DE69507938D1 - Zusammenbau von Leiterplatten mit einer verbesserten Isolierung der Bezugsebene - Google Patents

Zusammenbau von Leiterplatten mit einer verbesserten Isolierung der Bezugsebene

Info

Publication number
DE69507938D1
DE69507938D1 DE69507938T DE69507938T DE69507938D1 DE 69507938 D1 DE69507938 D1 DE 69507938D1 DE 69507938 T DE69507938 T DE 69507938T DE 69507938 T DE69507938 T DE 69507938T DE 69507938 D1 DE69507938 D1 DE 69507938D1
Authority
DE
Germany
Prior art keywords
assembly
printed circuit
circuit boards
reference plane
improved insulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69507938T
Other languages
English (en)
Other versions
DE69507938T2 (de
Inventor
Lydegraf Curt Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE69507938D1 publication Critical patent/DE69507938D1/de
Publication of DE69507938T2 publication Critical patent/DE69507938T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262—Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
DE69507938T 1994-12-22 1995-06-23 Zusammenbau von Leiterplatten mit einer verbesserten Isolierung der Bezugsebene Expired - Lifetime DE69507938T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/370,770 US5523921A (en) 1994-12-22 1994-12-22 Printed circuit assembly having improved reference plane isolation

Publications (2)

Publication Number Publication Date
DE69507938D1 true DE69507938D1 (de) 1999-04-01
DE69507938T2 DE69507938T2 (de) 1999-09-23

Family

ID=23461098

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69507938T Expired - Lifetime DE69507938T2 (de) 1994-12-22 1995-06-23 Zusammenbau von Leiterplatten mit einer verbesserten Isolierung der Bezugsebene

Country Status (4)

Country Link
US (1) US5523921A (de)
EP (1) EP0719078B1 (de)
JP (1) JPH08242079A (de)
DE (1) DE69507938T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9300868U1 (de) * 1993-01-22 1994-05-26 Siemens Ag Einstückiges Isolierteil, insbesondere Spritzgießteil
US6727435B1 (en) * 1996-03-12 2004-04-27 International Business Machines Corporation Backplane power distribution system
US5841074A (en) * 1996-03-12 1998-11-24 International Business Machines Corporation Backplane power distribution system having impedance variations in the form of spaced voids
US5686871A (en) * 1996-07-12 1997-11-11 Ast Research, Inc. Method for minimizing radio frequency emissions from plug-in adapter cards in computer systems
JP3036629B2 (ja) * 1996-10-07 2000-04-24 富士ゼロックス株式会社 プリント配線基板装置
JP3926880B2 (ja) * 1997-03-31 2007-06-06 富士通株式会社 多層プリント板
US6498708B2 (en) 1999-05-27 2002-12-24 Emerson Electric Co. Method and apparatus for mounting printed circuit board components
US6510058B1 (en) * 2000-07-14 2003-01-21 Sensormatic Electronics Corporation Printed circuit board configuration having reduced EMC/EMI interference in electromechanical relay circuits
US6496383B1 (en) * 2000-08-09 2002-12-17 Advanced Micro Devices, Inc. Integrated circuit carrier arrangement for reducing non-uniformity in current flow through power pins
US6618787B2 (en) 2000-12-14 2003-09-09 Hewlett-Packard Development Company, L.P. Computer printed circuit system board with LVD SCSI device direct connector
US6614662B2 (en) 2000-12-14 2003-09-02 Hewlett-Packard Development Company, L.P. Printed circuit board layout
US6977345B2 (en) * 2002-01-08 2005-12-20 International Business Machines Corporation Vents with signal image for signal return path
US7418779B2 (en) * 2005-02-03 2008-09-02 International Business Machines Corporation Method for balancing power plane pin currents in a printed wiring board using collinear slots
KR100945952B1 (ko) * 2007-11-30 2010-03-05 삼성전기주식회사 기판 판넬
US9468090B2 (en) 2012-10-29 2016-10-11 Cisco Technology, Inc. Current redistribution in a printed circuit board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4605915A (en) * 1984-07-09 1986-08-12 Cubic Corporation Stripline circuits isolated by adjacent decoupling strip portions
US4954929A (en) * 1989-08-22 1990-09-04 Ast Research, Inc. Multi-layer circuit board that suppresses radio frequency interference from high frequency signals
US5119047A (en) * 1990-11-19 1992-06-02 General Dynamics Corp., Air Defense Systems Div. Stripline shielding and grounding system
US5165055A (en) * 1991-06-28 1992-11-17 Digital Equipment Corporation Method and apparatus for a PCB and I/O integrated electromagnetic containment
GB9215707D0 (en) * 1992-07-23 1992-09-09 Cambridge Computer Rf waveguide signal transition apparatus

Also Published As

Publication number Publication date
DE69507938T2 (de) 1999-09-23
EP0719078A2 (de) 1996-06-26
JPH08242079A (ja) 1996-09-17
EP0719078B1 (de) 1999-02-24
US5523921A (en) 1996-06-04
EP0719078A3 (de) 1997-05-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE),

8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE