DE69511875T2 - Mikrokomponentenplattenarchitektur - Google Patents

Mikrokomponentenplattenarchitektur

Info

Publication number
DE69511875T2
DE69511875T2 DE69511875T DE69511875T DE69511875T2 DE 69511875 T2 DE69511875 T2 DE 69511875T2 DE 69511875 T DE69511875 T DE 69511875T DE 69511875 T DE69511875 T DE 69511875T DE 69511875 T2 DE69511875 T2 DE 69511875T2
Authority
DE
Germany
Prior art keywords
laminate
microcomponent
component plate
micro component
microcomponents
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69511875T
Other languages
English (en)
Other versions
DE69511875D1 (de
Inventor
Robert Wegeng
M Drost
Donald Carolyn Mc
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Battelle Memorial Institute Inc
Original Assignee
Battelle Memorial Institute Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23082561&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69511875(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Battelle Memorial Institute Inc filed Critical Battelle Memorial Institute Inc
Application granted granted Critical
Publication of DE69511875D1 publication Critical patent/DE69511875D1/de
Publication of DE69511875T2 publication Critical patent/DE69511875T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01BBOILING; BOILING APPARATUS ; EVAPORATION; EVAPORATION APPARATUS
    • B01B1/00Boiling; Boiling apparatus for physical or chemical purposes ; Evaporation in general
    • B01B1/005Evaporation for physical or chemical purposes; Evaporation apparatus therefor, e.g. evaporation of liquids for gas phase reactions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/40Static mixers
    • B01F25/42Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions
    • B01F25/421Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions by moving the components in a convoluted or labyrinthine path
    • B01F25/422Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions by moving the components in a convoluted or labyrinthine path between stacked plates, e.g. grooved or perforated plates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F33/00Other mixers; Mixing plants; Combinations of mixers
    • B01F33/30Micromixers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/0093Microreactors, e.g. miniaturised or microfabricated reactors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01KSTEAM ENGINE PLANTS; STEAM ACCUMULATORS; ENGINE PLANTS NOT OTHERWISE PROVIDED FOR; ENGINES USING SPECIAL WORKING FLUIDS OR CYCLES
    • F01K13/00General layout or general methods of operation of complete plants
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02CGAS-TURBINE PLANTS; AIR INTAKES FOR JET-PROPULSION PLANTS; CONTROLLING FUEL SUPPLY IN AIR-BREATHING JET-PROPULSION PLANTS
    • F02C7/00Features, components parts, details or accessories, not provided for in, or of interest apart form groups F02C1/00 - F02C6/00; Air intakes for jet-propulsion plants
    • F02C7/08Heating air supply before combustion, e.g. by exhaust gases
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254Cold plates transferring heat from heat source to coolant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00781Aspects relating to microreactors
    • B01J2219/00783Laminate assemblies, i.e. the reactor comprising a stack of plates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00781Aspects relating to microreactors
    • B01J2219/00873Heat exchange
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00781Aspects relating to microreactors
    • B01J2219/00891Feeding or evacuation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2309/00Gas cycle refrigeration machines
    • F25B2309/14Compression machines, plants or systems characterised by the cycle used 
    • F25B2309/1401Ericsson or Ericcson cycles
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/15Microelectro-mechanical devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Dispersion Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Laminated Bodies (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Materials For Photolithography (AREA)
  • Micromachines (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
DE69511875T 1994-07-29 1995-06-23 Mikrokomponentenplattenarchitektur Expired - Lifetime DE69511875T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/282,663 US5611214A (en) 1994-07-29 1994-07-29 Microcomponent sheet architecture
PCT/US1995/008011 WO1996004516A1 (en) 1994-07-29 1995-06-23 Microcomponent sheet architecture

Publications (2)

Publication Number Publication Date
DE69511875D1 DE69511875D1 (de) 1999-10-07
DE69511875T2 true DE69511875T2 (de) 2000-03-30

Family

ID=23082561

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69511875T Expired - Lifetime DE69511875T2 (de) 1994-07-29 1995-06-23 Mikrokomponentenplattenarchitektur

Country Status (8)

Country Link
US (1) US5611214A (de)
EP (1) EP0772756B1 (de)
JP (5) JPH10503884A (de)
AT (1) ATE184101T1 (de)
CA (1) CA2195859C (de)
DE (1) DE69511875T2 (de)
ES (1) ES2136297T3 (de)
WO (1) WO1996004516A1 (de)

Cited By (8)

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US7746634B2 (en) 2007-08-07 2010-06-29 Cooligy Inc. Internal access mechanism for a server rack
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US8157001B2 (en) 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
US8250877B2 (en) 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US8254422B2 (en) 2008-08-05 2012-08-28 Cooligy Inc. Microheat exchanger for laser diode cooling
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US8602092B2 (en) 2003-07-23 2013-12-10 Cooligy, Inc. Pump and fan control concepts in a cooling system
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door

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* Cited by examiner, † Cited by third party
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US6126723A (en) * 1994-07-29 2000-10-03 Battelle Memorial Institute Microcomponent assembly for efficient contacting of fluid
US5811062A (en) * 1994-07-29 1998-09-22 Battelle Memorial Institute Microcomponent chemical process sheet architecture
US6129973A (en) * 1994-07-29 2000-10-10 Battelle Memorial Institute Microchannel laminated mass exchanger and method of making
US5993750A (en) * 1997-04-11 1999-11-30 Eastman Kodak Company Integrated ceramic micro-chemical plant
EP1162426B1 (de) 1997-06-03 2005-04-06 CHART HEAT EXCHANGERS Limited Partnership Wärmetauscher und/oder Vorrichtung zur Mischung von Fluiden
US5961932A (en) * 1997-06-20 1999-10-05 Eastman Kodak Company Reaction chamber for an integrated micro-ceramic chemical plant
US6200536B1 (en) 1997-06-26 2001-03-13 Battelle Memorial Institute Active microchannel heat exchanger
US6494614B1 (en) 1998-07-27 2002-12-17 Battelle Memorial Institute Laminated microchannel devices, mixing units and method of making same
US6440895B1 (en) 1998-07-27 2002-08-27 Battelle Memorial Institute Catalyst, method of making, and reactions using the catalyst
US6616909B1 (en) 1998-07-27 2003-09-09 Battelle Memorial Institute Method and apparatus for obtaining enhanced production rate of thermal chemical reactions
US6793831B1 (en) 1998-08-06 2004-09-21 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Microlamination method for making devices
US6572830B1 (en) 1998-10-09 2003-06-03 Motorola, Inc. Integrated multilayered microfludic devices and methods for making the same
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US6148635A (en) * 1998-10-19 2000-11-21 The Board Of Trustees Of The University Of Illinois Active compressor vapor compression cycle integrated heat transfer device
US7150994B2 (en) * 1999-03-03 2006-12-19 Symyx Technologies, Inc. Parallel flow process optimization reactor
US6749814B1 (en) 1999-03-03 2004-06-15 Symyx Technologies, Inc. Chemical processing microsystems comprising parallel flow microreactors and methods for using same
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US6313393B1 (en) 1999-10-21 2001-11-06 Battelle Memorial Institute Heat transfer and electric-power-generating component containing a thermoelectric device
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DE10005549A1 (de) * 2000-02-09 2001-09-06 Cpc Cellular Process Chemistry Mikroreaktor für Reaktionsmedien in Form einer Suspension
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DE69511875D1 (de) 1999-10-07
EP0772756A1 (de) 1997-05-14
CA2195859A1 (en) 1996-02-15
JP2004257726A (ja) 2004-09-16
US5611214A (en) 1997-03-18
JP2010019547A (ja) 2010-01-28
WO1996004516A1 (en) 1996-02-15
ES2136297T3 (es) 1999-11-16
JPH10503884A (ja) 1998-04-07
JP2008101908A (ja) 2008-05-01
JP4580422B2 (ja) 2010-11-10
EP0772756B1 (de) 1999-09-01
JP2010216801A (ja) 2010-09-30
ATE184101T1 (de) 1999-09-15

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