DE69611851T2 - Haltevorrichtung für ein Substrat und Verfahren und Vorrichtung zum Polieren eines Substrates - Google Patents
Haltevorrichtung für ein Substrat und Verfahren und Vorrichtung zum Polieren eines SubstratesInfo
- Publication number
- DE69611851T2 DE69611851T2 DE69611851T DE69611851T DE69611851T2 DE 69611851 T2 DE69611851 T2 DE 69611851T2 DE 69611851 T DE69611851 T DE 69611851T DE 69611851 T DE69611851 T DE 69611851T DE 69611851 T2 DE69611851 T2 DE 69611851T2
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- polishing
- holding device
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8386095 | 1995-04-10 | ||
| JP14153695 | 1995-06-08 | ||
| JP31297895A JP2758152B2 (ja) | 1995-04-10 | 1995-11-30 | 被研磨基板の保持装置及び基板の研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69611851D1 DE69611851D1 (de) | 2001-04-05 |
| DE69611851T2 true DE69611851T2 (de) | 2001-06-13 |
Family
ID=27304352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69611851T Expired - Lifetime DE69611851T2 (de) | 1995-04-10 | 1996-04-10 | Haltevorrichtung für ein Substrat und Verfahren und Vorrichtung zum Polieren eines Substrates |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US5791973A (de) |
| EP (1) | EP0737546B1 (de) |
| KR (1) | KR100209383B1 (de) |
| CN (2) | CN1141202C (de) |
| CA (1) | CA2173639A1 (de) |
| DE (1) | DE69611851T2 (de) |
| TW (3) | TW400567B (de) |
Families Citing this family (81)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5695392A (en) * | 1995-08-09 | 1997-12-09 | Speedfam Corporation | Polishing device with improved handling of fluid polishing media |
| JPH1086056A (ja) * | 1996-09-11 | 1998-04-07 | Speedfam Co Ltd | 研磨パッドの管理方法及び装置 |
| JP2965536B2 (ja) * | 1996-12-17 | 1999-10-18 | 松下電器産業株式会社 | 被研磨基板の保持装置 |
| TW431942B (en) * | 1997-04-04 | 2001-05-01 | Tokyo Seimitsu Co Ltd | Polishing device |
| US5957751A (en) * | 1997-05-23 | 1999-09-28 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
| US6398621B1 (en) | 1997-05-23 | 2002-06-04 | Applied Materials, Inc. | Carrier head with a substrate sensor |
| MY120754A (en) * | 1997-08-11 | 2005-11-30 | Tokyo Seimitsu Co Ltd | Wafer polishing apparatus |
| TW434095B (en) * | 1997-08-11 | 2001-05-16 | Tokyo Seimitsu Co Ltd | Wafer polishing apparatus |
| GB2345257B (en) * | 1997-09-01 | 2002-11-06 | United Microelectronics Corp | Chemical-mechanical polishing method and fabricating method |
| JPH11226865A (ja) * | 1997-12-11 | 1999-08-24 | Speedfam Co Ltd | キャリア及びｃｍｐ装置 |
| US6142857A (en) * | 1998-01-06 | 2000-11-07 | Speedfam-Ipec Corporation | Wafer polishing with improved backing arrangement |
| US5989104A (en) * | 1998-01-12 | 1999-11-23 | Speedfam-Ipec Corporation | Workpiece carrier with monopiece pressure plate and low gimbal point |
| JPH11285966A (ja) * | 1998-04-02 | 1999-10-19 | Speedfam-Ipec Co Ltd | キャリア及びｃｍｐ装置 |
| JPH11300608A (ja) * | 1998-04-20 | 1999-11-02 | Nec Corp | 化学機械研磨装置 |
| US6106379A (en) * | 1998-05-12 | 2000-08-22 | Speedfam-Ipec Corporation | Semiconductor wafer carrier with automatic ring extension |
