DE69525665T2 - Polierkissencluster zum Polieren einer Halbleiterscheibe - Google Patents

Polierkissencluster zum Polieren einer Halbleiterscheibe

Info

Publication number
DE69525665T2
DE69525665T2 DE69525665T DE69525665T DE69525665T2 DE 69525665 T2 DE69525665 T2 DE 69525665T2 DE 69525665 T DE69525665 T DE 69525665T DE 69525665 T DE69525665 T DE 69525665T DE 69525665 T2 DE69525665 T2 DE 69525665T2
Authority
DE
Germany
Prior art keywords
polishing
pad
polishing pad
support
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69525665T
Other languages
English (en)
Other versions
DE69525665D1 (de
Inventor
Homayoun Talieh
David Edwin Weldon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of DE69525665D1 publication Critical patent/DE69525665D1/de
Application granted granted Critical
Publication of DE69525665T2 publication Critical patent/DE69525665T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
DE69525665T 1994-10-11 1995-10-11 Polierkissencluster zum Polieren einer Halbleiterscheibe Expired - Fee Related DE69525665T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/321,169 US5575707A (en) 1994-10-11 1994-10-11 Polishing pad cluster for polishing a semiconductor wafer

Publications (2)

Publication Number Publication Date
DE69525665D1 DE69525665D1 (de) 2002-04-04
DE69525665T2 true DE69525665T2 (de) 2002-08-29

Family

ID=23249490

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69512170T Expired - Fee Related DE69512170T2 (de) 1994-10-11 1995-10-11 Polierkissencluster zum Polieren einer Halbleiterscheibe
DE69525665T Expired - Fee Related DE69525665T2 (de) 1994-10-11 1995-10-11 Polierkissencluster zum Polieren einer Halbleiterscheibe

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69512170T Expired - Fee Related DE69512170T2 (de) 1994-10-11 1995-10-11 Polierkissencluster zum Polieren einer Halbleiterscheibe

Country Status (5)

