DE69535936D1 - Verfahren zum Herstellen einer Halbleitervorrichtung mit Graben - Google Patents

Verfahren zum Herstellen einer Halbleitervorrichtung mit Graben

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Publication number
DE69535936D1
DE69535936D1 DE69535936T DE69535936T DE69535936D1 DE 69535936 D1 DE69535936 D1 DE 69535936D1 DE 69535936 T DE69535936 T DE 69535936T DE 69535936 T DE69535936 T DE 69535936T DE 69535936 D1 DE69535936 D1 DE 69535936D1
Authority
DE
Germany
Prior art keywords
manufacturing
semiconductor device
trench semiconductor
trench
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69535936T
Other languages
English (en)
Inventor
Katsumi Nakamura
Tadaharu Minato
Shuuichi Tominaga
Katsuomi Shiozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE69535936D1 publication Critical patent/DE69535936D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • HELECTRICITY
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    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
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    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7816Lateral DMOS transistors, i.e. LDMOS transistors
    • H01L29/7824Lateral DMOS transistors, i.e. LDMOS transistors with a substrate comprising an insulating layer, e.g. SOI-LDMOS transistors
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    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H01L21/76232Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
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    • H01L21/76264SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
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DE69535936T 1994-02-04 1995-02-06 Verfahren zum Herstellen einer Halbleitervorrichtung mit Graben Expired - Lifetime DE69535936D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1255994 1994-02-04
JP00134795A JP3396553B2 (ja) 1994-02-04 1995-01-09 半導体装置の製造方法及び半導体装置

Publications (1)

Publication Number Publication Date
DE69535936D1 true DE69535936D1 (de) 2009-05-28

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ID=26334557

Family Applications (3)

Application Number Title Priority Date Filing Date
DE69536116T Expired - Lifetime DE69536116D1 (de) 1994-02-04 1995-02-06 Halbleiterbauelement mit Graben
DE69535936T Expired - Lifetime DE69535936D1 (de) 1994-02-04 1995-02-06 Verfahren zum Herstellen einer Halbleitervorrichtung mit Graben
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JP3396553B2 (ja) * 1994-02-04 2003-04-14 三菱電機株式会社 半導体装置の製造方法及び半導体装置
KR0186083B1 (ko) * 1995-08-12 1999-04-15 문정환 반도체 소자의 소자격리방법

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DE69536116D1 (de) 2010-12-02
DE69534955T8 (de) 2007-09-13
US20030203573A1 (en) 2003-10-30
EP1160852B1 (de) 2009-04-15
JPH07263692A (ja) 1995-10-13
EP0666590A2 (de) 1995-08-09
EP1160872A2 (de) 2001-12-05
US7067874B2 (en) 2006-06-27
EP1160872A3 (de) 2007-06-20
KR100188823B1 (ko) 1999-06-01
US6117734A (en) 2000-09-12
JP3396553B2 (ja) 2003-04-14
US6710401B2 (en) 2004-03-23
EP1160852A2 (de) 2001-12-05
DE69534955D1 (de) 2006-06-01
DE69534955T2 (de) 2007-04-12
EP0666590B1 (de) 2006-04-26
US5783491A (en) 1998-07-21
EP1160852A3 (de) 2007-05-30
US20010006836A1 (en) 2001-07-05
EP1160872B1 (de) 2010-10-20
EP0666590A3 (de) 1996-05-08

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