DE69620673T2 - Senkrechte Mikrowellenverbindung mittels Anordnung mit kompressiblem Leiter - Google Patents

Senkrechte Mikrowellenverbindung mittels Anordnung mit kompressiblem Leiter

Info

Publication number
DE69620673T2
DE69620673T2 DE69620673T DE69620673T DE69620673T2 DE 69620673 T2 DE69620673 T2 DE 69620673T2 DE 69620673 T DE69620673 T DE 69620673T DE 69620673 T DE69620673 T DE 69620673T DE 69620673 T2 DE69620673 T2 DE 69620673T2
Authority
DE
Germany
Prior art keywords
arrangement
compressible conductor
microwave connection
vertical microwave
vertical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69620673T
Other languages
English (en)
Other versions
DE69620673D1 (de
Inventor
Rick L Sturdivant
Clifton Quan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of DE69620673D1 publication Critical patent/DE69620673D1/de
Application granted granted Critical
Publication of DE69620673T2 publication Critical patent/DE69620673T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
DE69620673T 1995-06-02 1996-05-30 Senkrechte Mikrowellenverbindung mittels Anordnung mit kompressiblem Leiter Expired - Lifetime DE69620673T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/458,839 US5552752A (en) 1995-06-02 1995-06-02 Microwave vertical interconnect through circuit with compressible conductor

Publications (2)

Publication Number Publication Date
DE69620673D1 DE69620673D1 (de) 2002-05-23
DE69620673T2 true DE69620673T2 (de) 2002-08-14

Family

ID=23822283

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69620673T Expired - Lifetime DE69620673T2 (de) 1995-06-02 1996-05-30 Senkrechte Mikrowellenverbindung mittels Anordnung mit kompressiblem Leiter

Country Status (5)

Country Link
US (2) US5552752A (de)
EP (1) EP0746053B1 (de)
JP (1) JP3023312B2 (de)
DE (1) DE69620673T2 (de)
IL (1) IL118459A (de)

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US5644277A (en) * 1995-02-27 1997-07-01 Hughes Aircraft Company Three-wire-line vertical interconnect structure for multilevel substrates
US5552752A (en) * 1995-06-02 1996-09-03 Hughes Aircraft Company Microwave vertical interconnect through circuit with compressible conductor
US5668509A (en) * 1996-03-25 1997-09-16 Hughes Electronics Modified coaxial to GCPW vertical solderless interconnects for stack MIC assemblies
JP3960560B2 (ja) * 1996-09-27 2007-08-15 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 回路素子と伝送線路とを有する装置
US5879172A (en) * 1997-04-03 1999-03-09 Emulation Technology, Inc. Surface mounted adapter using elastomeric conductors
US5872550A (en) * 1997-06-09 1999-02-16 Raytheon Company Compressible coaxial interconnection with integrated environmental seal
US5886590A (en) * 1997-09-04 1999-03-23 Hughes Electronics Corporation Microstrip to coax vertical launcher using fuzz button and solderless interconnects
US5923234A (en) * 1997-10-27 1999-07-13 Lockheed Martin Corp. Hermetic feedthrough using three-via transmission lines
US5977850A (en) * 1997-11-05 1999-11-02 Motorola, Inc. Multilayer ceramic package with center ground via for size reduction
US6039580A (en) * 1998-07-16 2000-03-21 Raytheon Company RF connector having a compliant contact
US6166615A (en) * 1998-09-16 2000-12-26 Raytheon Company Blind mate non-crimp pin RF connector
US6100775A (en) * 1998-10-15 2000-08-08 Raytheon Company Vertical interconnect circuit for coplanar waveguides
US6292073B1 (en) * 1998-10-26 2001-09-18 The United States Of America As Represented By The Secretary Of The Air Force Solderless circuit interconnect having a spring contact passing through an aperture
US6785148B1 (en) * 1998-12-21 2004-08-31 Intel Corporation Easy mount socket
US6094115A (en) * 1999-02-12 2000-07-25 Raytheon Company Control impedance RF pin for extending compressible button interconnect contact distance
US6102709A (en) * 1999-03-31 2000-08-15 Raytheon Company Threaded double sided compressed wire bundle connector
US6307446B1 (en) 1999-09-14 2001-10-23 Raytheon Company Planar interconnects using compressible wire bundle contacts
US6362703B1 (en) 2000-01-13 2002-03-26 Raytheon Company Vertical interconnect between coaxial and rectangular coaxial transmission line via compressible center conductors
US6366185B1 (en) 2000-01-12 2002-04-02 Raytheon Company Vertical interconnect between coaxial or GCPW circuits and airline via compressible center conductors
JP3617633B2 (ja) * 2000-10-06 2005-02-09 三菱電機株式会社 導波管接続部
US6843657B2 (en) * 2001-01-12 2005-01-18 Litton Systems Inc. High speed, high density interconnect system for differential and single-ended transmission applications
US6910897B2 (en) * 2001-01-12 2005-06-28 Litton Systems, Inc. Interconnection system
US7108546B2 (en) * 2001-06-20 2006-09-19 Formfactor, Inc. High density planar electrical interface
US6822542B2 (en) 2001-07-26 2004-11-23 Xytrans, Inc. Self-adjusted subminiature coaxial connector
US6483404B1 (en) 2001-08-20 2002-11-19 Xytrans, Inc. Millimeter wave filter for surface mount applications
US6498551B1 (en) 2001-08-20 2002-12-24 Xytrans, Inc. Millimeter wave module (MMW) for microwave monolithic integrated circuit (MMIC)
US6417747B1 (en) 2001-08-23 2002-07-09 Raytheon Company Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards
US6788171B2 (en) * 2002-03-05 2004-09-07 Xytrans, Inc. Millimeter wave (MMW) radio frequency transceiver module and method of forming same
US6882247B2 (en) 2002-05-15 2005-04-19 Raytheon Company RF filtered DC interconnect
JP2004247980A (ja) * 2003-02-14 2004-09-02 Hitachi Ltd 伝送線路の接続構造及び方法
FR2852743B1 (fr) * 2003-03-21 2007-01-12 Cellon France Sas Agencement pour connecter deux platines electroniques par un connecteur zif ou lif, un troncon en structure coplanaire et un troncon en structure a microruban
US6958670B2 (en) * 2003-08-01 2005-10-25 Raytheon Company Offset connector with compressible conductor
US20050088258A1 (en) * 2003-10-27 2005-04-28 Xytrans, Inc. Millimeter wave surface mount filter
US7074047B2 (en) * 2003-11-05 2006-07-11 Tensolite Company Zero insertion force high frequency connector
US7503768B2 (en) * 2003-11-05 2009-03-17 Tensolite Company High frequency connector assembly
DE102005033915A1 (de) * 2005-07-20 2007-02-01 Tyco Electronics Amp Gmbh Koaxialer Verbinder
US7293994B2 (en) * 2005-12-08 2007-11-13 International Business Machines Corporation Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member
US7544064B2 (en) * 2006-07-27 2009-06-09 International Business Machines Corporation Cyclindrical impedance matching connector standoff with optional common mode ferrite
US7859367B2 (en) * 2007-02-12 2010-12-28 Finisar Corporation Non-coplanar high-speed interconnects
US7880570B2 (en) * 2007-10-25 2011-02-01 Finisar Corporation Feed thru with flipped signal plane using guided vias
US8040684B2 (en) * 2007-12-31 2011-10-18 Honeywell International Inc. Package for electronic component and method for manufacturing the same
FR2962601B1 (fr) * 2010-07-06 2013-06-14 Thales Sa Connecteur d'ensembles electroniques blindant et sans soudure electrique
US9502382B2 (en) * 2011-09-26 2016-11-22 Regents Of The University Of Minnesota Coplaner waveguide transition
US9209773B1 (en) * 2012-01-11 2015-12-08 Lockheed Martin Corporation RF/microwave pressure contact interface
CN103515356A (zh) * 2013-07-24 2014-01-15 中国电子科技集团公司第五十五研究所 一种叠层式三维ltcc垂直互连微波模块
US9755289B2 (en) 2015-02-18 2017-09-05 National Instruments Corporation Right angle transition to circuit
JP6766582B2 (ja) * 2016-10-18 2020-10-14 三菱電機株式会社 高周波伝送装置
US10944144B2 (en) * 2018-03-20 2021-03-09 Commscope Italy, S.R.L. Low loss radio frequency transmission lines and devices including such transmission lines
US11195779B2 (en) 2019-08-09 2021-12-07 Raytheon Company Electronic module for motherboard
CN112054270B (zh) * 2020-07-27 2022-06-10 中国电子科技集团公司第十三研究所 波导接口组件互联结构
CN115224462B (zh) * 2022-09-20 2022-12-06 成都瑞迪威科技有限公司 一种微波多层板层间互联匹配方法

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DE935014C (de) * 1953-09-01 1955-11-10 Siemens Ag Unsymmetrische Mikrowellen-Flachleitung
DE1291807B (de) * 1965-09-30 1969-04-03 Siemens Ag Mikrowellenbauteil mit wenigstens einem Doppelleitungsabschnitt
US3663739A (en) * 1970-10-26 1972-05-16 Du Pont Uniform flat cables
US4206958A (en) * 1978-03-27 1980-06-10 The Bendix Corporation Electrical conductor having an integral electrical contact
US4347487A (en) * 1980-11-25 1982-08-31 Raychem Corporation High frequency attenuation cable
US4556265A (en) * 1981-06-29 1985-12-03 Rca Corporation RF Coaxial-strip line connector
US4641140A (en) * 1983-09-26 1987-02-03 Harris Corporation Miniaturized microwave transmission link
US4686492A (en) * 1985-03-04 1987-08-11 Tektronix, Inc. Impedance match connection using multiple layers of bond wires
JP2763445B2 (ja) * 1992-04-03 1998-06-11 三菱電機株式会社 高周波信号用配線及びそのボンディング装置
US5302923A (en) * 1992-07-16 1994-04-12 Hewlett-Packard Company Interconnection plate having high frequency transmission line through paths
US5552752A (en) * 1995-06-02 1996-09-03 Hughes Aircraft Company Microwave vertical interconnect through circuit with compressible conductor

Also Published As

Publication number Publication date
EP0746053A1 (de) 1996-12-04
JP3023312B2 (ja) 2000-03-21
IL118459A0 (en) 1996-09-12
US5675302A (en) 1997-10-07
DE69620673D1 (de) 2002-05-23
EP0746053B1 (de) 2002-04-17
US5552752A (en) 1996-09-03
IL118459A (en) 1999-10-28
JPH09107208A (ja) 1997-04-22

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Legal Events

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