DE69524815T2 - Verbesserungen an oder in Verbindung mit mikromechanischen Vorrichtungen - Google Patents

Verbesserungen an oder in Verbindung mit mikromechanischen Vorrichtungen

Info

Publication number
DE69524815T2
DE69524815T2 DE69524815T DE69524815T DE69524815T2 DE 69524815 T2 DE69524815 T2 DE 69524815T2 DE 69524815 T DE69524815 T DE 69524815T DE 69524815 T DE69524815 T DE 69524815T DE 69524815 T2 DE69524815 T2 DE 69524815T2
Authority
DE
Germany
Prior art keywords
connection
micromechanical devices
micromechanical
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69524815T
Other languages
English (en)
Other versions
DE69524815D1 (de
Inventor
Monte A Douglas
Robert M Wallace
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE69524815D1 publication Critical patent/DE69524815D1/de
Application granted granted Critical
Publication of DE69524815T2 publication Critical patent/DE69524815T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0096—For avoiding stiction when the device is in use, i.e. after manufacture has been completed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0096—For avoiding stiction when the device is in use, i.e. after manufacture has been completed
    • B81C1/00968—Methods for breaking the stiction bond
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/11—Treatments for avoiding stiction of elastic or moving parts of MEMS
    • B81C2201/117—Using supercritical fluid, e.g. carbon dioxide, for removing sacrificial layers
DE69524815T 1994-06-21 1995-06-21 Verbesserungen an oder in Verbindung mit mikromechanischen Vorrichtungen Expired - Fee Related DE69524815T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/263,292 US5482564A (en) 1994-06-21 1994-06-21 Method of unsticking components of micro-mechanical devices

Publications (2)

Publication Number Publication Date
DE69524815D1 DE69524815D1 (de) 2002-02-07
DE69524815T2 true DE69524815T2 (de) 2002-08-29

Family

ID=23001153

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69524815T Expired - Fee Related DE69524815T2 (de) 1994-06-21 1995-06-21 Verbesserungen an oder in Verbindung mit mikromechanischen Vorrichtungen

Country Status (8)

Country Link
US (1) US5482564A (de)
EP (1) EP0689076B1 (de)
JP (1) JPH0886969A (de)
KR (1) KR100351077B1 (de)
CN (1) CN1149190A (de)
CA (1) CA2149934A1 (de)
DE (1) DE69524815T2 (de)
TW (2) TW302554B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10358967A1 (de) * 2003-12-15 2005-07-21 Universität Kassel Mikrospiegelarray