Country Link
US (1) US5575707A (de)
EP (2) EP0706856B1 (de)
JP (1) JP3745421B2 (de)
AT (1) ATE184536T1 (de)
DE (2) DE69512170T2 (de)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5967030A (en) 1995-11-17 1999-10-19 Micron Technology, Inc. Global planarization method and apparatus
US5961372A (en) * 1995-12-05 1999-10-05 Applied Materials, Inc. Substrate belt polisher
US5916012A (en) * 1996-04-26 1999-06-29 Lam Research Corporation Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher
JP3611404B2 (ja) * 1996-06-21 2005-01-19 株式会社荏原製作所 ポリッシング装置
JPH1034514A (ja) * 1996-07-24 1998-02-10 Sanshin:Kk 表面研磨加工方法及びその装置
US5722877A (en) * 1996-10-11 1998-03-03 Lam Research Corporation Technique for improving within-wafer non-uniformity of material removal for performing CMP
US6328642B1 (en) 1997-02-14 2001-12-11 Lam Research Corporation Integrated pad and belt for chemical mechanical polishing
US6059643A (en) * 1997-02-21 2000-05-09 Aplex, Inc. Apparatus and method for polishing a flat surface using a belted polishing pad
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US6316363B1 (en) 1999-09-02 2001-11-13 Micron Technology, Inc. Deadhesion method and mechanism for wafer processing
US6331488B1 (en) * 1997-05-23 2001-12-18 Micron Technology, Inc. Planarization process for semiconductor substrates
US6736714B2 (en) 1997-07-30 2004-05-18 Praxair S.T. Technology, Inc. Polishing silicon wafers
US6062959A (en) * 1997-11-05 2000-05-16 Aplex Group Polishing system including a hydrostatic fluid bearing support
US5980368A (en) * 1997-11-05 1999-11-09 Aplex Group Polishing tool having a sealed fluid chamber for support of polishing pad
US6336845B1 (en) 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US6083839A (en) * 1997-12-31 2000-07-04 Intel Corporation Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control
US6030275A (en) * 1998-03-17 2000-02-29 International Business Machines Corporation Variable control of carrier curvature with direct feedback loop
US6200199B1 (en) 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
US6315857B1 (en) * 1998-07-10 2001-11-13 Mosel Vitelic, Inc. Polishing pad shaping and patterning
US6126512A (en) * 1998-07-10 2000-10-03 Aplex Inc. Robust belt tracking and control system for hostile environment
US6036586A (en) 1998-07-29 2000-03-14 Micron Technology, Inc. Apparatus and method for reducing removal forces for CMP pads
US6273100B1 (en) 1998-08-27 2001-08-14 Micron Technology, Inc. Surface cleaning apparatus and method
US6218316B1 (en) 1998-10-22 2001-04-17 Micron Technology, Inc. Planarization of non-planar surfaces in device fabrication
US6875085B2 (en) * 1998-11-06 2005-04-05 Mosel Vitelic, Inc. Polishing system including a hydrostatic fluid bearing support
US6390890B1 (en) 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
US6086460A (en) * 1998-11-09 2000-07-11 Lam Research Corporation Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
US6296550B1 (en) 1998-11-16 2001-10-02 Chartered Semiconductor Manufacturing Ltd. Scalable multi-pad design for improved CMP process
US6179709B1 (en) * 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
US6641463B1 (en) * 1999-02-06 2003-11-04 Beaver Creek Concepts Inc Finishing components and elements
US6155913A (en) * 1999-04-12 2000-12-05 Chartered Semiconductor Manuf. Ltd. Double polishing head
US6241585B1 (en) 1999-06-25 2001-06-05 Applied Materials, Inc. Apparatus and method for chemical mechanical polishing
US6406363B1 (en) 1999-08-31 2002-06-18 Lam Research Corporation Unsupported chemical mechanical polishing belt
US6431959B1 (en) * 1999-12-20 2002-08-13 Lam Research Corporation System and method of defect optimization for chemical mechanical planarization of polysilicon
US6569004B1 (en) * 1999-12-30 2003-05-27 Lam Research Polishing pad and method of manufacture
US6306019B1 (en) 1999-12-30 2001-10-23 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6402591B1 (en) 2000-03-31 2002-06-11 Lam Research Corporation Planarization system for chemical-mechanical polishing
US6626743B1 (en) 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6261959B1 (en) 2000-03-31 2001-07-17 Lam Research Corporation Method and apparatus for chemically-mechanically polishing semiconductor wafers
US6616801B1 (en) 2000-03-31 2003-09-09 Lam Research Corporation Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
US6428394B1 (en) 2000-03-31 2002-08-06 Lam Research Corporation Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feed
US7374477B2 (en) * 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
US6361414B1 (en) 2000-06-30 2002-03-26 Lam Research Corporation Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
US6435952B1 (en) 2000-06-30 2002-08-20 Lam Research Corporation Apparatus and method for qualifying a chemical mechanical planarization process
US6500056B1 (en) 2000-06-30 2002-12-31 Lam Research Corporation Linear reciprocating disposable belt polishing method and apparatus
US6645046B1 (en) 2000-06-30 2003-11-11 Lam Research Corporation Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
US6495464B1 (en) 2000-06-30 2002-12-17 Lam Research Corporation Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool
US6518172B1 (en) 2000-08-29 2003-02-11 Micron Technology, Inc. Method for applying uniform pressurized film across wafer
US6776695B2 (en) * 2000-12-21 2004-08-17 Lam Research Corporation Platen design for improving edge performance in CMP applications
US6607425B1 (en) * 2000-12-21 2003-08-19 Lam Research Corporation Pressurized membrane platen design for improving performance in CMP applications
US6554688B2 (en) 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6875091B2 (en) 2001-01-04 2005-04-05 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6609961B2 (en) 2001-01-09 2003-08-26 Lam Research Corporation Chemical mechanical planarization belt assembly and method of assembly
US6612917B2 (en) 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
US6632129B2 (en) * 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
US6752698B1 (en) 2001-03-19 2004-06-22 Lam Research Corporation Method and apparatus for conditioning fixed-abrasive polishing pads
US6767427B2 (en) * 2001-06-07 2004-07-27 Lam Research Corporation Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
US6863771B2 (en) * 2001-07-25 2005-03-08 Micron Technology, Inc. Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
US6645052B2 (en) 2001-10-26 2003-11-11 Lam Research Corporation Method and apparatus for controlling CMP pad surface finish
US6808442B1 (en) * 2001-12-20 2004-10-26 Lam Research Corporation Apparatus for removal/remaining thickness profile manipulation
US6726545B2 (en) * 2002-04-26 2004-04-27 Chartered Semiconductor Manufacturing Ltd. Linear polishing for improving substrate uniformity
JP2003342800A (ja) * 2002-05-21 2003-12-03 Sony Corp 研磨方法および研磨装置、並びに半導体装置の製造方法
US20040137830A1 (en) * 2002-12-24 2004-07-15 Kazumasa Ohnishi Lapping method and lapping machine
JP4155872B2 (ja) * 2003-05-26 2008-09-24 一正 大西 ラップ盤の製造方法
US7018273B1 (en) 2003-06-27 2006-03-28 Lam Research Corporation Platen with diaphragm and method for optimizing wafer polishing
EP1745888A4 (de) * 2004-03-31 2008-01-02 Japan Science & Tech Agency Verfahren und vorrichtung für linear vorrückendes polieren
US6955588B1 (en) 2004-03-31 2005-10-18 Lam Research Corporation Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
CN101987429B (zh) * 2009-08-07 2012-09-26 中芯国际集成电路制造(上海)有限公司 化学机械研磨方法和装置
US9358658B2 (en) * 2013-03-15 2016-06-07 Applied Materials, Inc. Polishing system with front side pressure control
USD763932S1 (en) * 2014-12-04 2016-08-16 Georgi M Popov Grinding tool
CN112276787B (zh) * 2020-10-10 2021-12-14 湖南涟钢菱峰实业有限公司 一种卷钢表面处理设备及表面处理工艺

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR796866A (fr) * 1935-01-17 1936-04-16 G Guilbert Guilbert Ets Dispositif pour le surfaçage et le polissage
DE1907060A1 (de) * 1969-02-12 1970-09-03 Metabowerke Kg Bandschleifmaschine
US4128968A (en) * 1976-09-22 1978-12-12 The Perkin-Elmer Corporation Optical surface polisher
JPS5914469A (ja) * 1982-07-08 1984-01-25 Disco Abrasive Sys Ltd ポリツシング装置
JPS59161262A (ja) * 1983-03-04 1984-09-12 Masanori Kunieda 磁気吸引式研摩方法
DE3402104C2 (de) * 1984-01-21 1986-07-17 Karl Heesemann Maschinenfabrik GmbH & Co KG, 4970 Bad Oeynhausen Bandschleifmaschine
DE3643914A1 (de) * 1986-12-22 1988-06-30 Zeiss Carl Fa Verfahren und vorrichtung zum laeppen bzw. polieren optischer flaechen
US4811522A (en) * 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus
DE4027627A1 (de) * 1990-08-31 1992-03-05 Wolters Peter Fa Arbeitsscheibe fuer laepp-, hon- und poliermaschinen
FR2677276B1 (fr) * 1991-06-06 1995-12-01 Commissariat Energie Atomique Machine de polissage a table porte-echantillon perfectionnee.
EP0517594B1 (de) * 1991-06-06 1995-12-13 Commissariat A L'energie Atomique Poliermaschine mit einem gespannten Feinschleifband und einem verbesserten Werkstückträgerkopf
US5230184A (en) * 1991-07-05 1993-07-27 Motorola, Inc. Distributed polishing head
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5287663A (en) * 1992-01-21 1994-02-22 National Semiconductor Corporation Polishing pad and method for polishing semiconductor wafers
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
US5329734A (en) * 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate

Also Published As

Publication number Publication date
JPH08195364A (ja) 1996-07-30
EP0919330A1 (de) 1999-06-02
US5575707A (en) 1996-11-19
DE69525665D1 (de) 2002-04-04
JP3745421B2 (ja) 2006-02-15
DE69512170T2 (de) 2000-03-09
DE69512170D1 (de) 1999-10-21
EP0706856B1 (de) 1999-09-15
ATE184536T1 (de) 1999-10-15
EP0919330B1 (de) 2002-02-27
EP0706856A1 (de) 1996-04-17

Similar Documents

Publication Publication Date Title
DE69525665T2 (de) Polierkissencluster zum Polieren einer Halbleiterscheibe
ATE228915T1 (de) Halbleiterscheiben-polierkopf
DE69405342D1 (de) Poliervorrichtung für Halbleiterscheibe
DE59913703D1 (de) Operationstischsystem
EP0822741A3 (de) Chipbestückungsvorrichtung mit Ultraschallschwingungsschweissung
DE69820355D1 (de) Poliervorrichtung für Halbleiterscheibe
DE69510745T2 (de) Vorrichtung zum Polieren eines Halbleiters
DE69520863D1 (de) Scheibenhalter für Halbleiterscheiben-Poliermaschine
EE03021B1 (et) Seade formeeritava klaasplaadi kinnitamiseks ja hoidmiseks selle töötlemise ajal
DE69414534D1 (de) Bonding-Verfahren für Silizium-Wafer
AU2003296244A8 (en) Optical subassembly and projection objective for semiconductor lithography
KR20020033523A (ko) 반도체 디바이스
ITTO920412A1 (it) Procedimento per il recupero di perossidasi di semi di soia.
IT1213140B (it) Componente elettronico integrato per assemblaggio di superficie.
DE59712806D1 (de) Transfervorrichtung für Halbleiterscheiben
KR960019136U (ko) 반도체 웨이퍼 이송용 셔틀
KR950002235U (ko) 웨이퍼 냉각 겸용 웨이퍼 이송장치
ES2161811T3 (es) Balasto con zocalo de lamparas montable.
KR960032739U (ko) 반도체 식각장비의 벨로우즈 바이어스라인 제어장치
DE9321175U1 (de) Neuartige Siliziumhalbleiterscheibe
KR980005300U (ko) 웨이퍼 노광용 얼라인먼트 장비의 웨이퍼 이송용진공패드구조
KR960025487U (ko) 반도체 웨이퍼 냉각장치
DE68906657D1 (de) Schleifmittelzusammensetzung fuer siliciumwafer.
BR9204336A (pt) Modulo isolante ceramico e seu emprego
KR960019146U (ko) 반도체 제조장비용 웨이퍼 이송 척

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee