DE69509878T2 - Halbleiterchipträger - Google Patents

Halbleiterchipträger

Info

Publication number
DE69509878T2
DE69509878T2 DE69509878T DE69509878T DE69509878T2 DE 69509878 T2 DE69509878 T2 DE 69509878T2 DE 69509878 T DE69509878 T DE 69509878T DE 69509878 T DE69509878 T DE 69509878T DE 69509878 T2 DE69509878 T2 DE 69509878T2
Authority
DE
Germany
Prior art keywords
semiconductor chip
chip carriers
carriers
semiconductor
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69509878T
Other languages
English (en)
Other versions
DE69509878D1 (de
Inventor
Stanford W Crane Jr
Maria M Portuondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panda Project Inc
Original Assignee
Panda Project Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panda Project Inc filed Critical Panda Project Inc
Application granted granted Critical
Publication of DE69509878D1 publication Critical patent/DE69509878D1/de
Publication of DE69509878T2 publication Critical patent/DE69509878T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
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    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/26—Pin or blade contacts for sliding co-operation on one side only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
DE69509878T 1994-03-11 1995-03-09 Halbleiterchipträger Expired - Fee Related DE69509878T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/208,691 US5541449A (en) 1994-03-11 1994-03-11 Semiconductor chip carrier affording a high-density external interface
PCT/US1995/002677 WO1995024747A1 (en) 1994-03-11 1995-03-09 Semiconductor chip affording a high-density external interface

Publications (2)

Publication Number Publication Date
DE69509878D1 DE69509878D1 (de) 1999-07-01
DE69509878T2 true DE69509878T2 (de) 1999-12-09

Family

ID=22775609

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69509878T Expired - Fee Related DE69509878T2 (de) 1994-03-11 1995-03-09 Halbleiterchipträger

Country Status (8)

Country Link
US (6) US5541449A (de)
EP (1) EP0749640B1 (de)
JP (1) JPH10500246A (de)
KR (1) KR100360992B1 (de)
AU (1) AU2115895A (de)
DE (1) DE69509878T2 (de)
TW (1) TW232096B (de)
WO (1) WO1995024747A1 (de)

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US6339191B1 (en) * 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US5541449A (en) 1994-03-11 1996-07-30 The Panda Project Semiconductor chip carrier affording a high-density external interface
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US20040007774A1 (en) 2004-01-15
US5696027A (en) 1997-12-09
US6097086A (en) 2000-08-01
TW232096B (en) 1994-10-11
WO1995024747A1 (en) 1995-09-14
US6577003B1 (en) 2003-06-10
KR100360992B1 (ko) 2003-01-24
US5541449A (en) 1996-07-30
DE69509878D1 (de) 1999-07-01
EP0749640B1 (de) 1999-05-26
US7183646B2 (en) 2007-02-27
EP0749640A1 (de) 1996-12-27
US5892280A (en) 1999-04-06
JPH10500246A (ja) 1998-01-06

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