Families Citing this family (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6219015B1 (en) 1992-04-28 2001-04-17 The Board Of Directors Of The Leland Stanford, Junior University Method and apparatus for using an array of grating light valves to produce multicolor optical images
US5617242A (en) * 1995-01-10 1997-04-01 Texas Instruments Incorporated Repair of digital micromirror device having white defects
US5717513A (en) * 1995-01-10 1998-02-10 Texas Instruments Incorporated Unsticking mirror elements of digital micromirror device
US5841579A (en) 1995-06-07 1998-11-24 Silicon Light Machines Flat diffraction grating light valve
US6312528B1 (en) 1997-03-06 2001-11-06 Cri Recycling Service, Inc. Removal of contaminants from materials
US5982553A (en) 1997-03-20 1999-11-09 Silicon Light Machines Display device incorporating one-dimensional grating light-valve array
US6500605B1 (en) 1997-05-27 2002-12-31 Tokyo Electron Limited Removal of photoresist and residue from substrate using supercritical carbon dioxide process
US6306564B1 (en) 1997-05-27 2001-10-23 Tokyo Electron Limited Removal of resist or residue from semiconductors using supercritical carbon dioxide
US6036786A (en) * 1997-06-11 2000-03-14 Fsi International Inc. Eliminating stiction with the use of cryogenic aerosol
US6088102A (en) 1997-10-31 2000-07-11 Silicon Light Machines Display apparatus including grating light-valve array and interferometric optical system
US6271808B1 (en) 1998-06-05 2001-08-07 Silicon Light Machines Stereo head mounted display using a single display device
US6004912A (en) 1998-06-05 1999-12-21 Silicon Light Machines Vapor phase low molecular weight lubricants
US6130770A (en) 1998-06-23 2000-10-10 Silicon Light Machines Electron gun activated grating light valve
US6101036A (en) 1998-06-23 2000-08-08 Silicon Light Machines Embossed diffraction grating alone and in combination with changeable image display
US6215579B1 (en) 1998-06-24 2001-04-10 Silicon Light Machines Method and apparatus for modulating an incident light beam for forming a two-dimensional image
US6303986B1 (en) 1998-07-29 2001-10-16 Silicon Light Machines Method of and apparatus for sealing an hermetic lid to a semiconductor die
US7064070B2 (en) * 1998-09-28 2006-06-20 Tokyo Electron Limited Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process
US6277753B1 (en) 1998-09-28 2001-08-21 Supercritical Systems Inc. Removal of CMP residue from semiconductors using supercritical carbon dioxide process
JP3527117B2 (ja) * 1998-12-24 2004-05-17 富士電機デバイステクノロジー株式会社 半導体力学量センサの製造方法およびその製造装置
US6748960B1 (en) 1999-11-02 2004-06-15 Tokyo Electron Limited Apparatus for supercritical processing of multiple workpieces
EP1277233A2 (de) 2000-04-25 2003-01-22 Tokyo Electron Corporation Verfahren zur abscheidung einer metallschicht und mehrkammerreaktor mit einem superkritischen trocknungs-/reinigungsmodul zur metallabscheidung
AU2001262065A1 (en) * 2000-05-26 2001-12-03 Chaker Khalfaoui A stiction-free electrostatically driven microstructure device
US6795605B1 (en) 2000-08-01 2004-09-21 Cheetah Omni, Llc Micromechanical optical switch
US6530823B1 (en) 2000-08-10 2003-03-11 Nanoclean Technologies Inc Methods for cleaning surfaces substantially free of contaminants
US6719613B2 (en) * 2000-08-10 2004-04-13 Nanoclean Technologies, Inc. Methods for cleaning surfaces substantially free of contaminants utilizing filtered carbon dioxide
US6543462B1 (en) 2000-08-10 2003-04-08 Nano Clean Technologies, Inc. Apparatus for cleaning surfaces substantially free of contaminants
US6556741B1 (en) 2000-10-25 2003-04-29 Omm, Inc. MEMS optical switch with torsional hinge and method of fabrication thereof
US6387723B1 (en) 2001-01-19 2002-05-14 Silicon Light Machines Reduced surface charging in silicon-based devices
US6562146B1 (en) 2001-02-15 2003-05-13 Micell Technologies, Inc. Processes for cleaning and drying microelectronic structures using liquid or supercritical carbon dioxide
US6707591B2 (en) 2001-04-10 2004-03-16 Silicon Light Machines Angled illumination for a single order light modulator based projection system
KR100777892B1 (ko) * 2001-04-10 2007-11-21 동경 엘렉트론 주식회사 반도체 기판 처리용 고압 챔버
US6958123B2 (en) * 2001-06-15 2005-10-25 Reflectivity, Inc Method for removing a sacrificial material with a compressed fluid
US6782205B2 (en) 2001-06-25 2004-08-24 Silicon Light Machines Method and apparatus for dynamic equalization in wavelength division multiplexing
US6747781B2 (en) 2001-06-25 2004-06-08 Silicon Light Machines, Inc. Method, apparatus, and diffuser for reducing laser speckle
US6646778B2 (en) 2001-08-01 2003-11-11 Silicon Light Machines Grating light valve with encapsulated dampening gas
US6829092B2 (en) 2001-08-15 2004-12-07 Silicon Light Machines, Inc. Blazed grating light valve
US6785001B2 (en) * 2001-08-21 2004-08-31 Silicon Light Machines, Inc. Method and apparatus for measuring wavelength jitter of light signal
US6782900B2 (en) 2001-09-13 2004-08-31 Micell Technologies, Inc. Methods and apparatus for cleaning and/or treating a substrate using CO2
US6706641B2 (en) 2001-09-13 2004-03-16 Micell Technologies, Inc. Spray member and method for using the same
US6619304B2 (en) 2001-09-13 2003-09-16 Micell Technologies, Inc. Pressure chamber assembly including non-mechanical drive means
US6666928B2 (en) 2001-09-13 2003-12-23 Micell Technologies, Inc. Methods and apparatus for holding a substrate in a pressure chamber
US6763840B2 (en) 2001-09-14 2004-07-20 Micell Technologies, Inc. Method and apparatus for cleaning substrates using liquid carbon dioxide
JP2003133070A (ja) * 2001-10-30 2003-05-09 Seiko Epson Corp 積層膜の製造方法、電気光学装置、電気光学装置の製造方法、有機エレクトロルミネッセンス装置の製造方法、及び電子機器
US6538233B1 (en) 2001-11-06 2003-03-25 Analog Devices, Inc. Laser release process for micromechanical devices
US7028698B2 (en) * 2001-12-28 2006-04-18 Brian Nils Hansen Pressure processing apparatus with improved heating and closure system
US6800238B1 (en) 2002-01-15 2004-10-05 Silicon Light Machines, Inc. Method for domain patterning in low coercive field ferroelectrics
WO2003064065A1 (en) * 2002-01-25 2003-08-07 Supercritical Systems Inc. Method for reducing the formation of contaminants during supercritical carbon dioxide processes
US6876046B2 (en) * 2002-02-07 2005-04-05 Superconductor Technologies, Inc. Stiction alleviation using passivation layer patterning
WO2003070846A2 (en) * 2002-02-15 2003-08-28 Supercritical Systems Inc. Drying resist with a solvent bath and supercritical co2
US6924086B1 (en) * 2002-02-15 2005-08-02 Tokyo Electron Limited Developing photoresist with supercritical fluid and developer
US7270941B2 (en) 2002-03-04 2007-09-18 Tokyo Electron Limited Method of passivating of low dielectric materials in wafer processing
CN1642665A (zh) * 2002-03-22 2005-07-20 东京毅力科创株式会社 用超临界工艺清除杂质
US7169540B2 (en) * 2002-04-12 2007-01-30 Tokyo Electron Limited Method of treatment of porous dielectric films to reduce damage during cleaning
US6767751B2 (en) 2002-05-28 2004-07-27 Silicon Light Machines, Inc. Integrated driver process flow
US6728023B1 (en) 2002-05-28 2004-04-27 Silicon Light Machines Optical device arrays with optimized image resolution
US6822797B1 (en) 2002-05-31 2004-11-23 Silicon Light Machines, Inc. Light modulator structure for producing high-contrast operation using zero-order light
US6841079B2 (en) * 2002-05-31 2005-01-11 3M Innovative Properties Company Fluorochemical treatment for silicon articles
US7256467B2 (en) * 2002-06-04 2007-08-14 Silecs Oy Materials and methods for forming hybrid organic-inorganic anti-stiction materials for micro-electromechanical systems
US6846380B2 (en) * 2002-06-13 2005-01-25 The Boc Group, Inc. Substrate processing apparatus and related systems and methods
US6829258B1 (en) 2002-06-26 2004-12-07 Silicon Light Machines, Inc. Rapidly tunable external cavity laser
US6813059B2 (en) 2002-06-28 2004-11-02 Silicon Light Machines, Inc. Reduced formation of asperities in contact micro-structures
US6714337B1 (en) 2002-06-28 2004-03-30 Silicon Light Machines Method and device for modulating a light beam and having an improved gamma response
US7066789B2 (en) * 2002-07-29 2006-06-27 Manoclean Technologies, Inc. Methods for resist stripping and other processes for cleaning surfaces substantially free of contaminants
US7297286B2 (en) * 2002-07-29 2007-11-20 Nanoclean Technologies, Inc. Methods for resist stripping and other processes for cleaning surfaces substantially free of contaminants
US6764385B2 (en) 2002-07-29 2004-07-20 Nanoclean Technologies, Inc. Methods for resist stripping and cleaning surfaces substantially free of contaminants
US7101260B2 (en) * 2002-07-29 2006-09-05 Nanoclean Technologies, Inc. Methods for resist stripping and other processes for cleaning surfaces substantially free of contaminants
US7134941B2 (en) * 2002-07-29 2006-11-14 Nanoclean Technologies, Inc. Methods for residue removal and corrosion prevention in a post-metal etch process
US7057795B2 (en) * 2002-08-20 2006-06-06 Silicon Light Machines Corporation Micro-structures with individually addressable ribbon pairs
US6801354B1 (en) 2002-08-20 2004-10-05 Silicon Light Machines, Inc. 2-D diffraction grating for substantially eliminating polarization dependent losses
US6712480B1 (en) 2002-09-27 2004-03-30 Silicon Light Machines Controlled curvature of stressed micro-structures
US20040112409A1 (en) * 2002-12-16 2004-06-17 Supercritical Sysems, Inc. Fluoride in supercritical fluid for photoresist and residue removal
US20040177867A1 (en) * 2002-12-16 2004-09-16 Supercritical Systems, Inc. Tetra-organic ammonium fluoride and HF in supercritical fluid for photoresist and residue removal
US20040154647A1 (en) * 2003-02-07 2004-08-12 Supercritical Systems, Inc. Method and apparatus of utilizing a coating for enhanced holding of a semiconductor substrate during high pressure processing
US6829077B1 (en) 2003-02-28 2004-12-07 Silicon Light Machines, Inc. Diffractive light modulator with dynamically rotatable diffraction plane
US6806997B1 (en) 2003-02-28 2004-10-19 Silicon Light Machines, Inc. Patterned diffractive light modulator ribbon for PDL reduction
US7307019B2 (en) * 2004-09-29 2007-12-11 Tokyo Electron Limited Method for supercritical carbon dioxide processing of fluoro-carbon films
US7491036B2 (en) * 2004-11-12 2009-02-17 Tokyo Electron Limited Method and system for cooling a pump
US20060102204A1 (en) * 2004-11-12 2006-05-18 Tokyo Electron Limited Method for removing a residue from a substrate using supercritical carbon dioxide processing
US20060102208A1 (en) * 2004-11-12 2006-05-18 Tokyo Electron Limited System for removing a residue from a substrate using supercritical carbon dioxide processing
US20060102590A1 (en) * 2004-11-12 2006-05-18 Tokyo Electron Limited Method for treating a substrate with a high pressure fluid using a preoxide-based process chemistry
US20060102591A1 (en) * 2004-11-12 2006-05-18 Tokyo Electron Limited Method and system for treating a substrate using a supercritical fluid
US20060180174A1 (en) * 2005-02-15 2006-08-17 Tokyo Electron Limited Method and system for treating a substrate with a high pressure fluid using a peroxide-based process chemistry in conjunction with an initiator
US20060180572A1 (en) * 2005-02-15 2006-08-17 Tokyo Electron Limited Removal of post etch residue for a substrate with open metal surfaces
US7291565B2 (en) * 2005-02-15 2007-11-06 Tokyo Electron Limited Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid
US20060186088A1 (en) * 2005-02-23 2006-08-24 Gunilla Jacobson Etching and cleaning BPSG material using supercritical processing
US7550075B2 (en) 2005-03-23 2009-06-23 Tokyo Electron Ltd. Removal of contaminants from a fluid
US20060226117A1 (en) * 2005-03-29 2006-10-12 Bertram Ronald T Phase change based heating element system and method
US7442636B2 (en) 2005-03-30 2008-10-28 Tokyo Electron Limited Method of inhibiting copper corrosion during supercritical CO2 cleaning
US7399708B2 (en) * 2005-03-30 2008-07-15 Tokyo Electron Limited Method of treating a composite spin-on glass/anti-reflective material prior to cleaning
US20060255012A1 (en) * 2005-05-10 2006-11-16 Gunilla Jacobson Removal of particles from substrate surfaces using supercritical processing
US7789971B2 (en) * 2005-05-13 2010-09-07 Tokyo Electron Limited Treatment of substrate using functionalizing agent in supercritical carbon dioxide
US20070012337A1 (en) * 2005-07-15 2007-01-18 Tokyo Electron Limited In-line metrology for supercritical fluid processing
US7471439B2 (en) * 2005-11-23 2008-12-30 Miradia, Inc. Process of forming a micromechanical system containing an anti-stiction gas-phase lubricant
US7580174B2 (en) * 2005-11-23 2009-08-25 Miradia, Inc. Anti-stiction gas-phase lubricant for micromechanical systems
US7463404B2 (en) * 2005-11-23 2008-12-09 Miradia, Inc. Method of using a preferentially deposited lubricant to prevent anti-stiction in micromechanical systems
US7616370B2 (en) * 2005-11-23 2009-11-10 Miradia, Inc. Preferentially deposited lubricant to prevent anti-stiction in micromechanical systems
US7723812B2 (en) * 2005-11-23 2010-05-25 Miradia, Inc. Preferentially deposited lubricant to prevent anti-stiction in micromechanical systems
US8096665B2 (en) * 2006-10-11 2012-01-17 Miradia, Inc. Spatially offset multi-imager-panel architecture for projecting an image
US7843695B2 (en) * 2007-07-20 2010-11-30 Honeywell International Inc. Apparatus and method for thermal management using vapor chamber
US8031391B2 (en) * 2008-04-16 2011-10-04 Texas Instruments Incorporated System and method for operating light processing electronic devices
CN101750694B (zh) * 2008-11-27 2012-11-21 鸿富锦精密工业（深圳）有限公司 解胶装置和解胶方法
TWI415692B (zh) * 2008-12-05 2013-11-21 Hon Hai Prec Ind Co Ltd 解膠裝置和解膠方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5061049A (en) 1984-08-31 1991-10-29 Texas Instruments Incorporated Spatial light modulator and method
US4662746A (en) 1985-10-30 1987-05-05 Texas Instruments Incorporated Spatial light modulator and method
US4956610A (en) 1988-02-12 1990-09-11 Pgm Diversified Industries, Inc. Current density measurement system by self-sustaining magnetic oscillation
FR2658532B1 (fr) * 1990-02-20 1992-05-15 Atochem Application des (perfluoroalkyl)-ethylenes comme agents de nettoyage ou de sechage, et compositions utilisables a cet effet.
US5083857A (en) 1990-06-29 1992-01-28 Texas Instruments Incorporated Multi-level deformable mirror device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10358967A1 (de) * 2003-12-15 2005-07-21 Universität Kassel Mikrospiegelarray
DE10358967B4 (de) * 2003-12-15 2006-11-16 Universität Kassel Mikrospiegelarray

Also Published As

Publication number Publication date
TW335561B (en) 1998-07-01
EP0689076A1 (de) 1995-12-27
TW302554B (de) 1997-04-11
KR960000307A (ko) 1996-01-25
JPH0886969A (ja) 1996-04-02
EP0689076B1 (de) 2002-01-02
KR100351077B1 (ko) 2002-12-26
CN1149190A (zh) 1997-05-07
DE69524815D1 (de) 2002-02-07
CA2149934A1 (en) 1995-12-22
US5482564A (en) 1996-01-09

Similar Documents

Publication Publication Date Title
DE69524815T2 (de) Verbesserungen an oder in Verbindung mit mikromechanischen Vorrichtungen
DE69425966T2 (de) Apheresisgerät
DE69430250D1 (de) Fluorpolymer laminate
FI954807A (fi) Ionisia nesteitä
FI963134A0 (fi) Ioninesteitä
FI944624A (fi) 4-aryyliaminobentsopyraani- ja niiden kaltaisia yhdisteitä
DE69400828D1 (de) Motor-Getriebe-Antriebsverbindung
DE9409753U1 (de) Verbesserungen im Zusammenhang mit Verbindungs-Vorrichtungen
DE9310500U1 (de) Lichtdurchlässiges Bauelement
DE69431951D1 (de) Verbindungsvorrichtung
KR950013430U (ko) 작화완구
DE69401310D1 (de) Verbindungsvorrichtung
DK120993A (da) Forbindelsesindretning
DE9303814U1 (de) Auftragungsvorrichtung
NO954654D0 (no) Benzimiddazolyl-diazacyklo-oktanforbindelse
KR960010292U (ko) 칠판틀체
DE69509908D1 (de) Anzeigevorrichtung oder ähnliches
KR960010280U (ko) 칠판고정구조
ATA263993A (de) Anemometer
KR950020417U (ko) 풍향 풍속계
DE9310252U1 (de) Anschluß
KR950032581U (ko) 칠판 구조
KR960000848U (ko) 백 칠판
KR960016734U (ko) 칠판
KR960016735U (ko) 칠판

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee