DE69505866D1 - Komponentenschale mit abnehmbarem Einsatz - Google Patents

Komponentenschale mit abnehmbarem Einsatz

Info

Publication number
DE69505866D1
DE69505866D1 DE69505866T DE69505866T DE69505866D1 DE 69505866 D1 DE69505866 D1 DE 69505866D1 DE 69505866 T DE69505866 T DE 69505866T DE 69505866 T DE69505866 T DE 69505866T DE 69505866 D1 DE69505866 D1 DE 69505866D1
Authority
DE
Germany
Prior art keywords
removable insert
component shell
shell
component
removable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69505866T
Other languages
English (en)
Other versions
DE69505866T2 (de
Inventor
Leon D Royer
Mark J Zach
Thomas Skrtic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of DE69505866D1 publication Critical patent/DE69505866D1/de
Application granted granted Critical
Publication of DE69505866T2 publication Critical patent/DE69505866T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
DE69505866T 1994-03-14 1995-03-13 Komponentenschale mit abnehmbarem Einsatz Expired - Fee Related DE69505866T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21206394A 1994-03-14 1994-03-14

Publications (2)

Publication Number Publication Date
DE69505866D1 true DE69505866D1 (de) 1998-12-17
DE69505866T2 DE69505866T2 (de) 1999-04-08

Family

ID=22789404

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69505866T Expired - Fee Related DE69505866T2 (de) 1994-03-14 1995-03-13 Komponentenschale mit abnehmbarem Einsatz

Country Status (7)

Country Link
US (1) US5547082A (de)
EP (1) EP0673193B1 (de)
JP (1) JPH07257682A (de)
KR (1) KR100352582B1 (de)
DE (1) DE69505866T2 (de)
MY (1) MY112583A (de)
TW (1) TW353854B (de)

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US5746319A (en) * 1990-09-25 1998-05-05 R.H. Murphy Co., Inc. Tray for integrated circuits
US6527998B1 (en) * 1994-02-25 2003-03-04 Xilinx, Inc. Method of fabricating integrated circuit pack trays using modules
US5614377A (en) 1994-02-28 1997-03-25 Myco Pharmaceuticals, Incorporated Methods for identifying inhibitors of fungal pathogenicity
US5731230A (en) * 1995-03-28 1998-03-24 Micron Technology, Inc. Method for processing and/or shipping integrated circuit devices
JP3035727B2 (ja) * 1996-06-10 2000-04-24 ゴールド工業株式会社 部品搬送用トレー
US5988394A (en) * 1996-11-28 1999-11-23 Kabushiki Kaisha Toshiba Tray for containing parts for storage and transportation
US6036023A (en) * 1997-07-10 2000-03-14 Teradyne, Inc. Heat-transfer enhancing features for semiconductor carriers and devices
RU2133522C1 (ru) 1997-11-03 1999-07-20 Закрытое акционерное общество "Техно-ТМ" Способ изготовления и контроля электронных компонентов
US6227372B1 (en) 1998-04-30 2001-05-08 Peak International, Inc. Component carrier tray for high-temperature applications
US5957293A (en) * 1998-05-04 1999-09-28 Advanced Micro Devices, Inc. Tray to ship ceramic substrates and ceramic BGA packages
US6193068B1 (en) * 1998-05-07 2001-02-27 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
US6341695B1 (en) * 1998-05-07 2002-01-29 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
US6109445A (en) * 1998-06-24 2000-08-29 Tek Pak, Inc. Modular tray system
US7023087B1 (en) * 1998-08-05 2006-04-04 Agere Systems Inc. Integrated circuit carrier and method of manufacturing and integrated circuit
US7191512B2 (en) * 1998-09-29 2007-03-20 Applied Kinetics, Inc. Tray system for holding and positioning components
US6266869B1 (en) 1999-02-17 2001-07-31 Applied Kinetics, Inc. Method for assembling components
US6079565A (en) * 1998-12-28 2000-06-27 Flouroware, Inc. Clipless tray
US6082537A (en) * 1999-02-09 2000-07-04 Quinn; Forrest G. Drawer tray with attachment arms
US6021904A (en) * 1999-06-08 2000-02-08 International Business Machines Corporation Chip carrier processing and shipping array and method of manufacture thereof
WO2001023133A1 (en) * 1999-09-29 2001-04-05 Applied Kinetics, Inc. Processing assembly and method
US6116427A (en) * 2000-01-31 2000-09-12 Silicon Integrated Systems Corp. Tray for ball grid array devices
US6474475B1 (en) * 2000-02-22 2002-11-05 Micron Technology, Inc. Apparatus for handling stacked integrated circuit devices
US6371310B1 (en) * 2000-07-07 2002-04-16 Advanced Micro Devices, Inc. Boat for land grid array packages
MY130407A (en) * 2000-12-01 2007-06-29 Texchem Pack M Sdn Bhd Tray for storing semiconductor chips
US6474477B1 (en) 2001-05-02 2002-11-05 Ching T. Chang Carrier assembly for semiconductor IC (integrated circuit) packages
US7027141B2 (en) * 2001-05-03 2006-04-11 Applied Kinetics, Inc. Static attitude determination and adjust of head suspension components
TW557924U (en) * 2002-01-11 2003-10-11 Hon Hai Prec Ind Co Ltd Packing box for electrical connector
US7108899B2 (en) * 2002-09-11 2006-09-19 Entegris, Inc. Chip tray with tacky surface
US6926937B2 (en) * 2002-09-11 2005-08-09 Entegris, Inc. Matrix tray with tacky surfaces
JP4064203B2 (ja) * 2002-10-18 2008-03-19 川崎マイクロエレクトロニクス株式会社 半導体装置梱包方法
US20050072714A1 (en) * 2003-10-06 2005-04-07 Eleveld Martin J. Standard tray carrier for aligning trays
US20050210665A1 (en) * 2004-03-25 2005-09-29 Nigg James R Tray for storing and transporting semi-conductor and other microelectronic components
US7290701B2 (en) * 2004-08-13 2007-11-06 Accu-Assembly Incorporated Gathering data relating to electrical components picked from stacked trays
US7270056B2 (en) * 2004-08-31 2007-09-18 Intel Corporation Print stripper for ESD control
US20060060496A1 (en) * 2004-09-17 2006-03-23 Adams Michael S Universal packaging tray for disk drive assembly
US20080237158A1 (en) * 2007-04-02 2008-10-02 Sae Magnetics (H.K.) Ltd. Cleaning tray for electrical components and carrying tool with the same
MY153570A (en) * 2008-02-11 2015-02-27 Texchem Pack M Bhd A packaging tray for head stack assembly
US20100065458A1 (en) * 2008-09-18 2010-03-18 The Regents Of The University Of Michigan Specimen management system
WO2010036790A1 (en) * 2008-09-25 2010-04-01 Illinois Tool Works Inc. Devices and methods for handling microelectronic assemblies
DE202009001817U1 (de) * 2009-01-31 2009-06-04 Roth & Rau Ag Substratträger zur Halterung einer Vielzahl von Solarzellenwafern
MY166008A (en) 2010-03-12 2018-05-21 Illinois Tool Works A strippable hybrid tray system for electronic devices
EP2386490A1 (de) * 2010-05-12 2011-11-16 Deutsche Post AG Ladewerkzeug
SG186420A1 (en) * 2010-07-01 2013-01-30 Lubrizol Advanced Mat Inc Thermoformed ic trays of poly(phenylene ether) compositions
US8499531B2 (en) * 2010-10-19 2013-08-06 Aalba Dent Inc. System and method for packaging dental ingots
JP6044635B2 (ja) * 2011-07-29 2016-12-14 ロジャース ジャーマニー ゲーエムベーハー 基板用包装ならびにそのような包装を備える包装ユニット
US9824906B2 (en) 2013-09-03 2017-11-21 Altera Corporation Methods and structures for handling integrated circuits
DE102015009734B4 (de) * 2015-07-31 2017-12-28 Rösler IP GmbH Anreihbare Einzelverpackung
DE202016107209U1 (de) * 2016-12-21 2018-03-22 Schott Schweiz Ag Haltestruktur zum gleichzeitigen Halten einer Mehrzahl von Behältern für Substanzen für pharmazeutische, medizinische oder kosmetische Anwendungen, Transportgebilde und Transport- oder Verpackungsbehälter mit selbiger
USD901327S1 (en) * 2019-01-09 2020-11-10 Lg Electronics Inc. Shelf cover for plant cultivator
DE102019100951A1 (de) * 2019-01-15 2020-07-16 Osram Opto Semiconductors Gmbh Aufbewahrungsvorrichtung
USD909239S1 (en) * 2019-01-18 2021-02-02 Lg Electronics Inc. Shelf for plant cultivator
US20220135384A1 (en) * 2019-03-04 2022-05-05 Panasonic Intellectual Property Management Co., Ltd. Mover control method, mover control system, and program
US20200395234A1 (en) * 2019-06-12 2020-12-17 Intel Corporation Multi-component trays for transporting integrated circuit dice
CN113015344B (zh) * 2019-12-20 2023-03-07 奥特斯科技(重庆)有限公司 在处理阵列级部件承载件期间使阵列和分隔件本体堆叠

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2778490A (en) * 1953-12-16 1957-01-22 Richard L Emery Packaging with molded pulp cushioning pads
KR960015106B1 (ko) * 1986-11-25 1996-10-28 가부시기가이샤 히다찌세이사꾸쇼 면실장형 반도체패키지 포장체
JPH0257576A (ja) * 1988-08-12 1990-02-27 Minnesota Mining & Mfg Co <3M> 電子部品収納用テープ
GB8825154D0 (en) * 1988-10-27 1988-11-30 Reel Service Ltd Tape for storage of electronic components
FR2640108B1 (fr) * 1988-11-18 1991-08-23 Robin Jean Claude Ensemble pour la protection et/ou le transport d'elements fragiles sensiblement plats, notamment de circuits electroniques
US4898275A (en) * 1989-05-25 1990-02-06 Minnesota Mining And Manufacturing Company Non nesting component carrier tape
DE4003102A1 (de) * 1990-02-02 1991-08-08 Westermann Wolfgang Verpackungseinheit und verpackungsverfahren fuer gegenstaende, insbesondere elektrische bauelemente
JPH0418283A (ja) * 1990-04-27 1992-01-22 Mitsubishi Electric Corp Ｉｃ収納チューブ
US5234104A (en) * 1991-02-04 1993-08-10 Illinois Tool Works Inc. Carrier tape system
US5152393A (en) * 1991-07-08 1992-10-06 Advantek, Inc. Microchip storage tape
JP3089590B2 (ja) * 1991-07-12 2000-09-18 キヤノン株式会社 板状物収納容器およびその蓋開口装置
US5203450A (en) * 1992-02-12 1993-04-20 Aalba Dent, Inc. Combination display and packaging container for dental material
US5203452A (en) * 1992-03-13 1993-04-20 Illinois Tool Works, Inc. Shipping tray

Also Published As

Publication number Publication date
EP0673193B1 (de) 1998-11-11
US5547082A (en) 1996-08-20
KR100352582B1 (ko) 2003-01-24
KR950035563A (ko) 1995-12-30
JPH07257682A (ja) 1995-10-09
TW353854B (en) 1999-03-01
EP0673193A1 (de) 1995-09-20
DE69505866T2 (de) 1999-04-08
MY112583A (en) 2001-07-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee