent Thorning Bensen As Resonanzdetektorschaltung, produktionsweise und gebrauch
DE19932597C1 (de) * 1999-07-13 2000-10-05 Bolta Werke Gmbh Flächenelement mit einer strukturierten Metallschicht
US6177871B1 (en) * 1999-07-28 2001-01-23 Westvaco Corporation RF-EAS tag with resonance frequency tuning
DE19951561A1 (de) * 1999-10-27 2001-05-03 Meto International Gmbh Sicherungselement für die elektronischen Artikelsicherung
US6275156B1 (en) * 2000-02-07 2001-08-14 Westvaco Corporation EAS ready paperboard
US20010011948A1 (en) * 2000-02-07 2001-08-09 Rasband Paul B. Method of manufacturing resonant circuit devices
ATE229886T1 (de) * 2000-03-02 2003-01-15 Gerber Scient Products Inc Verfahren und vorrichtung zur herstellung eines graphischen produkts
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US7017820B1 (en) 2001-02-08 2006-03-28 James Brunner Machine and process for manufacturing a label with a security element
EP1397946A1 (de) 2001-04-02 2004-03-17 Nashua Corporation Schaltungselemente mit einer eingebetteten leiterbahn und verfahren zur herstellung
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US6988666B2 (en) * 2001-09-17 2006-01-24 Checkpoint Systems, Inc. Security tag and process for making same
US7524528B2 (en) * 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
EP1444055A4 (de) * 2001-10-19 2007-04-18 Superior Micropowders Llc Bandförmige zusammensetzungen zur ablagerung elektronischer strukturen
EP1318706A1 (de) * 2001-12-07 2003-06-11 Horst J. Lindemann GmbH Verfahren und Vorrichtung zur Herstellung von elektrisch leitfähigen Mustern auf Trägern, sowie Folien dazu
EP1383364A3 (de) * 2002-05-23 2006-01-04 Nashua Corporation Schaltungselemente mit tintenaufnehmender Beschichtung und einer Leiterbahn und Verfahren zu deren Herstellung
US20050003169A1 (en) * 2003-01-28 2005-01-06 Nobuyuki Ikeguchi Lubricant sheet for drilling and method of drilling
US7253735B2 (en) * 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
JP2004314307A (ja) * 2003-04-11 2004-11-11 Fuji Photo Film Co Ltd 情報表示の記録方法
US7694883B2 (en) * 2003-05-01 2010-04-13 Brother Kogyo Kabushiki Kaisha RFID label, method for producing the RFID label, device for producing the RFID label, sheet member (tag sheet) used for the RFID label, and cartridge attached to the device for producing the RFID label
JP2004342755A (ja) * 2003-05-14 2004-12-02 Shinko Electric Ind Co Ltd 平面コイルの製造方法
US7230580B1 (en) * 2003-08-29 2007-06-12 National Semiconductor Corporation Design of a two interconnect IC chip for a radio frequency identification tag and method for manufacturing same
US7116227B2 (en) * 2004-02-23 2006-10-03 Checkpoint Systems, Inc. Tag having patterned circuit elements and a process for making same
US7138919B2 (en) * 2004-02-23 2006-11-21 Checkpoint Systems, Inc. Identification marking and method for applying the identification marking to an item
US7119685B2 (en) * 2004-02-23 2006-10-10 Checkpoint Systems, Inc. Method for aligning capacitor plates in a security tag and a capacitor formed thereby
US8099335B2 (en) * 2004-02-23 2012-01-17 Checkpoint Systems, Inc. Method and system for determining billing information in a tag fabrication process
US7384496B2 (en) 2004-02-23 2008-06-10 Checkpoint Systems, Inc. Security tag system for fabricating a tag including an integrated surface processing system
US7704346B2 (en) * 2004-02-23 2010-04-27 Checkpoint Systems, Inc. Method of fabricating a security tag in an integrated surface processing system
WO2005089143A2 (en) 2004-03-12 2005-09-29 A K Stamping Co. Inc. Manufacture of rfid tags and intermediate products therefor
JP4752307B2 (ja) * 2004-04-28 2011-08-17 大日本印刷株式会社 非接触型データキャリア用導電部材とその製造方法及び装置
US7500307B2 (en) * 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US8334464B2 (en) 2005-01-14 2012-12-18 Cabot Corporation Optimized multi-layer printing of electronics and displays
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US7749299B2 (en) 2005-01-14 2010-07-06 Cabot Corporation Production of metal nanoparticles
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
WO2006098799A2 (en) * 2005-03-12 2006-09-21 3M Innovative Properties Company Illumination devices and methods for making the same
US7623034B2 (en) * 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US7555826B2 (en) * 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US8786510B2 (en) 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
US7497004B2 (en) * 2006-04-10 2009-03-03 Checkpoint Systems, Inc. Process for making UHF antennas for EAS and RFID tags and antennas made thereby
US8525402B2 (en) 2006-09-11 2013-09-03 3M Innovative Properties Company Illumination devices and methods for making the same
US8581393B2 (en) * 2006-09-21 2013-11-12 3M Innovative Properties Company Thermally conductive LED assembly
US7823269B2 (en) * 2006-10-17 2010-11-02 Tagsys Sas Method for manufacturing an auxiliary antenna
US7546676B2 (en) * 2007-05-31 2009-06-16 Symbol Technologies, Inc. Method for manufacturing micro-strip antenna element
US20080295327A1 (en) * 2007-06-01 2008-12-04 3M Innovative Properties Company Flexible circuit
DE102007026720A1 (de) * 2007-06-06 2008-12-11 Bielomatik Leuze Gmbh + Co.Kg Selbstklebende Antenne für ein RFID-System, insbesondere für ein RFID-Etikett, und Verfahren zu ihrer Herstellung
DE102007041751B4 (de) * 2007-09-04 2018-04-19 Bielomatik Leuze Gmbh + Co. Kg Verfahren und Vorrrichtung zur Herstellung eines RFID-Etiketts
CN102334392B (zh) 2009-06-30 2015-07-29 Dic株式会社 电子部件的制造方法及通过该方法制造的电子部件
EP2580057B1 (de) 2010-06-14 2019-05-22 Avery Dennison Corporation Verfahren zur herstellung eines rfid systems
FI125720B (fi) 2011-05-19 2016-01-29 Tecnomar Oy Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä
TWI483548B (zh) * 2011-11-15 2015-05-01 Quanta Comp Inc Method of manufacturing proximity sensor module
KR101828599B1 (ko) * 2013-12-31 2018-02-12 비와이디 컴퍼니 리미티드 신호 수집 조립체 및 이를 포함하는 파워 배터리 모듈
DE102014102519A1 (de) 2014-02-26 2015-08-27 Schreiner Group Gmbh & Co. Kg Folienverbund mit elektrischer Funktionalität zum Aufbringen auf ein Substrat
US9147875B1 (en) * 2014-09-10 2015-09-29 Cellink Corporation Interconnect for battery packs
US10211443B2 (en) 2014-09-10 2019-02-19 Cellink Corporation Battery interconnects
IL236093A0 (en) * 2014-12-04 2015-02-26 Bar Aharon Lamination printing system
CN107408544B (zh) 2015-02-03 2019-09-13 塞林克公司 用于组合式热能与电能传递的系统及方法
US10993334B2 (en) * 2019-09-20 2021-04-27 Manaflex, Llc Methods for laser welding layers of circuitry pattern in the reel-to-reel fabrication of flexible printed circuits
EP4205516A1 (de) 2020-10-02 2023-07-05 CelLink Corporation Herstellung von verbindungen zu flexiblen verbindungsschaltungen
US11876312B2 (en) 2020-10-02 2024-01-16 Cellink Corporation Methods and systems for terminal-free circuit connectors and flexible multilayered interconnect circuits
US20220311103A1 (en) 2021-03-24 2022-09-29 Cellink Corporation Multilayered flexible battery interconnects and methods of fabricating thereof
FI130466B (en) * 2021-05-04 2023-09-19 Teknologian Tutkimuskeskus Vtt Oy IMPROVED ROLL-TO-ROLL PROCESS METHOD
US11751328B1 (en) 2022-02-22 2023-09-05 Cellink Corporation Flexible interconnect circuits and methods of fabrication thereof
US11950377B1 (en) 2022-04-15 2024-04-02 Cellink Corporation Flexible interconnect circuits for battery packs

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2969300A (en) * 1956-03-29 1961-01-24 Bell Telephone Labor Inc Process for making printed circuits
US3497410A (en) * 1965-02-05 1970-02-24 Rogers Corp Method of die-stamping a printed metal circuit
DE3116078A1 (de) * 1981-04-22 1983-01-20 IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen "praegefolie"
DK163151C (da) * 1983-11-16 1992-06-22 Minnesota Mining & Mfg Maerkeplade med lc resonanskredsloeb til anvendelse i elektronisk genstandsovervaagningssystem, fremgangsmaade til fremstilling af maerkeplader, samt elektronisk genstandsovervaagningssystem hvori maerkepladen anvendes.
CH677988A5 (de) * 1986-07-30 1991-07-15 Actron Entwicklungs Ag
US4717438A (en) * 1986-09-29 1988-01-05 Monarch Marking Systems, Inc. Method of making tags
US4846922A (en) * 1986-09-29 1989-07-11 Monarch Marking Systems, Inc. Method of making deactivatable tags
US4876555B1 (en) * 1987-03-17 1995-07-25 Actron Entwicklungs Ag Resonance label and method for its fabrication
JPH01129396A (ja) * 1987-11-14 1989-05-22 Tokai Kinzoku Kk 共振タグおよびその製造法
US4985288A (en) * 1988-04-30 1991-01-15 Tokai Metals Co., Ltd. Resonant frequency characteristic tag and method of manufacturing the same
US5006856A (en) * 1989-08-23 1991-04-09 Monarch Marking Systems, Inc. Electronic article surveillance tag and method of deactivating tags
CH680483A5 (de) * 1989-10-20 1992-08-31 Kobe Properties Ltd
US5174847A (en) * 1989-10-20 1992-12-29 Fritz Pichl Process for the production of a circuit arrangement on a support film
US5059950A (en) * 1990-09-04 1991-10-22 Monarch Marking Systems, Inc. Deactivatable electronic article surveillance tags, tag webs and method of making tag webs
US5241299A (en) * 1991-05-22 1993-08-31 Checkpoint Systems, Inc. Stabilized resonant tag circuit

Also Published As

Publication number Publication date
EP0665705B1 (de) 2009-08-19
EP0665705A2 (de) 1995-08-02
EP0665705A3 (de) 1996-03-13
US5645932A (en) 1997-07-08
ATE440480T1 (de) 2009-09-15

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