DE69533338D1 - Multimikrorechnerkuehlsystem, das ein geblaese und einen kuehlkoerper mit im gegenueberliegenden verbund liegenden kuehlrippen zur luftfuehrung verwendet - Google Patents
Multimikrorechnerkuehlsystem, das ein geblaese und einen kuehlkoerper mit im gegenueberliegenden verbund liegenden kuehlrippen zur luftfuehrung verwendetInfo
- Publication number
- DE69533338D1 DE69533338D1 DE69533338T DE69533338T DE69533338D1 DE 69533338 D1 DE69533338 D1 DE 69533338D1 DE 69533338 T DE69533338 T DE 69533338T DE 69533338 T DE69533338 T DE 69533338T DE 69533338 D1 DE69533338 D1 DE 69533338D1
- Authority
- DE
- Germany
- Prior art keywords
- blowed
- radiator
- micro computer
- composite composition
- air ventilation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US26943194A | 1994-06-30 | 1994-06-30 | |
US269431 | 1994-06-30 | ||
PCT/US1995/006769 WO1996001035A1 (en) | 1994-06-30 | 1995-05-25 | Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69533338D1 true DE69533338D1 (de) | 2004-09-09 |
DE69533338T2 DE69533338T2 (de) | 2005-09-08 |
Family
ID=23027217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69533338T Expired - Fee Related DE69533338T2 (de) | 1994-06-30 | 1995-05-25 | Multimikrorechnerkuehlsystem, das ein geblaese und einen kuehlkoerper mit im gegenueberliegenden verbund liegenden kuehlrippen zur luftfuehrung verwendet |
Country Status (10)
Country | Link |
---|---|
US (1) | US5912802A (de) |
EP (1) | EP0803173B1 (de) |
JP (1) | JPH10502217A (de) |
CN (1) | CN1095318C (de) |
AU (1) | AU2605595A (de) |
BR (1) | BR9508153A (de) |
DE (1) | DE69533338T2 (de) |
HK (1) | HK1004184A1 (de) |
TW (1) | TW265430B (de) |
WO (1) | WO1996001035A1 (de) |
Families Citing this family (94)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE29712058U1 (de) * | 1996-01-27 | 1998-04-02 | Bayer Joachim | Kühlkörper zum Anbau an Halbleiterbauelemente sowie Teilprofile zur Herstellung solcher Kühlkörper |
EP0810511B1 (de) * | 1996-05-14 | 2003-11-12 | Hewlett-Packard Company, A Delaware Corporation | Einrichtung zur Kühlung von Komponenten in einem elektrischen Gerät mit interner Stromversorgungseinheit |
US6046905A (en) | 1996-09-30 | 2000-04-04 | Intel Corporation | Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges |
US5852547A (en) * | 1997-07-14 | 1998-12-22 | Sun Microsystems, Inc. | Module shroud attachment to motherboard |
US6009938A (en) * | 1997-12-11 | 2000-01-04 | Eastman Kodak Company | Extruded, tiered high fin density heat sinks and method of manufacture |
CN1093445C (zh) * | 1999-03-25 | 2002-10-30 | 富准精密工业(深圳)有限公司 | 复合式散热器及其制造方法 |
CN1085569C (zh) * | 1999-04-02 | 2002-05-29 | 富准精密工业(深圳)有限公司 | 高密度散热装置的制造方法 |
US6223970B1 (en) * | 1999-05-11 | 2001-05-01 | Yang-Shiau Chen | Die set for welding fins and a base plate of a heat sink |
AU5205200A (en) * | 1999-06-11 | 2001-01-02 | Jiung-Jung Wang | The heat-radiator of a portable computer's cpu |
US6430041B1 (en) | 1999-10-20 | 2002-08-06 | Micronpc, Llc | Computer cooling system and method |
US6938256B2 (en) | 2000-01-18 | 2005-08-30 | Galactic Computing Corporation | System for balance distribution of requests across multiple servers using dynamic metrics |
US6215662B1 (en) * | 2000-03-13 | 2001-04-10 | Intel Corporation | Circuit board with interleaved TO-220 heat sinks |
JP2001267771A (ja) * | 2000-03-17 | 2001-09-28 | Hitachi Ltd | 電子装置 |
US6359781B1 (en) | 2000-04-21 | 2002-03-19 | Dell Products L.P. | Apparatus for cooling heat generating devices |
US6478082B1 (en) * | 2000-05-22 | 2002-11-12 | Jia Hao Li | Heat dissipating apparatus with nest wind duct |
US6940716B1 (en) | 2000-07-13 | 2005-09-06 | Intel Corporation | Method and apparatus for dissipating heat from an electronic device |
US6816905B1 (en) | 2000-11-10 | 2004-11-09 | Galactic Computing Corporation Bvi/Bc | Method and system for providing dynamic hosted service management across disparate accounts/sites |
US8538843B2 (en) * | 2000-07-17 | 2013-09-17 | Galactic Computing Corporation Bvi/Bc | Method and system for operating an E-commerce service provider |
US7844513B2 (en) * | 2000-07-17 | 2010-11-30 | Galactic Computing Corporation Bvi/Bc | Method and system for operating a commissioned e-commerce service prover |
US6452809B1 (en) | 2000-11-10 | 2002-09-17 | Galactic Computing Corporation | Scalable internet engine |
US6396693B1 (en) * | 2000-08-24 | 2002-05-28 | Ming Fa Shih | Heat sink |
DE10058574B4 (de) * | 2000-11-24 | 2005-09-15 | Danfoss Drives A/S | Kühlgerät für Leistungshalbleiter |
EP1343204B1 (de) * | 2000-12-11 | 2016-11-23 | Fujitsu Limited | Elektronische bauelementeinheit |
JP3513116B2 (ja) * | 2001-03-22 | 2004-03-31 | 株式会社東芝 | 情報処理装置 |
EP1267598B1 (de) * | 2001-06-13 | 2008-02-06 | Fujikura, Ltd. | Einrichtung zur Kühlung einer elektronischen Anlage |
US6462948B1 (en) * | 2001-06-25 | 2002-10-08 | Intel Corporation | Thermal management system for a multiple processor computer appliance |
CA2456992A1 (en) * | 2001-08-09 | 2003-02-20 | Amy Elise Allen | Electronics cooling subassembly |
US20030033346A1 (en) * | 2001-08-10 | 2003-02-13 | Sun Microsystems, Inc. | Method, system, and program for managing multiple resources in a system |
US20030033398A1 (en) * | 2001-08-10 | 2003-02-13 | Sun Microsystems, Inc. | Method, system, and program for generating and using configuration policies |
DE10141988C1 (de) * | 2001-08-28 | 2003-01-09 | Manfred Diels | Verfahren zur Herstellung von Kühlkörpern |
US6438984B1 (en) | 2001-08-29 | 2002-08-27 | Sun Microsystems, Inc. | Refrigerant-cooled system and method for cooling electronic components |
US7252139B2 (en) | 2001-08-29 | 2007-08-07 | Sun Microsystems, Inc. | Method and system for cooling electronic components |
US6587343B2 (en) | 2001-08-29 | 2003-07-01 | Sun Microsystems, Inc. | Water-cooled system and method for cooling electronic components |
CA2462444A1 (en) * | 2001-10-04 | 2003-04-10 | Celestica International Inc. | Cooling system having independent fan location |
US7133907B2 (en) * | 2001-10-18 | 2006-11-07 | Sun Microsystems, Inc. | Method, system, and program for configuring system resources |
US6965559B2 (en) * | 2001-10-19 | 2005-11-15 | Sun Microsystems, Inc. | Method, system, and program for discovering devices communicating through a switch |
US20030135609A1 (en) * | 2002-01-16 | 2003-07-17 | Sun Microsystems, Inc. | Method, system, and program for determining a modification of a system resource configuration |
US7103889B2 (en) | 2002-07-23 | 2006-09-05 | Sun Microsystems, Inc. | Method, system, and article of manufacture for agent processing |
US20040024887A1 (en) * | 2002-07-31 | 2004-02-05 | Sun Microsystems, Inc. | Method, system, and program for generating information on components within a network |
US20040022200A1 (en) * | 2002-07-31 | 2004-02-05 | Sun Microsystems, Inc. | Method, system, and program for providing information on components within a network |
US7143615B2 (en) * | 2002-07-31 | 2006-12-05 | Sun Microsystems, Inc. | Method, system, and program for discovering components within a network |
US6658736B1 (en) * | 2002-08-09 | 2003-12-09 | Unisys Corporation | Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent |
EP1406147A1 (de) * | 2002-10-02 | 2004-04-07 | Saint Song Corporation | Wärmesenkestruktur für Computer |
EP1420331A1 (de) * | 2002-11-14 | 2004-05-19 | Saint Song Corporation | Miniaturcomputer und Verfahren zur Kühlung |
DE60223261D1 (de) * | 2002-11-14 | 2007-12-13 | Saint Song Corp | Vorrichtung und Verfahren zum Kühlen |
US6765796B2 (en) | 2002-11-21 | 2004-07-20 | Teradyne, Inc. | Circuit board cover with exhaust apertures for cooling electronic components |
US6953227B2 (en) * | 2002-12-05 | 2005-10-11 | Sun Microsystems, Inc. | High-power multi-device liquid cooling |
US20040130870A1 (en) * | 2003-01-07 | 2004-07-08 | Vulcan Portals Inc. | System and method for heat removal from a hand-held portable computer while docked |
JP4896359B2 (ja) * | 2003-01-28 | 2012-03-14 | 富士通株式会社 | 電子装置 |
US20040215764A1 (en) * | 2003-04-23 | 2004-10-28 | Sun Microsystems, Inc. | Method, system, and program for rendering a visualization of aggregations of network devices |
US6978827B2 (en) * | 2003-05-23 | 2005-12-27 | Tyco Electronics Canada Ltd. | Active heat sink |
US7079387B2 (en) * | 2003-06-11 | 2006-07-18 | Hewlett-Packard Development Company, L.P. | Computer cooling system and method |
US6958915B2 (en) * | 2003-10-07 | 2005-10-25 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipating device for electronic component |
US6967845B2 (en) * | 2003-11-05 | 2005-11-22 | Cpumate Inc. | Integrated heat dissipating device with curved fins |
TWI251460B (en) * | 2004-01-09 | 2006-03-11 | Delta Electronics Inc | Compound heat sink with multi-directional fins |
US7327578B2 (en) * | 2004-02-06 | 2008-02-05 | Sun Microsystems, Inc. | Cooling failure mitigation for an electronics enclosure |
US7256993B2 (en) * | 2004-04-05 | 2007-08-14 | Dell Products L.P. | Adjustable heat sink shroud |
US7460375B2 (en) * | 2004-05-07 | 2008-12-02 | Rackable Systems, Inc. | Interface assembly |
JP4265505B2 (ja) * | 2004-08-09 | 2009-05-20 | オムロン株式会社 | 電子機器の放熱構造 |
DE202005001212U1 (de) * | 2005-01-25 | 2005-06-09 | Gerätebau Felix Schulte GmbH & Co. KG | Anordnung zur Kühlung von multifunktionalen Systemkonsolen |
TWI281376B (en) * | 2005-02-25 | 2007-05-11 | Foxconn Tech Co Ltd | Cooling device for plural heat generating components |
US20060215366A1 (en) * | 2005-03-24 | 2006-09-28 | Vinod Kamath | Apparatus, system, and method for removing excess heat from a component |
US7259965B2 (en) * | 2005-04-07 | 2007-08-21 | Intel Corporation | Integrated circuit coolant microchannel assembly with targeted channel configuration |
US7262964B1 (en) | 2005-04-27 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Airflow control baffle |
CN100518475C (zh) * | 2006-06-02 | 2009-07-22 | 富准精密工业(深圳)有限公司 | 散热装置 |
TW200822845A (en) * | 2006-11-03 | 2008-05-16 | Chroma Ate Inc | Turbulence heat sink and heat dissipation assembly containing same |
US7495916B2 (en) * | 2007-06-19 | 2009-02-24 | Honeywell International Inc. | Low cost cold plate with film adhesive |
CN101252821B (zh) * | 2007-10-12 | 2010-09-08 | 张文 | 一种散热方法、散热系统及散热装置 |
JP4530054B2 (ja) * | 2008-01-23 | 2010-08-25 | ソニー株式会社 | 冷却ダクトおよび電子機器 |
TWI414235B (zh) * | 2009-08-24 | 2013-11-01 | Compal Electronics Inc | 散熱模組 |
WO2011131684A1 (en) | 2010-04-23 | 2011-10-27 | Napatech A/S | A thermally controlled assembly |
CN102196714A (zh) * | 2011-03-22 | 2011-09-21 | 网拓(上海)通信技术有限公司 | 一种散热装置 |
US20120293952A1 (en) * | 2011-05-19 | 2012-11-22 | International Business Machines Corporation | Heat transfer apparatus |
US8699226B2 (en) * | 2012-04-03 | 2014-04-15 | Google Inc. | Active cooling debris bypass fin pack |
US20130306293A1 (en) * | 2012-05-21 | 2013-11-21 | Hamilton Sundstrand Space Systems International | Extruded matching set radiators |
CN102769392A (zh) * | 2012-06-15 | 2012-11-07 | 张家港市泓溢电源科技有限公司 | 电源电柜冷却系统 |
KR102114069B1 (ko) * | 2012-10-26 | 2020-05-22 | 삼성전자주식회사 | 전자기기의 냉각장치 |
US9069535B2 (en) | 2013-06-07 | 2015-06-30 | Apple Inc. | Computer thermal system |
US11899509B2 (en) | 2013-06-07 | 2024-02-13 | Apple Inc. | Computer housing |
DE102014101898B3 (de) * | 2014-02-14 | 2015-06-25 | Fujitsu Technology Solutions Intellectual Property Gmbh | Kühlanordnung für ein Computersystem |
CN105224052A (zh) * | 2015-10-30 | 2016-01-06 | 同方计算机有限公司 | 计算机散热冷却系统 |
CN107526412A (zh) * | 2016-06-20 | 2017-12-29 | 凌今 | 组装风道式电脑芯片散热装置 |
JP6645915B2 (ja) * | 2016-06-24 | 2020-02-14 | 三協立山株式会社 | ヒートシンク |
JP2018074618A (ja) * | 2016-10-24 | 2018-05-10 | パナソニックIpマネジメント株式会社 | 電源装置の放熱構造、車載電源装置 |
CN108107998A (zh) * | 2016-11-24 | 2018-06-01 | 研能科技股份有限公司 | 气冷散热装置 |
WO2019045668A1 (ru) * | 2017-08-28 | 2019-03-07 | Дмитрий Валерьевич ХАЧАТУРОВ | Система и способ принудительного воздушного охлаждения электротехнического устройства |
RU2707443C2 (ru) * | 2017-09-21 | 2019-11-26 | Дмитрий Валерьевич Хачатуров | Способ отвода влаги из герметичного корпуса электронного устройства |
DE102017217537B4 (de) | 2017-10-02 | 2021-10-21 | Danfoss Silicon Power Gmbh | Leistungsmodul mit integrierter Kühleinrichtung |
JP6699695B2 (ja) | 2018-09-07 | 2020-05-27 | 日本電気株式会社 | 電子機器 |
DE102019201417A1 (de) * | 2019-02-05 | 2020-08-06 | Robert Bosch Gmbh | Kühlvorrichtung für einen Sensor eines Fortbewegungsmittels und Sensorbaugruppe umfassend die Kühlvorrichtung |
JP7214535B2 (ja) * | 2019-03-29 | 2023-01-30 | 三協立山株式会社 | ヒートシンクの製造方法 |
JP7213388B2 (ja) * | 2019-03-29 | 2023-01-26 | 三協立山株式会社 | ヒートシンクの製造方法 |
DE102020124947B4 (de) | 2020-09-24 | 2022-09-01 | Rolf Eggers | Luftkühlungsanordnung und Verfahren zum Kühlen von elektronischen Bauteilen |
FR3119949A1 (fr) * | 2021-02-16 | 2022-08-19 | Valeo Systèmes de Contrôle Moteur | Ensemble électronique avec circuit de refroidissement amélioré |
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-
1995
- 1995-05-04 TW TW084104469A patent/TW265430B/zh not_active IP Right Cessation
- 1995-05-25 JP JP8503157A patent/JPH10502217A/ja active Pending
- 1995-05-25 EP EP95920676A patent/EP0803173B1/de not_active Expired - Lifetime
- 1995-05-25 AU AU26055/95A patent/AU2605595A/en not_active Abandoned
- 1995-05-25 DE DE69533338T patent/DE69533338T2/de not_active Expired - Fee Related
- 1995-05-25 BR BR9508153A patent/BR9508153A/pt not_active IP Right Cessation
- 1995-05-25 WO PCT/US1995/006769 patent/WO1996001035A1/en active IP Right Grant
- 1995-05-25 CN CN95193833A patent/CN1095318C/zh not_active Expired - Fee Related
-
1997
- 1997-09-11 US US08/928,028 patent/US5912802A/en not_active Expired - Lifetime
-
1998
- 1998-04-24 HK HK98103488A patent/HK1004184A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW265430B (en) | 1995-12-11 |
BR9508153A (pt) | 1997-12-23 |
EP0803173A1 (de) | 1997-10-29 |
WO1996001035A1 (en) | 1996-01-11 |
AU2605595A (en) | 1996-01-25 |
EP0803173A4 (de) | 1997-12-10 |
EP0803173B1 (de) | 2004-08-04 |
DE69533338T2 (de) | 2005-09-08 |
JPH10502217A (ja) | 1998-02-24 |
US5912802A (en) | 1999-06-15 |
CN1095318C (zh) | 2002-11-27 |
HK1004184A1 (en) | 1998-11-20 |
CN1155370A (zh) | 1997-07-23 |
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