| US5985094A (en) * | 1998-05-12 | 1999-11-16 | Speedfam-Ipec Corporation | Semiconductor wafer carrier |
| US6436228B1 (en) * | 1998-05-15 | 2002-08-20 | Applied Materials, Inc. | Substrate retainer |
| JP2907209B1 (ja) * | 1998-05-29 | 1999-06-21 | 日本電気株式会社 | ウェハ研磨装置用裏面パッド |
| US6217425B1 (en) * | 1998-06-12 | 2001-04-17 | Tdk Corporation | Apparatus and method for lapping magnetic heads |
| US5925576A (en) * | 1998-08-19 | 1999-07-20 | Promos Technologies, Inc. | Method and apparatus for controlling backside pressure during chemical mechanical polishing |
| JP3502550B2 (ja) * | 1998-10-07 | 2004-03-02 | 株式会社東芝 | 研磨装置 |
| US6132298A (en) * | 1998-11-25 | 2000-10-17 | Applied Materials, Inc. | Carrier head with edge control for chemical mechanical polishing |
| JP2000228391A (ja) * | 1998-11-30 | 2000-08-15 | Canon Inc | 半導体基板の精密研磨方法および装置 |
| US6290589B1 (en) * | 1998-12-09 | 2001-09-18 | Applied Materials, Inc. | Polishing pad with a partial adhesive coating |
| US6422927B1 (en) * | 1998-12-30 | 2002-07-23 | Applied Materials, Inc. | Carrier head with controllable pressure and loading area for chemical mechanical polishing |
| EP1052060A3 (de) * | 1999-05-03 | 2001-04-18 | Applied Materials, Inc. | Verfahren zum chemisch-mechanischen Planarisieren |
| US6722963B1 (en) | 1999-08-03 | 2004-04-20 | Micron Technology, Inc. | Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane |
| US6217412B1 (en) * | 1999-08-11 | 2001-04-17 | Advanced Micro Devices, Inc. | Method for characterizing polish pad lots to eliminate or reduce tool requalification after changing a polishing pad |
| KR200179193Y1 (ko) * | 1999-11-12 | 2000-04-15 | 박철호 | 최소형 피. 씨. 비 기판의 접속부 연마장치 |
| US6264532B1 (en) | 2000-03-28 | 2001-07-24 | Speedfam-Ipec Corporation | Ultrasonic methods and apparatus for the in-situ detection of workpiece loss |
| US6616801B1 (en) | 2000-03-31 | 2003-09-09 | Lam Research Corporation | Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path |
| US6773337B1 (en) * | 2000-11-07 | 2004-08-10 | Planar Labs Corporation | Method and apparatus to recondition an ion exchange polish pad |
| DE10059345A1 (de) * | 2000-11-29 | 2002-06-13 | Infineon Technologies Ag | Halbleitersubstrathalter für chemisch-mechanisches Polieren |
| US6517426B2 (en) | 2001-04-05 | 2003-02-11 | Lam Research Corporation | Composite polishing pad for chemical-mechanical polishing |
| US6910949B1 (en) * | 2001-04-25 | 2005-06-28 | Lam Research Corporation | Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers |
| US6966816B2 (en) * | 2001-05-02 | 2005-11-22 | Applied Materials, Inc. | Integrated endpoint detection system with optical and eddy current monitoring |
| DE60101458T2 (de) | 2001-05-25 | 2004-10-28 | Infineon Technologies Ag | Halbleitersubstrathalter mit bewegbarer Platte für das chemisch-mechanische Polierverfahren |
| JP4102081B2 (ja) * | 2002-02-28 | 2008-06-18 | 株式会社荏原製作所 | 研磨装置及び研磨面の異物検出方法 |
| KR100848556B1 (ko) * | 2002-03-25 | 2008-07-25 | 엘지디스플레이 주식회사 | 액정 패널의 회전 버퍼 및 이를 이용한 러빙장치 |
| US20060166610A1 (en) * | 2002-09-02 | 2006-07-27 | Takakazu Miyahara | Optical disk polishing device |
| US7288465B2 (en) * | 2003-04-15 | 2007-10-30 | International Business Machines Corpoartion | Semiconductor wafer front side protection |
| US7178235B2 (en) * | 2003-12-03 | 2007-02-20 | Reflex Photonics Inc. | Method of manufacturing an optoelectronic package |
| KR100558196B1 (ko) * | 2003-10-28 | 2006-03-10 | 삼성전자주식회사 | 투과전자현미경 검사용 시편을 고정시키기 위한 마운트 및이를사용하는 시편 제조 방법 |
| DE102005011107A1 (de) * | 2005-03-10 | 2006-09-21 | Infineon Technologies Ag | Verfahren und Vorrichtung zum Bearbeiten von Wafern auf Montageträgern |
| US20060211349A1 (en) * | 2005-03-18 | 2006-09-21 | Seh America, Inc. | Wafer polishing template for polishing semiconductor wafers in a wax free polishing process |
| CN100453269C (zh) * | 2006-12-12 | 2009-01-21 | 友达光电股份有限公司 | 基板支架及其固定构件 |
| JP5191312B2 (ja) * | 2008-08-25 | 2013-05-08 | 東京エレクトロン株式会社 | プローブの研磨方法、プローブ研磨用プログラム及びプローブ装置 |
| JP5516051B2 (ja) * | 2010-05-13 | 2014-06-11 | 旭硝子株式会社 | 研磨パッドを用いた研磨装置及びガラス板の製造方法 |
| JP6073222B2 (ja) | 2010-08-06 | 2017-02-01 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 保定リングを用いた基板縁部調整 |
| US20130017762A1 (en) * | 2011-07-15 | 2013-01-17 | Infineon Technologies Ag | Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine |
| JP5807580B2 (ja) * | 2012-02-15 | 2015-11-10 | 信越半導体株式会社 | 研磨ヘッド及び研磨装置 |
| JP6113960B2 (ja) | 2012-02-21 | 2017-04-12 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
| CN102717324B (zh) * | 2012-05-29 | 2016-05-11 | 深圳莱宝高科技股份有限公司 | 基板处理装置 |
| JP6049183B2 (ja) * | 2012-11-21 | 2016-12-21 | 株式会社ディスコ | 研削装置 |
| JP5870960B2 (ja) * | 2013-05-16 | 2016-03-01 | 信越半導体株式会社 | ワークの研磨装置 |
| CN103465182A (zh) * | 2013-09-03 | 2013-12-25 | 宇环数控机床股份有限公司 | 一种带分液装置的抛光轮 |
| US9240042B2 (en) * | 2013-10-24 | 2016-01-19 | Globalfoundries Inc. | Wafer slip detection during CMP processing |
| CN103639886A (zh) * | 2013-11-29 | 2014-03-19 | 上海华力微电子有限公司 | 用于w-cmp的化学机械研磨装置及研磨方法 |
| CN104070466B (zh) * | 2014-06-25 | 2016-10-05 | 江苏吉星新材料有限公司 | 一种树脂抛光盘 |
| TWI548107B (zh) * | 2014-08-25 | 2016-09-01 | 財團法人工業技術研究院 | 氣密組件、具有其之裝置及其測漏方法 |
| US9744640B2 (en) * | 2015-10-16 | 2017-08-29 | Applied Materials, Inc. | Corrosion resistant retaining rings |
| JP6380333B2 (ja) * | 2015-10-30 | 2018-08-29 | 株式会社Sumco | ウェーハ研磨装置およびこれに用いる研磨ヘッド |
| JP6394569B2 (ja) * | 2015-11-06 | 2018-09-26 | 信越半導体株式会社 | ウェーハの研磨方法及び研磨装置 |
| US10160091B2 (en) | 2015-11-16 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | CMP polishing head design for improving removal rate uniformity |
| US20170252893A1 (en) * | 2016-03-03 | 2017-09-07 | P.R. Hoffman Machine Products Inc. | Polishing machine work piece holder |
| US10556317B2 (en) | 2016-03-03 | 2020-02-11 | P.R. Hoffman Machine Products Inc. | Polishing machine wafer holder |
| CN106402916A (zh) * | 2016-11-29 | 2017-02-15 | 郑州中拓知识产权代理有限公司 | 一种能分层抛洒的锅炉煤粉进料装置 |
| JP6360586B1 (ja) * | 2017-04-13 | 2018-07-18 | 三菱電線工業株式会社 | Ｃｍｐ装置のウエハ保持用の弾性膜 |
| KR102012786B1 (ko) | 2017-05-17 | 2019-08-21 | 모던세라믹스(주) | 드레싱 블록의 교체가 가능한 포지셔너 및 그 제조방법 |
| JP6506797B2 (ja) * | 2017-06-09 | 2019-04-24 | Ｔｏｗａ株式会社 | 研削装置および研削方法 |
| JP6312229B1 (ja) * | 2017-06-12 | 2018-04-18 | 信越半導体株式会社 | 研磨方法及び研磨装置 |
| CN107617971B (zh) * | 2017-10-24 | 2019-11-29 | 德淮半导体有限公司 | 研磨垫及研磨设备和方法 |
| CN107984374A (zh) * | 2017-11-30 | 2018-05-04 | 上海华力微电子有限公司 | 一种化学机械抛光研磨速率的实时侦测装置及其侦测方法 |
| JP6891847B2 (ja) * | 2018-04-05 | 2021-06-18 | 信越半導体株式会社 | 研磨ヘッド及びウェーハの研磨方法 |
| CN108381376B (zh) * | 2018-04-10 | 2020-01-24 | 中北大学 | 一种超声研磨蓝宝石镜片的加工装置 |
| JP7075814B2 (ja) * | 2018-05-21 | 2022-05-26 | 株式会社荏原製作所 | 基板保持装置、基板研磨装置、弾性部材および基板保持装置の製造方法 |
| KR20200016175A (ko) * | 2018-08-06 | 2020-02-14 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판 보유 지지 장치, 기판 흡착 판정 방법, 기판 연마 장치, 기판 연마 방법, 연마되는 웨이퍼의 상면으로부터 액체를 제거하는 방법, 및 웨이퍼를 연마 패드에 압박하기 위한 탄성막, 기판 릴리스 방법 및 정량 기체 공급 장치 |
| CN110695849B (zh) * | 2019-10-23 | 2020-09-15 | 清华大学 | 一种晶圆厚度测量装置和磨削机台 |
| CN111922883A (zh) * | 2020-07-17 | 2020-11-13 | 涂凯飞 | 一种抛光时自动添加抛光液的抛光装置 |
| CN113400176A (zh) * | 2021-06-21 | 2021-09-17 | 西安奕斯伟硅片技术有限公司 | 一种硅片边缘抛光装置以及方法 |
| CN115816267A (zh) * | 2022-12-29 | 2023-03-21 | 西安奕斯伟材料科技有限公司 | 硅片双面抛光装置的承载件及硅片双面抛光装置 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2998680A (en) * | 1958-07-21 | 1961-09-05 | Morton S Lipkins | Lapping machines |
| US3731435A (en) * | 1971-02-09 | 1973-05-08 | Speedfam Corp | Polishing machine load plate |
| US3982358A (en) * | 1973-10-09 | 1976-09-28 | Heijiro Fukuda | Laminated resinoid wheels, method for continuously producing same and apparatus for use in the method |
| US3863395A (en) * | 1974-02-19 | 1975-02-04 | Shugart Associates Inc | Apparatus for polishing a spherical surface on a magnetic recording transducer |
| JPS5944190B2 (ja) * | 1977-04-20 | 1984-10-27 | 関西ペイント株式会社 | 研摩材の製造方法 |
| FR2551382B1 (fr) * | 1983-09-02 | 1986-05-16 | Essilor Int | Procede et dispositif pour le surfacage d'une lentille optique |
| WO1985005734A1 (en) * | 1984-05-29 | 1985-12-19 | Mitsui Toatsu Chemicals, Incorporated | Film for machining wafers |
| JPS614661A (ja) * | 1984-06-13 | 1986-01-10 | Nec Corp | 平面研摩装置の被加工物保持機構 |
| JPS6138857A (ja) * | 1984-07-28 | 1986-02-24 | Hoya Corp | 平面加工装置 |
| JPS6224962A (ja) * | 1985-07-19 | 1987-02-02 | Mitsubishi Metal Corp | 半導体ウエハの保持具 |
| NL8503217A (nl) * | 1985-11-22 | 1987-06-16 | Hoogovens Groep Bv | Preparaathouder. |
| JPH0741534B2 (ja) * | 1986-11-10 | 1995-05-10 | 不二越機械工業株式会社 | ウエーハの研摩方法及び研摩装置 |
| JPH0767665B2 (ja) * | 1986-12-08 | 1995-07-26 | スピ−ドフアム株式会社 | 平面研磨装置 |
| JPS63188265A (ja) * | 1987-01-31 | 1988-08-03 | Tokyo Electric Co Ltd | 無線注文システム |
| JPH01188265A (ja) * | 1988-01-25 | 1989-07-27 | Hitachi Ltd | ラツプ加工装置 |
| JPH01193166A (ja) * | 1988-01-28 | 1989-08-03 | Showa Denko Kk | 半導体ウェハ鏡面研磨用パッド |
| US4954142A (en) * | 1989-03-07 | 1990-09-04 | International Business Machines Corporation | Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor |
| JP2527232B2 (ja) * | 1989-03-16 | 1996-08-21 | 株式会社日立製作所 | 研磨装置 |
| JPH03173129A (ja) * | 1989-12-01 | 1991-07-26 | Hitachi Ltd | 研磨装置 |
| US5104828A (en) * | 1990-03-01 | 1992-04-14 | Intel Corporation | Method of planarizing a dielectric formed over a semiconductor substrate |
| JPH0761609B2 (ja) * | 1990-03-23 | 1995-07-05 | 株式会社フジミインコーポレーテツド | 研磨方法及びこれに用いる研磨パッド |
| JP3256226B2 (ja) * | 1990-10-09 | 2002-02-12 | ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー | 浸蝕性凝集体を有する被覆研磨材料 |
| US5172448A (en) * | 1991-03-26 | 1992-12-22 | Waxing Corporation Of America | Molded buffer pad |
| JPH04310365A (ja) * | 1991-04-08 | 1992-11-02 | Toshiba Corp | 研磨皿 |
| JP2770087B2 (ja) * | 1991-09-17 | 1998-06-25 | 不二越機械工業株式会社 | ウェーハの研磨方法及びその研磨用トップリング |
| JPH0783709B2 (ja) * | 1992-03-02 | 1995-09-13 | 国税庁長官 | 酵母による異種タンパク質の発現及び生産量増大培養法 |
| JPH06763A (ja) * | 1992-06-19 | 1994-01-11 | Furukawa Electric Co Ltd:The | 半導体ウェハの研磨方法 |
| US5310455A (en) * | 1992-07-10 | 1994-05-10 | Lsi Logic Corporation | Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers |
| US5499733A (en) * | 1992-09-17 | 1996-03-19 | Luxtron Corporation | Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment |
| DE69325756T2 (de) * | 1992-09-24 | 2000-03-02 | Ebara Corp | Poliergerät |
| JP3370112B2 (ja) * | 1992-10-12 | 2003-01-27 | 不二越機械工業株式会社 | ウエハーの研磨装置 |
| US5433650A (en) * | 1993-05-03 | 1995-07-18 | Motorola, Inc. | Method for polishing a substrate |
| JP3311116B2 (ja) * | 1993-10-28 | 2002-08-05 | 株式会社東芝 | 半導体製造装置 |
| US5449316A (en) * | 1994-01-05 | 1995-09-12 | Strasbaugh; Alan | Wafer carrier for film planarization |
| JP3251419B2 (ja) * | 1994-03-18 | 2002-01-28 | 三菱マテリアルシリコン株式会社 | 半導体ウェーハの研磨用定盤 |
| JP2616736B2 (ja) * | 1995-01-25 | 1997-06-04 | 日本電気株式会社 | ウエーハ研磨装置 |
| JP3158934B2 (ja) * | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
| JPH08323615A (ja) * | 1995-05-30 | 1996-12-10 | Kyocera Corp | 研磨装置 |
-
1996
- 1996-03-07 TW TW086100159A patent/TW400567B/zh not_active IP Right Cessation
- 1996-03-07 TW TW086100157A patent/TW348279B/zh not_active IP Right Cessation
- 1996-03-07 TW TW085102803A patent/TW353203B/zh active
- 1996-03-26 KR KR1019960008408A patent/KR100209383B1/ko not_active IP Right Cessation
- 1996-04-08 CN CNB961046112A patent/CN1141202C/zh not_active Expired - Lifetime
- 1996-04-08 CN CNA2003101014893A patent/CN1494982A/zh active Pending
- 1996-04-09 CA CA002173639A patent/CA2173639A1/en not_active Abandoned
- 1996-04-09 US US08/629,691 patent/US5791973A/en not_active Expired - Lifetime
- 1996-04-10 EP EP96105657A patent/EP0737546B1/de not_active Expired - Lifetime
- 1996-04-10 DE DE69611851T patent/DE69611851T2/de not_active Expired - Lifetime
-
1997
- 1997-03-04 US US08/811,355 patent/US5921853A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1138745A (zh) | 1996-12-25 |
| CN1494982A (zh) | 2004-05-12 |
| TW400567B (en) | 2000-08-01 |
| EP0737546B1 (de) | 2001-02-28 |
| EP0737546A3 (de) | 1997-01-29 |
| CN1141202C (zh) | 2004-03-10 |
| TW353203B (en) | 1999-02-21 |
| KR100209383B1 (ko) | 1999-07-15 |
| US5791973A (en) | 1998-08-11 |
| US5921853A (en) | 1999-07-13 |
| DE69611851D1 (de) | 2001-04-05 |
| CA2173639A1 (en) | 1996-10-11 |
| EP0737546A2 (de) | 1996-10-16 |
| TW348279B (en) | 1998-12-21 |
| KR960039173A (ko) | 1996-11-21 |
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| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |