DE69523409D1 - Herstellung von Lötverbindungen zur Verwendung in der Verpackung von elektrischen Schaltungen - Google Patents
Herstellung von Lötverbindungen zur Verwendung in der Verpackung von elektrischen SchaltungenInfo
- Publication number
- DE69523409D1 DE69523409D1 DE69523409T DE69523409T DE69523409D1 DE 69523409 D1 DE69523409 D1 DE 69523409D1 DE 69523409 T DE69523409 T DE 69523409T DE 69523409 T DE69523409 T DE 69523409T DE 69523409 D1 DE69523409 D1 DE 69523409D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- electrical circuits
- solder joints
- packaging electrical
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33726994A | 1994-11-10 | 1994-11-10 | |
US08/523,873 US5906310A (en) | 1994-11-10 | 1995-09-05 | Packaging electrical circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69523409D1 true DE69523409D1 (de) | 2001-11-29 |
DE69523409T2 DE69523409T2 (de) | 2002-06-27 |
Family
ID=26990620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1995623409 Expired - Fee Related DE69523409T2 (de) | 1994-11-10 | 1995-11-10 | Herstellung von Lötverbindungen zur Verwendung in der Verpackung von elektrischen Schaltungen |
Country Status (4)
Country | Link |
---|---|
US (5) | US5906310A (de) |
EP (1) | EP0712153B1 (de) |
JP (2) | JP2810007B2 (de) |
DE (1) | DE69523409T2 (de) |
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1995
- 1995-09-05 US US08/523,873 patent/US5906310A/en not_active Expired - Lifetime
- 1995-11-10 EP EP19950308057 patent/EP0712153B1/de not_active Expired - Lifetime
- 1995-11-10 DE DE1995623409 patent/DE69523409T2/de not_active Expired - Fee Related
- 1995-11-10 JP JP7292999A patent/JP2810007B2/ja not_active Expired - Fee Related
-
1996
- 1996-09-19 US US08/715,785 patent/US5808358A/en not_active Expired - Lifetime
-
1998
- 1998-03-06 JP JP10054610A patent/JPH10303542A/ja active Pending
- 1998-06-03 US US09/090,270 patent/US6096981A/en not_active Expired - Lifetime
- 1998-06-03 US US09/089,438 patent/US6159772A/en not_active Expired - Lifetime
- 1998-06-03 US US09/089,770 patent/US6119923A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH08321675A (ja) | 1996-12-03 |
EP0712153A2 (de) | 1996-05-15 |
JP2810007B2 (ja) | 1998-10-15 |
JPH10303542A (ja) | 1998-11-13 |
US5906310A (en) | 1999-05-25 |
US5808358A (en) | 1998-09-15 |
EP0712153B1 (de) | 2001-10-24 |
DE69523409T2 (de) | 2002-06-27 |
EP0712153A3 (de) | 1997-10-08 |
US6119923A (en) | 2000-09-19 |
US6096981A (en) | 2000-08-01 |
US6159772A (en) | 2000-12-12 |
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